Copper CPU Coolers
from USUSTK LIMITED
Application: High-power Laser Equipment [See More]
- Material: Aluminum; Copper
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 83
- Device: Active Heat Sink
- W: 83
from ToneCooling Technology Co., Ltd
This compact TC-LGA4189 CPU water cooler is designed for Intel Xeon processors in 1U server environments. Its full-copper construction ensures efficient heat dissipation in space-constrained applications. Copper Microchannel Cold Plate: Direct-contact design with 0.1mm micro-fins for 20% higher... [See More]
- Material: Copper; Copper block and copper fins for superior thermal conductivity .
- L: 113
- Device: Liquid Cooler
- W: 78
from USUSTK LIMITED
Manufactured with high-precision CNC skiving technology, achieving a fin thickness of 0.06 mm and a fin pitch of 0.1 mm. This extreme structure design increases the heat dissipation surface area by up to 300% compared to traditional cold plates. [See More]
- Material: Copper
from Rego Electronics Inc.
We are excited to announce that we have just launched new cooler product of 1U 95 watts for Intel ® Socket 1155/1156/1150 CPU. They are for application in markets such us Industry PC, Server, Telecommunication and Instrumentation, etc. In addition, these Coolers are really good for dissipating... [See More]
- Material: Copper
- L: 92
- Device: Vapor Cooler
- W: 90.3
from ToneCooling Technology Co., Ltd
This active LGA4189 CPU cooler is designed for Intel Xeon processors on rectangular motherboards within 2U server environments, delivering efficient cooling with a copper base and aluminum fin design. AI Training Clusters. Supports NVIDIA HGX H100 8-GPU sustained cooling. 100% core Turbo Boost in... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 5 heat pipes .
- L: 113
- Device: Active Heat Sink
- W: 78
from USUSTK LIMITED
Application: High-power Laser Equipment [See More]
- Material: Aluminum; Copper
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 83
- Device: Active Heat Sink
- W: 83
from ToneCooling Technology Co., Ltd
CMc is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides.It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]
- Material: Copper; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from USUSTK LIMITED
Application: Data Centers [See More]
- Material: Copper
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 83
- Device: Active Heat Sink
- W: 83
from ToneCooling Technology Co., Ltd
High Efficiency: Provides excellent thermal conductivity for stable operation. Durability: Withstands high pressure and temperatures, suitable for tough conditions. Complex Design Flexibility: Can be custom-designed with intricate channels. Leak-Proof: Fully sealed to prevent leaks. Lightweight and... [See More]
- Material: Copper; Copper
- Weight: 5000
from USUSTK LIMITED
Application: Servers [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Copper
- L: 92
- Device: Active Heat Sink
- W: 90
from ToneCooling Technology Co., Ltd
High Efficiency: Provides excellent thermal conductivity for stable operation. Durability: Withstands high pressure and temperatures, suitable for tough conditions. Complex Design Flexibility: Can be custom-designed with intricate channels. Leak-Proof: Fully sealed to prevent leaks. Lightweight and... [See More]
- Material: Copper; Copper
- Weight: 3000
from ToneCooling Technology Co., Ltd
High Efficiency: Provides excellent thermal conductivity for stable operation. Durability: Withstands high pressure and temperatures, suitable for tough conditions. Complex Design Flexibility: Can be custom-designed with intricate channels. Leak-Proof: Fully sealed to prevent leaks. Lightweight and... [See More]
- Material: Copper; Copper
- Weight: 3000
from ToneCooling Technology Co., Ltd
High Efficiency: Provides excellent thermal conductivity for stable operation. Durability: Withstands high pressure and temperatures, suitable for tough conditions. Complex Design Flexibility: Can be custom-designed with intricate channels. Leak-Proof: Fully sealed to prevent leaks. Lightweight and... [See More]
- Material: Copper; Copper
- Weight: 4000
from ToneCooling Technology Co., Ltd
CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]
- Material: Copper; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Copper/Kovar/Copper, Copper/Invar/Copper, and Copper/Steel/Copper series products are similar to CMC and CPC series sandwich composite materials. They combine the high thermal conductivity of copper with the low thermal expansion coefficient of Kovar, Invar, and steel. Although the thermal... [See More]
- Material: Copper; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond... [See More]
- Material: Copper; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
The TC-LGA4189 CPU cooler is specifically designed for Intel Xeon processors, providing exceptional cooling performance for high-power applications. With a robust build and optimized design, this cooler is ideal for server environments that require reliable thermal management. Enterprise Data... [See More]
- Material: Aluminum; Copper; Constructed with a copper base, aluminum fins, and four heat pipes to enhance thermal conductivity and heat transfer.
- W: 200
- L: 350
- H: 25
from ToneCooling Technology Co., Ltd
This active TC-LGA4189 CPU cooler is designed for reliable cooling of Intel Xeon processors on rectangular motherboards within 2U server environments. It combines a copper base with aluminum fins, heat pipes, and a high-speed PWM fan to ensure efficient thermal management. Key Features: ✅... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 4 heat pipes.
- W: 78
- Device: Active Heat Sink
- H: 64.5
from ToneCooling Technology Co., Ltd
This active TC-LGA4189 CPU cooler is designed for Intel Xeon processors on rectangular motherboards in 2U server environments and above. It delivers maximum cooling performance with a copper base, aluminum fins, heat pipes, and a high-speed PWM fan for systems requiring exceptional thermal... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 5 heat pipes .
- L: 113
- Device: Active Heat Sink
- W: 79
from ToneCooling Technology Co., Ltd
This low-profile TC-LGA4189 CPU cooler is designed for Intel Xeon processors, balancing a compact form factor with efficient cooling performance. It ’s ideal for server environments where space is limited but reliable thermal management is crucial. 14mm ultra-slim design, compatible with 1U... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 4 heat pipes . Some coolers utilize a copper vapor chamber base for enhanced heat dissipation .
- W: 154
- L: 169
- H: 25
from ToneCooling Technology Co., Ltd
This TC-LGA7529-M95 CPU cooler is designed for Intel server processors that utilize the TC-LGA 7529-M95 socket. It balances thermal performance and noise level, making it suitable for various server environments. In the era of data-driven computing, server performance hinges on efficient thermal... [See More]
- Material: Aluminum; Copper; Copper base + aluminum fins + 6 heat pipes 7 . Some coolers have 8 heat pipes .
- W: 103
- L: 127
- H: 121
from ToneCooling Technology Co., Ltd
Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The use of crystal ” oxygen-free copper heat sinks was prevalent over a decade... [See More]
- Material: Copper; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Molybdenum copper series is also a pseudo alloy. Molybdenum and copper are not miscible. It fully combines the high thermal conductivity, high melting point, low thermal expansion coefficient, and high thermal conductivity of molybdenum. The ratio of molybdenum to copper can be adjusted arbitrarily,... [See More]
- Material: Copper; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
This high-performance TC-LGA7529 CPU cooler is designed for Intel server processors utilizing the TC-LGA 7529 socket. It provides a balance of efficient cooling and quiet operation, making it an excellent choice for various server environments. Enterprise-Grade Virtualization Platforms. Optimized... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 6 heat pipes . Some coolers have 8 heat pipes .
- W: 120
- L: 154
- H: 121
from ToneCooling Technology Co., Ltd
This high-performance TC-LGA7529-M98 CPU cooler is engineered for Intel server processors using the TC-LGA 7529-M98 socket, offering a balance of efficient cooling and quiet operation, ideal for 2U server environments. Cloud Data Centers. Designed for hyperscale cloud infrastructure, it ensures... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 6 heat pipes . Some coolers have 8 heat pipes .
- W: 97.8
- L: 127
- H: 121
from ToneCooling Technology Co., Ltd
#183;High Thermal Performance: Efficiently dissipates heat to enhance cooling in servers and data centers. ·Customizable Designs: Tailored to specific cooling needs with various sizes and configurations. ·Robust Construction: Durable materials designed to endure high-demand server... [See More]
- Material: Copper; AL Base + Cu Block +AL Fin + 4HP+ 6025 Fan
- W: 88
- L: 96
- H: 67
from ToneCooling Technology Co., Ltd
Top Benefits of Using Coolserver Heat Sinks for Electronic Devices. CPU coolserver W2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When... [See More]
- Material: Copper; AL Base + Cu Block +AL Fin + 5HP+ 9225 Fan
- W: 95
- L: 108
- H: 126
from ToneCooling Technology Co., Ltd
Advanced Liquid Cooling Technology from Coolserver for Modern Data Centers. CPU coolserver W2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable... [See More]
- Material: Copper; AL Base + Cu Block +AL Fin + 4HP + 6025 Fan
- W: 78
- L: 113
- H: 64
from ToneCooling Technology Co., Ltd
Optimize Your Cooling with Coolserver ’s High-Efficiency Heat Sink Solutions. CPU coolserver P9. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and... [See More]
- Material: Copper; AL Base + Cu Block +AL Fin + 4HP+ 6025 Fan
- W: 78
- L: 108
- H: 64
from ToneCooling Technology Co., Ltd
#183;High Thermal Performance: Efficiently dissipates heat to enhance cooling in servers and data centers. ·Customizable Designs: Tailored to specific cooling needs with various sizes and configurations. ·Robust Construction: Durable materials designed to endure high-demand server... [See More]
- Material: Copper; AL Base + Cu Block + AL Fin + 5HP + 9225 Fan
- W: 95
- L: 110
- H: 127
from ToneCooling Technology Co., Ltd
High-Quality Liquid Cooling Plates by Coolserver for Server Applications. CPU coolserver H2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable... [See More]
- Material: Copper; Cu Base + AL Fin + 6025 Fan
- W: 90
- L: 91
- H: 67.3
from TONGYU Technology Co., Ltd.
Name: CPU Liquid Cooler. Item No.: TY-C03. Material: C1100. Appearance: No oxidation, inner and outer surfaces clean, no impurities. Parameters: 200PSIto detect leak. Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system. Custom Design: Available [See More]
- Material: Copper; C1100
- Device: Thermo-Electric Cooler; Liquid Cooler
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Material: Aluminum; Copper
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Material: Aluminum; Copper
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Passive copper heatsink for 1U Server solution. [See More]
- Material: Copper
- W: 75.5
- L: 115
- H: 24
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 106
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 & 6100 Series. CPU Socket : G34. Solution : Passive skived fin copper heatsink for 1U Server solution. [See More]
- Material: Copper
- W: 75
- L: 115
- H: 27
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 60 x 60 x 25mm fan, Copper Heatsink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 106
- Device: Active Heat Sink
- W: 73
from Dynatron Corp.
CPU Support : Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan with PWM function, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution. [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 75
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : Copper Heatsink, 1U server solution [See More]
- Material: Copper
- W: 78
- L: 106
- H: 23.5
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 106
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : 60 x 60 x 25mm PWM fan, Copper Hestink with Stacked Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 72
from Dynatron Corp.
CPU Support : AMD ® K8 Socket 754, Socket 939 and Athlon 64 FX socket 940 1U Opteron Server for Opteron 150/250/850. CPU Socket : 754/939/940. Solution : Copper Heatsink, 1U server solution [See More]
- Material: Copper
- W: 74
- L: 100
- H: 24
from Dynatron Corp.
CPU Support : AMD ® 4.1" Mounting Pitch. CPU Socket : F 1207(4.1" Mounting Pitch). Solution : Copper Heatsink, 1U server solution [See More]
- Material: Copper
- W: 76
- L: 115
- H: 24
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Next Generation ™ Opteron. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 77 x 77 x 20mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 114
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 114
- Device: Active Heat Sink
- W: 75.5
from Dynatron Corp.
CPU Support : AMD Dual-Core Opteron. CPU Socket : 754/939/940. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Dual-Core 4.1" Mounting Pitch. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6100 Series. CPU Socket : G34. Solution : 75x15mm Aluminum blower, Copper heatsink with heatpipes embedded for 1U Server solution [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Dual-Core. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 115
- Device: Active Heat Sink
- W: 72
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Material: Copper
- L: 100
- Device: Active Heat Sink
- W: 71