Copper CPU Coolers
from TONGYU Technology Co., Ltd.
Name: CPU Liquid Cooler. Item No.: TY-C03. Material: C1100. Appearance: No oxidation, inner and outer surfaces clean, no impurities. Parameters: 200PSIto detect leak. Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system. Custom Design: Available [See More]
- Material: Copper; C1100
- Device: Thermo-Electric Cooler; Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 83
- Device: Active Heat Sink
- W: 83
from Rego Electronics Inc.
We are excited to announce that we have just launched new cooler product of 1U 95 watts for Intel ® Socket 1155/1156/1150 CPU. They are for application in markets such us Industry PC, Server, Telecommunication and Instrumentation, etc. In addition, these Coolers are really good for dissipating... [See More]
- Material: Copper
- L: 92
- Device: Vapor Cooler
- W: 90.3
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 83
- Device: Active Heat Sink
- W: 83
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 83
- Device: Active Heat Sink
- W: 83
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 92
- Device: Active Heat Sink
- W: 90
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Material: Aluminum; Copper
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Material: Aluminum; Copper
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Passive copper heatsink for 1U Server solution. [See More]
- Material: Copper
- W: 75.5
- L: 115
- H: 24
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 106
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 & 6100 Series. CPU Socket : G34. Solution : Passive skived fin copper heatsink for 1U Server solution. [See More]
- Material: Copper
- W: 75
- L: 115
- H: 27
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 60 x 60 x 25mm fan, Copper Heatsink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 106
- Device: Active Heat Sink
- W: 73
from Dynatron Corp.
CPU Support : Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan with PWM function, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution. [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 75
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : Copper Heatsink, 1U server solution [See More]
- Material: Copper
- W: 78
- L: 106
- H: 23.5
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 106
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : 60 x 60 x 25mm PWM fan, Copper Hestink with Stacked Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 72
from Dynatron Corp.
CPU Support : AMD ® K8 Socket 754, Socket 939 and Athlon 64 FX socket 940 1U Opteron Server for Opteron 150/250/850. CPU Socket : 754/939/940. Solution : Copper Heatsink, 1U server solution [See More]
- Material: Copper
- W: 74
- L: 100
- H: 24
from Dynatron Corp.
CPU Support : AMD ® 4.1" Mounting Pitch. CPU Socket : F 1207(4.1" Mounting Pitch). Solution : Copper Heatsink, 1U server solution [See More]
- Material: Copper
- W: 76
- L: 115
- H: 24
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Next Generation ™ Opteron. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 77 x 77 x 20mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 114
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 114
- Device: Active Heat Sink
- W: 75.5
from Dynatron Corp.
CPU Support : AMD Dual-Core Opteron. CPU Socket : 754/939/940. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Dual-Core 4.1" Mounting Pitch. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 77