BGA Placement

Description: being used. It is also possible to check for missing bumps on BGA and CSP parts, which cannot be detected after a part is placed. The panel warp is automatically measured by a laser sensor before placement. Placement is only performed on panels that are within the set tolerance,

Description: before placement. Placement is only performed on panels that are within the set tolerance, so that producing on defective panels is prevented. Excessive downward push and placing parts above the panel can be prevented by reflecting the part height measured by IPS to the

Description: KIT, STAR TOOL, BGA, 7 PIECES; For Use With:ASP/SHP Arms; Tip / Nozzle Style:Star; Tip / Nozzle Width:-; Tip / Nozzle Length:-; Product Range:-; SVHC:No SVHC (15-Jun-2015); Accessory Type:Star BGA Placement Tool Set RoHS Compliant: Yes

Description: STAR TOOL, BGA, 27X27MM; For Use With:ASP/SHP Arms; Tip / Nozzle Style:Star; Tip / Nozzle Width:27mm; Tip / Nozzle Length:27mm; Product Range:-; SVHC:No SVHC (15-Jun-2015); Accessory Type:Star BGA Placement Tool RoHS Compliant: Yes

Description: STAR TOOL, BGA, 31X31MM; For Use With:ASP/SHP Arms; Tip / Nozzle Style:Star; Tip / Nozzle Width:31mm; Tip / Nozzle Length:31mm; Product Range:-; SVHC:No SVHC (15-Jun-2015); Accessory Type:Star BGA Placement Tool RoHS Compliant: Yes

Description: STAR TOOL, BGA, 40X40MM; For Use With:ASP/SHP Arms; Tip / Nozzle Style:BGA; Tip / Nozzle Width:40mm; Tip / Nozzle Length:40mm; Product Range:-; SVHC:No SVHC (15-Jun-2015); Accessory Type:Star BGA Placement Tool RoHS Compliant: Yes

Description: BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly Cal Quality maintains a highly skilled work force for the assembly of Through Hole or mixed technology boards, including both wave and hand

• Testing Services: Agency Compliance Testing, Analytical Laboratory Testing, Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
• Production Capabilities: Cabling, High Volume, Mid Volume, Prototype / Low Volume, Quick Turn
• Material Acquisition: Customer Supplied, Vendor Supplied
• Manufacturing: Flexible Printed Circuit Board Assembly, Microelectronic, Chip On Board, Microelectronic, Flip Chip, Optoelectronic Assembly, Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Surface Mount Assembly, System Assembly, Through Hole Assembly

Description: Profab Electronics offers turnkey or consigned contract manufacturing of printed circuit boards and electro-mechanical assemblies. Our services include surface mount placement (BGA's, ultra fine pitch, micro BGA's, and components as small as 0201), through hole, programming,

• Testing Services: Agency Compliance Testing, Analytical Laboratory Testing, Automated Optical Inspection, Functional Testing, In-circuit Testing, X-Ray Testing
• Production Capabilities: Cabling, High Volume, Mid Volume, Prototype / Low Volume, Quick Turn
• Design Services: Conceptual Product Development, Electrical Design Services, Mechanical Design Services, Software Design Services
• Material Acquisition: Customer Supplied, Vendor Supplied

Description: Micro-BGA, flip-chip, fine-pitch, and high density component placement capabilitity (0201), in-circuit and functional testing. We are equipped with in-house x-ray inspection, and BGA rework tools. 50,000 ft2 ISO Certified, UL Approved Facility Located in Export Zone at NSEZ,

• Testing Services: Automated Optical Inspection, Functional Testing, In-circuit Testing, X-Ray Testing
• Production Capabilities: Cabling, High Volume, Mid Volume, Prototype / Low Volume, Quick Turn
• Design Services: Conceptual Product Development, Electrical Design Services, Mechanical Design Services, Software Design Services
• Material Acquisition: Customer Supplied, Vendor Supplied

Description: Halide-free, no clean, low voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and reflow. LF730 has been formulated to give low voiding in BGA joints, a high tack force to resist component movement during high speed

Description: For high-mix, automated, prototype- to medium-volume printed circuit board assembly (PCBA) SemiGen is your go-to, on-time provider. We help manufacturers of military electronics, commercial products, and medical instrumentation with their leadless, fine-pitch, BGA, and QFP assembly

• Features: North America, Other, United States Only
• Supplier Capability: PCB Assembly, PCB Design / Layout, Production Quantities, Prototype Quantities
• PCB Type: Single-Sided Boards, THT Components

Description: For high-mix, automated, prototype- to medium-volume printed circuit board assembly (PCBA) SemiGen is your go-to, on-time provider. We help manufacturers of military electronics, commercial products, and medical instrumentation with their leadless, fine-pitch, BGA, and QFP assembly

• Features: North America, Other, United States Only
• PCB Type: Single-Sided Boards, THT Components

Description: interface that virtually automates the process.All operations: component pick-up, alignment, placement, and reflow are completed in a single axis, eliminating the risk of component movement after placement. The PCB holders features fine micrometer adjustment for the most delicate X and

• Features: Accessory / Other
• Process Capability: Soldering Equipment

Description: dedicated Jigs and fixtures. · Functional testing (Teradyne A360, Geotester). · X-Ray and Optical inspection facility for BGA placement. · PC based test systems (Dedicated, JTAG/Boundary Scan). Turnkey product manufacturing · Total product build. · Packaging and warehousing including

• Capabilities: Design Assistance, Full System Assembly (Box Build), Just-In-Time Capability, Large Production Quantities, Part Procurement, Prototype / Low Production Quantities, Subsystem Assembly, Testing and Evaluation
• Features: East Asia / Pacific Only, North America, Southwest US Only, United States Only