Products/Services for Bolometer 320x240 Chip
-
Network and Communication Chips - (591 companies)Network and communication chips are semiconductor integrated circuits (IC) used in telecommunication devices and systems. Network and communication chips use many different technologies. Choices include: current mode logic (CML). gunning transceiver...TechnologyInterfaceDevice Type -
LAN Chips - (38 companies)LAN chips provide wireless local area network (LAN) connectivity in a system-on-chip platform. A LAN chip is a device on an Ethernet network that broadcasts information and provides Ethernet functions, including PHYceivers and media access control... -
Chip Inductors - (346 companies)Chip inductors are manufactured using semiconductor material. General specifications, performance specifications and features are all important parameters to consider when searching for chip inductors. General Specifications for chip inductors... -
xDSL Chips - (11 companies)...xDSL chips provide digital subscriber line (DSL) connectivity in a system-on-chip platform. The term xDSL refers collectively to all types of digital subscriber lines. An xDSL chip is a generic term for all forms of DSL service spanning transmission... -
Chip Antennas - (111 companies)Chip antennas are semiconductor ICs used to collect or radiate electromagnetic waves. Chip antennas are a particular type of antenna valued for their small footprint. They are most commonly integrated in circuit boards to radiate high frequency... -
Microphone Chips - (38 companies)Microphone Chips are integrated circuits (IC) microphones. Microphone chips are integrated circuits (IC) microphones and are usually mounted directly to a circuit board. A pressure-sensitive diaphragm is etched directly into a silicon chip...
-
Memory Chips - (674 companies)Memory chips are internal storage areas in computers. Although the term "memory chip " commonly refers to a computer's random access memory (RAM), this product area includes many different types of electronic data storage. Computer memory stores...
-
Chip Capacitors - (286 companies)Chip capacitors or surface mount capacitors do not have leads. Chip capacitors are passive integrated circuit (IC) components that store electrical energy. Chip capacitors are simply capacitors manufactured as integrated circuit (IC) devices, also...
-
Sensor Chips - (429 companies)Description. Sensor chips are dies incorporating semiconductor circuit elements that are used to convert changes to some physical parameter to an electrical signal. Like other semiconductors, a sensor chip can be flexible, and can be manufactured...
-
CPU Chips - (79 companies)CPU chips or central processing unit chips are used in digital computers and are the semiconductor component where most calculations take place. Specifications. Specifications include: Clock speed. Internal register size. Data input/output (I/O) bus...
Product News
-
Rego Electronics Inc.
Chip Coolers Rego 's chip coolers are a series of cooling solutions for multi-functional chips. These products are well designed in thermal performance based on our professional manufacturing know how. We have the sophisticated equipment to precisely measure its performance to meet your requirements. Rego not only provides existing standard products but also customized thermal solutions according to your specifications. Product Series -. Chip Size : 35mm x 35mm to 52mm x 52mm, Height : 8.5mm to 10 mm, TDP... (read more)Browse CPU Coolers Datasheets for Rego Electronics Inc. -
KOA Speer Electronics, Inc.
ANTI-SULFURATION CHIP RESISTORS Silver-based inner electrodes in flat chip resistors can lose conductivity when the silver reacts with sulfur in a high-sulfur environment. The electrodes can lose all conductivity and disconnect the circuit as sulfuration continues. KOA Speer has developed a complete line of anti-sulfur chip resistors and arrays to protect against sulfuration of the resistor electrodes. Learn more (read more)Browse Chip Resistors Datasheets for KOA Speer Electronics, Inc. -
EXAIR
Patented Chip Trapper The patented Chip Trapper offer a fast easy way to clean chips, swarf and shavings out of used coolants and other liquids. The Chip Trapper vacuums the coolant or liquid that is filled with debris into the included drum, trapping all the solids in a reusable filter bag. With a turn of the flow valve, clean liquid pumps back out. Expensive coolant that used to last only six weeks can now last six months with regular use of the Chip Trapper. It is ideal for use on machines with sumps, parts... (read more)Browse Vacuum Cleaners Datasheets for EXAIR -
Coilcraft, Inc.
Ceramic Chip Inductors 112 inductance values from 0.8 to 120 nH. Available in 0.1 nH incremental steps between 2.8 nH and 10 nH. For inductance values greater than 120 nH please consider the 0402HP series. Lower DCR than other 0402 chip inductors. AEC-Q200 Grade 1 ( -40°C to +125°C). Exceptionally high Q - up to 160 at 2.4 GHz!. Very high self-resonant frequencies - as high as 28.8 GHz. RoHS Compliant. 260°C compatible. Matte tin over nickel over silver-platinum-glass frit terminations (read more)Browse Chip Inductors Datasheets for Coilcraft, Inc. -
Busch Vacuum Solutions
Crispy Chips and Shiny Fittings From composite foils to showerheads and reflectors, plastics with metallic surfaces are everywhere. They are often produced using BUSCH vacuum pumps. Hard, shiny, and hermetically sealed. To prevent potato chips from becoming rancid and stale, the inside of most packets of chips is coated with an ultra-thin layer of aluminum. It makes the plastic foil impermeable to air, water vapor, and UV light. It also keeps flavors from escaping via diffusion, as would be possible with pure plastic foils... (read more)Browse Mechanical Vacuum Pumps and Systems Datasheets for Busch Vacuum Solutions -
Nova Technology(HK) Co.,Ltd
Multi-Protocol Mobile Connectivity Chip Mobile and wearable devices require seamless, reliable connectivity across multiple protocols. Engineers face challenges integrating Wi-Fi, Bluetooth, GNSS, FM, and IR into compact designs while maintaining high performance, stable signals, and extended battery life. Without proper integration, devices may experience connectivity drops, reduced efficiency, and shorter lifespan. This chip provides comprehensive, high-performance connectivity solutions: Dual-band Wi-Fi 2.4/5 GHz with DBDC and 2x2... (read more) -
Cornell Dubilier
XMPL Series Polymer Chip Capacitor Cornell Dubilier 's XMPL Series Polymer Chip Capacitor series has been expanded to match applications requiring higher voltage and/or capacitance requirements. With very low ESR and robust ripple current ratings, they will easily outperform surface mount electrolytics of greater size. XMPL capacitors also provide longer life, greater stability with temperature changes, and lower ESR at higher frequencies than electrolytics. Compared to tantalum capacitors of similar size (standard 7343... (read more)Browse Capacitors Datasheets for Cornell Dubilier -
Xiamen Unipretec Ceramic Technology Co., Ltd.
AlN Ceramic Components for Chip Reliability efficiency and performance in advanced devices. Engineering Benefits. Optimizes thermal management, reducing the risk of overheating and improving device stability. Provides durable, reliable components that reduce maintenance frequency in demanding environments. Supports high-performance, precision applications, improving overall semiconductor device efficiency and lifespan. AlN ceramic components provide engineers with reliable, durable, and efficient solutions to enhance semiconductor chip... (read more)Browse Specialty Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
bisco industries
Bivar's LED Surface Mount Chips Bivar's LED Surface Mount Chips. SM1204RGB/SM0807RGB are Industry-standard high-quality SMD LEDs used in reduced space applications such as indication or backlighting. Working at bisco industries. bisco industries, a leader in electronic component and specialty fastener distribution, is growing and looking for friendly and knowledgeable people to join our team. Come join one of North America 's Top 20 Electronics Distributors where we believe that employees are our greatest asset. We have sales... (read more) -
Marki Microwave LLC
The Next Generation of Chip Scale Packaging MPDR-0070CSP2, the first product in Marki Microwave 's new CSP2 package design, is a mmWave resistive power divider enabling unmatched performance from DC to 70 GHz. It offers a low 1.5 dB excess insertion loss on top of the 6 dB nominal power splitting of a resistive power divider and features low 0.25 dB amplitude and 5 phase balance across the entire band to maintain signal integrity. The power divider is available in a 2.5 x 2.5 mm CSP2 package, compatible with standard pick and place... (read more)Browse RF Power Dividers and RF Power Combiners Datasheets for Marki Microwave LLC
More Information
Indicates content that may require registration and/or purchase.
-
Performance of 320x240 uncooled bolometer-type infrared focal plane arrays
The authors design, fabricate and evaluate a 320x240 bolometer -type uncooled IR FPA, on- chip readout circuit and camera.
-
A non-uniformity correction scheme using multiple analog buses for an uncooled infrared sensor
A 320x240 -pixel bolometer array is arranged above the circuit on the chip .
-
Advances in uncooled 1-mil pixel size focal plane products at DRS
demonstrated on the 51-micron pixel size U4000 320x240 UIRFPA, which included on- chip pixel offset compensation, on-chip signal gain selection, on-chip bolometer bias selection and regulation, on-chip selection the output video format as either TV compatible 2:1…
-
Infrared sensor module using uncooled 320 × 240/640 × 480 detector
NEC has developed bolometer type uncooled infrared sensors, having features of high temperature resolution, low drift and low power consumption and including on- chip readout integrated circuit (ROIC) with array formats of 320x240 and 640x480 having 23.5um pitch [1][2][3].
-
Low-cost uncooled microbolometers for thermal imaging
A fluxless wafer-scale CuSn SLID packaging process in vacuum has been demonstrated with bond frames designed for bolometer arrays with a 320x240 pixel resolution. .... Vacuum tight bond frames have been accomplished with typically more than 95% of the chips properly sealed.
-
Future Security
320x240 bolometer arrays (figure 10) have been designed and collectively fabricated above CMOS Application-Specific Integrated Circuits (ASIC) in the Leti 200mm silicon facilities. .... very high yield has been achieved with 56 functional arrays out of 63 chips available per 200…
-
Active THz imaging and explosive detection with uncooled antenna-coupled microbolometer arrays
The ROIC consists in a CMOS Application-Specific Integrated Circuit (ASIC) that ensures measurement of the resistances of the 320x240 bolometers and formats the result into a single video data stream. .... As in standard IR chips [17], the ROIC drives a row by row biasing and current reading…
-
Infrared imager employing a 160 x 120 pixel uncooled bolometer array
…by the Honeywell licensees.25 In so doing, we believe that our bolometric imager will be able to compete effectively in price with electrically biased pyroelectric uncooled hybrid array imagers which sell for less than the 320x240 bolometer array imagers, but have … 160x120 pixel bolometric focal plane array and its vacuum package, and the off- chip electrical circuitry plus…
-
THz uncooled microbolometer array development for active imaging and spectroscopy applications
A 320x240 pixel sensor has been designed and a first prototype processed above an 8” Si wafer. .... Each pixel consists in 50μm pitch antenna-coupled micro- bolometer . .... After dice cutting, chips have been mounted on specific metalized ceramic (Figure 1) that makes possible the…
-
Pixel-by-pixel VIS/NIR and LIR sensor fusion system
UFPAs of VOx micron bolometer, BST, and Silicon bolometer with formats of 320x240 /50µ and 160x120/50µ were adopted. .... Traditional electronic circuit design using Digital Signal Processor (DSP) and new design using Altera chip were realized.
