Paste Solder
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) [See More]
- Product Form: Braze or solder in the form of a paste.; Jar, 17.64 oz (500g)
- Melting Range: 423
from RS Components, Ltd.
ALLOY SN96.5 AG3 CU0.5 SIRIUS 1 LF-500G [See More]
- Product Form: Braze or solder in the form of a paste.; Paste
- Approvals / Conformance: RoHS Compliant
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 21.16 oz (600g) [See More]
- Product Form: Braze or solder in the form of a paste.; Jar, 21.16 oz (600g)
- Melting Range: 423
from RS Components, Ltd.
ALLOY SN62 PB AG2 SIRIUS 1 - 100G [See More]
- Product Form: Braze or solder in the form of a paste.; Paste
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
from DigiKey
CNP NP575-KAP 969 88.8-4-M17 INN [See More]
- Product Form: Braze or solder in the form of a paste.; Cartridge
from DigiKey
CNP NP575-KAP 969 88.8-4-M17 INN [See More]
- Product Form: Braze or solder in the form of a paste.; Jar
from DigiKey
R276 SN96.5AG3.0CU0.5 T4 86% 100 [See More]
- Product Form: Braze or solder in the form of a paste.; Syringe, 3.53 oz (100g)
from DigiKey
R500 SN63PB37 T3 86% 100G SYR [See More]
- Product Form: Braze or solder in the form of a paste.; Syringe, 3.53 oz (100g)
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
from DigiKey
Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) [See More]
- Product Form: Braze or solder in the form of a paste.; Jar, 17.64 oz (500g)
from DigiKey
WP616 SN96.5AG3.0CU0.5 T4 88.8% [See More]
- Product Form: Braze or solder in the form of a paste.; Cartridge, 21.16 oz (600g)
from DigiKey
WP616 SN96.5AG3.0CU0.5 T5 88.3% [See More]
- Product Form: Braze or solder in the form of a paste.; Jar, 17.64 oz (500g)
from DigiKey
Lead Free No-Clean Solder Paste Jar, 17.64 oz (500g) [See More]
- Product Form: Braze or solder in the form of a paste.; Jar, 17.64 oz (500g)
from DigiKey
Lead Free No-Clean Solder Paste Cartridge, 21.16 oz (600g) [See More]
- Product Form: Braze or solder in the form of a paste.; Cartridge, 21.16 oz (600g)
from DigiKey
Lead Free No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Tube, 0.35 oz (10g) [See More]
- Product Form: Braze or solder in the form of a paste.; Tube, 0.35 oz (10g)
- Melting Range: 284
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 0.53 oz (15g), 5cc [See More]
- Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) [See More]
- Product Form: Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc [See More]
- Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g) [See More]
- Product Form: Braze or solder in the form of a paste.; Jar, 1.76 oz (50g)
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 0.53 oz (15g), 5cc [See More]
- Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) [See More]
- Product Form: Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc [See More]
- Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc
- Melting Range: 422 to 428
from DigiKey
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g) [See More]
- Product Form: Braze or solder in the form of a paste.; Jar, 1.76 oz (50g)
- Melting Range: 422 to 428
from DigiKey
Rosin Mildly Activated (RMA), Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 0.53 oz (15g), 5cc [See More]
- Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
from DigiKey
Rosin Mildly Activated (RMA), Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc [See More]
- Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc
from DigiKey
No-Clean, Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 0.53 oz (15g), 5cc [See More]
- Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
from DigiKey
No-Clean, Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) [See More]
- Product Form: Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)
from DigiKey
No-Clean, Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc [See More]
- Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc
from Henkel Corporation - Industrial
LOCTITE MP 218, Solder paste, High activity, Soft residue, Colorless, Sn/Pb soldering. LOCTITE ® MP 218 is a high activity, soft residue, colorless solder paste with pin-testable flux that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly... [See More]
- Product Form: Braze or solder in the form of a paste.; Paste
from Indium Corporation
Indium Corporation is the leading global supplier of commercial indium, high purity indium, indium fabrications, alloys, and chemicals. Indium metal is extracted from indium-bearing ore and is refined to various grades in high volume utilizing state of the art SPC controlled refining technologies. [See More]
- Product Form: Braze or solder in the form of a paste.; Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.; Solid wire or rod
- Solder Alloy: Indium Alloy Solders
from R. S. Hughes Company, Inc.
The Kester 531 water soluble lead solder paste is another quality product from Kester. Total composition for this lead solder paste is sn62/pb36/ag02. Additional, and potentially important, information was collected about this product: Type 3 [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: ORM0 (IPC/J STD 004)
from Nordson EFD
When joints are needed but printing is not possible, Nordson EFD ’s premium dispensing solder paste supports a wider array of applications with formulations created for specific uses. In addition to the standard pastes offered by other suppliers, EFD provides specialized formulations for... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: ISO9001
from Henkel Corporation - Electronics
Halide-free, No-clean, SnPbSnPb solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in Pb-free formulation [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: 63S4, Sn62, Sn63; Lead Free
from Lucas Milhaupt Global Brazing Solutions
Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip, paste, powder or... [See More]
- Product Form: Braze or solder in the form of a paste.; Powder; Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.; Solid wire or rod
- Melting Range: 460
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
- Conductivity: 5.86E10
from Galco Industrial Electronics
Solder Paste, No Clean Lead-free, [See More]
- Product Form: Braze or solder in the form of a paste.
from ESAB Welding and Cutting Products
Features. Cadmium free, low temperature, food grade solder in mesh form premixed with flux. For use on stainless and dissimilar metals. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Silver Alloy
from Henkel Corporation - Industrial
Modest residue level, halide-free solder paste recommended for Pb-free soldering and Sn/Pb soldering for printing and reflow in air. LOCTITE ® CR 32 is formulated as a modest residue level, halide-free solder paste recommended for Pb-free soldering and Sn/Pb soldering for printing and reflow in... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Indium Alloy Solders
from R. S. Hughes Company, Inc.
The Kester Easy Profile 256 no clean lead solder paste is another quality product from Kester. Total composition for this lead solder paste is sn62/pb36/ag02. [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: Bellcore GR 78; ROL0 (IPC/J STD 004)
from Nordson EFD
Nordson EFD ’s print paste is the industry leader in Surface Mount Technology (SMT) applications. Our batch-to-batch consistency helps reduce defects and eliminate the need for rework. PrintPlus ® glides smoothly over stencils, filling the apertures without voids and leaving virtually no... [See More]
- Product Form: Braze or solder in the form of a paste.
from Henkel Corporation - Electronics
Halide-free, No-clean, Pb-freeDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in SnPb formulation [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb) (optional feature); 92A; Lead Free
from Henkel Corporation - Industrial
LOCTITE ECCOBOND LUX OGR150THTG, Acrylate, Assembly, Photocurable Adhesive LOCTITE ® ECCOBOND LUX OGR150THTG photocurable adhesive is designed for high throughput optoelectronic assembly operations. This product also contains a secondary thermal cure mechanism for applications that contain... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
Traditional solders have reflow temperatures in the range of 183 °C to 221 °C. However, advancements in components, substrates, and electronics design have driven the need for solder that will reflow in the 115 °C to 180 °C range. Some of these key drivers include: Temperature... [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Indium Alloy Solders; Bismuth
from R. S. Hughes Company, Inc.
The Kester Enviromark 808 water soluble lead-free solder paste is another quality product from Kester. Total composition for this lead-free solder paste is sn96.5/ag03/cu0.5. [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: ORM0 (IPC/J STD 004)
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeIndustry-leading solder paste in paste-transfer efficiency. Improved stability at different storage and operating temperatures, with extended stencil life up to 72 hours and extended abandon time up to 24 hours. Suitable for high-density, small to large boards. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: SAC305; Lead Free
from Henkel Corporation - Industrial
LOCTITE GC 10, No-clean and Halogen-free Solder Paste, a RoHS-compliant, Excellent resistance in high humidity, Pb-free soldering. LOCTITE ® GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In addition, NC-SMQ92J offers excellent wetting, unsurpassed stencil life, and consistent fine pitch deposition. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
from R. S. Hughes Company, Inc.
The Kester Enviromark 907 no clean lead-free solder paste is another quality product from Kester. Total composition for this lead-free solder paste is sn96.5/ag03/cu0.5. Additional, and potentially important, information was collected about this product: Powder Size: 3 [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: RoHS 2002/95/EC; ROL0 (IPC/J STD 004)
from Henkel Corporation - Electronics
Halogen-free, Pb-free, Water WashRoHS-compliant solder paste with excellent resistance in high humidity. Improved stability at different storage and operating temperatures, with extended stencil life over 24 hours. Suitable for high-density, small to large boards. Residues can be removed with... [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: SAC305; Lead Free
from Henkel Corporation - Industrial
LOCTITE GC 3W, Solder paste, Pb-free soldering, Halogen-free, Water Washable flux. LOCTITE ® GC 3W is a RoHS-compliant solder paste with excellent resistance in high humidity. Improved stability at different storage and operating temperatures, with extended stencil life over 24 hours. Suitable... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium 8.9E offers unprecedented... [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Lead Free
from R. S. Hughes Company, Inc.
The Kester R276 no clean lead solder paste is another quality product from Kester. Total composition for this lead solder paste is sn63/pb37. [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: Bellcore GR 78; ROL0 (IPC/J STD 004)
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste designed for medium to large boards. Robust reflow process window with exceptional solderability across a wide range of challenging surfaces finishes including immersion Ag and OSP copper. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: SAC305, SAC387; Lead Free
from Henkel Corporation - Industrial
LOCTITE HF 108, Solder paste, Pb-free soldering LOCTITE ® HF 108 is a high tack, low voiding, RoHS-compliant solder paste designed for medium to large boards. Excellent fine pitch coalescence. Robust reflow process window with exceptional solderability across a wide range of challenging... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
Indium Corporation ’s “Power-Safe ” NC-SMQ ®75 is the world ’s first and only solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach. The ultra-low flux residue, combined with a benign, low reactivity flux chemistry, enables... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004, J-STD-005
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste suitable for high speed printing. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range of challenging surface finishes including OSP copper. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: 90iSC, SAC305, SAC387; Lead Free
from Henkel Corporation - Industrial
LOCTITE HF 212, No-clean and Halogen-free Solder Paste, High tack, Low voiding, RoHS-compliant Pb-free soldering. LOCTITE ® HF 212 is a high tack, low voiding, RoHS-compliant solder paste with excellent fine pitch coalescence and extended stencil life and abandon time. Designed for medium to... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
BiAgX ® is a true solder paste technology. It reflows, solders, wets, and solidifies, just like any other solder paste. When converting from a standard high-Pb solder paste-based process, minimal process adjustments are required, eliminating the need for new capital expenditure. Solder joints... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004, J-STD-005
- Solder Alloy: Lead Free
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeHalogen and Pb-free solder paste designed for medium to large boards. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP copper, ENIG and CuNiZn. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: 90iSC, SAC0307, SAC305, SAC387; Lead Free
from Henkel Corporation - Industrial
LOCTITE HF 250DP, Pb-free soldering, Solder paste LOCTITE ® HF 250DP solder paste is a halogen-free, no clean, low voiding Pb-free solder paste. It is a low metal content solder paste formulated for dispense applications. Optimized to achieve consistent 250 to 300 µm dot diameter using a... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
BiAgX ® is a true solder paste technology. It reflows, solders, wets, and solidifies, just like any other solder paste. When converting from a standard high-Pb solder paste-based process, minimal process adjustments are required, eliminating the need for new capital expenditure. Solder joints... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004, J-STD-005
- Solder Alloy: Lead Free
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeDispensing grade, halogen and Pb-free solder paste with exceptional dot-to-dot consistency, colorless residues and high-speed dispense capability with zero slump. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: SAC387; Lead Free
from Henkel Corporation - Industrial
LOCTITE HF 2W, Solder paste, Halogen-free, Water washable flux, Low voiding, REACH-compliant, Pb-based soldering. LOCTITE ® HF 2W is a low voiding, REACH-compliant solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with aqueous cleaner followed... [See More]
- Product Form: Braze or solder in the form of a paste.; Paste
from Indium Corporation
Indium8.9LDA is specially designed for IGBT manufacturing. The formulation has been optimized for vacuum reflow soldering of large area die. Ultra-low total voids are possible (typically <0.5%) using a variety of reflow profiles: two examples of suitable vacuum reflow profiles are shown on page... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004, J-STD-005
- Solder Alloy: Tin-Gold
from Henkel Corporation - Electronics
Halogen-free, SnPb, Water WashSnPb water washable, halogen-free solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with aqueous cleaner followed by deionized water for 5 to 15 minutes at 40°C to 60°C. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: 63S4, Sn63; Lead Free
from Henkel Corporation - Industrial
LOCTITE LF 310, No-clean Solder paste, Excellent open time, Pb-free soldering. LOCTITE ® LF 310 medium is formulated for use with Pb-free alloys as a no-clean product for printing and reflow in air where process yield is critical. This material offers excellent open time, and good soldering... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
Indium9.52 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Indium9.52 is formulated for reflow in nitrogen... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: ANSI/JSTD-004/5
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
from Henkel Corporation - Electronics
This halide-free, no-clean and Pb-free solder paste has an excellent humidity resistance and a broad process window for both reflow and printing. It offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent solderability over a wide range of... [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Lead Free
from Henkel Corporation - Industrial
LOCTITE LF 318, Solder paste, Pb-free soldering LOCTITE ® LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Normally used with high temperature alloys,... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004, J-STD-005
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
from Henkel Corporation - Electronics
No-clean, Pb-freePb-free solder paste designed for low-temperature, Pb-free solder alloys. This material is formulated to provide excellent dispensability, printability and solderability through various reflow profiles. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: B158; Lead Free
from Henkel Corporation - Industrial
LOCTITE LF 318M, Solder paste, Halide-free, No clean, Low voiding, Pb-free soldering LOCTITE LF 318M is a halide-free, no clean, low voiding Pb-free solder paste which has excellent humidity resistance and a broad process window both for printing and reflow. This product has high tack... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
Indium9.72-HF is a dispensing solder paste designed and formulated specifi cally for die attach processes. The fl ux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of wirebond pads and for improved environmental compliance. Normally used with high temperature... [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Lead-Gold
from Henkel Corporation - Electronics
Halide-free, No-clean, SnPbSnPb, halide-free solder paste designed for high speed printing. Extended printed open time and tack life. Resistant to both hot and cold slump. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: 63S4, Sn62, Sn63; Lead Free
from Henkel Corporation - Industrial
LOCTITE LF 620, Solder paste, Halide-free, No clean, Low voiding, Pb-free soldering LOCTITE ® LF 620 is a halide-free, no clean, low voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and reflow . It shows low hot slump to minimize... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
NC-SMQ ®71 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. NC-SMQ ®71 is formulated for reflow in... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004A, J-STD-005
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Lead-Gold
from Henkel Corporation - Electronics
Halide-free, No-clean, SnPbSnPb, halide-free, high activity solder paste that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly processes, including rheo pump, proflow, large, high-density. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: 63S4, Sn62, Sn63; Lead Free
from Henkel Corporation - Industrial
LOCTITE LM 100, no clean flux, RoHS-compliant, Designed for use with low temperature Pb-free solder alloys LOCTITE ® LM 100 is a RoHS-compliant solder paste designed for use with low-temperature, Pb-free alloys. Formulated to provide excellent dispensability, printability and solderability in... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
NC-SMQ ®75 is a halogen-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0.4% of paste or <5% of flux vehicle. It is designed for reflow in a nitrogen atmosphere of 100-ppm oxygen or less. This product has superior wetting capabilities compared to most... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004, J-STD-005
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
from Henkel Corporation - Electronics
No-clean, SnPbSnPb, halide-containing solder paste formulated for dispensing or printing and reflow in air, where process yield is critical. Offers excellent open time, good soldering activity, especially on OSP copper. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: 63S4, Sn62; Lead Free
from Henkel Corporation - Industrial
LOCTITE 309, Rosin based Cored Solder Wire Flux. LOCTITE ® 309 solid flux is based on a blend of novel activators and resins. It has a mild characteristic odor and leaves a clear pale residue. The alloys used for LOCTITE flux cored solder wires conform to the purity requirements of the common... [See More]
- Product Form: Braze or solder in the form of a paste.; Wire
from Indium Corporation
PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process. [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
from Henkel Corporation - Electronics
SnPb, Water WashSnPb water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time, greatly extended abandon times and good soldering activity over a wide range of reflow profile types and surface... [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: 63S4, Sn62, Sn63; Lead Free
from Henkel Corporation - Industrial
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill LOCTITE ® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
PoP Paste Indium9.91 is a no-clean solder paste designed for use in package-on-package (0.3mm and larger) applications. PoP Paste Indium9.91 has a rheology designed to provide a long-lasting dipping process. Features: Eliminates defects due to package-warping. Air-reflow. Rheology optimized for both... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); SAC305
from Henkel Corporation - Electronics
Pb-free, Water WashPb-free water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time and good soldering activity over a wide range of reflow profiles and surface finishes. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: SAC305, SAC387; Lead Free
from Indium Corporation
SMQ ®51-SC is a dispensing solder paste designed and formulated specifically for die-attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. When used with high temperature alloys, SMQ... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-004, J-STD-005
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
from Indium Corporation
Indium Corporation's Wafer Pastes are a nitrogen refl ow, no-clean solder pastes using Type 5 and Type 6 powder, which are specifi cally formulated for fl ip-chip attachment and CSP and wafer bumping applications. The fl ux is formulated so that it is applicable to Sn/Ag and Sn/Ag/ Cu alloy systems. [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Gold
from Indium Corporation
PoP Flux 89HF-LV is a thixotropic no-clean flux designed for package-on-package applications with Pb-free solders. PoP Flux 89HF-LV has a unique halogen-free activator system. Features: Application by dipping or dispensing. Halogen-free (No interntionally-added halides). Optimized for Pb-Free (SAC... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
Indium6.3 is a halide free, low voiding, water soluble solder paste. Indium6.3 has excellent wetting and solder joint appearance, exceptional printing and response to pause with a wide reflow profile window. Indium6.3 has outstanding slump resistance [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
As a leader in soldering technology, Indium Corporation offers a number of solder pastes for SnPb circuit board assembly. With proven flux technology, these solder pastes will provide the highest end of line yields. Benefits: Excellent wetting on a variety of surface finishes. Fewer voids, reduced... [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
from Indium Corporation
Features: • Eliminates defects due to package-warping. • Air-reflow. • Rheology optimized for both dipping and package-retention. • Designed for use with SAC305 and Sn63/Pb37 alloys. • Excellent solderability. • Long pot life. • Suitable for use down to 0.3mm... [See More]
- Product Form: Braze or solder in the form of a paste.
from Indium Corporation
Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This product formulation offers consistent, repeatable printing performance combined... [See More]
- Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Lead Free
from Indium Corporation
Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications. Indium6.6HF exhibits... [See More]
- Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-006
- Solder Alloy: Lead Free