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Supplier: Fuji America Corporation
Description: . It is also possible to check for missing bumps on BGA and CSP parts, which cannot be detected after a part is placed. The panel warp is automatically measured by a laser sensor before placement. Placement is only performed on panels that are within the set tolerance, so that
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Supplier: Fuji America Corporation
Description: placement to ensure that there are no warped terminals or leads on parts such as connectors and IC chips that can cause poor connectivity, preventing defective parts from being used. It is also possible to check for missing bumps on BGA and CSP parts, which cannot be detected after a
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the highest performance and completely
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 1 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the highest performance and completely
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 1 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the highest performance and completely
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 0.5000 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Cal Quality Electronics, Inc.
Description: the following SMT assembly capabilities: AOI (Automated Optical Inspection) BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly
- Location: North America, United States Only, Southwest US Only
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Material Acquisition: Customer Supplied, Vendor Supplied
- Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling
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Supplier: Henkel Corporation - Electronics
Description: Halide-free, no clean, low voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and reflow. LF730 has been formulated to give low voiding in BGA joints, a high tack force to resist component movement during high speed
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Supplier: Optima Technology Associates, Inc.
Description: (BGA), Micro-BGA, flip-chip, fine-pitch, and high density component placement capabilitity (0201), in-circuit and functional testing. We are equipped with in-house x-ray inspection, and BGA rework tools. 50,000 ft2 ISO Certified, UL Approved Facility Located in Export
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
- Location: North America, United States Only, Northeast US Only, South Asia Only
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Material Acquisition: Customer Supplied, Vendor Supplied
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Supplier: Profab Electronics, Inc.
Description: Profab Electronics offers turnkey or consigned contract manufacturing of printed circuit boards and electro-mechanical assemblies. Our services include surface mount placement (BGA's, ultra fine pitch, micro BGA's, and components as small as 0201), through hole, programming,
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
- Location: North America, United States Only, Southern US Only
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Material Acquisition: Customer Supplied, Vendor Supplied
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Supplier: Cal Quality Electronics, Inc.
Description: the following SMT assembly capabilities: AOI (Automated Optical Inspection) BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly
- Capabilities: Total Manufacturing, Testing and Evaluation, Prototyping, Just-In-Time Capability
- Industry Served: Aerospace / Military, Automotive, Commercial, Computer / Networking, Consumer Electronics / Appliances, Industrial Automation, Medical, Telecommunications
- Location: North America, United States Only, Southwest US Only
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Supplier: PACE
Description: PACE's ThermoFlo Systems (TF 1700 & TF 2700) are the next generation in semi-automated, cost effective solutions for area array package (BGA) rework. No other systems on the market have the advanced features found on these systems or is easier to use, ensuring operator acceptance and success
- Equipment Type: Accessory / Other
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Supplier: Entech Electronics Inc.
Description: facility for BGA placement. · PC based test systems (Dedicated, JTAG/Boundary Scan). Turnkey product manufacturing · Total product build. · Packaging and warehousing including manuals, CDs, literature and cartons. · Shipping direct to the end user. Other
- Capabilities: Design Assistance, Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
- Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only
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Supplier: SemiGen
Description: For high-mix, automated, prototype- to medium-volume printed circuit board assembly (PCBA) SemiGen is your go-to, on-time provider. We help manufacturers of military electronics, commercial products, and medical instrumentation with their leadless, fine-pitch, BGA, and QFP assembly
- Location: North America, United States Only, Other
- PCB Type: Single-Sided Boards, THT Components
- Supplier Capability: PCB Design / Layout, Prototype Quantities, Production Quantities, PCB Assembly
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Supplier: Entech Electronics Inc.
Description: facility for BGA placement. · PC based test systems (Dedicated, JTAG/Boundary Scan). Turnkey product manufacturing · Total product build. · Packaging and warehousing including manuals, CDs, literature and cartons. · Shipping direct to the end user. Other
- Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Extrusion, Mechanical Assembly, Molding, Plastic Fabrication, Sheet Metal Fabrication
- Industry Served: Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Instruments / Sensors, Telecommunications
- Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only
- Services: Computer Aided Design (CAD) / Solid Modeling, Computer Aided Machining (CAM), Just-in-Time Delivery, Kitting, Low Volume Production, High Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing /
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Supplier: SemiGen
Description: For high-mix, automated, prototype- to medium-volume printed circuit board assembly (PCBA) SemiGen is your go-to, on-time provider. We help manufacturers of military electronics, commercial products, and medical instrumentation with their leadless, fine-pitch, BGA, and QFP assembly
- Capabilities: Single-Sided Boards, THT Components
- Location: North America, United States Only, Other
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Unique Application of Solder Ball Technology on QFP Pads Improves Processing Reliability
IC complexity and higher I/O counts have pushed older technology like Quad Flat Pack packages (QFP) to the limit of finer pin placement. Solder bridging between closely spaced gull wing leads of fine pitch QFP packages presents a significant yield issue in production. This, along with other
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Gapless rework and reliability of lead-free BGA assemblies
A plot of the time-to- failure for the BGA placement gaps is shown in Figure 11.
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No clean mass reflow of large over molded plastic pad array carriers (OMPAC)
Stencil printing of solder paste was used before BGA placements for solder ball attachments to the corresponding pads on the PCBs.
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Printed Circuits Handbook, Sixth Edition > COMPONENT-TO-PWB RELIABILITY—THE IMPACT OF DESIGN VARIABLES AND LEAD FREE
This PWB density increase (where density refers to the number of components per unit area of PWB) may force designers to consider mirror BGA placement (see Figs. 58.7 and 58.8) or to place multiple devices on one side of a …
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Equipment requirements for the repair of BGA-boards
This alternativeprinciple of BGA placement is illustrated in figure2.
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Writing and applications of fiber Bragg grating arrays
b) Fig.6: BGA ofconsisting oflO Bragg gratings spaced by 100 GHz a) refiectedpower spectrum and reflection delayfrom one Bragg grating set and b) reflectedpower spectra offour identical BGA and the resulting spectrum measuredfor the four BGA placed in cascade with circulators.
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High reliability second level interconnects using polymer core BGAs
BGA placements were done by printing eutectic Sn63Rb37 solder paste onto LGA pads and then placing either conventional solder balls or the polymer core balls.
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Failure Mechanisms of Ball Grid Array Packages Under Vibration and Thermal Loading
OBSERVED FAILURES After accumulated test duration over 1700 hours for the polyimide based board, we have gathered knowledge on fatigue endurance, best locations for BGA placement , and failure mechanism.
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Reliability issues studied in Solid-State Drives
A BGA placed near the maximum flexing point of an SSD experiences higher failure rate under shock loading than the one that is placed further away.
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Effect of fixation method on solder joint vibration fatigue reliability of high density PCB assembly
Finally, it can make some references for guiding BGA placement , selecting the appropriate size of BGA and the best fixation method for predicting and optimizing random vibration fatigue life of solder joints.
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Secure Embedded Systems: The Threat of Reverse Engineering
But even for BGA devices, unrouted JTAG pins can often be accessed by controlled depth drilling through the PCB from the opposite side, meaning that back-to-back BGA placement is most secure (such as a BGA processor on one side of …