Low Thermal Conductivity Film

Description: applications and easier suspension in liquids or melts. *** Intended for large and very high-conducting samples. Kapton sensors for thin film measurements, operating temperature from -196 °C up to 300 °C (400 °C in vacuum): Sensor design: Radius

Description: Very high thermal conductivity Outstanding thermal shock resistance Good dielectric properties Low thermal expansion coefficient Good metalization capacity Applications High power electrical insulators Power

• Dielectric Strength: 2.00E7 V/m
• Material Type: Aluminum Nitride
• Thermal Conductivity: 180 to 200 W/m-K

Description: The Hot Disk TPS 2500 S is the flagship instrument in the system portfolio of Hot Disk AB. This general-purpose R&D instrument is designed for precision analysis of thermal transport properties - including thermal conductivity (0.005 to 1800 W/m/K), thermal diffusivity

• Accuracy: 5 (%)
• Display Options: Digital Readout
• Local Interface: Digital Front Panel
• Temperature Range: -253 to 1000 C

Description: LiPOLY AS02-s is a material with double sided inherent tack, low thermal resistance and high thermal conductivity. It has excellent compressive strength characteristics and good electrical isolation function for high-power electronic components, making it the best choice

• Applied Thickness / Gap Fill: 0.0059 to 0.0079 inch
• Chemical / Polymer System Type: Silicone
• Dielectric Strength: 4 to 6 kV/in
• Elongation: 10 %

Description: , automotive, and electrical industries. Features & Benefits Excellent heat transfer Good wetting Low bond line Low thermal resistance High thermal conductivity (high bulk thermal conductivity) for thick-film and gap

• Chemical / Polymer System Type: Specialty / Other
• Composition: Unfilled
• Cure Type / Technology: Single Component System
• Industry: Electronics, Semiconductors / IC Packaging

Description: Features for Sarcon® QR: High Heat Conductivity. SARCON ® QR is Fujipoly's originally developed High Heat Conductive/Low Hardness Silicone Rubber. Fine, high heat conductive ceramic particles are mixed with insulative silicone rubber to produce this excellent insulative

• Applied Thickness / Gap Fill: 0.0118 to 0.0335 inch
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Gap Filling Compound
• Use Temperature: -76 to 356 F

Description: BERGQUIST GAP PAD TGP HC3000, High-Compliance, Thermally Conductive, Low Modulus, Fiberglass reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP HC3000 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional

• Chemical / Polymer System Type: Silicone
• Material Type: Gap Filling Compound
• Thermal Conductivity: 0.3000 W/m-K
• Use Temperature: 76 to 392 F

Description: exceptionally low interfacial resistances to adjacent surfaces. BERGQUIST GAP PAD TGP 3004SF is designed for applications that are silicone-sensitive. BERGQUIST GAP PAD TGP 3004SF is constructed using a 0.25 mil PET film that provides a no tack surface on one side and natural tack on

• Chemical / Polymer System Type: Silicone
• Material Type: Gap Filling Compound
• Thermal Conductivity: 3 W/m-K
• Use Temperature: 40 to 257 F

Description: upon request Benefits Thermal conductivity: 2.0 W/m-K Silicone-free formulation Minimal compression set 0.5 mil film provides tack-free surface Tacky side allows for ease of handling and placement

• Dielectric Constant (Relative Permittivity): 0.0060
• Material Type: Gap Filling Compound
• Thermal Conductivity: 2 W/m-K
• Use Temperature: 104 to 257 F

Description: LiPOLY AS400 is a thermally conductive gel designed for gap filling. The thermal conductivity is 4.0 W/m*K. The hardness is Shore 00/45, with high flexibility and compressibility. AS400 has ultra-low oil bleeding properties, which helps reduce pollutants from silicon oil,

• Chemical / Polymer System Type: Silicone
• Dielectric Strength: 279 kV/in
• Features: Thermal Compound / Interface (Thermally Conductive), UL Approved
• Form: Film / Sheet, Pad, Specialty / Other

Description: LiPOLY AS200 is a thermally conductive gel designed for gap filling. The thermal conductivity is 2.0 W/m*K. The hardness is Shore 00/30, with high flexibility and compressibility. AS200 has ultra-low oil bleeding properties, which helps reduce pollutants from silicon oil,

• Chemical / Polymer System Type: Silicone
• Dielectric Strength: 279 kV/in
• Features: Thermal Compound / Interface (Thermally Conductive), UL Approved
• Form: Film / Sheet, Pad, Specialty / Other

Description: AS27 is an advanced insulation material composed of nanoscale porous silica, carbon, and other materials, with an extremely low thermal conductivity of 0.009 W/m·K, making it one of the lowest-known thermal conductivity solid materials. AS27 is renowned for its

• Features: Electrical Insulation / Dielectric Material, Thermal Insulation / Heat Insulating
• Form: Film / Sheet, Pad, Specialty / Other
• Industry: Optoelectronics / Photonics, Semiconductors / IC Packaging, Electronics, Electrical Power / HV
• Thermal Conductivity: 0.0090 W/m-K

Description: over an exceptionally wide temperature range from -100°F to 400°F. Even at elevated temperatures of 300°C the weight loss is less than 0.70%. At room temperature Master Bond FL901S features a low volume resistivity of less than 2 milliohms as well as an excellent thermally

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 3.33E-5 to 1.11E-4 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and

• Chemical / Polymer System Type: Specialty / Other
• Coeff. of Thermal Expansion (CTE): 15 µin/in-F
• Features: Thermal Compound / Interface (Thermally Conductive)
• Form: Film / Sheet

Description: P8700 Series is an aerogel heat insulation film made of nano-insulated aerogel film as the base material and coated with acrylic glue. It has excellent heat insulation, excellent insulation performance, low heat conductivity, heat preservation, combined with heat

• Adhesive: Acrylic
• Backing: Plastic / Polymer, Acrylic / Acrylate
• Dielectric Strength: 4.00E6 V/m
• Features: Anti-static / ESD Control, Electrically Conductive

Description: Die Transfer Film (DTF) processes, it supports a wide range of surfaces and is customized for fast, easy die and clip lamination. The film forms a pure silver bond line that provides high thermal and electrical conductivity. Designed for low-pressure sintering, it

Description: printing, dispensing, and drying process steps. Specifically developed for die attachment using a low-pressure sintering process, it is designed to meet the needs of high-volume manufacturing. Formulated with highly engineered silver particles, the film delivers consistent bond line

Description: . High adhesion strength at elevated temperatures High electrical conductivity High thermal conductivity Low cure temperature Custom preforms Adhesion with flexibility Uniform bondline adhesion Void-free bondline

• Chemical / Polymer System Type: Epoxy (EP)
• Thermal Conductivity: 7 W/m-K

Description: Diamond has long been the technologically preferred material for critical thermal management applications due to its extremely high thermal conductivity, low coefficient of thermal expansion and high electrical resistivity. High costs, however, have traditionally

• Applications: Battery / Fuel Cell, Electronics / Microelectronics, Medical / Biotech
• Materials Processed: Carbon / Diamond-like Carbon (DLC)
• Type: CVD / Chemical Precursor

Description: electromagnetic shielding materials. Storage: Store at room Temperature Application: 1. Conductive ink 2. Heat dissipation paint 3. Electrically and thermally conductive polymer materials 4. Electromagnetic shielding materials, etc. Purity: >98% Product overview: Layers: 5-6 Film

• Shape / Form: Powder / Aggregate (Grain / Grog)

Description: -creep characteristics. Excellent thermal conductivity even at high temperatures. White colour enables treated parts to be easily identified. Low evaporation weight loss. Specific resistance: 1 x 10^14 Ω cm Thermal Conductivity = 0.9W/m·K Material = Non-Silicone

• Chemical / Polymer System Type: Specialty / Other
• Material Type: Grease / Paste
• Thermal Conductivity: 0.9000 W/m-K
• Use Temperature: -58 to 266 F

Description: -sensitive applications. The material's construction features a 0.5 mil PET film on one side and natural tack on the other. The natural tack eliminates the need for an additional adhesive layer. Your benefits Thermal conductivity: 2.0 W/m-K Silicone

• Industry: Electronics

Description: -sensitive. Gap Pad® 3004SF is constructed using a 0.25 mil PET film that provides a no tack surface on one side and natural tack on the other side. Your benefits Thermal Conductivity: 3.0 W/m-K Silicone-free formulation 0.25 mil PET provides easy disassembly

• Industry: Electronics

Description: , "specific to the task" thermoplastic formulation for the enclosure, improves thermal conductivity. There is also an integrated flange with pre-drilled holes to simplify mounting. The UNLYTIC® UL3 SERIES, with its introduction, the designer has a film capacitor for high power

• Capacitance Range: 6.5 to 350 microF
• Capacitance Tolerance: 10 (+/- %)
• DC Rated Voltage Range (WVDC): 500 to 2200 volts
• Operating Temperature: -55 to 105 C

Description: LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. High adhesion strength at elevated High

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: OEM / Industrial
• Thermal Conductivity: 7 W/m-K

Description: from a given condenser. The calculation method is applicable to those cases where the saturation temperature over the length of the condensing path remains approximately constant. The method covers gravity-controlled flows, flows with high vapour shear and high and low thermal

Description: associated with flexible films. High strength film with high thermal conductivity Thin bondline Uniform bondline control Good heat transfer

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: OEM / Industrial
• Thermal Conductivity: 1.1 W/m-K

Description: increase corrosion and UV resistance. UV Resistance Corrosion resistant Low conductivity – thermally and electrically Non-magnetic – electromagnetic transparency Lightweight High strength Dimensional stability Low

• Overall Length: 96 inch
• Overall Thickness: 0.1250 to 1 inch
• Overall Width: 48 inch

Description: manufactured to be used for interior and limited exterior applications. Regular, Fine-Celled Foam Structure Matte Surface Finish, Both Sides Vibration and Sound Absorbent Low Thermal Conductivity High Insulation Value Chemical Resistant, Non

• Chemical / Polymer System Type: Polyvinyl Chloride (PVC)
• Thermoplastic: Yes

Description: We supply evaporation boats manufactured from tungsten, molybdenum, molybdenum-lanthanum (ML), molybdenum-yttrium oxide (MY) or tantalum. Our evaporation boats offer a good level of electrical conductivity and possess low vapor pressures combined with a very high

• Materials Processed: Molybdenum, Tungsten, Specialty / Other

Description: High electrical and thermal conductivity – superior grounding and minimum thermal resistance to heat sink Compatible with temperature-sensitiv e substrates and components – cures at a low temperature of 125°C Flexible – allows use of material combinations with CTE

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 11.39 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: OEM / Industrial

Description: . Due to their construction utilizing relatively high thermal conductivity materials, Accu-P’s have become the preferred device in R & D labs and production environments where hand soldering is used.

• Capacitance Range: 1.10E-5 microF
• Capacitance Tolerance: 1 (+/- %)
• DC Rated Voltage Range (WVDC): 10 volts
• Lead / Termination Type: Other

Description: . Due to their construction utilizing relatively high thermal conductivity materials, Accu-P’s have become the preferred device in R & D labs and production environments where hand soldering is used.

• Capacitance Range: 3.90E-5 microF
• Capacitance Tolerance: 5 (+/- %)
• DC Rated Voltage Range (WVDC): 50 volts
• Lead / Termination Type: Other

Description: . Due to their construction utilizing relatively high thermal conductivity materials, Accu-P’s have become the preferred device in R & D labs and production environments where hand soldering is used.

• Capacitance Range: 3.00E-5 microF
• Capacitance Tolerance: 1 (+/- %)
• DC Rated Voltage Range (WVDC): 25 volts
• Lead / Termination Type: Other

Description: . Due to their construction utilizing relatively high thermal conductivity materials, Accu-P’s have become the preferred device in R & D labs and production environments where hand soldering is used.

• Capacitance Range: 1.75E-6 microF
• DC Rated Voltage Range (WVDC): 10 volts
• Lead / Termination Type: Other
• Mounting Style: Other

Description: /mK • Integral support using fabric or PET film • Fabric support provides good cut resistance for high abuse applications Benefits • low pressure applied to assembled components • Provides high range thermal conductivity • Cost effective gap

• Chemical / Polymer System Type: Silicone
• Dielectric Strength: 250 kV/in
• Features: Thermally Conductive
• Filler Material: Mineral, Other

Description: The LR series from TE Connectivity offers a highly reliable range of metal film fixed resistors. These thin film resistors have been designed with a thin layer of nickel-chrome alloy on top of a high thermal conductivity ceramic core. This low cost range features

• Power Rating: 0.6000 watts
• Resistance Range: 110 ohms
• Technology / Construction: Thin Film
• Temperature Coefficient (TCR): 50 ±ppm/°C

Description: The LR series from TE Connectivity offers a highly reliable range of metal film fixed resistors. These thin film resistors have been designed with a thin layer of nickel-chrome alloy on top of a high thermal conductivity ceramic core. This low cost range features

• Power Rating: 0.6000 watts
• Resistance Range: 100000 ohms
• Technology / Construction: Thin Film
• Temperature Coefficient (TCR): 50 ±ppm/°C

Description: The LR series from TE Connectivity offers a highly reliable range of metal film fixed resistors. These thin film resistors have been designed with a thin layer of nickel-chrome alloy on top of a high thermal conductivity ceramic core. This low cost range features

• Power Rating: 0.6000 watts
• Resistance Range: 1 ohms
• Technology / Construction: Thin Film
• Temperature Coefficient (TCR): 50 ±ppm/°C

Description: Insulating Foam Benefits: Compressibility Energy absorption Fabricatibility Flexibility Lightweight Low thermal conductivity Low water vapor transmission Mildew-resistance Resiliency Sound absorption vibration dampening

• Application: Filtration
• Foam Type: Open Cellular, Reticular
• Form / Shape: Stock Shape (Bar, Sheet, etc.), Film / Sheet
• Material / Composition: Plastic / Polymer, Thermoset / Crosslinked

Description: PolyPhen™ rigid foam insulation products, have thermal conductivities from 0.15-.22 Btu in/hr ft2 and can be used to insulate surfaces operating within the temperature range of -290°F to +250°F (-180°C to + 120°C), and is manufactured to provide optimum thermal

• Application: HVAC, Industrial OEM, Marine, Medical, Other
• Bulk Density: 3.75 lbs/ft³
• Foam Type: Closed Cellular, Rigid
• Form / Shape: Fabricated Shapes / Parts (Molded, Cast), Stock Shape (Bar, Sheet, etc.), Rod / Bar Stock

Description: combustion. NH Armaflex will not carry a progressive flame, and is formulated without chlorine, bromines, or PVC. A closed-cell material, NH Armaflex provides low thermal conductivity, good fire behavior, low-temperature flexibility, and excellent protection against water

• Application: HVAC, Marine, Other
• Bulk Density: 3 lbs/ft³
• Foam Type: Closed Cellular, Flexible
• Form / Shape: Film / Sheet, Other

Description: provides low thermal conductivity, excellent fire and smoke behavior, and excellent protection against heat flow and water vapor diffusion. It is manufactured without the use of CFCs, HFCs or HCFCs. The product complies with: ASTM C 534 Type I (Tubular) Grade 2, Type II (Sheet),

• Application: Automotive / Transportation, HVAC, Other
• Bulk Density: 3 lbs/ft³
• Foam Type: Closed Cellular, Flexible
• Form / Shape: Film / Sheet, Other

Description: Unipretec offers 99.6% alumina substrates. This high purity alumina substrate exhibits excellent physical, chemical, and mechanical properties, including exceptional insulating properties, high thermal conductivity, low dielectric constant, low dielectric loss, high

• Applications: Chemical / Materials Processing, Corrosion Protection, Electrical / HV Parts, Electronics / RF-Microwave
• Density: 3.9 to 3.95 g/cc
• Dielectric Strength: 1.70E7 to 2.00E7 V/m
• Material Type: Alumina / Aluminum Oxide

Description: urethane foams or fiberglass insulations. This fire retardant foam meets the flame spread, smoke density and fuel contribution requirements necessary to comply with Class-l building code regulations. The high performance thermal and acoustical characteristics of this flexible, low

• Application: Acoustics / Sound Proofing, Aerospace, Architectural / Construction, Industrial OEM
• Bulk Density: 0.7000 lbs/ft³
• Elongation: 15 %
• Foam Type: Open Cellular, Flexible

Description: : Compressibility Cushioning Energy absorption< Fabricatibility Flexibility Insulating Light-weight Low thermal conductivity Low water vapor transmission Mildew-resistance Resiliency Sound absorption Vibration dampening

• Application: Packaging / Casing
• Bulk Density: 2 lbs/ft³
• Foam Type: Open Cellular, Flexible
• Form / Shape: Stock Shape (Bar, Sheet, etc.), Board / Block / Bun, Film / Sheet

Description: Suited for thermal spreading and shielding applications High in-plane thermal conductivity 300 W/mK to >1500 W/mK Lightweight Flexible Minimum graphite thickness 0.017mm Minimum aggregate thickness with adhesive and protective film 0.0275mm

• Applications: Other
• Carbon and Graphite Material Type: Graphite
• Thermal Conductivity: 300 to 1500 W/m-K
• Thickness / Wall Thickness: 6.69E-4 inch

Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical

• Applications: Abrasive / Erosive Wear Protection, Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave, Structural, Thermal Insulation / Fire Proofing, Wear Parts / Tooling, Other, Optics / Optical Grade, Refractory / High Temperature Materials
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Compressive / Crushing Strength: 50000 psi
• Density: 2.52 g/cc

Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical

• Applications: Abrasive / Erosive Wear Protection, Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave, Structural, Thermal Insulation / Fire Proofing, Wear Parts / Tooling, Other, Optics / Optical Grade, Refractory / High Temperature Materials
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Compressive / Crushing Strength: 50000 psi
• Density: 2.52 g/cc

Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical

• Applications: Abrasive / Erosive Wear Protection, Electrical / HV Parts, Electronics / RF-Microwave, Optics / Optical Grade, Refractory / High Temperature Materials, Structural, Thermal Insulation / Fire Proofing, Wear Parts / Tooling, Other
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Compressive / Crushing Strength: 50000 psi
• Density: 2.52 g/cc

Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical

• Applications: Abrasive / Erosive Wear Protection, Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave, Optics / Optical Grade, Refractory / High Temperature Materials, Structural, Thermal Insulation / Fire Proofing, Wear Parts / Tooling, Other
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Compressive / Crushing Strength: 50000 psi
• Density: 2.52 g/cc