Other / Specialty Configuration Semiconductor Power Modules
from Infineon Technologies AG
CIPOS ™ Mini 600 V, 10 A PFC-integrated three-phase intelligent power module. CIPOS ™ Mini 600 V, 10 A three-phase TRENCHSTOP ™ IGBT based intelligent power module with PFC switching optimized for 40 kHz. It integrates single boost Power Factor Correction (PFC) stage and inverter... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: DIP 36x21D
- Configuration: Power Factor Correction (PFC); PFC Integrated
- Input Current: 10
from Infineon Technologies AG
CIPOS ™ Mini 650 V, 20 A two-phase interleaved PFC intelligent power module. CIPOS ™ Mini 650 V, 20 A two-phase TRENCHSTOP ™ IGBT based intelligent power module in DIP 36x21D package that provides fully featured interleaved Power Factor Correction (PFC) input power stage. Perfectly... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: DIP 36x21D
- Configuration: Power Factor Correction (PFC); 2 Phase Interleaved PFC
- Input Current: 20
from Infineon Technologies AG
CIPOS ™ Mini 600 V, 4 A three-phase intelligent power module. CIPOS ™ Mini 600 V, 4 A three-phase intelligent power module with open emitter in DIP 36x21 package. It provides cost and performance optimized efficiency incorporating Reverse Conducting (RC) IGBT along with excellent thermal... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: DIP 36x21
- Configuration: Three Phase; 3 Phase Open Emitter
- Input Current: 4
from Infineon Technologies AG
CIPOS ™ Nano 250 V, 4 A full-bridge Intelligent Power Module. CIPOS ™ Nano 250 V, 4 A full-bridge OptiMOS ™ based intelligent power module with open source in PQFN 12x10 mm package, providing a compact motor drive solution for single phase motor applications. Summary of Features. [See More]
- Technology: Intelligent Power Module (IPM)
- Package: QFN 12x10
- Configuration: Full Bridge; Full-Bridge
- Input Current: 4
from Infineon Technologies AG
CIPOS ™ Micro 600 V, 6 A three-phase RCD2 IGBT based intelligent power module with open emitter in SOP 29x12 package providing fully-featured compact inverter solution for low motor drive applications like fans, pumps and light load appliances. Summary of Features. Reverse Conducting IGBT Gen... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: SOP 29x12
- Configuration: Three Phase; 3 Phase Open Emitter
- Input Current: 6
from Infineon Technologies AG
CIPOS ™ Micro 600 V, 6 A three-phase intelligent power module. CIPOS ™ Micro 600 V, 6 A three-phase RCD2 IGBT based intelligent power module with open emitter in DIP 29x12 package providing fully-featured compact inverter solution for low motor drive applications like fans, pumps and... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: DIP 29x12
- Configuration: Three Phase; 3 Phase Open Emitter
- Input Current: 6
from Infineon Technologies AG
CIPOS ™ Mini 600 V, 30 A three-phase intelligent power module. CIPOS ™ Mini 600 V, 30 A three-phase TRENCHSTOP ™ IGBT based intelligent power module with open emitter in DIP 36x21D package. It provides fully featured compact inverter solution with DCB substrate to enable excellent... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: DIP 36x21D
- Configuration: Three Phase; 3 Phase Open Emitter
- Input Current: 30
from Infineon Technologies AG
CIPOS ™ Maxi 1200 V, 15 A three-phase intelligent power module. CIPOS ™ Maxi 1200 V, 15 A three-phase IGBT based intelligent power module with open emitter in DIP 36x23D package providing fully-featured compact inverter solution with excellent thermal conduction for motor drive... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: DIP 36x23D
- Configuration: Three Phase; 3 Phase Open Emitter
- Input Current: 15
from Infineon Technologies AG
CIPOS ™ Maxi 1200 V, 20 A three-phase Intelligent Power Module. CIPOS ™ Maxi 1200 V, 20 A three-phase CoolSiC ™ MOSFET based intelligent power module with open emitter in DIP 36x23D package providing fully-featured compact inverter solution with excellent thermal conduction for... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: DIP 36x23D
- Configuration: Three Phase; 3 Phase Open Emitter
- Input Current: 20
from Infineon Technologies AG
CIPOS ™ Nano 100 V, 0.02 Ω half-bridge intelligent power module. CIPOS ™ Nano 100 V, 0.02 Ω half-bridge MOSFET based intelligent power module providing ultra compact, half-bridge topology solution through a rugged IC in a small QFN package for small home appliances, low power... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: QFN 7x8
- Configuration: Half-Bridge; Half-Bridge
- Input Current: 30
from Infineon Technologies AG
CIPOS ™ Nano 500 V, 1.7 Ω half-bridge intelligent power module. CIPOS ™ Nano 500 V, 1.7 Ω half-bridge MOSFET based intelligent power module in QFN 8x9 package providing ultra compact, half-bridge topology solution through a rugged IC in the small QFN package for small home... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: QFN 8x9
- Configuration: Half-Bridge; Half-Bridge
- Input Current: 4
from Infineon Technologies AG
CIPOS ™ Nano 500 V, 6 Ω three-phase intelligent power module. CIPOS ™ Nano 500 V, 6 Ω three-phase MOSFET based intelligent power module with open source in QFN 12x12 package providing fully-featured compact inverter solution with excellent thermal conduction for motor drive... [See More]
- Technology: Intelligent Power Module (IPM)
- Input Current: 1
- Configuration: Three Phase; 3 Phase Open Source
- Output Voltage: 500
from Infineon Technologies AG
CIPOS ™ Mini 600 V 50 A, three-phase IGBT based intelligent power module with open emitter in DIP 36x21 package. It provides fully featured compact inverter solution with excellent thermal performance and power loss for motor drive applications including industrial motor drives, pumps, fan... [See More]
- Technology: Intelligent Power Module (IPM)
- Package: DIP 36x21D
- Configuration: Three Phase; 3 Phase Open Emitter
- Input Current: 50
from Vincotech GmbH
Kelvin Emitter for improved switching performance. Temperature sensor. Bypass Diode. 3x Booster. Easy paralleling. High speed switching. Low switching losses. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. Solder pin [See More]
- Technology: IGBT; IGBT4 HS
- Output Voltage: 1200
- Configuration: Booster
- Output Current: 80
from Vincotech GmbH
Kelvin Emitter for improved switching performance. Temperature sensor. 3ph Flying Cap inverter. Triple Flying Cap Buck/Boost. Low collector emitter saturation voltage. High speed and smooth switching. CTI600 housing material. Compact, baseplate-less housing. VINcoPress Technology. Thermo-mechanical... [See More]
- Technology: IGBT; IGBT S7
- Output Voltage: 950
- Configuration: Three-level FC Inverter
- Output Current: 100
from Vincotech GmbH
Kelvin Emitter for improved switching performance. Integrated DC capacitor. Temperature sensor. Triple Buck-Boost. Low collector emitter saturation voltage. High speed and smooth switching. CTI600 housing material. Compact, baseplate-less housing. VINcoPress Technology. Thermo-mechanical... [See More]
- Technology: IGBT; IGBT S7
- Output Voltage: 950
- Configuration: Buck-Booster Symmetric
- Output Current: 100
from Vincotech GmbH
IGBT4 HS, IGBT3. Three-phase Mixed Voltage Neutral Point Clamped Topology (T-Type). Kelvin Emitter for improved switching performance. Temperature sensor. Easy paralleling. High speed switching. Low switching losses. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]
- Technology: IGBT; IGBT4 HS
- Output Voltage: 1200
- Configuration: Three-level MNPC (T-Type)
- Output Current: 25
from Vincotech GmbH
Kelvin Emitter for improved switching performance. Temperature sensor. Three-phase Mixed Voltage Neutral Point Clamped Topology (T-Type). Easy paralleling. High speed switching. Low switching losses. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. [See More]
- Technology: IGBT; IGBT4 HS
- Output Voltage: 1200
- Configuration: Three-level MNPC (T-Type)
- Output Current: 25
from Vincotech GmbH
IGBT4 HS, IGBT3. Kelvin Emitter for improved switching performance. Temperature sensor. Three-phase Mixed Voltage Neutral Point Clamped Topology (T-Type). Easy paralleling. High speed switching. Low switching losses. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]
- Technology: IGBT; IGBT4 HS
- Output Voltage: 1200
- Configuration: Three-level MNPC (T-Type)
- Output Current: 25
from Vincotech GmbH
IGBT4 HS, IGBT3. Kelvin Emitter for improved switching performance. Temperature sensor. Three-phase Mixed Voltage Neutral Point Clamped Topology (T-Type). Easy paralleling. High speed switching. Low switching losses. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]
- Technology: IGBT; IGBT4 HS
- Output Voltage: 1200
- Configuration: Three-level MNPC (T-Type)
- Output Current: 25
from Vincotech GmbH
Kelvin Emitter for improved switching performance. Temperature sensor. Three-phase Mixed Voltage Neutral Point Clamped Topology (T-Type). High speed switching. Low collector emitter saturation voltage. Low turn-off losses. Optimized for hard switching topologies. Positive temperature coefficient. [See More]
- Technology: IGBT; IGBT7 H7
- Output Voltage: 1200
- Configuration: Three-level MNPC (T-Type)
- Output Current: 150
from Vincotech GmbH
Three-phase Neutral Point Clamped Topology (I-Type). Kelvin Emitter for improved switching performance. Temperature sensor. High speed and smooth switching. Low gate charge. Very low collector emitter saturation voltage. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]
- Technology: IGBT; IGBT S5
- Output Voltage: 650
- Configuration: Three-level NPC (I-Type)
- Output Current: 30
from Vincotech GmbH
Brake+Inverter. Open Emitter configuration. Temperature sensor. Easy paralleling. Low collector emitter saturation voltage. Low turn-off losses. Positive temperature coefficient. Clip-in, reliable mechanical connection, qualified for wave soldering. Convex shaped substrate for superior thermal... [See More]
- Technology: IGBT; IGBT7
- Output Voltage: 650
- Configuration: Sevenpack
- Output Current: 20
from Vincotech GmbH
Open Emitter configuration. Temperature sensor. Brake+Inverter. Easy paralleling. Low turn-off losses. Low collector emitter saturation voltage. Positive temperature coefficient. Short tail current. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. [See More]
- Technology: IGBT; IGBT4
- Output Voltage: 1200
- Configuration: Sevenpack
- Output Current: 8
from Vincotech GmbH
Brake+Inverter. Open Emitter configuration. Temperature sensor. High speed and smooth switching. Low gate charge. Very low collector emitter saturation voltage. Single screw heat sink mounting. Ultra-compact design. Thermo-mechanical push-and-pull force relief. Solder pin [See More]
- Technology: IGBT; IGBT S5
- Output Voltage: 650
- Configuration: Sevenpack
- Output Current: 30
from Vincotech GmbH
Brake+Inverter. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. Easy paralleling. Low turn-off losses. Low collector emitter saturation voltage. Positive temperature coefficient. Short tail current. Convex shaped substrate for superior thermal... [See More]
- Technology: IGBT; IGBT4
- Output Voltage: 1200
- Configuration: Sevenpack
- Output Current: 35
from Vincotech GmbH
Inverter. Brake Chopper. Open Emitter configuration. Kelvin Emitter for improved switching performance. Temperature sensor. Easy paralleling. Low turn-off losses. Low collector emitter saturation voltage. Positive temperature coefficient. Short tail current. Convex shaped baseplate for superior... [See More]
- Technology: IGBT; IGBT4
- Output Voltage: 1200
- Configuration: Sevenpack
- Output Current: 50
from Vincotech GmbH
Three-phase Rectifier. Brake Chopper. High inrush current capability. 90 ° mounting angle between heatsink and PCB. Screw-on heatsink mounting. Clip-in PCB mounting. Thermo-mechanical push-and-pull force relief. Solder pin [See More]
- Technology: Rectifier; Rectifier
- Output Voltage: 1600
- Configuration: Rectifier (+Brake)
- Output Current: 42
from Vincotech GmbH
Three-phase Half Controlled Converter. Open Emitter configuration. Brake Chopper. High inrush current capability. 90 ° mounting angle between heatsink and PCB. Screw-on heatsink mounting. Clip-in PCB mounting. Thermo-mechanical push-and-pull force relief. Solder pin [See More]
- Technology: Thyristor; Thyristor (SCR)
- Output Voltage: 1600
- Configuration: Rectifier (+Brake)
- Output Current: 36
from Vincotech GmbH
Three-phase Rectifier. Brake Chopper. Temperature sensor. High inrush current capability. 90 ° mounting angle between heatsink and PCB. Screw-on heatsink mounting. Clip-in PCB mounting. Thermo-mechanical push-and-pull force relief. Solder pin [See More]
- Technology: Rectifier; Rectifier
- Output Voltage: 1600
- Configuration: Rectifier (+Brake)
- Output Current: 39
from Vincotech GmbH
Brake Chopper. Brake sense. Common rectifier and brake DC+. Temperature sensor. Three-phase Rectifier. High inrush current capability. 90 ° mounting angle between heatsink and PCB. Screw-on heatsink mounting. Clip-in PCB mounting. Thermo-mechanical push-and-pull force relief. Solder pin [See More]
- Technology: Thyristor; Thyristor (SCR)
- Output Voltage: 1600
- Configuration: Rectifier (+Brake)
- Output Current: 36
from Vincotech GmbH
Three-phase Rectifier. Brake Chopper. Temperature sensor. Easy paralleling. Low turn-off losses. Low collector emitter saturation voltage. Positive temperature coefficient. Short tail current. 90 ° mounting angle between heatsink and PCB. Screw-on heatsink mounting. Clip-in PCB mounting. [See More]
- Technology: IGBT; IGBT4
- Output Voltage: 1200
- Configuration: Rectifier (+Brake)
- Output Current: 100
from Vincotech GmbH
Converter+PFC+Inverter. Open Emitter configuration. Temperature sensor. Easy paralleling. Low turn-off losses. Positive temperature coefficient. Short tail current. 90 ° mounting angle between heatsink and PCB. Screw-on heatsink mounting. Clip-in PCB mounting. Thermo-mechanical push-and-pull... [See More]
- Technology: IGBT; IGBT3 LL
- Output Voltage: 600
- Configuration: Power Factor Correction (PFC); PIM+PFC (CIP)
- Output Current: 20
from Vincotech GmbH
Temperature sensor. Advanced Neutral Point Clamped topology. Split output for improved switching performance. Split topology. Easy paralleling. Low on-resistance. Fast switching speed. Fast recovery body diode. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull... [See More]
- Technology: SiC; SiC MOSFET
- Output Voltage: 1200
- Configuration: Three-level ANPC
- Output Current: 150
from Vincotech GmbH
Temperature sensor. Advanced Neutral Point Clamped topology. Split output for improved switching performance. Split topology. Easy paralleling. Low on-resistance. Fast switching speed. Fast recovery body diode. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull... [See More]
- Technology: SiC; SiC MOSFET
- Output Voltage: 1200
- Configuration: Three-level ANPC
- Output Current: 150
from Vincotech GmbH
Temperature sensor. Advanced Neutral Point Clamped topology. Low collector emitter saturation voltage. High speed and smooth switching. Convex shaped baseplate for superior thermal contact. Cu baseplate. Thermo-mechanical push-and-pull force relief. Solder pin [See More]
- Technology: IGBT; IGBT S7
- Output Voltage: 950
- Configuration: Three-level ANPC
- Output Current: 200
from Vincotech GmbH
Advanced Neutral Point Clamped topology. Integrated snubber capacitor. Split output for improved switching performance. Temperature sensor. High speed and smooth switching. Low gate charge. Very low collector emitter saturation voltage. Convex shaped baseplate for superior thermal contact. Cu... [See More]
- Technology: IGBT; IGBT S5
- Output Voltage: 650
- Configuration: Three-level ANPC
- Output Current: 300
from Vincotech GmbH
Temperature sensor. Advanced Neutral Point Clamped topology. Low collector emitter saturation voltage. High speed and smooth switching. Convex shaped baseplate for superior thermal contact. Cu baseplate. Thermo-mechanical push-and-pull force relief. Press-fit pin. Reliable cold welding connection [See More]
- Technology: IGBT; IGBT S7
- Output Voltage: 950
- Configuration: Three-level ANPC
- Output Current: 200