-
Supplier: Accuris
Description: SOCKETS, CHIP CARRIER, CERAMIC, FOR USE WITH CHIP CARRIER, JEDEC, .050 CENTER, LEADLESS TYPES A, B, AND D
-
Supplier: Skyworks Solutions, Inc.
Description: The OLI110 consists of an LED and N-P-N silicon phototransistor that is electrically isolated, but optically coupled on a ceramic leadless chip carrier (LCC) surface mount package. The epoxy coating on the OLI110 allows the device to withstand normal solvent cleaning
- Isolation Voltage: 1,500 volts
- Output: Phototransistor
-
Supplier: APITech
Description: API Technologies' line of non-dispersive and dispersive SAW Delay Lines offer semi-standard or custom designs with various delay and bandwidth options. SAW Delay Lines are available in several packaging options such as ceramic leadless chip carriers, which provide small
-
-
Supplier: Skyworks Solutions, Inc.
Description: The OLS303 is suitable for wide bandwidth analog applications. Each OLS303 has an LED and integrated photodiode transistor detector mounted and coupled in a custom hermetic surface mount Leadless Chip Carrier (LCC) ceramic package, that provides 1500 VDC of electrical
-
Supplier: Allied Electronics, Inc.
Description: systems requiring large programs and is organized as 131,072 words of 8 bits. The FDIP32W (window ceramic frit-seal package) and the LCCC32W (leadless chip carrier package) have a transparent lids which allow the user to expose the chip to ultraviolet light to
-
Supplier: Allied Electronics, Inc.
Description: systems requiring large programs and is organized as 131,072 words of 8 bits. The FDIP32W (window ceramic frit-seal package) and the LCCC32W (leadless chip carrier package) have a transparent lids which allow the user to expose the chip to ultraviolet light to
-
Supplier: Skyworks Solutions, Inc.
Description: isolated, but optically coupled on a ceramic Leadless Chip Carrier (LCC) surface mount package. The epoxy coating on the OLI149 allows the device to withstand normal solvent cleaning operations. Surface mounting can be accomplished with either conductive epoxies or by
- Output: Phototransistor
-
Supplier: Richardson RFPD
Description: The HMC787A is a general-purpose, double balanced mixer in a 12-terminal, RoHS compliant, ceramic leadless chip carrier (LCC) package that can be used as an upconverter or downconverter from 3 GHz to 10 GHz. This mixer is fabricated in a gallium arsenide (GaAs), metal
- RF Frequency Range: 3,000 to 10,000 MHz
- LO Frequency Range: 3,000 to 10,000 MHz
- IF Frequency Range: 0 to 4,000 MHz
- Conversion Loss: 9 dB
-
Supplier: Skyworks Solutions, Inc.
Description: mounted and coupled in a custom hermetic surface mount leadless chip carrier (LCC) ceramic package that provides 1500 VDC of electrical isolation between the input and output. The integrated photodiode transistor improves the switching speed by orders of magnitude as
- Isolation Voltage: 1,500 volts
-
Supplier: Richardson RFPD
Description: The HMC908A is a compact, gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), inphase/ quadrature (I/Q) downconverter in a leadless, RoHS compliant ceramic leadless chip carrier. This device provides a small signal conversion gain of 11 dB with
- Input Frequency Range: 9,000 to 12,000 MHz
- Output Frequency Range: 0 to 3,500 MHz
- Conversion Gain: 11 dB
- Noise Figure: 2 dB
-
Supplier: Richardson RFPD
Description: AD7878 is fabricated in Linear Compatible CMOS (LC2 MOS), an advanced, mixed technology process that combines precision bipolar circuits with low power CMOS logic. The part is available in four package styles, 28-pin plastic and hermetic dual-in-line package (DIP), leadless ceramic
-
Supplier: Microchip Technology, Inc.
Description: Plastic J-leaded Chip Carrier (PLCC) 32-lead, Plastic Thin Small Outline Package (TSOP) Available in dual marked (5962-382670xxx) CERAMIC Hermetic Packaging 32-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip) 32-Lead, Non-Windowed, Ceramic
- Density: 1,000 kbits
- Data Rate: 120 MHz
- Access Time: 120 to 150 ns
- Data Retention: 10 years
-
Supplier: Richardson RFPD
Description: of efficient saturated output power. The RF input/outputs are internally matched and dc blocked for ease of integration into higher level assemblies. The ADPA7007 is packaged in a 7 mm x 7 mm, 18-terminal ceramic leadless chip carrier with heat sink (LCC_HS) that exhibits
- Frequency Range: 20,000 to 44,000 MHz
- Maximum Gain: 21.5 dB
- Output Power( P1dB): 30 dBm
- Minimum Operating Voltage: 5 volts
-
Supplier: Microchip Technology, Inc.
Description: 20 pin Leadless Chip Carrier (LCC). The plastic SOIC (DW) is designed to operate over the commercial temperature range of 0°C to 70°C Additional Features Seven NPN Darlington Pairs -55°C to 125°C Ambient Operating Temperature Range Collector Currents to 600mA Output Voltages
- Output Voltage: 30 volts
- Peak Output Current: 0.5 amps
- Features: Other
-
Supplier: Microchip Technology, Inc.
Description: 20 pin Leadless Chip Carrier (LCC). The plastic SOIC (DW) is designed to operate over the commercial temperature range of 0°C to 70°C Additional Features Seven NPN Darlington Pairs -55°C to 125°C Ambient Operating Temperature Range Collector Currents to 600mA Output Voltages
- Output Voltage: 30 volts
- Peak Output Current: 0.5 amps
- Features: Other
-
Supplier: Microchip Technology, Inc.
Description: 20 pin Leadless Chip Carrier (LCC). The plastic SOIC (DW) is designed to operate over the commercial temperature range of 0°C to 70°C Additional Features Seven NPN Darlington Pairs -55°C to 125°C Ambient Operating Temperature Range Collector Currents to 600mA Output Voltages
- Output Voltage: 30 volts
- Peak Output Current: 0.5 amps
- Features: Other
- Package Type: SOIC
-
Supplier: Broadcom Inc.
Description: The HCPL-6631 is a high reliability Class H two channel hermetically sealed optocoupler in a 20 Pad Leadless Ceramic Chip Carrier package with solder dipped pads. The solder contains lead. The product is capable of operation and storage over the full military temperature
- Isolation Voltage: 1,500 volts
- Rise Time: 0.035 µs
- Collector Emitter Breakdown Voltage: 5 volts
- Operating Temperature: -55 to 125 C
-
Supplier: Broadcom Inc.
Description: The HCPL-6230 is a commercial grade two channel hermetically sealed optocoupler in a 20 pad Leadless Ceramic Chip Carrier with solder dipped pads. The solder contains lead. The product is capable of operation and storage over the full military temperature range and may
- Isolation Voltage: 1,500 volts
- Rise Time: 0.045000000000000005 µs
- Collector Emitter Breakdown Voltage: 3 volts
- Operating Temperature: -55 to 125 C
-
Supplier: Broadcom Inc.
Description: The HCPL-6431 is a high reliability Class H two channel hermetically sealed optocoupler in a 20 pad Leadless Ceramic Chip Carrier with solder dipped pads. The solder contains lead. The product is capable of operation and storage over the full military temperature range
- Isolation Voltage: 1,500 volts
- Rise Time: 0.015 µs
- Collector Emitter Breakdown Voltage: 3 volts
- Operating Temperature: -55 to 125 C
-
Supplier: Broadcom Inc.
Description: The HCPL-673K is a two channel hermetically sealed optocoupler in a 20 pad Leadless Ceramic Chip Carrier package with solder dipped pads and the highest level of reliability (Class K). The solder contains lead. The product is capable of operation and storage over the full
- Isolation Voltage: 1,500 volts
- Collector Emitter Breakdown Voltage: 5 volts
- Operating Temperature: -55 to 125 C
- Input: DC
Find Suppliers by Category Top
Featured Products Top
-
Insaco, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience, Insaco® offers multiple hole wafer carriers in sapphire for GaAs, Indium Phosphide, and other semiconductors. Why (read more)
Browse Wafer Cassettes Datasheets for Insaco, Inc. -
Insaco, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience, Insaco® offers multiple hole wafer carriers in sapphire for GaAs, Indium Phosphide, and other semiconductors. Why (read more)
Browse Wafer Cassettes Datasheets for Insaco, Inc. -
are required for packaging new vertical and flip chip When vertical silicon chip is packaged, ceramic substrate is usually used as thermal conductivity and electrical carrier to obtain superior thermoelectric effect. In flip chip packaging, ceramic substrates can be selected as thermal (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Silicon nitride ceramic substrate is a high-performance ceramic material with Si?N? as the main component, with high strength, high thermal conductivity, wear resistance, and excellent insulation. It is made by casting, sintering, and other processes, with controllable thickness (0.25 mm-1.00 mm (read more)
Browse Silicon Nitride and Silicon Nitride Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
, allowing customers to easily generate a negative voltage reference or a gain of 2 with minimal impact on the output accuracy or drift. The ADR1001 is packaged in a hermetic, ceramic, 20-terminal leadless chip carrier (LCC). The surface-mount ceramic package allows customers to eliminate the (read more)
Browse Current Sensors Datasheets for DigiKey -
FP-16 ceramic flat-pack and LCCC, enabling high-density, leadless assembly in complex environments (read more)
Browse Resistors Datasheets for Win Source Electronics -
INSACO Offers Wafer Carriers With or Without Multiple Holes INSACO, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience (read more)
Browse Glass Fabrication Services Datasheets for Insaco, Inc.
More Information Top
Indicates content that may require registration and/or purchase.
-
Holo-interferometric measurement of the thermal deformation response to power dissipation in multilayer printed wiring boards
Hall, P.M., "'Strain Measurements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Multilayered Printed WiringBoards, ""submitted to 1984Electronic Mat.
-
Circuit bridging of components by smoke
Comb pattern A with 160-Vbias Comb pattern B with 50-V bias Comb pattern C with 5-V bias Comb pattern D with 0-V bias except 5 V during measurement Ceramic leadless chip carrier Ceramic dual-in-linepackage Ceramic flat…
-
Structural Dynamics of Electronic and Photonic Systems
The board was populated with 55 daisy chain packages consisting of ceramic leadless chip carrier (CLCC), plastic leaded chip carriers (PLCCs), thin small outline packages (TSOPs), thin quad flat packs (TQFPs), dual in-line packages, (DIPs), and BGAs.
-
(LCCs) R & M Implications of leadless chip carriers
C. H. Chen and J. M. Verville (AerospaceiOptical Div., I’IT, Fort Wayne, IN, U.S.A.) ‘Direct soldering of ceramic leadless chip carrier solves radio production problems’, Elec- tronics (USA), 30, (2), 15-17 (1984).
-
Stress analysis of a leadless chip carrier soldered to a ceramic substrate
and the underlying ceramic substrate when leadless ceramic chip carriers (LCCC's) were soldered to such metal]Jzation and subsequently subjected to thermal cycling.