Copper CPU Coolers
from ToneCooling Technology Co., Ltd
AlSiC Pin Fin Coolers for IGBT: We offer high-performance AlSiC coolers designed for efficient heat management. Function: Provides superior thermal dissipation for IGBT modules, ensuring stable operation and enhanced reliability. Applications: Used in power electronics and automotive systems,... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 83
- Device: Active Heat Sink
- W: 83
from ToneCooling Technology Co., Ltd
High Thermal Conductivity. Efficiently transfers heat from the Eagle-Stream platform ‘s CPUs or GPUs to the cooling fluid, ensuring effective heat dissipation for high-performance computing systems. Customizable Designs. Available in various sizes and configurations to fit Eagle-Stream CPUs... [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
We are excited to announce that we have just launched new cooler product of 1U 95 watts for Intel ® Socket 1155/1156/1150 CPU. They are for application in markets such us Industry PC, Server, Telecommunication and Instrumentation, etc. In addition, these Coolers are really good for dissipating... [See More]
- Material: Copper
- L: 92
- Device: Vapor Cooler
- W: 90.3
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 83
- Device: Active Heat Sink
- W: 83
from ToneCooling Technology Co., Ltd
》Efficient heat dissipation and noise control. 》Higher performance and longer life of graphics cards. 》Compatible with and made of high thermal conductivity materials. Materials such as copper and aluminum. “Easy to install. 》Seamless and perfect joint, no leaks. [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 83
- Device: Active Heat Sink
- W: 83
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Copper; Mixed; Aluminum,Copper
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 92
- Device: Active Heat Sink
- W: 90
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from ToneCooling Technology Co., Ltd
High-Quality Liquid Cooling Plates by Coolserver for Server Applications. CPU coolserver H2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 90
- L: 91
- H: 67.3
from ToneCooling Technology Co., Ltd
Custom Heat Sink Solutions from Coolserver for Electronics Cooling. CPU coolserver B6. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
High Efficiency: Provides excellent thermal conductivity for stable operation. Durability: Withstands high pressure and temperatures, suitable for tough conditions. Complex Design Flexibility: Can be custom-designed with intricate channels. Leak-Proof: Fully sealed to prevent leaks. Lightweight and... [See More]
- Material: Copper; Copper
- Weight: 5000
- Device: Liquid Cooler
from ToneCooling Technology Co., Ltd
High Efficiency: Provides excellent thermal conductivity for stable operation. Durability: Withstands high pressure and temperatures, suitable for tough conditions. Complex Design Flexibility: Can be custom-designed with intricate channels. Leak-Proof: Fully sealed to prevent leaks. Lightweight and... [See More]
- Material: Copper; Copper
- Weight: 3000
- Device: Liquid Cooler
from ToneCooling Technology Co., Ltd
High Efficiency: Provides excellent thermal conductivity for stable operation. Durability: Withstands high pressure and temperatures, suitable for tough conditions. Complex Design Flexibility: Can be custom-designed with intricate channels. Leak-Proof: Fully sealed to prevent leaks. Lightweight and... [See More]
- Material: Copper; Copper
- Weight: 3000
- Device: Liquid Cooler
from ToneCooling Technology Co., Ltd
High Efficiency: Provides excellent thermal conductivity for stable operation. Durability: Withstands high pressure and temperatures, suitable for tough conditions. Complex Design Flexibility: Can be custom-designed with intricate channels. Leak-Proof: Fully sealed to prevent leaks. Lightweight and... [See More]
- Material: Copper; Copper
- Weight: 4000
- Device: Liquid Cooler
from TONGYU Technology Co., Ltd.
Name: CPU Liquid Cooler. Item No.: TY-C03. Material: C1100. Appearance: No oxidation, inner and outer surfaces clean, no impurities. Parameters: 200PSIto detect leak. Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system. Custom Design: Available [See More]
- Material: Copper; C1100
- Device: Thermo-Electric Cooler; Liquid Cooler
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Material: Aluminum; Copper
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Material: Aluminum; Copper
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Passive copper heatsink for 1U Server solution. [See More]
- Material: Copper
- W: 75.5
- L: 115
- H: 24
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 106
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 & 6100 Series. CPU Socket : G34. Solution : Passive skived fin copper heatsink for 1U Server solution. [See More]
- Material: Copper
- W: 75
- L: 115
- H: 27
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 60 x 60 x 25mm fan, Copper Heatsink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 106
- Device: Active Heat Sink
- W: 73
from Dynatron Corp.
CPU Support : Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan with PWM function, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution. [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 75
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : Copper Heatsink, 1U server solution [See More]
- Material: Copper
- W: 78
- L: 106
- H: 23.5
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 106
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : 60 x 60 x 25mm PWM fan, Copper Hestink with Stacked Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 72
from Dynatron Corp.
CPU Support : AMD ® K8 Socket 754, Socket 939 and Athlon 64 FX socket 940 1U Opteron Server for Opteron 150/250/850. CPU Socket : 754/939/940. Solution : Copper Heatsink, 1U server solution [See More]
- Material: Copper
- W: 74
- L: 100
- H: 24
from Dynatron Corp.
CPU Support : AMD ® 4.1" Mounting Pitch. CPU Socket : F 1207(4.1" Mounting Pitch). Solution : Copper Heatsink, 1U server solution [See More]
- Material: Copper
- W: 76
- L: 115
- H: 24
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Next Generation ™ Opteron. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 77 x 77 x 20mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 114
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 114
- Device: Active Heat Sink
- W: 75.5
from Dynatron Corp.
CPU Support : AMD Dual-Core Opteron. CPU Socket : 754/939/940. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Dual-Core 4.1" Mounting Pitch. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6100 Series. CPU Socket : G34. Solution : 75x15mm Aluminum blower, Copper heatsink with heatpipes embedded for 1U Server solution [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Dual-Core. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 72
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 71