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Supplier: MACOM
Description: MACOM’s portfolio of 10G/40G/100G Ethernet Physical Layer (PHY) devices offers unparalleled performance while maintaining high density at low cost. Integrated high-speed, high performance mixed signal I/O using advanced CMOS process nodes support a variety of optical and copper
- Data Rate: 10.52 to 31.79 kbps
- Device Type: Physical Layer Controller
- IC Package Type: BGA, PBGA, Other
- Number of Transmitters: 1 to 10 #
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Supplier: MACOM
Description: IEEE 802.1AE Media Access Control Security (MACsec) is an industry standard security technology that provides secure communication for Ethernet traffic. MACOM’s wire-speed Ethernet MACsec PHY products offer highly scalable and cost-effective encryption solutions to address the data
- Data Rate: 2.66E7 to 2.80E7 kbps
- Device Type: Physical Layer Controller
- IC Package Type: FCBGA, Other
- Number of Transmitters: 8 to 24 #
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Supplier: Rochester Electronics
Description: 125Mbps-2.5Gbps FTTX Burst Mode Laser Driver/Postamplifier
- Device Type: Other
- Package Type: Other
- RoHS Compliant: Yes
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Supplier: Rochester Electronics
Description: Laser Driver/Postamp with Digital Diagnostics
- Device Type: Other
- Package Type: Other
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Supplier: Acme Chip Technology Co., Limited
Description: 10GBASEKR_PHY-OM
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Supplier: Acme Chip Technology Co., Limited
Description: 10GBASEKR_PHY-OMFL
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Supplier: Intel Corporation
Description: Gigabit Ethernet physical layer (PHY) controllers provide high-performance gigabit network connectivity with support for Intel® vPro technology and software solutions and user-centered design (SSUD) technology. Package size is as small as a compact 6x6 mm, and the PHY controllers allow
- Data Rate: 1.00E6 kbps
- Device Type: Physical Layer Controller
- Technology: Ethernet
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Supplier: Intel Corporation
Description: Gigabit Ethernet physical layer (PHY) controllers provide high-performance gigabit network connectivity with support for Intel® vPro technology and software solutions and user-centered design (SSUD) technology. Package size is as small as a compact 6x6 mm, and the PHY controllers allow
- Device Type: Physical Layer Controller
- Interface: Other
- Pd: 1180 milliwatts
- Technology: Ethernet
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Supplier: Intel Corporation
Description: Gigabit Ethernet physical layer (PHY) controllers provide high-performance gigabit network connectivity with support for Intel® vPro technology and software solutions and user-centered design (SSUD) technology. Package size is as small as a compact 6x6 mm, and the PHY controllers allow
- Data Rate: 1.00E6 kbps
- Device Type: Physical Layer Controller
- Technology: Ethernet
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Supplier: Intel Corporation
Description: Gigabit Ethernet physical layer (PHY) controllers provide high-performance gigabit network connectivity with support for Intel® vPro technology and software solutions and user-centered design (SSUD) technology. Package size is as small as a compact 6x6 mm, and the PHY controllers allow
- Data Rate: 1.00E6 kbps
- Device Type: Physical Layer Controller
- Technology: Ethernet
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Supplier: Win Source Electronics
Description: Manufacturer: Maxim Integrated Win Source Part Number: 274189-PHY1078-01QT- BR Popularity: Low Fake Threat In the Open Market: 40 pct. Supply and Demand Status: Balance
- Output Options: Inverting
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Supplier: Win Source Electronics
Description: Manufacturer: Maxim Integrated Win Source Part Number: 274190-PHY1078-01QT- RR Popularity: Low Fake Threat In the Open Market: 71 pct. Supply and Demand Status: Balance
- Output Options: Inverting
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Supplier: Quarktwin Technology Ltd.
Description: Transimpedance Amplifier IC Telecommunications Die
- Package Type: Other
- RoHS Compliant: Yes
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Supplier: Win Source Electronics
Description: Manufacturer: Maxim Integrated Win Source Part Number: 1087860-PHY1076-01QH -RR Categories: Integrated Circuits Status: Obsolete Popularity: Medium Fake Threat In the Open Market: 28 pct. Supply and Demand Status: Balance
- Output Options: Inverting
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Supplier: Win Source Electronics
Description: Manufacturer: Maxim Integrated Win Source Part Number: 274193-PHY2078QT-BR Categories: Integrated Circuits Status: Obsolete Popularity: Medium Fake Threat In the Open Market: 42 pct. Supply and Demand Status: Balance
- Output Options: Inverting
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Supplier: VAST STOCK CO., LIMITED
Description: Transimpedance Amplifiers 1.25Gbps High-SensTIA
- Device Type: Other
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Supplier: VAST STOCK CO., LIMITED
Description: Transimpedance Amplifiers 10GbE Linear Transimpedance Amplifier
- Device Type: Other
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Supplier: Microchip Technology, Inc.
Description: different layers: Application Interface Layer (function groups), Chip Interface Layer (register mappings), I/O Layer (register access), OS Layer (Linux, VxWorks, eCos), and Trace Layer. To obtain the latest PHY only 4.67 branch API, click here. To obtain the Switch and PHY 4.69
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Supplier: Lingto Electronic Limited
Description: LASER DRIVER/POSTAMP WITH DIGITA
- Device Type: Transceiver
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Description: 2.5GBPS HIGH SENSTIA
- Device Type: Other
- Package Type: Other
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Supplier: Lingto Electronic Limited
Description: 1.25GBPS TIA
- Device Type: Other
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Supplier: Quarktwin Technology Ltd.
Description: Transimpedance Amplifier IC Telecommunications, Optical Networks Die
- Package Type: Other
- RoHS Compliant: Yes
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Supplier: Quarktwin Technology Ltd.
Description: Transimpedance Amplifier IC Ethernet, Optical Networks Die
- Package Type: Other
- RoHS Compliant: Yes
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Supplier: Quarktwin Technology Ltd.
Description: IC
- RoHS Compliant: Yes
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Supplier: Lingto Electronic Limited
Description: IC PWR MGMT OP AMP
- Device Type: Other
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Supplier: Acme Chip Technology Co., Limited
Description: IC
- Device Type: Other
- Package Type: Other
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Supplier: Lingto Electronic Limited
Description: 2.5GBPS HIGH SENSTIA
- Device Type: Other
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Supplier: Microchip Technology, Inc.
Description: Microchip's complimentary and confidential LANCheck® online design review service is available for customers who have selected our products for their application design-in. The LANCheck online design review service is subject to Microchip's Program Terms and Conditions and requires a myMicrochip
- IC Package Type: Other
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Supplier: Microchip Technology, Inc.
Description: The VSC8221 is the smallest, lowest power Gigabit Ethernet (GE) over copper PHY available and is ideal for SFP/GBIC and Media Converter applications. It is the only triple speed copper SFP PHY to meet the stringent MSA power consumption requirement of 140m of Category 5, unshielded
- Data Rate: 10000 to 1.00E6 kbps
- IC Package Type: Other
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Supplier: Microchip Technology, Inc.
Description: The VSC8540ET device is the extended temperature -55°C/+125°C version of the popuar VSC8540 single port Gigabit Ethernet copper PHY targeting space-constrained 10/100BASE-T applications. Low-power, small form-factor Cu PHY with IEEE 802.3az Energy Efficient Ethernet (EEE), Wake
- IC Package Type: Other
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Supplier: Broadcom Inc.
Description: The Vortex Gearbox™ AVSP-1104 is a single-chip 100Gbps gearbox PHY IC designed for high-density 100G Ethernet and Optical Transport Networking (OTN) applications. The device supports full-duplex multiplexing of ten 10/11Gbps channels and de-multiplexing of four 25/28Gbps channels. The
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Selecting the right Ethernet PHY directly impacts system power efficiency, EMI stability, board space, and long-term reliability. We compare three widely used 10/100 Mbps PHY chips to help engineers identify the best fit for (read more)
Browse Network and Communication Chips Datasheets for Win Source Electronics -
The QPL1841 is a GaAs pHEMT single ended MMIC RF amplifier IC featuring 12 dB of gain and low noise from 5 MHz to 850 MHz. This high linearity IC is designed to support Broadband CATV DOCSIS 4.0 applications, such as Nodes, Amplifiers, and Remote PHY Devices, as well as Fiber to The Home (read more)
Browse Amplifier and Comparator Chips Datasheets for Qorvo -
The QPL1840 is a GaAs pHEMT single ended MMIC RF amplifier IC featuring 17 dB of gain and low noise from 5 MHz to 1800 MHz. This high linearity IC is designed to support Broadband CATV DOCSIS 4.0 applications, such as Nodes, Amplifiers, and Remote PHY Devices, as well as (read more)
Browse Amplifier and Comparator Chips Datasheets for Qorvo
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SuperSpeed USB Protocol Verification Probing at 5Gbps (.pdf)
hurdles along the. way. Early USB 3.0 developers cite the shortage of native SuperSpeed PHY chips as. well as sophisticated physical layer features including high speed signaling, dynamic. equalization, and power management as key challenges for their product validation. efforts.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
raising antitrust concerns stemming from its involvement in such a tightly knit, closed committee. eSilicon licenses Ethernet chip technology from Mysticom SANTA CLARA, Calif. -- Fabless ASIC startup eSilicon Corp. here announced that it is licensing Ethernet-based, physical-layer (PHY) chip
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. for $215 million in stock. With the surprise acquisition of Kendin, based in Sunnyvale, Calif., Micrel gains a quick entry into the physical-layer (PHY) IC and switch-chip markets for Fast Ethernet, Gigabit Ethernet, and 10 Gigabit Ethernet networks. European lead-free law could cost U.S. companies
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
-- Cypress Semiconductor Corp. here today announced a partnership with Munich startup MorethanIP GmbH to provide intellectual property (IP) and design cores for programmable physical layer devices (PHY) and complex programmable logic devices (CPLDs). Hitachi plans new general-purpose chip company while
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Microchip TCP/IP Stack with BSD Socket API for PIC32MX
be work chip is a Microchip ENC28J60, a 10 Mbps compiled in an embedded environment, provided the integrated MAC/PHY Ethernet controller. The stack can embedded platform supplies the BSD library API. easily be ported to other PIC microcontrollers. Micro- This application note describes the Microchip TCP
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A Microfluidic System for Biological Particle Enrichment Using Contactless Dielectrophoresis
and highly specific concentration is. critical. Dielectrophoresis (DEP), or the motion of a particle. because of its polarization in a nonuniform. Keywords: BioMEMS,. sample enrichment,. cell separation,. lab on a chip. *Correspondence: Rafael V. Davalos, PhD, Bioelectromechanical. Systems Laboratory
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Designing Atmospheric-Pressure Plasma Sources for Surface Engineering of Nanomaterials
and isolation. The. potential of DEP as a biological tool for sample isolation and. enrichment for drug screening, disease detection and. treatment, as well as on-chip applications lies in its inherent. advantages over current concentration and detection techniques. These techniques typically maintain
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MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
. Keywords: Dielectrophoresis / Fluid mixing / Microfluidics / Dielectrophoretic sample. management DOI 10.1002/elps.201100171. 1 Introduction. Mixing in microfluidic devices has an important role in. numerous biological and chemical applications. Rapid. mixing is necessary in many lab-on-a-chip and micro
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http://www.nxp.com/documents/user_manual/UM10326.pdf
Wake-on-LAN power management support allows system wake-up: using the receive filters or a magic frame detection filter • Physical interface – Attachment of external PHY chip through standard MII or RMII interface – PHY register access is available via …
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An ATM chip set for high performance computer interfaces, affording over 100 Mbps sustained throughput
The chip set is composed of a SAR chip, supporting AAL and ATM layer, and a PHY chip , supporting the transmission convergence sublayer (TC) in ATM physical layer.
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40.3: A 2Gbps/lane Source Synchronous Intra‐Panel Interface for Large Size and High Refresh Rate Panel with Automatic Calibration
On the transmitter PCB, mini-LVDS signal from the conventional TCON is converted to CalDriCon signal by the combination of 8 PHY chips and one FPGA.
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http://www.cisco.com/en/US/docs/cable/cmts/system/message/uberrchap2.pdf
Explanation There is error assert in upstream PHY chip .
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Intel Readies GigE PHY Chip | Light Reading
Intel Readies GigE PHY Chip .
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http://www.loadparts.com/catalog_C.htm
… a href="http://www.loadparts.com/Catalog/C/1337.htm" title="CTS CB3-2C-36000000MHZ - Loadparts Search Engine Results">CTS CB3-2C-36000000MHZ - Loadparts Search Engine Results
- http://www.nxp.com/documents/user_manual/UM10211.pdf
• Physical interface: – Attachment of external PHY chip through a standard Reduced MII (RMII) interface.- AN10859.pdf (AN10859.zip)
MDIO is a simple two-wired serial interface used to access a set of control and status registers inside the PHY chip . - http://www.nxp.com/documents/user_manual/UM10211.pdf