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Supplier: Ironwood Electronics, Inc.
Description: Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the
- Number of Contacts: 676
- Contacts Pitch: 1 mm
- Socket Type: BGA
- Contact Plating: Gold Plating
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Supplier: Advanced Interconnections Corp.
Description: BGA Socketing Systems from Advanced offer an economical and dependable alternative to direct device attach. Our patented SMT designs are field-proven in production, development, programming and test applications. Compact designs and patented features offer you cost effective solutions for
- Number of Contacts: 4 to 1,936
- Contacts Pitch: 0.8 to 1.27 mm
- Socket Type: BGA, LGA, Receptacle, Test / Prototyping Socket
- Contact Plating: Gold Plating
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Supplier: Advanced Interconnections Corp.
Description: Our Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top™ BGA Sockets require no
- Number of Contacts: 4 to 1,764
- Contacts Pitch: 1 to 1.27 mm
- Socket Type: BGA, LGA, Test / Prototyping Socket
- Features: Clamshell Socket, Machined Pins, Open Top Socket, Other
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Supplier: Accuris
Description: Production Ball Grid Array (BGA) Socket Test Specification
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Supplier: Lingto Electronic Limited
Description: CONN SOCKET BGA CUSTOM
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Supplier: Newark, An Avnet Company
Description: BGA SOCKET, 388 POSITION, SMD; No. of Contacts:388Contacts; Connector Type:BGA Socket; Pitch Spacing:1.27mm; Product Range:-; Row Pitch:1.27mm; Contact Material:Beryllium Copper; Contact Plating:- RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: BGA SOCKET, 676 POSITION, SMD; No. of Contacts:676Contacts; Connector Type:BGA Socket; Pitch Spacing:1mm; Product Range:-; Row Pitch:-; Contact Material:Beryllium Copper; Contact Plating:-; Contact Termination:Surface Mount Vertical RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: BGA SOCKET, 272 POSITION, SMD; No. of Contacts:272Contacts; Connector Type:BGA Socket; Pitch Spacing:1.27mm; Product Range:-; Row Pitch:1.27mm; Contact Material:Beryllium Copper; Contact Plating:- RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: BGA SOCKET, 652 POSITION, SMD; No. of Contacts:652Contacts; Connector Type:BGA Socket; Pitch Spacing:1.27mm; Product Range:-; Row Pitch:1.27mm; Contact Material:Beryllium Copper; Contact Plating:- RoHS Compliant: Yes
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Supplier: Rego Electronics Inc.
Description: Product Series 1U & 2U Coolers, TDP : 35 Watts to 55 Watts Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers AMD : FP3, FP4 & FP5 Coolers Features & Benefits A full range of products, customized technology, high quality, high reliability, lower noise level, long term supply Target Market
- Length: 60 mm
- Width: 60 mm
- Height: 43 mm
- Thermal Resistance: 0.57 °C / W
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Supplier: Heilind Electronics, Inc.
Description: Connectors Sockets - Processor (PLCC, PGA,BGA, etc.)
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Supplier: Aries Electronics, Inc.
Description: life 4-point edge male contacts provide accurate mating Socket locating posts provide accurate socket location to board Bottom contact allows for via in center of PCB pad Available in pitch sizes from 0.20mm GENERAL SPECIFICATIONS SOCKET BODY MATERIAL: Torlon PAI HARDWARE:
- Contact Resistance: 40 milliohms
- Contacts Pitch: 0.2 to 0.8 mm
- Socket Type: BGA, DIP, Test / Prototyping Socket
- Features: Clamshell Socket, IC Probing / Analysis Adapters, Other, Solderless
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood leads the industry in BGA probing systems. Most of our BGA probing systems are modular. We have developed probing adapters for 0.75mm pitch BGA packages. Some of our BGA probing adaptors incorporate our own high performance GHz BGA sockets. Most of
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Supplier: Aries Electronics, Inc.
Description: innovative, protected, validated and released product with capacity and quality control available to meet existing and emerging customer needs MECHANICAL CONTACT LENGTH (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and
- Current Rating: 4 amps
- Operating Temperature: -55 to 200 C
- Contacts Pitch: 10.16 mm
- Socket Type: BGA, LGA, QFN, Test / Prototyping Socket
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Supplier: Sensata Technologies
Description: Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers to spring pins Two finger knob - easy to operate even at high force Lid assembly can be easily removed Lid has
- Product Type: IC Socket
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Supplier: Sensata Technologies
Description: Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless otherwise specified Heat Sink - simulations confirm application Positive locking lid High
- Product Type: IC Socket
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU29 Frame / BGA pkg Size 29x30.6mm / 1.14"x1.20" Can also be used as Burn in Socket ●High reliability ●Cost competitive ●Temperature: -40 to +150℃ For BGA Device How to order for Custom design GQ29-BGAxxxxxxx *P/N will be informed after fixing
- Product Type: IC Socket
- Socket Type: Test / Prototyping Socket
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU78 Frame / BGA pkg Size 78x116.7mm / 3.07"x4.59" Can also be used as Burn in Socket ●High reliability ●Cost competitive ●Temperature: -40 to +150℃ For BGA Device How to order for Custom design GU78-BGAxxxxxxx *P/N will be informed after fixing
- Product Type: IC Socket
- Socket Type: Test / Prototyping Socket
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include BGA. Search-friendly keywords include connector, interconnect, header, socket, terminal block, BGA, Electronic Connector, Board to Board & Mezzanine
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: Single Socket CardBus Controller w/Dedicated Smart Card Socket 257-BGA MICROSTAR 0 to 70 Product overview: PCI6515AGHK from Texas Instruments is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and
- Package Type: BGA
- Features: Other
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Supplier: Aries Electronics, Inc.
Description: FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications Any device pitch from 0.20mm 4-point crown insures “scrub” on solder oxides Single-point Probes available for small land area contact pads Signal path during test only 0.077
- Operating Temperature: -55 to 150 C
- Contacts Pitch: 5.08 to 20.32 mm
- Socket Type: BGA, CSP, Test / Prototyping Socket
- Features: Clamshell Socket, Other, Solderless
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Supplier: Aries Electronics, Inc.
Description: FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm 4-point crown insures “scrub” on solder oxides Single Point Probes available for small land area contact pads Signal path during test only 0.077 [1.96] Socket is easily mounted
- Operating Temperature: -55 to 150 C
- Contacts Pitch: 5.08 to 20.32 mm
- Socket Type: BGA, CSP, Test / Prototyping Socket
- Features: Clamshell Socket, Other, Solderless
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Supplier: Sensata Technologies
Description: Open top Compression surface mount Spring and probe contact 4 point crown tip interface on DUT solder ball Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high
- Contact Resistance: 349.99999999999994 milliohms
- Operating Temperature: 125 C
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: Plastronics Socket Company, Inc.
Description: design challenges at an enabling cost. BGA sockets with the H-Pin provide a high-performance socket that is affordable for all burn-in operations. The BGA platform serves package sizes from as small as 6.0mm X 6.0mm to the industry’s largest standard socket for
- Current Rating: 1 amps
- Contact Resistance: 50 milliohms
- Operating Temperature: -45 to 150 C
- Socket Type: BGA
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: Integrated dual-socket UltraMedia PC Card controller, IEEE 1394 Open HCI host controller and PHY, an 288-BGA MICROSTAR 0 to 70 Product overview: PCI7421GHK from Texas Instruments is an Interface Transceiver IC for serial communication, bus conversion, signal driving, receiver stages,
- Device Type: Transceiver
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Supplier: Accuris
Description: Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
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Supplier: Plastronics Socket Company, Inc.
Description: an enabling cost. BGA sockets with the H-Pin provide a high-performance socket that is affordable for all burn-in operations. The BGA platform serves package sizes from as small as 6.0mm X 6.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm
- Current Rating: 1 amps
- Contact Resistance: 35 milliohms
- Operating Temperature: -55 to 180 C
- Number of Contacts: 150
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Description: IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
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Supplier: CSA Group
Description: IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
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Supplier: Accuris
Description: Detail Specification for Production Ball Grid Array (BGA) High Pin Count (1089 Pins and Greater) Socket for Use in Electronic Equipment
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Supplier: ToneCooling Technology Co., Ltd
Description: environments. This article discusses a custom heatsink solution designed specifically for BGA 2518 processors BGA 2518 Socket and Compatible CPUs The BGA 2518 socket is used by Intel Xeon D processors. These processors are designed for embedded applications,
- Length: 120 mm
- Width: 84 mm
- Height: 28.5 mm
- Material: Aluminum
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Supplier: Powell Electronics, Inc.
Description: BGA sockets 1.27 mm grid with self-align
- Socket Type: BGA
- Product Type: IC Socket
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Supplier: Mill-Max Mfg. Corp.
Description: 1mm Grid; BGA Socket
- Socket Type: BGA
- Contact Plating: Gold Plating
- Product Type: IC Socket
- Features: Other
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Supplier: JC Cherry, Inc.
Description: High Current High Speed Interface Manual/Handler/Burn in ●Test socket for CCD and CMOS sensor. ●Customizable for various package such as BGA, LGA, PGA. ●Using our high reliable spring probes, stamping pins and socket pins. ●We manufacture test sockets for high current,
- Voltage Rating: 100 volts
- Current Rating: 0.5 amps
- Contact Resistance: 200 milliohms
- Operating Temperature: -40 to 150 C
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Supplier: Aaeon Systems Inc.
Description: The HSB-910I supports Intel® Pentium® M/ Celeron® M processors up to 1.8GHz with a FSB of 400MHz. Designed for support of both BGA and socket processor packages, the HSB-910I can operate fanless with an Intel® Low Power CPU or can be configured with a socket to support end user
- RAM: 256 MB
- Operating Temperature: 32 to 140 F
- Computer Bus: ISA / EISA
- Chipset: Intel® Chipset
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The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. The conductive columns in the elastomeric grid ensure accurate and consistent test results for various devices. Its high bandwidth and low inductance capabilities render it electrically invisible to the test system, safeguarding against ball damage to Devices Under Test (DUT... (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
We offer a full range of cooler solutions for various Intel (R) mobile CPU families which supports socket 478/479, Intel (R) Core TM Mobile Processor rPGA 988 & BGA packages & Intel (R) Atom TM Processor ( Bay Trail, Braswell, Apollo Lake, Elkhart Lake ) Coolers. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment to precisely measure its performance. We are here to provide customized thermal solutions... (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc.
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BGA Socket Considerations - Prototype to Reality
For many products designed with todays high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, and/or production phases of a new product development process. In response to these demanding needs, sockets featuring a wide variety of contacting
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GHz BGA Socket User Manual
The IC package drawing is required to select the correct GHz socket. Go to www.ironwoodelectronics.com. Select the "Products" link, then under the "Browse" menu, select the "GHz BGA & MLF socket" link. For 1.27mm, 1mm, 0.8mm and 0.75mm pitch BGA devices, select the "SG-BGA-6xxx" link. For 0.65mm
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BGA Socket with Heatsink for High Power Devices
The classic function of a socket is to provide a connection mechanism from the IC (Integrated Circuit) to the circuit board with as little electrical load as possible. This allows the IC to function as it is soldered into the PCB (printed circuit board) but can be replaced by another
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BGA Sockets To Solve All Your Electronics Testing Needs
Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry 's burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production
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BGA Socket Adapter System Provides Reliable Test Equipment Connection for Engine Performance Analysis (.pdf)
A major electronics test equipment manufacturer developed a new engine control unit test board to calibrate embedded semiconductor automotive engine control devices. These automotive engine control devices are critical to the power train performance of the vehicle and must be accurately calibrated
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Spring Pin Socket User Manual
SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware
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Socket-Adapter Systems: A Practical Test Alternative (.pdf)
Traditional one-piece, clam¬shell-design test sockets are useful diagnostic tools for establishing or evaluating device functionality. However, they tend to be less satisfactory for validating fine-pitch packages such as ball grid ar¬ray (BGA) and land grid array (LGA), which are gaining popularity
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. At last! You can watch TV and sew Flush with affordable video-specific technology and desperate to differentiate their products, OEMs are incorporating video as a secondary feature in a host of traditionally nonvideo applications. Hot products: 10-GHz BGA socket, automotive MCU Among the hottest
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IC Component Sockets
These two designs are more common with BGA sockets .
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BGA Test Socket
BGA Sockets .
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Solder joint attachment reliability and assembly quality of a molded ball grid array socket
The BGA socket adapter system.
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Electrical characterization of BGA test socket for high-speed applications
The bandwidth of the BGA socket from the 3 dB return loss criteria was calculatedto be around 5 GHz for time domain measurements .
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uBGA
BGA Socket and BGA Adapter Systems .
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http://www.microsemi.com/document-portal/doc_download/131100-qfpbga
Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to a PCB.
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Managing BGA test socket SI characterization
… ameters which can CPEM is carefully can be consistently simulation, with a hed 2-port VNA ent of the targeted efined Signal and ic Electromagnetic ct that Lloop and xtracted Lloop and cteristic Impedance upling Coefficient obust and better to BGA socket .
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Reliability and wear-out characterization of BGA production sockets
Yield degradation often happens by the increased contact resistance of signal paths, which are caused by the generation of both the particle contamination and the wear-out failures on a BGA socket .