Metal Foil / Cladding Printed Circuit Substrate Materials (PCB / PWB)
from Oak-Mitsui Technologies - FaradFlex®
This material is a single sided coated copper which contains a high Dk ceramic powder. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and other high technology... [See More]
- Materials: Copper Foil; Metal Foil
from LG Chemical of America Inc.
Circuit / Semiconductor Materials. LG Chem achieved growth mainly based on high value products. LG Chem boasts competitiveness in the materials used for PCB and semiconductors such as CCL, 2CCL, and DAF. LG Chem started mass-producing 2CCL beginning 2005, and it has been widely used in major IT... [See More]
- Materials: Copper Foil; Metal Foil; Copper Clad Laminates
from Advanced Technical Ceramics Company
AdTech Ceramics is the leading manufacturer of custom designed multilayer aluminum nitride substrates. Aluminum nitride offers high thermal conductivity with an excellent coefficient of thermal expansion (CTE) match to silicon. The material system is stable from cryogenic to high temperatures making... [See More]
- Materials: Aluminum Foil; Metal Foil; Aluminum Nitride