Products/Services for HTCC Ceramic Package Manufacturers
-
Industrial Ceramic Materials - (413 companies)How to Select Industrial Ceramic Materials. Industrial ceramic materials are non-metallic, inorganic compounds that include oxides, carbides, or nitrides. They have high melting points, low wear resistance, and a wide range of electrical properties...ApplicationsMaterial TypeShape / Form -
Packaging Machines - (2535 companies)Packaging machines are used to package products or components, including equipment that forms, fills, seals, wraps, cleans and packages at different levels of automation. Packaging machines are used to package products or components. This product... -
Ceramic Capacitors - (276 companies)...for fixed ceramic capacitors. MIL-PRF-20 [series] -- Reliability of ceramic capacitors. Additional Specifications. For information on additional selection details, including packaging, mounting, and product features, please visit the Capacitors... -
Electronic Packages and Lids - (16 companies)Electronic Packages and Lids are used in the microelectronic and fiber optic industry. Packages and lids are used to enclose electronic chips and interface with circuit boards. They are typicaly customized to customer requirements.
-
Ceramic Bearings - (106 companies)Ceramic hybrid bearings, the most common type of ceramic bearing, are constructed of steel inner and outer rings with ceramic (typically Si3N4) balls in place of steel. Common types of ceramic bearings are angular contact and conrad. Description... -
Ceramic Fabrication Services - (237 companies)Ceramic fabrication services produce parts and assemblies made of ceramic or refractory materials for electrical, thermal, optical, wear and mechanical, or structural applications. In addition to applications and industries served, ceramic...
-
Ceramic Tube and Ceramic Rod Products - (184 companies)Ceramic tube and ceramic rod products are suitable for use in applications requiring high temperature strength, erosion resistance, electrical or thermal insulation, and other specialized characteristics. Description. Ceramic tube and ceramic rod...
-
Ceramic Balls - (71 companies)Ceramic balls are spherical, rolling elements that provide higher stiffness, lower thermal expansion, lighter weight, increased corrosion resistance, and higher electrical resistance than steel balls. They are made from a variety of ceramic...
-
Electronic and IC Packaging Services - (106 companies)Electronic packaging and IC packaging services perform the final stage of semiconductor device fabrication, places dies or boards inside of a protective package that provides connectors or pins for connecting to other devices. Electronic packaging...
-
Packaging Equipment Design and Fabrication - (198 companies)Packaging equipment design and packaging equipment fabrication services specialize in the design and fabrication of packaging equipment and packaging products. Packaging equipment design and fabrication services are typically part of a new product...
Product News
-
Suntech Applied Materials (Hefei) Co.,Ltd
HTCC Multi-Layer Co-Fired Ceramic Substrate HTCC (High-Temperature Co-fired Ceramic) multi-layer co-fired ceramic substrate packaging technology provides a reliable solution for high-performance electronics. This advanced technology leverages the superior properties of HTCC materials, including high mechanical strength, thermal conductivity, and chemical stability. These materials are ideal for applications that demand high thermal resistance and electrical performance under extreme conditions. HTCC substrates are often used in fields... (read more)Browse Specialty Ceramics Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
3X Ceramic Parts Company Limited
Ceramic Substrate for LED Packaging As an important component of LED, packaging substrates are also changing with the development of LED chip technology. At present, metal and ceramic substrates are mainly used in LED heat dissipation substrates. Metal substrates are made of aluminum or copper. Because of their mature technology and cost advantages, they are currently used in general LED products. Ceramic substrates have high alignment accuracy and are recognized as excellent materials for heat conduction and heat dissipation... (read more)Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Xiamen Innovacera Advanced Materials Co., Ltd.
Hermetic Optoelectronic Packaging Solutions provide customized services. Product model. -Signal processing device housing. -Power module package. -Motor drives and PWM package. -Ceramic package for semiconductor discrete device. -Replay package. -Lid and cap. -Power surface mount package. HTCC ceramic package shell. -Ceramic Dual in-line Package (CDIP). -Ceramic Flat Pack /Ceramic Quad Flat Pack (CFP/CQFP). -Ceramic Quad Flat Non -leded Package?CQFN). -Ceramic Pin Grid Array (CPGA). -Ceramic Small Outline Package (CSOP). -Ceramic... (read more) -
Xiamen Innovacera Advanced Materials Co., Ltd.
Black Alumina Ceramic for Package Black alumina ceramics are made from alumina materials by doping specific metal or non-metal ions. These dopants can absorb various light waves in the visible light spectrum, thereby achieving a stable black appearance. This material can meet the light-shielding requirements of some electronic products in high-reliability packaging. Moreover, compared with other ceramic materials, it has numerous advantages and enjoys extensive practical value in industrial applications. The core advantages... (read more)Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Suntech Applied Materials (Hefei) Co.,Ltd
Advanced Al2O3/AIN Ceramic Packages Our Advanced Al2O3/AIN Ceramic Packages are engineered to deliver precision, durability, and superior sealing in demanding electronic environments. These packages offer tailored Ni and Au coating thicknesses, meeting exact customer specifications for optimal bonding and conductivity. Built to meet the stringent GJB 2440A-2006 standard for helium leak testing, these ceramic packages ensure exceptional gas tightness, making them a trusted choice for mission-critical systems. Whether used... (read more)Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Suntech Applied Materials (Hefei) Co.,Ltd
High-Performance Semiconductor Ceramic Packaging Our semiconductor ceramic packaging technology provides exceptional benefits for professional engineers and buyers seeking long-lasting, high-performance solutions. These packages ensure superior physical, electrical, and thermal properties, making them ideal for demanding industries such as electronics, telecommunications, and automotive. By using this innovative packaging, engineers can improve the longevity, reliability, and efficiency of their products, reducing failure rates and enhancing... (read more)Browse Ceramic Tube and Ceramic Rod Products Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Xiamen Unipretec Ceramic Technology Co., Ltd.
Ceramic Substrate Ceramic Substrate Introduction. 96% Alumina Substrate. 96% Alumina (Al2O3) substrate is considered as one of the most cost-effective substrate materials. It possesses comprehensive properties of outstanding strength, good thermal conductivity, and stable electrical insulation. Another characteristic that makes it suited for both thin film and thick film metalization is its smooth surface. 96% alumina substrate is widely utilized in LED packages, chip resistor substrates, HIC substrates for heat... (read more)Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Micro Crystal AG
Precision Timing in a Tiny Package Real-Time Clock (RTC) Modules with Ultra Low Power in Compact Packages. Real-Time Clock (RTC) Modules combine a 32.768 kHz XTAL with a CMOS based oscillator and RTC IC inside a miniature SMD ceramic package. Ultra low power consumption: 45nA. High accuracy: +- 1 ppm, +- 0.09s/day. Smallest package: 2.0 x 1.2 x 0.7 mm. Extended temperature range up to +125 C including AEC-Q200 (read more)Browse IC Clocks Datasheets for Micro Crystal AG -
Suntech Applied Materials (Hefei) Co.,Ltd
AlN: The Future of Semiconductor Packaging and ensuring reliable operation in semiconductor devices. Advanced Ceramic Substrates: AlN outperforms traditional alumina (Al2O3) substrates by offering superior heat dissipation and supporting the development of more efficient and reliable electronic components. By integrating AlN into your design, you can address the growing demand for higher performance, efficiency, and durability in semiconductor devices and electronics packaging. (read more)Browse Specialty Ceramics Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Suntech Applied Materials (Hefei) Co.,Ltd
Advanced Ceramics for Cosmetic Packaging Advanced Ceramics for High-End Cosmetic Packaging by Suntech. Suntech Applied Materials (Hefei) Co., Ltd. delivers advanced ceramic solutions tailored for luxury cosmetic packaging. These ceramics combine balanced weight and a cool tactile feel with an impeccable surface finish, providing both superior functionality and aesthetic appeal. Compared to standard ceramics, Suntech 's advanced ceramics exhibit higher hardness, precision, and a flawless finish, ensuring smooth and uniform cosmetic... (read more)Browse Zirconium Oxide and Zirconia Ceramics Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd
More Information
Indicates content that may require registration and/or purchase.
-
Front matter
Schott Electronic Packaging is a leading manufacturer of hermetic housings and other components for the reliable, ling-lasting pro- tection of sensitive electronics. Drawing upon more that 125 years of experience in glass development and processing, our core technologies include glass/ cera- mic -to metal sealing as well as full ceramic packages ( HTCC /LTCC); With 1,500 employees at production locations in Germany, the Czech …
-
Approaches to wafer level packaging for SAW components
Since around the year 2000, the major acoustic component manufacturers of SAW components started to apply chip size packages (CSP or CSSP) [2]. These typically used chips flip chip bonded to an HTCC or LTCC ceramic carrier and covered by a polymer laminate.
-
7.25.06 -- Feature Article: RF Radiation Hazard And Antenna Placement Analysis On Electrically Large Military Platforms
2 x 2 mm Ceramic Air Cavity Package Colorado Microcircuits manufacturers these packages from HTCC alumina.
-
12.13.05 -- Feature Article: Commercial Use Of Unmanned Aerial Vehicles (UAVs): Surveying The Regulatory Landscape
4 x 4 mm Ceramic Air Cavity Package Colorado Microcircuits manufacturers these packages from HTCC alumina.
-
11.3.05 -- Feature Article: The Basics Of LNA Use In GPS Reception
3 x 3 mm Ceramic Air Cavity Package Colorado Microcircuits manufacturers these packages from HTCC alumina.
-
9.29.05 -- Feature Article: Enhancements To Iterative Inexact Lanczos For Solving Finite Element Eigenmode Problems
4 x 4 mm Ceramic Air Cavity Package Colorado Microcircuits manufacturers these packages from HTCC alumina.
-
7.6.06 -- Semiconductors & ICs Update
1.5 By 1.5 mm Ceramic Air Cavity Package Colorado Microcircuits manufacturers these packages from HTCC alumina.
-
2.21.06 -- Feature Article: Introduction To Gunn Diodes
1.5 x 1.5 mm Ceramic Air Cavity Package Colorado Microcircuits manufacturers these packages from HTCC alumina.
-
8.23.05 -- Feature Article: Designing With Single-Ended Passive Mixers
3 x 3 mm Ceramic Air Cavity Package Colorado Microcircuits manufacturers these packages from HTCC alumina.
-
5.25.06 -- Feature Article: A Crystal Filter Tutorial
4 x 4 mm Ceramic Air Cavity Package Colorado Microcircuits manufacturers these packages from HTCC alumina.
