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  • Luminescence Lifetime Imaging with Transparent Oxygen Optodes
    of the MOLLI imaging system is determined by a) the area size of the view field that is imaged onto the amount of pixels of the CCD-chip (640x480 in our case) and b) by the spatial limitations of the sensing layer. The latter means in case of the planar optode the thickness of the sensing layer
  • Transparent Oxygen Optodes in Environmental Applications at Fine Scale as Measured by Luminescence Lifetime Imaging
    of the MOLLI imaging system is determined by a) the area size of the view field that is imaged onto the amount of pixels of the CCD-chip (640x480 in our case) and b) by the spatial limitations of the sensing layer. The latter means in case of the planar optode the thickness of the sensing layer
  • Smart Computing Article - Focusing On Digital Cameras
    CMOS chips instead. CMOS chips are easier and less expensive to make and require less power than CCDs, but CMOS chips are vulnerable to damage from static electricity and they often do not deliver the same image quality as CCDs. An electronic component used for RAM (random-access memory) and fast
  • Pixel Binning
    The mechanism by which charge transfer from a CCD is performed lends itself to on-chip pixel binning. To quickly review charge transfer in a CCD, the following diagram is shown. As light (photons) falls on the surface of the CCD, charge (electrons) accumulates in each pixel. The number of electrons
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Sony '90-nm' processor is '130-nm' chip, analysis firm claims Roving eye for Mars rover forces CCD rethink Asian economies brace for next crisis: bird flu for January 25 to 31 Low-k likely to dog 90-nm process transition, says analyst On Semi, Melexis go tandem on automotive chips Litho Forum
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Some Taiwan fabs shut down briefly for Y2K rollover; no glitches found Sipex to reorganize, closes acquisition of discretes manufacturer Calogic Samsung, Hyundai target sub-0.15-micron litho technology Taiwan's DRAM vendors take aim at industry's top tier Software forces PC audio chip makers
  • CMOS Cameras Rise to Speed Challenge
    Advances in CMOS image-sensor technology are making it possible for a new breed of highspeed cameras to capture events previously impossible to image by conventional CCD cameras. Improvements in chip design and manufacturing have enabled CMOS cameras to become a cost-effective, high-performance
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    DSPs drive team to win Darpa race A robotic car with a good chance of winning the Grand Challenge race in the California desert next week it is the Toyota pickup equipped with two 1-GHz DSPs. The chips drive a fast, proprietary image-processing engine that helps the robotic car avoid obstacles

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