Products & Services
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Supplier: Advanced Interconnections Corp.
Description: BGA Socketing Systems from Advanced offer an economical and dependable alternative to direct device attach. Our patented SMT designs are field-proven in production, development, programming and test applications. Compact designs and patented features offer you cost effective solutions
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins, Other
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 0.8000 to 1.27 mm
- Features: Machined Pins, Open Top Socket
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Supplier: Advanced Interconnections Corp.
Description: Our Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top™ BGA Sockets require no
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins, Spring Loaded, Other
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 1 to 1.27 mm
- Features: Machined Pins, Open Top Socket, Clamshell Socket
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Supplier: Advanced Interconnections Corp.
Description: The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs.
- Contact / Pin Type: Straight Pins
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 0.5000 mm
- Current Rating: 2.8 amps
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 1 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 1 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Ironwood Electronics, Inc.
Description: BGA ZIF socket MGA assembly
- Contact Plating: Gold Plating
- Contacts Pitch: 0.8000 mm
- Features: Solderless, ZIF Lock
- Mounting: Other
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Supplier: Ironwood Electronics, Inc.
Description: BGA land sockets (male)
- Contact / Pin Type: Low Profile Pins
- Contact Plating: Gold Plating
- Contacts Pitch: 1.27 mm
- Mounting: SMT, Through-hole
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Supplier: Advanced Interconnections Corp.
Description: Using our exclusive, field-proven eutectic solder ball terminal design, the SMT Adapter from Advanced provides a reliable solution for mounting or socketing LGA or re-worked BGA devices. Use in connection with our BGA Sockets for LGA to BGA conversion or board to
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins, Other
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 0.8000 to 1.27 mm
- Features: Machined Pins
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Supplier: Lingto Electronic Limited
Description: CONN SOCKET BGA CUSTOM
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Supplier: Aries Electronics, Inc.
Description: location Spring loaded contacts provide high cycle life 4-point edge male contacts provide accurate mating Socket locating posts provide accurate socket location to board Bottom contact allows for via in center of PCB pad Available in pitch sizes from 0
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contact Resistance: 40 milliohms
- Contacts Pitch: 0.2000 to 0.8000 mm
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Supplier: Aries Electronics, Inc.
Description: (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays Available STRUCTURE: Silmat® Interposer with Patented Core INTERPOSER MATERIALS: Ag Particles in Silicone Elastomer
- Contacts Pitch: 10.16 mm
- Current Rating: 4 amps
- Features: Clamshell Socket
- Operating Temperature: -55 to 200 C
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU29 Frame / BGA pkg Size 29x30.6mm / 1.14"x1.20" Can also be used as Burn in Socket ?High reliability ?Cost competitive ?Temperature: -40 to +150? For BGA Device How to order for Custom design GQ29-BGAxxxxxxx *P/N will be informed after fixing
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU78 Frame / BGA pkg Size 78x116.7mm / 3.07"x4.59" Can also be used as Burn in Socket ?High reliability ?Cost competitive ?Temperature: -40 to +150? For BGA Device How to order for Custom design GU78-BGAxxxxxxx *P/N will be informed after fixing
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Aries Electronics, Inc.
Description: KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE
- Contacts Pitch: 2.54 mm
- Features: Clamshell Socket
- Operating Temperature: -67 to 392 C
- Package Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket, Other
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Supplier: Aries Electronics, Inc.
Description: CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square Chinese FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications Any
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 5.08 to 20.32 mm
- Features: Solderless, Clamshell Socket
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Supplier: Heilind Electronics, Inc.
Description: Connectors Sockets - Processor (PLCC, PGA,BGA, etc.)
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Supplier: Accuris
Description: Production Ball Grid Array (BGA) Socket Test Specification
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Supplier: Sensata Technologies
Description: Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers to spring pins Two finger knob - easy to operate even at high force Lid assembly can be easily removed Lid has
- Product Type: IC Socket
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Supplier: Sensata Technologies
Description: Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless otherwise specified Heat Sink - simulations
- Product Type: IC Socket
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Supplier: JC Cherry, Inc.
Description: High Current High Speed Interface Manual/Handler/Burn in ?Test socket for CCD and CMOS sensor. ?Customizable for various package such as BGA, LGA, PGA. ?Using our high reliable spring probes, stamping pins and socket pins. ?We manufacture test sockets for high current,
- Contact Resistance: 200 milliohms
- Contacts Pitch: 0.2500 mm
- Current Rating: 0.5000 amps
- Operating Temperature: -40 to 150 C
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Supplier: Sensata Technologies
Description: Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locator plate Multi-site options are available Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high
- Contact Plating: Gold Plating
- Contact Resistance: 350 milliohms
- Operating Temperature: 125 C
- Product Type: IC Socket
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Supplier: Plastronics Socket Company, Inc.
Description: - increase socket life Plastronics patented technologies are based on solving the difficult industry problems associated with high frequency, high current, low stable resistance and adequate contact travel to accommodate larger package footprints. Our BGA socket platform takes
- Contact Resistance: 50 milliohms
- Current Rating: 1 amps
- Mounting: Through-hole
- Operating Temperature: -45 to 150 C
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Supplier: Powell Electronics, Inc.
Description: BGA sockets 1.27 mm grid with self-align
- Package Type: BGA
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: BGA sockets 1.27 mm grid with self-align
- Package Type: BGA
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: BGA interconnect sockets 1.27 mm grid, t
- Package Type: BGA
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: BGA sockets 1.27 mm grid with self-align
- Package Type: BGA
- Product Type: IC Socket
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Supplier: Mill-Max Mfg. Corp.
Description: 1mm Grid; BGA Socket
- Contact Plating: Gold Plating, Other
- Package Type: BGA
- Product Type: IC Socket
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Supplier: Rego Electronics Inc.
Description: Product Series - 1U & 2U Coolers, TDP : 35 Watts to 55 Watts Features & Benefits - A full range of products, customized technology, high quality, high reliability, lower noise level, long term supply Target Market - Industrial PC, Point of Sale, Embedded Board, Gaming, Kiosk
- Device: Active Heat Sink
- Heat Sink Fin Style: Straight Fin
- Mounting: Socket Mount
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Description: IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
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Supplier: Aaeon Systems Inc.
Description: The HSB-910I supports Intel® Pentium® M/ Celeron® M processors up to 1.8GHz with a FSB of 400MHz. Designed for support of both BGA and socket processor packages, the HSB-910I can operate fanless with an Intel® Low Power CPU or can be configured with a socket to support end user
- Chipset Type: Intel® Chipset
- Features: Watchdog Timer?, RJ-45 Connectors?
- I/O Bus Specifications: ISA / EISA
- Operating Temperature: 32 to 140 F
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Supplier: CSA Group
Description: IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
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Supplier: Twilight Technology Inc.
Description: and memory module solutions. Our customers benefit from our broad experience and expertise in design, IC packaging, component reliability, and quality testing. With 25 years of design experience, our engineering staff solves problems with footprint conversions, RoHS, BGA and flip chip
- Product Type: IC Socket, IC Headers
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Supplier: Molex Signal Tech Industrial Ltd.
Description: to +125 °C Consistent stable contact resistance 120 m? (Ave) Designed for manual test, bench test, and HVM Production Test using the same socket Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm Floating base or Hi Low
- Package Type: BGA, LGA, QFN, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: DigiKey
Description: 898 POS BGA SOCKET .050
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Supplier: DigiKey
Description: MPLAB® PM3 MPLAB® PM3 Socket Module - BGA
Find Suppliers by Category Top
Featured Products Top
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The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. The conductive columns in the elastomeric grid ensure accurate and (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
We offer a full range of cooler solutions for various Intel® mobile CPU families which supports socket 478/479, Intel® Core™ Mobile Processor rPGA 988 & BGA packages & Intel® Atom™ Processor ( Bay Trail, Braswell, Apollo Lake, Elkhart Lake ) Coolers. Our products (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
The HDMI modulator is very important, allowing the distribution of HD video and audio over coaxial cable networks. HDMI modulators are a cheap, simple, and complete solution for a wide variety of applications for both residential and commercial, and institutional applications. This article reviews HDMI modulators, some basic features, and their applications.
(read more)
Browse Drive Sockets and Adapters Datasheets for ODG (Origin Data Global) -
At Smiths Interconnect, we are constantly striving to exceed the evolving demands of the semiconductor industry. The Davinci 112 test socket, and expansion of the DaVinci Series, is designed to tackle some of the most complex challenges in testing Application Specific Integrated Circuits (ASICs (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
SD (Secure Digital) Card is a non-volatile memory card format for portable devices such as mobile phones, digital cameras, GPS navigation devices, and tablet computers. The three form factors are original size, mini size, and micro size. Rego offers a complete line of sockets for these cards (read more)
Browse IC Sockets and Headers Datasheets for Rego Electronics Inc. -
OEM to handle these tasks, companies focus their resources on other business areas requiring more attention. Using advanced equipment and OEM tools like socket sets speeds up the production process, ensuring that components get delivered on time. This (read more)
Browse Drive Sockets and Adapters Datasheets for Lowell Corporation -
socket provides increased performance and reduced overall power consumption that leads to cost savings. The PCIe generation 5 specification doubles the bandwidth from previous generations, providing faster speeds and more efficiency. Ease of (read more)
Browse IC Sockets and Headers Datasheets for TE Connectivity -
Smiths Interconnect, a division of Smiths Group plc, announces that it has completed the acquisition of Plastronics Sockets & Connectors (“Plastronics”), a leading supplier of burn-in test sockets and patented spring probe contacts for the semiconductor test market segment (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry. As a result, Kepler provides a boosted first pass yield (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
Lowell Corporation has been supplying the highest quality tools and equipment since 1869. The new Single End Triple Square Impact Socket can be used with any impact wrench to install or tighten utility pole hardware. You can easily change from the 3/4” (read more)
Browse Drive Sockets and Adapters Datasheets for Lowell Corporation
Conduct Research Top
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BGA Socket Considerations - Prototype to Reality
For many products designed with todays high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, and/or production phases of a new product development process. In response to these demanding needs, sockets featuring a wide variety of contacting
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GHz BGA Socket User Manual
The IC package drawing is required to select the correct GHz socket. Go to www.ironwoodelectronics.com. Select the "Products" link, then under the "Browse" menu, select the "GHz BGA & MLF socket" link. For 1.27mm, 1mm, 0.8mm and 0.75mm pitch BGA devices, select the "SG-BGA-6xxx" link. For 0.65mm
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BGA Socket with Heatsink for High Power Devices
The classic function of a socket is to provide a connection mechanism from the IC (Integrated Circuit) to the circuit board with as little electrical load as possible. This allows the IC to function as it is soldered into the PCB (printed circuit board) but can be replaced by another
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BGA Sockets To Solve All Your Electronics Testing Needs
Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry 's burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production
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BGA Socket Adapter System Provides Reliable Test Equipment Connection for Engine Performance Analysis (.pdf)
A major electronics test equipment manufacturer developed a new engine control unit test board to calibrate embedded semiconductor automotive engine control devices. These automotive engine control devices are critical to the power train performance of the vehicle and must be accurately calibrated
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Spring Pin Socket User Manual
SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware
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Socket-Adapter Systems: A Practical Test Alternative (.pdf)
Traditional one-piece, clam¬shell-design test sockets are useful diagnostic tools for establishing or evaluating device functionality. However, they tend to be less satisfactory for validating fine-pitch packages such as ball grid ar¬ray (BGA) and land grid array (LGA), which are gaining popularity
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. At last! You can watch TV and sew Flush with affordable video-specific technology and desperate to differentiate their products, OEMs are incorporating video as a secondary feature in a host of traditionally nonvideo applications. Hot products: 10-GHz BGA socket, automotive MCU Among the hottest
More Information Top
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IC Component Sockets
These two designs are more common with BGA sockets .
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BGA Test Socket
BGA Sockets .
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Solder joint attachment reliability and assembly quality of a molded ball grid array socket
The BGA socket adapter system.
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Electrical characterization of BGA test socket for high-speed applications
The bandwidth of the BGA socket from the 3 dB return loss criteria was calculatedto be around 5 GHz for time domain measurements .
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uBGA
BGA Socket and BGA Adapter Systems .
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http://www.microsemi.com/document-portal/doc_download/131100-qfpbga
Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to a PCB.
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Managing BGA test socket SI characterization
… ameters which can CPEM is carefully can be consistently simulation, with a hed 2-port VNA ent of the targeted efined Signal and ic Electromagnetic ct that Lloop and xtracted Lloop and cteristic Impedance upling Coefficient obust and better to BGA socket .
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Reliability and wear-out characterization of BGA production sockets
Yield degradation often happens by the increased contact resistance of signal paths, which are caused by the generation of both the particle contamination and the wear-out failures on a BGA socket .
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