Other / Specialty Technology Semiconductor Power Modules

50 Results
Flip Flops -- SN74ALVCH16374DGVR [SN74ALVCH16374DGVR from Texas Instruments]
from ODG (Origin Data Global)

IC FF D-TYPE DUAL 8BIT 48TVSOP [See More]

  • Technology: D-Type
  • Output Current: 0.0240
  • Input Voltage: 1.65 to 3.6
Flip Flops -- SN74LVC821ADGVR [SN74LVC821ADGVR from Texas Instruments]
from ODG (Origin Data Global)

IC FF D-TYPE SNGL 10BIT 24TVSOP [See More]

  • Technology: D-Type
  • Output Current: 0.0240
  • Input Voltage: 1.65 to 3.6
Power Driver Modules -- BM63963S-VA [BM63963S-VA from ROHM Co., Ltd.]
from ODG (Origin Data Global)

INTELLIGENT POWER MODULE [See More]

  • Technology: IGBT; Intelligent Power Module (IPM); IGBT
Power Driver Modules -- FSB50550BSL [FSB50550BSL from onsemi]
from ODG (Origin Data Global)

INTELLIGENT POWER MODULE, 500V, [See More]

  • Technology: Intelligent Power Module (IPM); MOSFET
Power Driver Modules -- NFAM1012L5B [NFAM1012L5B from onsemi]
from ODG (Origin Data Global)

INTELLIGENT POWER MODULE, SPM31, [See More]

  • Technology: IGBT; Intelligent Power Module (IPM); IGBT
Power Driver Modules -- NFAP0560L3TT [NFAP0560L3TT from onsemi]
from ODG (Origin Data Global)

INTELLIGENT POWER MODULE (IPM), [See More]

  • Technology: IGBT; Intelligent Power Module (IPM); IGBT
fast PACK 0 Power Module -- 10-F4074PA030SM-L623F04
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Clip-in, reliable mechanical connection, qualified for wave soldering. Convex... [See More]

  • Technology: IGBT; IGBT H5
  • Output Voltage: 650
  • Configuration: H-Bridge
  • Output Current: 30
fast PACK 0 Power Module -- 10-FX074PA075SM-L625F07
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Technology: IGBT; IGBT H5
  • Output Voltage: 650
  • Configuration: H-Bridge
  • Output Current: 75
fast PACK 0 Power Module -- 10-FZ074PA030SM-L623F08
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Clip-in, reliable mechanical connection, qualified for wave soldering. Convex... [See More]

  • Technology: IGBT; IGBT H5
  • Output Voltage: 650
  • Configuration: H-Bridge
  • Output Current: 30
fast PACK 0 Power Module -- 10-PC074PA075SM-L625F06Y
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Technology: IGBT; IGBT H5
  • Output Voltage: 650
  • Configuration: H-Bridge
  • Output Current: 75
fast PACK 0 Power Module -- 10-PD074PA075SM-L625F07Y
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Technology: IGBT; IGBT H5
  • Output Voltage: 650
  • Configuration: H-Bridge
  • Output Current: 75
fast PACK 0 Power Module -- 10-PZ074PA030SM-L623F08Y
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Clip-in, reliable mechanical connection, qualified for wave soldering. Convex... [See More]

  • Technology: IGBT; IGBT H5
  • Output Voltage: 650
  • Configuration: H-Bridge
  • Output Current: 30
fast PACK 0 Power Module -- V23990-P627-F89-PM
from Vincotech GmbH

fsw < 50 kHz. Kelvin Emitter for improved switching performance. Temperature sensor. Easy paralleling. High speed switching. Low switching losses. Clip-in, reliable mechanical connection, qualified for wave soldering. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Technology: IGBT; IGBT4 HS
  • Output Voltage: 1200
  • Configuration: H-Bridge
  • Output Current: 15
fast PACK 0 SiC Power Module -- 10-PZ07O2A020RO-LH01J88Y
from Vincotech GmbH

Temperature sensor. Single-phase non-controlled rectifier. No diode recovery losses. Very fast switching. Clip-in, reliable mechanical connection, qualified for wave soldering. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. Press-fit pin. Reliable... [See More]

  • Technology: Rectifier; SiC diode
  • Output Current: 20
  • Output Voltage: 650
fast PACK 1 GaN Power Module -- 10-FY074PC010GN-PL85F08
from Vincotech GmbH

Kelvin Emitter for improved switching performance. Integrated DC capacitor. Open Emitter configuration. Temperature sensor. Fast and controllable fall and rise times. GaN enhancement mode power switch. Zero reverse recovery Qrr. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Technology: GaN E-Mode
  • Output Voltage: 650
  • Configuration: H-Bridge
  • Output Current: 95
fast PACK 1 Power Module -- 10-FY074PA100SM-L583F08
from Vincotech GmbH

fsw > 30 kHz. Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. [See More]

  • Technology: IGBT; IGBT H5
  • Output Voltage: 650
  • Configuration: H-Bridge
  • Output Current: 100
fast PACK 1 Power Module -- 10-FY124PA040SH-L588F48
from Vincotech GmbH

Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. Easy paralleling. High speed switching. Low switching losses. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. Solder pin [See More]

  • Technology: IGBT; IGBT4 HS
  • Output Voltage: 1200
  • Configuration: H-Bridge
  • Output Current: 40
fast PACK 1 Power Module -- 10-PG07ORA160RF-LJ53I88T
from Vincotech GmbH

Temperature sensor. Single-phase non-controlled rectifier. Low diode recovery losses. Low reverse recovery time and recovery charge. Designed for high switching frequency. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. Press-fit pin. Reliable cold... [See More]

  • Technology: Rectifier; Fast diode
  • Output Current: 160
  • Output Voltage: 650
fast PACK 1 Power Module -- 10-PY074PA100SM-L583F08Y
from Vincotech GmbH

fsw > 30 kHz. Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. [See More]

  • Technology: IGBT; IGBT H5
  • Output Voltage: 650
  • Configuration: H-Bridge
  • Output Current: 100
fast PACK 1 Power Module -- 10-PY120RA060VH-LJ92I08Y
from Vincotech GmbH

Integrated DC capacitor. Temperature sensor. Single-phase non-controlled rectifier. Integrated by-pass diode. Designed for high switching frequency. Low forward voltage drop. Low reverse recovery time and recovery charge. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Technology: Rectifier; Fast diode
  • Output Current: 60
  • Output Voltage: 1200
fast PACK 1 Power Module -- 10-PY124PA040SH-L588F48Y
from Vincotech GmbH

Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. Easy paralleling. High speed switching. Low switching losses. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. Press-fit pin. Reliable cold welding... [See More]

  • Technology: IGBT; IGBT4 HS
  • Output Voltage: 1200
  • Configuration: H-Bridge
  • Output Current: 40
fast PACK E1 SiC Power Module -- 10-EZ124PA016ME-LQ18F18T
from Vincotech GmbH

Equivalent: F4-17MR12W1M1HP_B76. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High Blocking Voltage with low drain source on state resistance. High speed SiC-MOSFET technology. Resistant to Latch-up. Convex shaped substrate for superior thermal... [See More]

  • Technology: SiC; SiC MOSFET
  • Output Voltage: 1200
  • Configuration: H-Bridge
  • Output Current: 70
fast PACK E1 SiC Power Module -- 10-EZ124PA018MR-LR09F08T
from Vincotech GmbH

Kelvin Emitter for improved switching performance. Temperature sensor. Easy paralleling. Low on-resistance. Fast switching speed. Fast recovery body diode. Convex shaped substrate for superior thermal contact. Compact housing. CTI600 housing material. Thermo-mechanical push-and-pull force relief. [See More]

  • Technology: SiC; SiC MOSFET
  • Output Voltage: 1200
  • Configuration: H-Bridge
  • Output Current: 50
fast PACK E1 SiC Power Module -- 10-EZ124PA020MS-LQ18F78T
from Vincotech GmbH

Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High Blocking Voltage with low drain source on state resistance. High speed SiC-MOSFET technology. Resistant to Latch-up. Convex shaped substrate for superior thermal contact. Compact housing. CTI600... [See More]

  • Technology: SiC; SiC MOSFET
  • Output Voltage: 1200
  • Configuration: H-Bridge
  • Output Current: 70
fast PACK E1 SiC Power Module -- 10-EZ124RA010RO-LS06J88T
from Vincotech GmbH

Temperature sensor. Single-phase non-controlled rectifier. No diode recovery losses. Very fast switching. Convex shaped substrate for superior thermal contact. Compact housing. CTI600 housing material. Thermo-mechanical push-and-pull force relief. Press-fit pin. Reliable cold welding connection [See More]

  • Technology: Rectifier; SiC diode
  • Output Current: 10
  • Output Voltage: 1200
fast PACK E2 SiC Power Module -- 10-EY124PA011ME-LP40F18T
from Vincotech GmbH

Equivalent: F4-11MR12W2M1HP_B76. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High Blocking Voltage with low drain source on state resistance. High speed SiC-MOSFET technology. Resistant to Latch-up. Convex shaped substrate for superior thermal... [See More]

  • Technology: SiC; SiC MOSFET
  • Output Voltage: 1200
  • Configuration: H-Bridge
  • Output Current: 120
fast PACK E2 SiC Power Module -- 10-EY124PA016ME01-LP49F16T
from Vincotech GmbH

AlN Substrate for enhanced thermal performance. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High Blocking Voltage with low drain source on state resistance. High speed SiC-MOSFET technology. Resistant to Latch-up. Convex shaped substrate for... [See More]

  • Technology: SiC; SiC MOSFET
  • Output Voltage: 1200
  • Configuration: H-Bridge
  • Output Current: 80
fast PACK S3 SiC Power Module -- B0-SP12ORA080RO-LM90J48T
from Vincotech GmbH

Temperature sensor. Ultrafast output rectifier. No diode recovery losses. Very fast switching. CTI600 housing material. Compact, baseplate-less housing. VINcoPress Technology. Thermo-mechanical push-and-pull force relief. Press-fit pin. Reliable cold welding connection [See More]

  • Technology: Rectifier; SiC diode
  • Output Current: 80
  • Output Voltage: 1200
flow 3xANPFC 0 Power Module -- 10-FU073AA030SM-PF04H06
from Vincotech GmbH

3ph Advanced Neutral PFC. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. Solder pin [See More]

  • Technology: IGBT; IGBT H5
  • Output Voltage: 650
  • Configuration: Power Factor Correction (PFC)
  • Output Current: 30
flow 3xANPFC 1 Power Module -- 10-FY073AA030RG04-LK12L03
from Vincotech GmbH

3x Advanced Neutral Boost PFC. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. Solder pin [See More]

  • Technology: IGBT; IGBT fast
  • Output Voltage: 650
  • Configuration: Power Factor Correction (PFC)
  • Output Current: 30
flow 3xANPFC 1 Power Module -- 10-PY073AA050RG01-LK14L08Y
from Vincotech GmbH

3x Advanced Neutral Boost PFC. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. Press-fit pin. Reliable cold welding connection [See More]

  • Technology: IGBT; IGBT fast
  • Output Voltage: 650
  • Configuration: Power Factor Correction (PFC)
  • Output Current: 50