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Supplier: 3X Ceramic Parts Company Limited
Description: Aluminum Nitride (AlN) Substrate Description: AlN substrate is produced by tape casting using AlN powder as raw material and high temperature sintering. It has all the unique properties of AlN material and meets the requirements for electronic packaging baseplate, which
- Density: 3.3399978920356252 to 3.359997879413084 g/cc
- Thermal Conductivity: 165 to 185 W/m-K
- MOR / Flexural Strength: 50,762.89377501895 psi
- Dielectric Constant (Relative Permittivity): 9.3 #
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Description: Aluminum Nitride (AlN) substrate is a ceramic material widely used in the electronics industry. It is renowned for its superior thermal conductivity, high electrical insulating properties, and outstanding chemical stability. AlN substrates have a unique combination of
- Density: 3.2499979488370605 to 3.349997885724355 g/cc
- Max Use / Curie Temperature: 1,200 C
- Dielectric Strength: 17,000,000 V/m
- Specialty Ceramic Type: Aluminum Nitride
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Supplier: Zhuhai Cersol Technology Co., Ltd.
Description: With high efficiency, low cost and pollution-free ceramic substrate casting technology, the product length and width can each reach 7.5 inches. It can also produce ultra-thin substrates with thickness of 0.1mm and 0.15mm. Products with special specifications can be customized according
- Thickness / Wall Thickness: 0.05905515 inch
- Material Type: Alumina / Aluminum Oxide
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Supplier: Accuratus Corporation
Description: pressing produces substrates up to 2 inches square and .250 inches thick. A list of standard substrate sizes can be found on the Aluminum Nitride Substrate Sizes page. Standard aluminum nitride process methods yield strong substrates with
- Thickness / Wall Thickness: 0.025 inch
- Length: 2 inch
- Diameter: 2 inch
- Density: 3.26 g/cc
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Supplier: CoorsTek
Description: CoorsTek developed the standards for thick-film and thin-film substrates and continues to lead the market with innovative materials, manufacturing, and secondary processes. Customers rely on us for cost-effective solutions delivered on time. Aluminum Nitride Advantages High heat
- Features: Dielectric / Insulating, Specialty / Other
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Description: Innovacera standard aluminum nitride wafer diameters are from 50.8 mm (2 inch) to 200 mm (8 inch) ; mostly use are 6" aluminum nitride wafers and 8" AlN wafer substrates . AlN Wafers can be produced in various thicknesses from 0.125mm to 1mm with polished or lapped
- Specialty Ceramic Type: Aluminum Nitride
- Features: Other, Specialty / Other, Specialty Ceramic
- Shape / Form: Wafer / Substrate
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Supplier: 3X Ceramic Parts Company Limited
Description: Laser Scribining Drilling Aluminum Nitride Substrate Aluminum nitride ceramic substrate has very good thermal conductivity. It is one of the materials with good thermal conductivity in the field of thermal conductivity at present. It is used in hybrid
- Density: 3.3299978983468956 g/cc
- Thermal Conductivity: 170 W/m-K
- MOR / Flexural Strength: 58,014.7357428788 psi
- Specialty Ceramic Type: Aluminum Nitride
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Description: Advantages Of Aluminum Nitride Custom Substrate Aluminum Nitride Custom Substrate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss.
- Thermal Conductivity: 170 W/m-K
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Electrical / HV Parts
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Supplier: 3X Ceramic Parts Company Limited
Description: Silicon Nitride Substrate Description : Silicon nitride ceramic substrate is a ceramic substrate with silicon nitride (Si3N4) as the main crystal phase, also known as silicon nitride ceramic substrate. Silicon nitride ceramic is a kind
- Density: 3.1999979803934133 g/cc
- Thermal Conductivity: 15 to 20 W/m-K
- MOR / Flexural Strength: 87,022.1036143182 psi
- Compressive / Crushing Strength: 362,592.0983929925 psi
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Supplier: 3X Ceramic Parts Company Limited
Description: Thickness 0.15mm 0.25mm 0.5mm Aluminum Nitride Substrate The Advantage of Aluminum Nitride Substrate : 3X Ceramic Parts company use tape casting to produce high thermal conductivity aluminum nitride substrates . * High Thermal
- Density: 3.3299978983468956 g/cc
- Thermal Conductivity: 170 W/m-K
- MOR / Flexural Strength: 58,014.7357428788 psi
- Dielectric Constant (Relative Permittivity): 8.8 #
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Description: Aluminum nitride AlN If high thermal conductivity and electrical insulation are required, aluminum nitride (AlN) is an excellent material, making it an ideal material for thermal management and electrical applications. In addition, aluminum nitride is a
- Thermal Conductivity: 150 W/m-K
- Coeff. of Thermal Expansion (CTE): 4.5 µm/m-C
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Electrical / HV Parts
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Description: AlN Ceramic Substrate Laser Cutting Overview Aluminum nitride (AlN) ceramic substrate is a technical ceramic material with excellent performance, which has a wide range of applications in semiconductor, optoelectronics, aerospace and other fields. Laser cutting is one of
- Thermal Conductivity: 170 W/m-K
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Electrical / HV Parts
- Features: Specialty Ceramic
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Supplier: Accuratus Corporation
Description: Aluminum Nitride, formula AlN, is a newer material in the technical ceramics family. While its discovery occurred over 100 years ago, it has been developed into a commercially viable product with controlled and reproducible properties within the last 20 years. Aluminum
- Material Type: Aluminum Nitride
- Features: Dielectric Ceramic, Specialty Ceramic
- Shape / Form: Fabricated / Custom Shape
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Supplier: Advanced Technical Ceramics Company
Description: AdTech Ceramics is the leading manufacturer of custom designed multilayer aluminum nitride substrates. Aluminum nitride offers high thermal conductivity with an excellent coefficient of thermal expansion (CTE) match to silicon. The material system is stable from
- Materials: Aluminum Foil / Cladding, Metal Foil / Cladding
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Description: Substrates for electronic packages Substrates & insulators for microelectronic devices & opto electronic devices Laser heat management components Electrical insulators Molten metal fixtures Aluminum nitride (AlN) Basic Information Aluminum nitride (AlN) is a
- Thermal Conductivity: 170 W/m-K
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Electrical / HV Parts
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Description: With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma
- Max Use / Curie Temperature: 1,500 C
- Thermal Conductivity: 70 to 180 W/m-K
- MOR / Flexural Strength: 43,511.0518071591 psi
- Specialty Ceramic Type: Aluminum Nitride
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Description: ALN ceramic components purity is 99.5% aluminum nitride and its density is about 3.3g/cm3. The thermal conductivity is 140-170 W/(m·k). The forming way of hot-pressed aluminum nitride ceramics is vacuum hot pressing sintering. After high temperature and high pressure, hot
- Specialty Ceramic Type: Aluminum Nitride
- Performance Features: Metallized / Silvered (Electrode, Mirror)
- Features: Other, Sintered / Fired, Specialty Ceramic
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Supplier: Fairfield Crystal Technology, LLC.
Description: Fairfield Crystal Technology uses a unique patented process to produce our Aluminum Nitride (AlN) crystals. We produce single-crystal hexagonal material for a variety of device applications. We are currently offering 5 to 10mm diameter research grade substrates.
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Supplier: San Jose Delta Associates, Inc.
Description: Aluminum Nitride - AlN, is most often the material of choice due to its relatively excellent thermal conductivity and non-toxic nature. Because San Jose Delta has a segregated beryllium oxide - BeO department with over 20 years of experience fabricating common microwave designs such as
- Density: 3.2699979362145193 g/cc
- Thermal Conductivity: 170 to 200 W/m-K
- Coeff. of Thermal Expansion (CTE): 5 µm/m-C
- MOR / Flexural Strength: 52,000 psi
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Description: Nitride ceramics at a competitive price. More Materials: Our Advanced Ceramics include: Alumina (Al2O3) Ceramics Zirconia (ZrO2) Ceramics Beryllia (BeO) Ceramics Aluminum Nitride (AlN) Ceramics Silicon Nitride (Si3N4) Ceramics Hot Pressed Boron Nitride (HBN)
- Density: 1.4999990533094125 to 1.5999989901967067 g/cc
- Material Type: Aluminum Nitride, Boron Nitride
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Supplier: FX PCB Co., Ltd.
Description: Description Aluminum Nitride PCB Manufacturer Fx PCB is a professional manufacturer of Ceramic substrate PCB, and we can make the ALN PCB(Aluminum Nitride PCB) and AI203 circuit boards(Aluminum oxide board). FX PCB manufactures the ceramic PCB using DPC
- Thickness: 0.014960629921259842 to 0.11811023622047244 inches
- Electrical Resistivity: 10 ohm-cm
- Features: Specialty / Other
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Supplier: 3M Advanced Materials Division
Description: levels. Boron nitride-filled polymers cool more quickly during production, helping increase throughput. The low density and inherent electrically insulating properties of 3M boron nitride cooling fillers allow for the production of lighter, thinner parts and simpler, more compact
- Density: 0.14999990533094124 to 0.5499996528801179 g/cc
- Material Type: Boron Nitride
- Features: Dielectric / Electrical Insulation, Other, Specialty Ceramic
- Shape / Form: Fabricated / Custom Shape
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Description: DPC ceramic substrates are typically composed of aluminium nitride or alumina ceramic materials, to which a copper layer is directly bonded on one or both sides. DPC ceramic substrates are frequently used in applications like electronic packaging and power electronics because
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Performance Features: Metallized / Silvered (Electrode, Mirror)
- Features: Specialty Ceramic
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Description: DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules
- Features: Alumina / Aluminum Oxide, Specialty Ceramic
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Battery / Fuel Cell, Construction & Building / Architectural, Electrical / HV Parts, Electronics / RF-Microwave
- Performance Features: Metallized / Silvered (Electrode, Mirror)
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Supplier: Zhuhai Cersol Technology Co., Ltd.
Description: Nitride Ceramic Square Crucible BORON NITRIDE CERAMIC SQUARE CRUCIBLE Silicon Nitride Lift Tube SILICON NITRIDE LIFT TUBE Silicon Nitride Ceramic Beads SILICON NITRIDE CERAMIC BEADS Aluminum Nitride Substrate ALUMINUM
- Material Types: Boron Nitride
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Description: Ceramic substrates have following advantages: High thermal conductivity Excellent insulation properties High mechanical strength Excellent chemical stability Aluminum nitride ceramic substrates: Thermal conductivity > 200 W/m·K, thermal expansion coefficient matches that
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Supplier: Knowles Precision Devices
Description: High-K substrates are used for circuit miniaturization. DLI offers complete fabrication services!
- Length: 1 to 4 inch
- Width / O.D.: 1 to 4 inch
- Thickness / Wall Thickness: 0.025 inch
- Coeff. of Thermal Expansion (CTE): 0.55 to 10.1 µm/m-C
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Description: Zirconia (ZrO2) Ceramics Beryllia (BeO) Ceramics Aluminum Nitride (AlN) Ceramics Silicon Nitride (Si3N4) Ceramics Hot Pressed Boron Nitride (HBN) Ceramics Pyrolytic Boron Nitride (PBN) Ceramics Silicon Carbide (SiC) Ceramics Boron Carbide (B4C) Ceramics Titanium
- Thermal Conductivity: 180 to 200 W/m-K
- Dielectric Strength: 20,000,000 V/m
- Material Type: Aluminum Nitride
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Description: AlN substrate possesses a wide range of superior physical properties, including high breakdown electric field strength, thermal conductivity, resistivity, and so forth. In fields like LED packaging, power modules, wafer bonding, power resistors, and metalized substrates (such as thin
- Density: 3.2499979488370605 to 3.349997885724355 g/cc
- Max Use / Curie Temperature: 1,200 C
- Dielectric Strength: 17,000,000 V/m
- Specialty Ceramic Type: Aluminum Nitride
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Description: Wintrustek is a leading ceramic materials supplier. Aluminum nitride and aluminum oxide ceramic substrates are available from us. Aluminum nitride (AlN) is a novel ceramic material with exceptional all-around properties. It has good thermal conductivity,
- Features: Alumina / Aluminum Oxide
- Specialty Ceramic Type: Aluminum Nitride
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Supplier: Zhuhai Cersol Technology Co., Ltd.
Description: efficiency of molten aluminum, enhances the corrosion resistance of molten aluminum of the substrate, and prolongs the service life.
- Features: Other
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Supplier: CoorsTek
Description: CoorsTek ceramics provide superior thermal performance in wafers, phosphors, and substrates for high-brightness LED manufacturing. Ceramic substrates Thick-Film Alumina Aluminum Nitride Ceramic phosphors Gallium nitride on silicon epiwafers MOCVD process equipment
- Features: Alumina / Aluminum Oxide, Other, Specialty Ceramic
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Thermal Insulation / Fire Proofing
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Supplier: Plansee SE
Description: Our targets and cathodes made from titanium-aluminum (TiAl) ensure that drills, milling machines, indexable cutting inserts and other tools are protected by a hard, oxidation-resistant nitride coating (TiAlN). High feed speeds, excellent cutting performance and impressive metal removal
- Type: Sputtering Target
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Supplier: Ohmite Manufacturing Co.
Description: Ohmite has the solution for high wattage surface mount chips. The ALN series thick film chips offer 3.5 watts of power dissipation in a 2512 package size. This is accomplished with the use of an Aluminum Nitride substrate. Aluminum Nitride (AlNi) dissipates heat
- Resistance Range: 10 to 2,000 ohms
- Temperature Coefficient (TCR): 150 ±ppm/°C
- Power Rating: 3.5000000000000004 watts
- Operating Temperature: -55 to 155 C
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Aluminum Nitride (AlN) Substrate Description: AlN substrate is produced by tape casting using AlN powder as raw material and high temperature sintering. It has all the unique properties of AlN material and meets the requirements for electronic packaging baseplate, which makes it (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
The Importance of Aluminum Nitride Wafer Substrates Aluminum Nitride Wafer Substrates play an essential role in the semiconductor industry. One of the key reasons for their (read more)
Browse Specialty Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
With superior mechanical strength, high breakdown voltage, and outstanding thermal shock resistance, AlN substrates ensure reliable performance in demanding environments. Their precision machining capability and customizable specifications make them well-suited for IGBT power modules, high (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
-pressed aluminum nitride ceramic part application: Semiconductor heaters Magnetic resonance imaging equipment Etching machine Integrated circuit part Structural packaging materials High-power heat dissipation insulating substrates (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Product Overview Aluminum nitride ceramic flanges are precision ceramic components manufactured from advanced aluminum nitride (AlN) materials. They provide excellent thermal conductivity, electrical insulation, high temperature resistance (read more)
Browse Silicon Nitride and Silicon Nitride Ceramics Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
Efficient thermal management and electrical insulation are crucial in modern electronics and high-power devices. Aluminum nitride (AlN) ceramics provide engineers with a robust solution, combining superior heat dissipation, mechanical strength, and electrical (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
, resulting in a surface roughness of Ra0.1-0.3um. 99.6% alumina provides excellent electrical insulation, low thermal conductivity, great mechanical strength, outstanding dielectric characteristics, and good resistance to wear and corrosion. Aluminum Nitride Substrate Aluminum (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
and are used in semiconductor key equipment such as etchers, glue developers, and ion implanters. Semiconductor packaging Ceramic substrates Aluminum nitride ceramic substrates are ideal for high-performance electronic (read more)
Browse Specialty Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Aluminum Nitride is a material that has heat resistance, high thermal conductivity, dielectricity, piezoelectricity, low thermal expansion, and so on. Because of those properties, this material is often used for heat sinks, heaters, substrates, and so on. For example, we machine it into a part (read more)
Browse CNC Machining Services Datasheets for Top Seiko Co., Ltd. -
Aluminum Nitride (AlN) Ceramic Parts AlN ceramics are renowned for their unique combination of high thermal conductivity, electrical insulation, and excellent mechanical properties, including hardness, wear resistance, and corrosion resistance. These properties make Al (read more)
Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD.
Conduct Research Top
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Design Guidelines - Thick Film Resistors and Patterned Substrates
Guidelines apply to both Al2O3 and ALN (Aluminum Nitride) substrates unless otherwise noted. Dimensions are in inches unless otherwise stated. The above are guidelines only and not to be construed as ultimate limitations. Any listed parameter may be improved if other related parameters can
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Aluminum Nitride, One Of The Most Promising Ceramic Materials
Aluminum Nitride ceramics have excellent overall performance, are ideal for semiconductor substrates and structural packaging materials, and have significant application potential in the electronics industry.
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High Thermal Conductivity Aluminum Nitride (AlN) Ceramic Substrate
Suntech's standard AlN substrates are in thickness 0.385mm, 0.5mm, 0.635mm, 0.8mm and 1.0mm, customized specifications are also available. We are also good at laser scribing, surface grinding, polishing and other machining work.
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Market Trend Of Thin Film Ceramic Substrates
) or three-dimensional are considered thin-film ceramic substrates. They can be manufactured from a variety of materials, including Silicon Nitride, Aluminum Nitride, Beryllium Oxide, and Alumina. Because of thin-film ceramics' ability to transfer heat, electronics can use them as heat sinks.
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Comparison of RF Terminations with BeO and ALN Substrates
the use of BeO, though, has necessitated the search for alternative materials that do not have the toxicity associated with beryllia. Aluminum Nitride (AlN) has emerged as the best current candidate to replace BeO in these applications. This paper delineates the issues involved and provides two examples
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AMB AlN Ceramic Substrate
Aluminum nitride (AlN) ceramics as a high thermal conductivity, thermal expansion coefficient close to silicon semiconductor material, has good insulation and mechanical properties, aluminum nitride copper clad plate has very high thermal conductivity in thermal characteristics, heat dissipation
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Power Handling of AIN vs. Al203
Thermal conductivity of a ceramic substrate is an important element when considering the differences between AlN (aluminum nitride) and Al2O3 (alumina). A brief explanation and basic equations follow. The thermal conductivities of each of the ceramics are: [1] Kn = 170-190 (W/m °C) AlN [2] Ka = ~25
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Study on the influencing factors of peeling strength of aluminum nitride DBC substrates
…atmosphere, the aluminum nitride ceramic surface can form an oxide film at a high temperature; (2) the surface of the copper foil can produce a certain amount of Cu-Cu2O eutectic liquid which can wet aluminum nitride substrate surface oxide layer in…
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Prototype packages in aluminum nitride for high performance electronic systems
In the latter case, a cavity down construction, the thin film circuitry was formed on a polished aluminum nitride substrate while the pins were brazed onto another, cofired aluminum nitride base.
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Springer Handbook of Crystal Growth
L.J. Schowalter, Y. Shusterman, R. Wang, I. Bhat, G. Arunmodhi, G.A. Slack: Epitaxial growth of AlN and Al0.5Ga0.5N layers on aluminum nitride sub- strates , Appl. Phys. Lett. 76, 985–987 (2000) 24.7 .
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Measured properties of aluminium nitride microstrip substrates
The measured losses of microstrip lines on aluminium nitride substrates are presented.
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Reaction kinetics and mechanical properties in the reactive brazing of copper to aluminum nitride
the joint between the braze alloy and the aluminum nitride substrate .
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Surface modification technologies V
We compared the sintered aluminium nitride substrate with the alumina substrate.
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DEWPOINT. Final report
Aluminum Nitride Substrate to Heatsink Bonding ........................
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Fracture of hard thin films using nanoindentation and nanoscratch techniques: A materials and mechanics approach
The thin tantalum nitride films used in this study were reactively sputtered onto smooth sapphire (single crystal alumina) substrates and air-fired aluminum nitride substrates .
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Metallized Rubalit® (96% or 99% Alumina) and ALUNIT® (Aluminum Nitride) Substrates by CeramTec
Metallized Rubalit Alumina and Alunit Aluminum Nitride Substrates .
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