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  • Market Trend Of Thin Film Ceramic Substrates
    ) or three-dimensional are considered thin-film ceramic substrates. They can be manufactured from a variety of materials, including Silicon Nitride, Aluminum Nitride, Beryllium Oxide, and Alumina. Because of thin-film ceramics' ability to transfer heat, electronics can use them as heat sinks.
  • Comparison of RF Terminations with BeO and ALN Substrates
    Terminations designed to dissipate significant amounts of power at RF frequencies have traditionally been fabricated on beryllium oxide (BeO) substrates. The high thermal conductivity and moderate dielectric constant make BeO an ideal choice for this application. Increased regulation regarding

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