H-Bridge Semiconductor Power Modules

18 Results
Full Silicon Carbide Power Modules
from Semikron, Inc.

Highest Power Output and Efficiency. SEMIKRON offers Full Silicon Carbide Power Modules in MiniSKiiP, SEMITOP and SEMITRANS housings. By using SiC MOSFETs of the leading suppliers highest output power and power densities are reached in combination with high switching frequencies, lowest losses and... [See More]

  • Configuration: Half-Bridge; H-Bridge; Six-Pack
  • Output Voltage: 1200 to 1700
  • Technology: SiC
  • Output Current: 18 to 478
fast PACK 0 Power Module -- 10-F4074PA030SM-L623F04
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Clip-in, reliable mechanical connection, qualified for wave soldering. Convex... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 650
  • Technology: IGBT; IGBT H5
  • Output Current: 30
fast PACK 0 Power Module -- 10-FX074PA075SM-L625F07
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 650
  • Technology: IGBT; IGBT H5
  • Output Current: 75
fast PACK 0 Power Module -- 10-FZ074PA030SM-L623F08
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Clip-in, reliable mechanical connection, qualified for wave soldering. Convex... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 650
  • Technology: IGBT; IGBT H5
  • Output Current: 30
fast PACK 0 Power Module -- 10-PC074PA075SM-L625F06Y
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 650
  • Technology: IGBT; IGBT H5
  • Output Current: 75
fast PACK 0 Power Module -- 10-PD074PA075SM-L625F07Y
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 650
  • Technology: IGBT; IGBT H5
  • Output Current: 75
fast PACK 0 Power Module -- 10-PZ074PA030SM-L623F08Y
from Vincotech GmbH

Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Clip-in, reliable mechanical connection, qualified for wave soldering. Convex... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 650
  • Technology: IGBT; IGBT H5
  • Output Current: 30
fast PACK 0 Power Module -- V23990-P627-F89-PM
from Vincotech GmbH

fsw < 50 kHz. Kelvin Emitter for improved switching performance. Temperature sensor. Easy paralleling. High speed switching. Low switching losses. Clip-in, reliable mechanical connection, qualified for wave soldering. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 1200
  • Technology: IGBT; IGBT4 HS
  • Output Current: 15
fast PACK 1 GaN Power Module -- 10-FY074PC010GN-PL85F08
from Vincotech GmbH

Kelvin Emitter for improved switching performance. Integrated DC capacitor. Open Emitter configuration. Temperature sensor. Fast and controllable fall and rise times. GaN enhancement mode power switch. Zero reverse recovery Qrr. Convex shaped substrate for superior thermal contact. Thermo-mechanical... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 650
  • Technology: GaN E-Mode
  • Output Current: 95
fast PACK 1 Power Module -- 10-FY074PA100SM-L583F08
from Vincotech GmbH

fsw > 30 kHz. Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. [See More]

  • Configuration: H-Bridge
  • Output Voltage: 650
  • Technology: IGBT; IGBT H5
  • Output Current: 100
fast PACK 1 Power Module -- 10-FY124PA040SH-L588F48
from Vincotech GmbH

Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. Easy paralleling. High speed switching. Low switching losses. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. Solder pin [See More]

  • Configuration: H-Bridge
  • Output Voltage: 1200
  • Technology: IGBT; IGBT4 HS
  • Output Current: 40
fast PACK 1 Power Module -- 10-PY074PA100SM-L583F08Y
from Vincotech GmbH

fsw > 30 kHz. Integrated DC capacitor. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High efficiency in hard switching and resonant topologies. High speed switching. Low gate charge. Convex shaped substrate for superior thermal contact. [See More]

  • Configuration: H-Bridge
  • Output Voltage: 650
  • Technology: IGBT; IGBT H5
  • Output Current: 100
fast PACK 1 Power Module -- 10-PY124PA040SH-L588F48Y
from Vincotech GmbH

Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. Easy paralleling. High speed switching. Low switching losses. Convex shaped substrate for superior thermal contact. Thermo-mechanical push-and-pull force relief. Press-fit pin. Reliable cold welding... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 1200
  • Technology: IGBT; IGBT4 HS
  • Output Current: 40
fast PACK E1 SiC Power Module -- 10-EZ124PA016ME-LQ18F18T
from Vincotech GmbH

Equivalent: F4-17MR12W1M1HP_B76. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High Blocking Voltage with low drain source on state resistance. High speed SiC-MOSFET technology. Resistant to Latch-up. Convex shaped substrate for superior thermal... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 1200
  • Technology: SiC; SiC MOSFET
  • Output Current: 70
fast PACK E1 SiC Power Module -- 10-EZ124PA018MR-LR09F08T
from Vincotech GmbH

Kelvin Emitter for improved switching performance. Temperature sensor. Easy paralleling. Low on-resistance. Fast switching speed. Fast recovery body diode. Convex shaped substrate for superior thermal contact. Compact housing. CTI600 housing material. Thermo-mechanical push-and-pull force relief. [See More]

  • Configuration: H-Bridge
  • Output Voltage: 1200
  • Technology: SiC; SiC MOSFET
  • Output Current: 50
fast PACK E1 SiC Power Module -- 10-EZ124PA020MS-LQ18F78T
from Vincotech GmbH

Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High Blocking Voltage with low drain source on state resistance. High speed SiC-MOSFET technology. Resistant to Latch-up. Convex shaped substrate for superior thermal contact. Compact housing. CTI600... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 1200
  • Technology: SiC; SiC MOSFET
  • Output Current: 70
fast PACK E2 SiC Power Module -- 10-EY124PA011ME-LP40F18T
from Vincotech GmbH

Equivalent: F4-11MR12W2M1HP_B76. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High Blocking Voltage with low drain source on state resistance. High speed SiC-MOSFET technology. Resistant to Latch-up. Convex shaped substrate for superior thermal... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 1200
  • Technology: SiC; SiC MOSFET
  • Output Current: 120
fast PACK E2 SiC Power Module -- 10-EY124PA016ME01-LP49F16T
from Vincotech GmbH

AlN Substrate for enhanced thermal performance. Kelvin Emitter for improved switching performance. Open Emitter configuration. Temperature sensor. High Blocking Voltage with low drain source on state resistance. High speed SiC-MOSFET technology. Resistant to Latch-up. Convex shaped substrate for... [See More]

  • Configuration: H-Bridge
  • Output Voltage: 1200
  • Technology: SiC; SiC MOSFET
  • Output Current: 80