Aluminum Oxide Wafer

Description: from substrate surfaces. Additionally, the surfactant technology employed by AmberClean SWR is designed to cut through and remove aluminum oxide, diamond, silicon carbide and other process residues without harming delicate ceramic or silicon-based substrates. Features & Benefits

• Aqueous / Water-based: Yes
• Features: Biodegradable, VOC Compliant
• Industry Applications: Semiconductor Wafer / Cleanroom
• Temperature (As Used): 150 F

Description: from substrate surfaces. Additionally, the surfactant technology employed by AmberClean SWB is designed to cut through and remove aluminum oxide, diamond, silicon carbide, waxes and other process residues without harming delicate ceramic or silicon-based substrates. Features

• Aqueous / Water-based: Yes
• Features: Biodegradable, VOC Compliant
• Industry Applications: Semiconductor Wafer / Cleanroom
• Temperature (As Used): 150 F

Description: Aluminum Oxide is a typical artifical abrasive having larger tenacity without impurities. It is characterized by its hardness, toughness and uniformity in size. Hardness Mohs Scale: 9.8 Specific Gravity: 3.9 Color: Light Brown / White Applications: Brass Parts, Valve Parts, Silicon

• Views: Abrasive Grain / Grit

Description: from the substrate surface in highly technical applications such as silicon wafer fabrication. Additionally, the surfactant technology employed by AmberClean L17M is designed to cut through and remove aluminum oxide slurries and other process residues without harming delicate

• Aqueous / Water-based: Yes
• Features: Biodegradable, VOC Compliant
• Industry Applications: Semiconductor Wafer / Cleanroom
• Temperature (As Used): 150 F

Description: Safety Packaging Under None

• Inorganic Compounds: OrganoMetallics

Description: Material High-purity aluminum oxide (Al2O3), silicon carbide (SiC), or silicon nitride (Si3N4). Advanced porous ceramic structure for uniform vacuum distribution. Features The porosity is high: An important feature of porous ceramics is that they have more uniform and

• Chuck Geometry: Round
• Diameter: 4 to 12 inch
• Materials of Construction: Ceramic
• Type: Vacuum Chuck

Description: High Precise & Fine Patterning Technology for Al2O3 and AlN Substrate High Grade Al2O3 Substrate

• Aluminum Oxide / Aluminate Type: Alumina / Aluminum Oxide
• Applications: Electronics / RF-Microwave
• Shape / Form: Wafer / Substrate

Description: Lift pins are used in assemblies to lift and move wafers through semiconductor processing positions. Since they are exposed to chamber or other processing conditions, they require robust thermal stability and corrosion resistance. Semiconductor Processing Components Coors

• Aluminum Oxide / Aluminate Type: Alumina / Aluminum Oxide
• Applications: Wear Parts / Tooling, Chemical / Materials Processing
• Shape / Form: Wafer Carrier / Holder

Description: TO-3P Ceramic heat sinks and thermal pads are designed to provide superior thermal performance in advanced thermal management solution such as high power applications, particularly for insulated-gate bipolar transistor (IGBT) modules. These heat sinks have advantages of heat dissipation, electrical

• Applications: Other
• Performance Features: Specialty / Other
• Shape / Form: Wafer / Substrate

Description: Susceptors hold and heat semiconductor wafers during thermal processing. A susceptor is made of a material which absorbs energy by induction, conduction, and/or radiation and heats the wafer. Its thermal shock resistance, thermal conductivity, and purity are critical to rapid thermal

• Aluminum Oxide / Aluminate Type: Alumina / Aluminum Oxide
• Applications: Wear Parts / Tooling
• Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder

Description: . Variously-shaped Nano-step structures can be formed on the Sapphire wafer surface, and have been expected to be used as the height standard sample for SPM and Immobilization plate for observing biomaterials.

• Aluminum Oxide / Aluminate Type: Sapphire
• Applications: Optics / Optical Grade
• Bore Diameter (I.D.): 0.0787 inch
• Density: 3.97 g/cc

Description: guide rail, silicon carbide slide rail, silicon carbide vacuum suction cup, silicon carbide reflector, silicon carbide crossbeam, silicon carbide workpiece table, etc. the main function is to carry the wafer to perform high-speed ultra-precision motion along the designated movement trajectory

• Aluminum Oxide / Aluminate Type: Alumina / Aluminum Oxide
• Applications: Other
• Length: 62.99 inch

Description: Saint-Gobain Ceramic Materials' sub-micron polishing slurries are calcined aluminum oxide particles (99%+ purity) suspended in aqueous solutions, designed for use in electronics and industrial polishing applications. They are offered with only minimal additives and are intended as the

• Abrasive Grain Type: Aluminum Oxide
• Form: Slurry
• Products / Materials Finished: Semiconductors / Electronics (Wafers)
• Type: Polishing

Description: vacuum ceramic arm are used on the photovaltaic equipment , a left and a right ceramic arm used in conjunction, their funtion is to handling the wafer by air suction and move it . The hole and air slot on the plate was cnc machined , and the top plate and bottom plate combined together to

• Aluminum Oxide / Aluminate Type: Alumina / Aluminum Oxide
• Compressive / Crushing Strength: 377096 psi
• Density: 3.9 g/cc

Description: The most widely used and best-known fine ceramic material. Good mechanical strength, electrical insulation, high-frequency loss, thermal conductivity, and resistance to heat, wear and corrosion. Sapphire is single-crystal alumina.

• Aluminum Oxide / Aluminate Type: Alumina / Aluminum Oxide
• Applications: Wear Parts / Tooling, Other, Chemical / Materials Processing, Dielectric Ceramics / Materials, Refractory / High Temperature Materials, Electrical / HV Parts, Electronics / RF-Microwave
• Coeff. of Thermal Expansion (CTE): 7.8 µm/m-C
• Compressive / Crushing Strength: 313280 to 340837 psi

Description: value for the cost in fabricated alumina shapes. With an excellent combination of properties and an attractive price, it is no surprise that fine grain technical grade alumina has a very wide range of applications. Alumina or aluminum oxide (Al2O3) in its various levels of purity is

• Aluminum Oxide / Aluminate Type: Alumina / Aluminum Oxide
• Applications: Dielectric Ceramics / Materials
• Coeff. of Thermal Expansion (CTE): 8.2 to 8.4 µm/m-C
• Compressive / Crushing Strength: 304577 to 377096 psi

Description: Sapphire is single-crystal alumina, a transparent material with excellent chemical stability and valuable mechanical, thermal and optical properties. Its material properties are vastly superior to glass, quartz and other mass-produced transparent materials.

• Aluminum Oxide / Aluminate Type: Sapphire
• Applications: Other, Chemical / Materials Processing, Dielectric Ceramics / Materials, Optics / Optical Grade, Refractory / High Temperature Materials, Electrical / HV Parts, Electronics / RF-Microwave
• Coeff. of Thermal Expansion (CTE): 7 to 7.7 µm/m-C
• Compressive / Crushing Strength: 426408 psi

Description: Aluminum Nitride (AlN) is a suitable material to utilize when high thermal conductivity and electrical insulation are required, making it perfect for use in thermal management and electrical applications. Furthermore, AlN is a popular alternative to Beryllium Oxide (BeO) in the

• Material Type: Aluminum Nitride

Description: walled showerheads including 151 holes sized and positioned to create uniform plasma flow over a wafer surface. Complex geometries – delicate shapes for plasma components Integrated flanges on sapphire tubes for high vacuum applications Polished faces and diameters

• Aluminum Oxide / Aluminate Type: Sapphire
• Shape / Form: Fabricated / Custom Shape

Description: Ceramic Focus Ring for Plasma Etch Equipment When aluminum alloy is selected as the chamber material of the etcher, it is easy to cause metal particle pollution. Instead, a dense anodic aluminum oxide layer is coated on the aluminum alloy to improve the corrosion

Description: properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finish. High Temperature Applications Temperature stability and excellent resistance to thermal shock makes BN the material of choice in the

• Applications: Refractory / High Temperature Materials, Thermal Insulation / Fire Proofing, Wear Parts / Tooling
• Coeff. of Thermal Expansion (CTE): -0.7000 to 7.2 µm/m-C
• Compressive / Crushing Strength: 3626 to 45968 psi
• Density: 1.9 to 2.9 g/cc

Description: be used for surface metal contamination that is located within approximately 5 nm of the surface of the wafer. 1.4 This test method is especially useful for determining the surface metal areal densities in the native oxide or chemically grown oxide of polished silicon substrates

Description: approximately 5 nm of the surface of the wafer. 1.4 This test method is especially useful for determining the surface metal areal densities in the native oxide or chemically grown oxide of polished silicon substrates after cleaning. 1.5 This test method is useful for sodium,

Description: Aluminum Nitride (AlN) is a suitable material to utilize when high thermal conductivity and electrical insulation are required, making it perfect for use in thermal management and electrical applications. Furthermore, AlN is a popular alternative to Beryllium Oxide (BeO) in the

• Material Type: Aluminum Nitride

Description: . The results indicate that by comparision, Hexaloy® SA SiC outperforms tungsten carbide and aluminum oxide in all chemical categories. The ability of Hexaloy® SA SiC to resist corrosion along with its excellent surface finish characteristics makes it ideallu suited to

• Applications: Abrasive / Erosive Wear Protection, Chemical / Materials Processing, Refractory / High Temperature Materials, Corrosion Protection, Wear Parts / Tooling
• Coeff. of Thermal Expansion (CTE): 4.02 µm/m-C
• Compressive / Crushing Strength: 565644 psi
• Density: 3.1 g/cc

Description: ) ZABN: Boron Nitride + Zirconium Oxide + Aluminum Nitride + Al2BO3 SCBN: Boron Nitride + Silicon Carbon + Al2BO3 Processing of Boron Nitride Ceramics Hot Pressed Sintering Chemical Vapor Deposition Applications of Boron Nitrides

• Applications: Foundry / Metal Processing, Thermal Insulation / Fire Proofing
• Compressive / Crushing Strength: 14504 to 43511 psi
• Density: 1.95 to 3.3 g/cc
• Electrical Resistivity: 10 ohm-cm

Description: Vanpro offers specialized manufacturing services for companies in the Medical, Defense and Communications, and Wafer Processing industries. In our perpetually shrinking and increasingly faster-paced world, Vanpro has positioned itself on the cutting edge by transitioning to a

• Location: North America, United States Only, Midwest US Only
• Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Swiss Machining, Water / Abrasive Jet Machining, Jig Boring, Broaching, Deep Hole Drilling, Centerless Grinding, Double-disc Grinding, ID / Internal Grinding, OD / External Grinding, Jig Grinding, Surface Grinding, Honing, Electrode EDM, Wire EDM, Other
• Materials: Aluminum, Brass, Cast Iron, Composites, Hardened Metals, Magnesium, Nickel / Nickel Alloys, Plastics, Stainless Steel, Steel / Steel Alloys, Titanium, Other
• Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding, Other

Description: dielectric constant, and enhanced dielectric strength. Because it has a microstructure similar to graphite, boron nitride is often referred to as "white graphite" in its solid form. Unlike graphite, however, boron nitride is an excellent electrical insulator with a greater oxidation

• Material Type: Boron Nitride
• Shape / Form: Tube / Sheath - Immersion (Closed End)

Description: dielectric constant, and enhanced dielectric strength. Because it has a microstructure similar to graphite, boron nitride is often referred to as "white graphite" in its solid form. Unlike graphite, however, boron nitride is an excellent electrical insulator with a greater oxidation

• Material Type: Boron Nitride

Description: cobalt-60 sources, test specimens must be enclosed in a lead-aluminum container to minimize dose-enhancement effects caused by low-energy scattered radiation (unless it has been demonstrated that these effects are negligible). For this lead-aluminum container, a minimum of 1.5 mm of