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Supplier: Accuris
Description: SOCKETS, CHIP CARRIER, CERAMIC, FOR USE WITH CHIP CARRIER, JEDEC, .050 CENTER, LEADLESS TYPES A, B, AND D
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Supplier: Microchip Technology, Inc.
Description: , Plastic J-leaded Chip Carrier (PLCC) 32-lead, Plastic Thin Small Outline Package (TSOP) Available in dual marked (5962-382670xxx) CERAMIC Hermetic Packaging 32-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip) 32-Lead, Non-Windowed, Ceramic
- Access Time: 120 to 150 ns
- Data Rate: 120 MHz
- Data Retention: 10 years
- Density: 1000 kbits
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Supplier: Microchip Technology, Inc.
Description: ) 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC) 28-lead, Plastic Thin Small Outline Package (TSOP) Available in Dual marked (5962-886340xxx) CERAMIC Hermetic Packaging 28-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip) 28-Lead, Non-Windowed, Ceramic
- Access Time: 70 to 120 ns
- Data Retention: 10 years
- Density: 256 kbits
- IC Package Type: SOIC, DIP, Other
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Supplier: Microchip Technology, Inc.
Description: .600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip) 28-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack) 32-Pad, Non-windowed, Ceramic, Leadless Chip Carrier (LCC)
- Access Time: 150 to 250 ns
- Data Retention: 10 years
- Density: 256 kbits
- IC Package Type: SOIC, DIP, Other
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Supplier: Richardson RFPD
Description: The HMC908A is a compact, gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), inphase/ quadrature (I/Q) downconverter in a leadless, RoHS compliant ceramic leadless chip carrier. This device provides a small signal conversion gain of 11 dB with
- Conversion Gain: 11 dB
- Form Factor: Other
- Input Frequency Range: 9000 to 12000 MHz
- Noise Figure: 2 dB
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Supplier: Skyworks Solutions, Inc.
Description: The OLS303 is suitable for wide bandwidth analog applications. Each OLS303 has an LED and integrated photodiode transistor detector mounted and coupled in a custom hermetic surface mount Leadless Chip Carrier (LCC) ceramic package, that provides 1500 VDC of electrical
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Supplier: Skyworks Solutions, Inc.
Description: The OLI110 consists of an LED and N-P-N silicon phototransistor that is electrically isolated, but optically coupled on a ceramic leadless chip carrier (LCC) surface mount package. The epoxy coating on the OLI110 allows the device to withstand normal solvent cleaning
- Isolation Voltage: 1500 volts
- Optocoupler Output: Phototransistor
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Supplier: APITech
Description: API Technologies' line of non-dispersive and dispersive SAW Delay Lines offer semi-standard or custom designs with various delay and bandwidth options. SAW Delay Lines are available in several packaging options such as ceramic leadless chip carriers, which provide small
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Supplier: Richardson RFPD
Description: AD7878 is fabricated in Linear Compatible CMOS (LC2 MOS), an advanced, mixed technology process that combines precision bipolar circuits with low power CMOS logic. The part is available in four package styles, 28-pin plastic and hermetic dual-in-line package (DIP), leadless ceramic
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Supplier: Richardson RFPD
Description: The HMC787A is a general-purpose, double balanced mixer in a 12-terminal, RoHS compliant, ceramic leadless chip carrier (LCC) package that can be used as an upconverter or downconverter from 3 GHz to 10 GHz. This mixer is fabricated in a gallium arsenide (GaAs), metal
- Conversion Loss: 9 dB
- IF Frequency Range: 0.0 to 4000 MHz
- LO - IF Isolation: 43 dB
- LO - RF Isolation: 48 dB
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Supplier: Richardson RFPD
Description: fabricated in Analog Devices' Linear Compatible CMOWS (LC2MOS) process, a mixed technology process that combines precision bipolar circuits with low-power CMOS logic. The part is available in a 28-pin, 0.6"" wide, plastic or hermetic dual-in-line package (DIP), in a 28-terminal leadless
- IC Package Type: DIP
- Resolution: 12 bits
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Supplier: RS Components, Ltd.
Description: The GSPW16x3J series, from Stanley Electric, are high efficiency white LEDs suitable applications include: Residential lighting, Office lighting, Plant lighting, Store lighting, Special lighting, etc. Ceramic Leadless Chip Carrier (CLCC) package. Dimensions: 5.0 x 5.0 x
- Color: White, Other
- Forward Voltage: 3.5 volts
- Viewing Angle: 120 degrees
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Supplier: RS Components, Ltd.
Description: The GSPW16x3J series, from Stanley Electric, are high efficiency white LEDs suitable applications include: Residential lighting, Office lighting, Plant lighting, Store lighting, Special lighting, etc. Ceramic Leadless Chip Carrier (CLCC) package. Dimensions: 5.0 x 5.0 x
- Color: White, Other
- Forward Voltage: 3.5 volts
- Viewing Angle: 120 degrees
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Supplier: RS Components, Ltd.
Description: The GSPW16x3J series, from Stanley Electric, are high efficiency white LEDs suitable applications include: Residential lighting, Office lighting, Plant lighting, Store lighting, Special lighting, etc. Ceramic Leadless Chip Carrier (CLCC) package. Dimensions: 5.0 x 5.0 x
- Color: White, Other
- Forward Voltage: 3.5 volts
- Viewing Angle: 120 degrees
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Supplier: RS Components, Ltd.
Description: The GSPW16x3J series, from Stanley Electric, are high efficiency white LEDs suitable applications include: Residential lighting, Office lighting, Plant lighting, Store lighting, Special lighting, etc. Ceramic Leadless Chip Carrier (CLCC) package. Dimensions: 5.0 x 5.0 x
- Color: White, Other
- Forward Voltage: 3.5 volts
- Viewing Angle: 120 degrees
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Supplier: Skyworks Solutions, Inc.
Description: -transistor that is electrically isolated, but optically coupled on a ceramic Leadless Chip Carrier (LCC) surface mount package. The epoxy coating on the OLI149 allows the device to withstand normal solvent cleaning operations. Surface mounting can be accomplished with
- Optocoupler Output: Phototransistor
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Supplier: Skyworks Solutions, Inc.
Description: transistor detector mounted and coupled in a custom hermetic surface mount leadless chip carrier (LCC) ceramic package that provides 1500 VDC of electrical isolation between the input and output. The integrated photodiode transistor improves the switching speed by orders
- Isolation Voltage: 1500 volts
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Supplier: Broadcom Inc.
Description: The HCPL-6631 is a high reliability Class H two channel hermetically sealed optocoupler in a 20 Pad Leadless Ceramic Chip Carrier package with solder dipped pads. The solder contains lead. The product is capable of operation and storage over the full military temperature
- Collector Emitter Breakdown Voltage: 5 volts
- Isolation Voltage: 1500 volts
- Mounting Option: Surface Mount
- Operating Temperature: -55 to 125 C
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Supplier: Broadcom Inc.
Description: The DSCC SMD 81028032A is a high reliability Class H two channel hermetically sealed optocoupler in a 20 Pad Leadless Ceramic Chip Carrier package with solder dipped pads. The solder contains lead. The product is capable of operation and storage over the full military
- Collector Emitter Breakdown Voltage: 5 volts
- Isolation Voltage: 1500 volts
- Mounting Option: Surface Mount
- Operating Temperature: -55 to 125 C
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Supplier: Broadcom Inc.
Description: The HCPL-663K is a two channel hermetically sealed optocoupler in a 20 Pad Leadless Ceramic Chip Carrier package with solder dipped pads and the highest level of reliability, Class K. The solder contains lead. The product is capable of operation and storage over the full
- Collector Emitter Breakdown Voltage: 5 volts
- Isolation Voltage: 1500 volts
- Mounting Option: Surface Mount
- Operating Temperature: -55 to 125 C
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Supplier: Microchip Technology, Inc.
Description: ) package and 20 pin Leadless Chip Carrier (LCC). The plastic SOIC (DW) is designed to operate over the commercial temperature range of 0°C to 70°C Additional Features Seven NPN Darlington Pairs -55°C to 125°C Ambient Operating Temperature Range
- IC Package Type: Other
- Output Voltage: 30 volts
- Peak Output Current: 0.5000 amps
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Supplier: Broadcom Inc.
Description: The HCPL-673K is a two channel hermetically sealed optocoupler in a 20 pad Leadless Ceramic Chip Carrier package with solder dipped pads and the highest level of reliability (Class K). The solder contains lead. The product is capable of operation and storage over the full
- Collector Emitter Breakdown Voltage: 5 volts
- Isolation Voltage: 1500 volts
- Mounting Option: Surface Mount
- Operating Temperature: -55 to 125 C
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Insaco, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience, Insaco® offers multiple hole wafer carriers in sapphire for GaAs, Indium Phosphide, and other semiconductors. Why (read more)
Browse Wafer Cassettes Datasheets for Insaco, Inc. -
Insaco, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience, Insaco® offers multiple hole wafer carriers in sapphire for GaAs, Indium Phosphide, and other semiconductors. Why (read more)
Browse Wafer Cassettes Datasheets for Insaco, Inc. -
are required for packaging new vertical and flip chip When vertical silicon chip is packaged, ceramic substrate is usually used as thermal conductivity and electrical carrier to obtain superior thermoelectric effect. In flip chip packaging, ceramic substrates can be selected as thermal (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
installation and strong compatibility. Ceramic Leadless Chip Carrier/Quad Flat No-Lead Package (CLCC/CQFN): Boasts small parasitic parameters and compact volume, supporting both double-sided and four-sided lead-out structures. The lead pitches include 1.27mm, 1.00mm, 0.50mm, etc (read more)
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Silicon nitride ceramic substrate is a high-performance ceramic material with Si?N? as the main component, with high strength, high thermal conductivity, wear resistance, and excellent insulation. It is made by casting, sintering, and other processes, with controllable thickness (0.25 mm-1.00 mm (read more)
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(CDIP) -Ceramic Flat Pack /Ceramic Quad Flat Pack (CFP/CQFP) -Ceramic Quad Flat Non -leded Package?CQFN) -Ceramic Pin Grid Array (CPGA) -Ceramic Small Outline Package (CSOP) -Ceramic Leadless Chip Carrier (CLCC) Technical advantages (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
, allowing customers to easily generate a negative voltage reference or a gain of 2 with minimal impact on the output accuracy or drift. The ADR1001 is packaged in a hermetic, ceramic, 20-terminal leadless chip carrier (LCC). The surface-mount ceramic package allows customers to eliminate the (read more)
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FP-16 ceramic flat-pack and LCCC, enabling high-density, leadless assembly in complex environments (read more)
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Indicates content that may require registration and/or purchase.
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Holo-interferometric measurement of the thermal deformation response to power dissipation in multilayer printed wiring boards
Hall, P.M., "'Strain Measurements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Multilayered Printed WiringBoards, ""submitted to 1984Electronic Mat.
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Circuit bridging of components by smoke
Comb pattern A with 160-Vbias Comb pattern B with 50-V bias Comb pattern C with 5-V bias Comb pattern D with 0-V bias except 5 V during measurement Ceramic leadless chip carrier Ceramic dual-in-linepackage Ceramic flat…
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Structural Dynamics of Electronic and Photonic Systems
The board was populated with 55 daisy chain packages consisting of ceramic leadless chip carrier (CLCC), plastic leaded chip carriers (PLCCs), thin small outline packages (TSOPs), thin quad flat packs (TQFPs), dual in-line packages, (DIPs), and BGAs.
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(LCCs) R & M Implications of leadless chip carriers
C. H. Chen and J. M. Verville (AerospaceiOptical Div., I’IT, Fort Wayne, IN, U.S.A.) ‘Direct soldering of ceramic leadless chip carrier solves radio production problems’, Elec- tronics (USA), 30, (2), 15-17 (1984).
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Stress analysis of a leadless chip carrier soldered to a ceramic substrate
and the underlying ceramic substrate when leadless ceramic chip carriers (LCCC's) were soldered to such metal]Jzation and subsequently subjected to thermal cycling.