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Description: Innovacera standard aluminum nitride wafer diameters are from 50.8 mm (2 inch) to 200 mm (8 inch) ; mostly use are 6" aluminum nitride wafers and 8" AlN wafer substrates . AlN Wafers can be produced in various thicknesses from 0.125mm to 1mm with polished or lapped
- Applications: Other
- Performance Features: Specialty / Other
- Shape / Form: Wafer / Substrate
- Specialty Ceramic Type: Aluminum Nitride
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Supplier: Accuratus Corporation
Description: Accuratus maintains an inventory of standard aluminum nitride substrates for fast delivery requirements. They are stocked in industry standard thicknesses of .025 inches and .040 inches. We will be happy to provide a quotation. Call us at 908-213-7070 or fax your requirement to
- Applications: Electronics / RF-Microwave
- Coeff. of Thermal Expansion (CTE): 4.5 µm/m-C
- Dielectric Constant (Relative Permittivity): 9 #
- Dielectric Strength: 1.70E7 V/m
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Description: Advantages Of Aluminum Nitride Custom Substrate Aluminum Nitride Custom Substrate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss.
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Specialty Ceramic Type: Aluminum Nitride
- Thermal Conductivity: 170 W/m-K
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Description: Aluminum Nitride (AlN) substrate is a ceramic material widely used in the electronics industry. It is renowned for its superior thermal conductivity, high electrical insulating properties, and outstanding chemical stability. AlN substrates have a unique combination of
- Applications: Chemical / Materials Processing, Electrical / HV Parts, Optics / Optical Grade
- Material Type: Aluminum Nitride
- Performance Features: Sintered / Fired
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Supplier: 3X Ceramic Parts Company Limited
Description: Aluminum Nitride (AlN) Substrate Description: AlN substrate is produced by tape casting using AlN powder as raw material and high temperature sintering. It has all the unique properties of AlN material and meets the requirements for electronic packaging baseplate, which
- Dielectric Constant (Relative Permittivity): 9.3 #
- Material Type: Aluminum Nitride
- Shape / Form: Bar Stock, Fabricated / Custom Shape, Rod Stock
- Thermal Conductivity: 165 to 185 W/m-K
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Supplier: Zhuhai Cersol Technology Co., Ltd.
Description: With high efficiency, low cost and pollution-free ceramic substrate casting technology, the product length and width can each reach 7.5 inches. It can also produce ultra-thin substrates with thickness of 0.1mm and 0.15mm. Products with special specifications can be customized according
- Aluminum Oxide / Aluminate Type: Alumina / Aluminum Oxide
- Thickness / Wall Thickness: 0.0591 inch
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Description: Aluminum nitride AlN If high thermal conductivity and electrical insulation are required, aluminum nitride (AlN) is an excellent material, making it an ideal material for thermal management and electrical applications. In addition, aluminum nitride is a
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4.5 µm/m-C
- Specialty Ceramic Type: Aluminum Nitride
- Thermal Conductivity: 150 W/m-K
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Supplier: 3X Ceramic Parts Company Limited
Description: PCB substrate in China's market continues to rise. With its excellent performance, the market share of silicon nitride ceramic substrate is increasing. (1) Compared with alumina substrate or aluminum nitride substrate, it has more than twice the
- Compressive / Crushing Strength: 362592 psi
- Density: 3.2 g/cc
- MOR / Flexural Strength: 87022 psi
- Thermal Conductivity: 15 to 20 W/m-K
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Description: AlN Ceramic Substrate Laser Cutting Overview Aluminum nitride (AlN) ceramic substrate is a technical ceramic material with excellent performance, which has a wide range of applications in semiconductor, optoelectronics, aerospace and other fields. Laser cutting is one of
- Applications: Electrical / HV Parts
- Specialty Ceramic Type: Aluminum Nitride
- Thermal Conductivity: 170 W/m-K
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Supplier: Accuratus Corporation
Description: Aluminum Nitride, formula AlN, is a newer material in the technical ceramics family. While its discovery occurred over 100 years ago, it has been developed into a commercially viable product with controlled and reproducible properties within the last 20 years. Aluminum
- Material Type: Aluminum Nitride
- Shape / Form: Fabricated / Custom Shape
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Supplier: 3X Ceramic Parts Company Limited
Description: Aluminum Nitride Characteristics: Aluminum Nitride Crucible with excellent thermal , mechanical and electrical properties, such as High thermal conductivity, low dielectric constant, linear expansion coefficient matched with silicon, excellent electrical insulation, low
- Coeff. of Thermal Expansion (CTE): 3 to 4.5 µm/m-C
- Dielectric Constant (Relative Permittivity): 9.66 to 10.6 #
- Loss Tangent (tan δ ): 3.00E-4 #
- Material Type: Aluminum Nitride
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Supplier: 3X Ceramic Parts Company Limited
Description: Aluminum Nitride Tube Properties High thermal conductivity,(170-23 0W/mK), up to 9.5 times than that of Alumina Similar coefficient of thermal expansion to that of silicon(Si) Higher electric insulation, and Smaller dielectric constant Higher mechanical strength (450MPa
- Coeff. of Thermal Expansion (CTE): 3 to 4.5 µm/m-C
- Dielectric Constant (Relative Permittivity): 9.66 to 10.6 #
- Loss Tangent (tan δ ): 3.00E-4 #
- Material Type: Aluminum Nitride
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Supplier: CoorsTek
Description: CoorsTek developed the standards for thick-film and thin-film substrates and continues to lead the market with innovative materials, manufacturing, and secondary processes. Customers rely on us for cost-effective solutions delivered on time. Aluminum Nitride Advantages High
- Features: Dielectric / Insulating
- Materials of Construction: Specialty / Other
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Description: Advantages Of Aluminum nitride ceramic washers Aluminum nitride ceramic washers has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Specialty Ceramic Type: Aluminum Nitride
- Thermal Conductivity: 170 W/m-K
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Description: substrates Microwave window materials Compound semiconductor single crystal growth crucible Innovacera can provide Hot Pressed Aluminum Nitride (HPALN) as customized size and welcome to send your inquiry for us.
- Applications: Other
- Material Type: Aluminum Nitride, Other
- Performance Features: Sintered / Fired
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Supplier: Advanced Technical Ceramics Company
Description: AdTech Ceramics is the leading manufacturer of custom designed multilayer aluminum nitride substrates. Aluminum nitride offers high thermal conductivity with an excellent coefficient of thermal expansion (CTE) match to silicon. The material system is stable from
- Materials of Construction: Aluminum Foil / Cladding, Metal Foil / Cladding
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Description: With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma
- Applications: Optics / Optical Grade, Other
- MOR / Flexural Strength: 43511 psi
- Material Type: Aluminum Nitride, Specialty Ceramic
- Max Use / Curie Temperature: 1500 C
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Supplier: San Jose Delta Associates, Inc.
Description: Aluminum Nitride - AlN, is most often the material of choice due to its relatively excellent thermal conductivity and non-toxic nature. Because San Jose Delta has a segregated beryllium oxide - BeO department with over 20 years of experience fabricating common microwave designs such as
- Coeff. of Thermal Expansion (CTE): 5 µm/m-C
- Dielectric Constant (Relative Permittivity): 9 #
- Electrical Resistivity: 1.00E15 ohm-cm
- Material Type: Aluminum Nitride
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Description: Our Advanced Ceramics include: Alumina (Al2O3) Ceramics Zirconia (ZrO2) Ceramics Beryllia (BeO) Ceramics Aluminum Nitride (AlN) Ceramics Silicon Nitride (Si3N4) Ceramics Hot Pressed Boron Nitride (HBN) Ceramics Pyrolytic Boron
- Density: 1.5 to 1.6 g/cc
- Material Type: Aluminum Nitride, Boron Nitride
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Supplier: 3M Advanced Materials Division
Description: loading levels. Boron nitride-filled polymers cool more quickly during production, helping increase throughput. The low density and inherent electrically insulating properties of 3M boron nitride cooling fillers allow for the production of lighter, thinner parts and simpler, more
- Applications: Other
- Material Type: Boron Nitride
- Shape / Form: Fabricated / Custom Shape
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Description: Ceramic substrates have following advantages: High thermal conductivity Excellent insulation properties High mechanical strength Excellent chemical stability Aluminum nitride ceramic substrates: Thermal conductivity > 200 W/m·K, thermal expansion coefficient matches that
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Supplier: San Jose Delta Associates, Inc.
Description: Boron nitride is offered in several grades each with unique materal properties. All however, are readily machinable; much like green (not sintered), alumina BN allows drilling, tapping, treads etc. without the need for diamond tools. Hot-Pressed Boron Nitride Shapes Hot-pressed BN
- Coeff. of Thermal Expansion (CTE): -0.7000 to 7.2 µm/m-C
- Dielectric Constant (Relative Permittivity): 3.4 to 4.6 #
- Dielectric Strength: 9.00E6 to 8.80E7 V/m
- Material Type: Boron Nitride
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Supplier: FX PCB Co., Ltd.
Description: Description Aluminum Nitride PCB Manufacturer Fx PCB is a professional manufacturer of Ceramic substrate PCB, and we can make the ALN PCB(Aluminum Nitride PCB) and AI203 circuit boards(Aluminum oxide board). FX PCB manufactures the ceramic PCB using DPC
- Electrical Resistivity: 10 ohm-cm
- Materials of Construction: Specialty / Other
- Thickness: 0.0150 to 0.1181 inches
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Supplier: Knowles Precision Devices
Description: High-K substrates are used for circuit miniaturization. DLI offers complete fabrication services!
- Applications: Electronics / RF-Microwave
- Coeff. of Thermal Expansion (CTE): 0.5500 to 10.1 µm/m-C
- Length: 1 to 4 inch
- Material Type: Alumina / Aluminum Oxide, Aluminum Nitride, Quartz, Silica / Silicate Materials
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Description: DPC ceramic substrates are typically composed of aluminium nitride or alumina ceramic materials, to which a copper layer is directly bonded on one or both sides. DPC ceramic substrates are frequently used in applications like electronic packaging and power electronics because
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Material Type: Aluminum Nitride, Specialty Ceramic
- Performance Features: Metallized / Silvered
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Description: in telecommunications technology since it can be processed using both thick and thin film technologies. As a result, Aluminum Nitride ceramic is utilized as a substrate for semiconductors as well as high-power electronic devices, housings, and heat sinks. Typical Features
- Dielectric Strength: 2.00E7 V/m
- Material Type: Aluminum Nitride
- Thermal Conductivity: 180 to 200 W/m-K
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Description: DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules
- Applications: Battery / Fuel Cell, Construction & Building / Architectural, Electrical / HV Parts, Electronics / RF-Microwave
- Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Specialty Ceramic
- Performance Features: Metallized / Silvered
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Supplier: Fairfield Crystal Technology, LLC.
Description: Fairfield Crystal Technology uses a unique patented process to produce our Aluminum Nitride (AlN) crystals. We produce single-crystal hexagonal material for a variety of device applications. We are currently offering 5 to 10mm diameter research grade substrates.
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Description: AlN substrate possesses a wide range of superior physical properties, including high breakdown electric field strength, thermal conductivity, resistivity, and so forth. In fields like LED packaging, power modules, wafer bonding, power resistors, and metalized substrates (such as thin
- Applications: Chemical / Materials Processing, Electrical / HV Parts, Electronics / RF-Microwave, Refractory / High Temperatures
- Material Type: Aluminum Nitride
- Performance Features: Sintered / Fired
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Supplier: Zhuhai Cersol Technology Co., Ltd.
Description: Inserts Series PCBN INSERTS SERIES Boron Nitride Ceramic Square Crucible BORON NITRIDE CERAMIC SQUARE CRUCIBLE Silicon Nitride Lift Tube SILICON NITRIDE LIFT TUBE Silicon Nitride Ceramic Beads SILICON NITRIDE CERAMIC BEADS Aluminum Nitride
- Material Types: Boron Nitride
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Supplier: Zhuhai Cersol Technology Co., Ltd.
Description: bulk density. The digital control of production equipment ensures stable and consistent product quality. The unique process formula optimizes the component structure, enhances the thermal shock resistance and flexural strength of the evaporation boat, improves the spreading area and evaporation
- Glass Materials: Other
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Description: Wintrustek is a leading ceramic materials supplier. Aluminum nitride and aluminum oxide ceramic substrates are available from us. Aluminum nitride (AlN) is a novel ceramic material with exceptional all-around properties. It has good thermal conductivity,
- Material Type: Alumina / Aluminum Oxide, Aluminum Nitride
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Description: supplier. We provide high-quality Beryllium Oxide ceramics at a competitive price. More Materials: Our Advanced Ceramics include: Alumina (Al2O3) Ceramics Zirconia (ZrO2) Ceramics Beryllia (BeO) Ceramics Aluminum Nitride (AlN) Ceramics
- Dielectric Strength: 4.00E7 V/m
- Material Type: Beryllia / Beryllium Oxide
- Max Use / Curie Temperature: 1800 C
- Thermal Conductivity: 260 W/m-K
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATITE®650 is an alloy of silicon nitride and aluminum oxide. This superior refractory material has the combined properties of silicon nitride (high strength, hardness, fracture toughness, and low thermal expansion) and aluminum oxide (corrosion resistance, chemically
- Applications: Other
- Bore Diameter (I.D.): 0.2559 to 0.6299 inch
- Coeff. of Thermal Expansion (CTE): 3 µm/m-C
- Length: 5.91 to 23.62 inch
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Description: BN-AlN Ceramic is made by sintering Boron Nitride (BN) and Aluminum Nitride (AIN) powder. It has excellent electrical insulator, thermal conductivity, high strength, resistance to thermal shock, and strong resistance to halogen gas plasma, which is offers a wide range of
- Applications: Other
- Performance Features: Machinable
- Shape / Form: Wafer / Substrate
- Specialty Ceramic Type: Boron Nitride
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Supplier: San Jose Delta Associates, Inc.
Description: like other technical ceramics of the similar density and grain size. Intricate design features are no more or less difficult than other materials such as alumina or aluminum nitride-AlN and delivery times are similar as well.
- Coeff. of Thermal Expansion (CTE): 9.54E8 µm/m-C
- Dielectric Constant (Relative Permittivity): 6.7 to 6.8 #
- Dielectric Strength: 300 V/m
- Material Type: Beryllia / Beryllium Oxide
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Supplier: CoorsTek
Description: CoorsTek ceramics provide superior thermal performance in wafers, phosphors, and substrates for high-brightness LED manufacturing. Ceramic substrates Thick-Film Alumina Aluminum Nitride Ceramic phosphors Gallium nitride on silicon epiwafers MOCVD process equipment
- Applications: Thermal Insulation / Fire Proofing, Other
- Specialty Ceramic Type: Aluminum Nitride
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Supplier: Plansee SE
Description: Our targets and cathodes made from titanium-aluminum (TiAl) ensure that drills, milling machines, indexable cutting inserts and other tools are protected by a hard, oxidation-resistant nitride coating (TiAlN). High feed speeds, excellent cutting performance and impressive metal removal
- Type: Sputtering Target
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Supplier: FX PCB Co., Ltd.
Description: Ceramic bare PCB. What’s more, the board will have the properties of Ceramic: 1, High Thermal Conductivity The Ceramic material AI203(Alumina) and AIN(Aluminum nitride) have high thermal conductivity, which will make the heat dissipation more efficient and reduce the overheating
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Supplier: FX PCB Co., Ltd.
Description: Description What is the Ceramic PCB Substrate? FX PCB listed two kinds of Ceramic PCBs, which are Aluminum Nitride Ceramic PCB and Alumina Ceramic PCB (ALN and AI203) Properties for your reference: BECAUSE OF ITS HIGH THERMAL CONDUCTIVITY, LOW ROUGHNESS, AND EXPANSION
- Electrical Resistivity: 10 ohm-cm
- Materials of Construction: Specialty / Other
- Thickness: 0.0098 to 0.0150 inches
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Supplier: Cutting Edge Technologies, Inc.
Description: Length: 1 1/2" Shank Diameter: 1/8" Substrate Material: Carbide Type: End Mill
- Coating: Coated, Titanium Nitride (TiN)
- Cutter Configuration: Solid Construction
- Cutter Material: Carbide
- Cutting Application: General Purpose, Aluminum, Bronze / Brass / Copper, Ceramic, Plastic
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Supplier: Cutting Edge Technologies, Inc.
Description: : 2 1/2" Shank Diameter: 1/4" Substrate Material: Carbide Type: End Mill
- Coating: Coated, Titanium Nitride (TiN)
- Cutter Configuration: Solid Construction
- Cutter Material: Carbide
- Cutting Application: General Purpose, Aluminum, Bronze / Brass / Copper, Ceramic, Plastic
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Supplier: Cutting Edge Technologies, Inc.
Description: : 2" Shank Diameter: 3/16" Substrate Material: Carbide Type: End Mill
- Coating: Coated, Titanium Nitride (TiN)
- Cutter Configuration: Solid Construction
- Cutter Material: Carbide
- Cutting Application: General Purpose, Aluminum, Bronze / Brass / Copper, Ceramic, Plastic
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Supplier: Cutting Edge Technologies, Inc.
Description: Length: 2 1/2" Shank Diameter: 7/16" Substrate Material: Carbide Type: End Mill
- Coating: Coated, Titanium Nitride (TiN)
- Cutter Configuration: Solid Construction
- Cutter Material: Carbide
- Cutting Application: General Purpose, Aluminum, Bronze / Brass / Copper, Ceramic, Plastic
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Aluminum Nitride (AlN) Substrate Description: AlN substrate is produced by tape casting using AlN powder as raw material and high temperature sintering. It has all the unique properties of AlN material and meets the requirements for electronic packaging baseplate, which makes it (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
The Importance of Aluminum Nitride Wafer Substrates Aluminum Nitride Wafer Substrates play an essential role in the semiconductor industry. One of the key reasons for their (read more)
Browse Specialty Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
With superior mechanical strength, high breakdown voltage, and outstanding thermal shock resistance, AlN substrates ensure reliable performance in demanding environments. Their precision machining capability and customizable specifications make them well-suited for IGBT power modules, high (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
-pressed aluminum nitride ceramic part application: Semiconductor heaters Magnetic resonance imaging equipment Etching machine Integrated circuit part Structural packaging materials High-power heat dissipation insulating substrates (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Efficient thermal management and electrical insulation are crucial in modern electronics and high-power devices. Aluminum nitride (AlN) ceramics provide engineers with a robust solution, combining superior heat dissipation, mechanical strength, and electrical (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
, resulting in a surface roughness of Ra0.1-0.3um. 99.6% alumina provides excellent electrical insulation, low thermal conductivity, great mechanical strength, outstanding dielectric characteristics, and good resistance to wear and corrosion. Aluminum Nitride Substrate Aluminum (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
and are used in semiconductor key equipment such as etchers, glue developers, and ion implanters. Semiconductor packaging Ceramic substrates Aluminum nitride ceramic substrates are ideal for high-performance electronic (read more)
Browse Specialty Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Aluminum Nitride is a material that has heat resistance, high thermal conductivity, dielectricity, piezoelectricity, low thermal expansion, and so on. Because of those properties, this material is often used for heat sinks, heaters, substrates, and so on. For example, we machine it into a part (read more)
Browse CNC Machining Services Datasheets for Top Seiko Co., Ltd. -
Aluminum Nitride (AlN) Ceramic Parts AlN ceramics are renowned for their unique combination of high thermal conductivity, electrical insulation, and excellent mechanical properties, including hardness, wear resistance, and corrosion resistance. These properties make Al (read more)
Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
As an important component of LED, packaging substrates are also changing with the development of LED chip technology. At present, metal and ceramic substrates are mainly used in LED heat dissipation substrates. Metal substrates are made of aluminum or copper. Because of their mature technology (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited
Conduct Research Top
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Design Guidelines - Thick Film Resistors and Patterned Substrates
Guidelines apply to both Al2O3 and ALN (Aluminum Nitride) substrates unless otherwise noted. Dimensions are in inches unless otherwise stated. The above are guidelines only and not to be construed as ultimate limitations. Any listed parameter may be improved if other related parameters can
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Aluminum Nitride, One Of The Most Promising Ceramic Materials
Aluminum Nitride ceramics have excellent overall performance, are ideal for semiconductor substrates and structural packaging materials, and have significant application potential in the electronics industry.
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High Thermal Conductivity Aluminum Nitride (AlN) Ceramic Substrate
Suntech's standard AlN substrates are in thickness 0.385mm, 0.5mm, 0.635mm, 0.8mm and 1.0mm, customized specifications are also available. We are also good at laser scribing, surface grinding, polishing and other machining work.
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Market Trend Of Thin Film Ceramic Substrates
) or three-dimensional are considered thin-film ceramic substrates. They can be manufactured from a variety of materials, including Silicon Nitride, Aluminum Nitride, Beryllium Oxide, and Alumina. Because of thin-film ceramics' ability to transfer heat, electronics can use them as heat sinks.
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Comparison of RF Terminations with BeO and ALN Substrates
the use of BeO, though, has necessitated the search for alternative materials that do not have the toxicity associated with beryllia. Aluminum Nitride (AlN) has emerged as the best current candidate to replace BeO in these applications. This paper delineates the issues involved and provides two examples
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AMB AlN Ceramic Substrate
Aluminum nitride (AlN) ceramics as a high thermal conductivity, thermal expansion coefficient close to silicon semiconductor material, has good insulation and mechanical properties, aluminum nitride copper clad plate has very high thermal conductivity in thermal characteristics, heat dissipation
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Power Handling of AIN vs. Al203
Thermal conductivity of a ceramic substrate is an important element when considering the differences between AlN (aluminum nitride) and Al2O3 (alumina). A brief explanation and basic equations follow. The thermal conductivities of each of the ceramics are: [1] Kn = 170-190 (W/m °C) AlN [2] Ka = ~25
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Study on the influencing factors of peeling strength of aluminum nitride DBC substrates
…atmosphere, the aluminum nitride ceramic surface can form an oxide film at a high temperature; (2) the surface of the copper foil can produce a certain amount of Cu-Cu2O eutectic liquid which can wet aluminum nitride substrate surface oxide layer in…
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Prototype packages in aluminum nitride for high performance electronic systems
In the latter case, a cavity down construction, the thin film circuitry was formed on a polished aluminum nitride substrate while the pins were brazed onto another, cofired aluminum nitride base.
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Springer Handbook of Crystal Growth
L.J. Schowalter, Y. Shusterman, R. Wang, I. Bhat, G. Arunmodhi, G.A. Slack: Epitaxial growth of AlN and Al0.5Ga0.5N layers on aluminum nitride sub- strates , Appl. Phys. Lett. 76, 985–987 (2000) 24.7 .
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Measured properties of aluminium nitride microstrip substrates
The measured losses of microstrip lines on aluminium nitride substrates are presented.
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Reaction kinetics and mechanical properties in the reactive brazing of copper to aluminum nitride
the joint between the braze alloy and the aluminum nitride substrate .
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Surface modification technologies V
We compared the sintered aluminium nitride substrate with the alumina substrate.
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DEWPOINT. Final report
Aluminum Nitride Substrate to Heatsink Bonding ........................
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Fracture of hard thin films using nanoindentation and nanoscratch techniques: A materials and mechanics approach
The thin tantalum nitride films used in this study were reactively sputtered onto smooth sapphire (single crystal alumina) substrates and air-fired aluminum nitride substrates .
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Metallized Rubalit® (96% or 99% Alumina) and ALUNIT® (Aluminum Nitride) Substrates by CeramTec
Metallized Rubalit Alumina and Alunit Aluminum Nitride Substrates .
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