Dielectric / Insulating Printed Circuit Substrate Materials (PCB / PWB)

10 Results
FARADFLEX® Ultra Thin Advanced Electronic Material, MCxxM -- MC8M, MC12M and MC24M
from Oak-Mitsui Technologies - FaradFlex®

These materials are unfilled dielectrics. The thicknesses available include 24, 12 and 8um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and other high... [See More]

  • Features: Dielectric / Insulating
  • Resistivity: 3.02E13 to 7.20E13
  • Thickness: 3.15E-4 to 9.84E-4
  • Temperature Resistance: 125 to 130
Printed Electronics
from Sheldahl Flexible Technologies - a Flex company

Our Printed Electronics (PE) toolbox is as deep as it is wide, offering an extensive array of possibilities by combining film types, thicknesses, double-sided printing, ink types, and finishing options to produce your desired functionality. From simple switches to complex, functional, multi-layer... [See More]

  • Features: Dielectric / Insulating
  • Materials: Plastic / Polymer; Polyester; PET, PI, PEN
Circuit Board Tape -- DW 904-1
from DeWAL

DW 904-1 uses 1 mil polyester film coated with silicone adhesive. The silicone adhesive will release cleanly. This tape product is transparent for applications where optical clarity is important. APPLICATION INFORMATION. These tapes are used in masking metal parts during bonding or mild acid... [See More]

  • Features: Dielectric / Insulating
  • Thickness: 1.00E-3
  • Materials: Plastic / Polymer; Polyester
  • Width: 0.2500 to 17
CHEMFILM® Skived PTFE Film -- T-100
from Saint-Gobain Tape Solutions

CHEMFILM ® T-100 Premium Skived PTFE film is manufactured from the highest quality virgin PTFE resins. It is engineered to meet the requirements of demanding electrical, mechanical and industrial applications. [See More]

  • Features: Dielectric / Insulating
  • Materials: Fluoropolymer (Teflon); Plastic / Polymer
  • Type: RF / Microwave
  • Thickness: 5.00E-4 to 0.1250
Aluminum Nitride Substrates -- AlN 170
from CoorsTek

CoorsTek developed the standards for thick-film and thin-film substrates and continues to lead the market with innovative materials, manufacturing, and secondary processes. Customers rely on us for cost-effective solutions delivered on time. Aluminum Nitride Advantages. High heat dissipation with... [See More]

  • Features: Dielectric / Insulating
  • Materials: Ceramic Material
FARADFLEX® Ultra Thin Advanced Electronic Material, MCxxTM -- MC8TM, MC12TM
from Oak-Mitsui Technologies - FaradFlex®

These materials are partially filled dielectrics which contain a high Dk ceramic powder. The thicknesses available include 12 and 8um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials... [See More]

  • Features: Dielectric / Insulating
  • Resistivity: 1.20E13 to 1.90E13
  • Thickness: 3.15E-4 to 4.72E-4
Skived PTFE Film -- DW202
from DeWAL

DW202 is a skived PTFE (Polytetrafluoroethylene) film held to close tolerance on width and thickness. DW202 conforms to ASTM D3308 Type II and SAE AMS 3662C. APPLICATION INFORMATION. DW202 finds use in electrical applications where high temperature service rating and superior electrical properties... [See More]

  • Features: Chemical Resistant; Dielectric / Insulating
  • Thickness: 1.00E-3 to 0.0310
  • Materials: Fluoropolymer (Teflon); Plastic / Polymer; PTFE
  • Width: 0.2500 to 11
Mid-Film Ceramic Electronic Substrates -- ADS-995R
from CoorsTek

CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates?. ALUMINA. Alumina is the material of... [See More]

  • Features: Dielectric / Insulating
  • Materials: Ceramic Material
Filled Dielectric -- MC xx T
from Oak-Mitsui Technologies - FaradFlex®

This material is a filled dielectric which contains a high Dk ceramic powder. The thicknesses available include 25 and 16um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed... [See More]

  • Features: Dielectric / Insulating
  • Thickness: 6.30E-4 to 9.84E-4
Thin-Film Ceramic Electronic Substrate -- ADS-995
from CoorsTek

CoorsTek is the leader in custom and standard thin-film ceramic substrates. Four thin-film substrate material options combine smooth surface finish, strong flexural strength, and consistent electrical properties. Why Ceramic Thin-Film Substrates?. Alumina is an optimal material for most thin-film... [See More]

  • Features: Dielectric / Insulating
  • Thickness: 0.0050 to 0.0600
  • Materials: Ceramic Material