Com Express Compact

Description: COM Express Type 6 Compact module based on AMD Embedded Ryzen V2000 embedded processor series COM Express Compact Type 6 Next gen 7nm SOC High performance Zen 2 CPU & VEGA 7 GPU Huge scalability with TDP Range from 10-54W Up to 64GByte dual channel DDR4

• Capacity: 32,000 MB
• Operating Temperature: 32 to 140 F
• Operating Humidity: 10 to 90 %
• Form Factor: COM Express Compact

Description: COM Express Type 6 Compact module based on 8th Generation Intel® Core™ SOC processor family Up to 4 cores Configuration of display mode by software (LVDS/eDP) Low power consumption (TDP 15W, cTDP 10W) Up to 64 GByte dual channel DDR4 2400 MT/s Optional eMMC 5.1 on board mass

• Capacity: 64,000 MB
• Operating Temperature: 32 to 140 F
• Operating Humidity: 10 to 90 %
• Form Factor: COM Express Compact

Description: With dual independent display support, the COM-Express® Type 6 Computer on Module (CoM) with the Intel® Atom™ E3800 and Celeron® families offers broad connectivity options (HDMI, DVI, DP, DP++, LVDS, CRT), and it is also available in an Industrial temperature range and features

• Capacity: 8,000 MB
• Operating Temperature: -40 to 185 F
• Form Factor: COM Express Compact
• Socket: Card

Description: SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to

• Operating Temperature: -40 to 185 F
• Form Factor: COM Express Compact
• Socket: Card
• Ports / Buses: I²C, PCI Express, SPI, Serial Ports, USB

Description: COM Express® 3.0 Type 6 Compact Computer on Module (CoM) with AMD Ryzen™ Embedded V2000 SoCs

• Capacity: 64,000 MB
• Operating Temperature: 32 to 140 F
• Form Factor: COM Express Compact
• Socket: Card

Description: Low-end AMD Ryzen® on COM Express® Type 6 Compact Computer on Module (CoM)

• Capacity: 32,000 MB
• Operating Temperature: -40 to 185 F
• Form Factor: COM Express Compact
• Socket: Card

Description: The COMeT6-1100 is an industrial COM Express Type 6 Compact module with an Intel® 11th Gen Core™ i3/i5/i7 Processor. This industrial module is designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a

• Capacity: 32,000 MB
• Operating Temperature: -40 to 185 F
• Form Factor: COM Express Compact
• Features: Other, Speaker Support

Description: The XTend7103 is a COM Express® carrier card designed to provide a low-cost and compact platform for the XPedite8150 and XPedite8152 COM Express® Type 10 mezzanine modules. The XTend7103, in conjunction with a standard off-the-shelf 12 V power supply, provides a

• Features: Other

Description: Computer-On-Modules - COM Compact COM Express Type6 with Intel Apollo Lake Pentium N3350

Description: Intel® Mobile Atom Cedar Trail and NM10 based Type VI COM Express module with DDR3 SDRAM, LVDS/Display Port, 10/100 Ethernet, SATA and USB Portwell PCOM-B218VG series are designed with Intel® AtomTM N2800/ D2550 processor + NM10 chipset, cost effective dual-core solution. Due to low

• Capacity: 4,000 MB
• Operating Temperature: 32 to 140 F
• Operating Humidity: 5 to 95 %
• Form Factor: COM Express Basic

Description: Get your COM Express project off to a fast start with the Express-BASE6 COM Express carrier board. The Express-BASE6 supports Basic and Compact Type 6 COM Express modules. Standard features include seven PCI Express X1 slots, one

Description: Get your COM Express project off to a fast start with the TEVAL COM Express carrier board. The TEVAL supports Basic and Compact Type 6 COM Express modules. Standard features include six PCI Express X1 slots, one PCI Express X16 slot, one

Description: Development Boards & Kits - x86 The conga-MCB is a full featured carrier board for COM Express Compact modules.

• Category: Development Board, Development Suite / Kit

Description: x 3 Wide DC Input Range, +8.5V To +19V (Optional) COM Express Pin-out Type 2 Compact Module Size, 95mm x 95mm, COM.0 Rev. 1.0

• Operating Temperature: 32 to 140 F
• Operating Humidity: 0 to 90 %
• Memory Type: DDR2
• Processor / CPU: Intel® Atom^TM

Description: x 1, SATA 3.0Gb/s x 3 USB2.0 x 8 PCI x 4, PCI-Express [x1] x 5 (x 6: Optional) Wide DC Input Range, +8.5V to +19V (Optional) COM Express Pin-out Type 2 Compact Module Size, 95mm x 95mm, COM.0 Rev. 1.0/2.0

• Operating Temperature: 32 to 140 F
• Operating Humidity: 0 to 90 %
• Memory Type: DDR3
• Processor / CPU: Intel® Atom^TM

Description: D2550/N2600 Processor Intel NM10 SODIMM DDR3 1066 Memory, Max. 4 GB Intel 82583V Gigabit Ethernet CRT, Up to 24-bit Dual-Channel LVDS LCD, HDMI SATA 3.0Gb/s x 2, USB3.0 x 2, USB2.0 x 8 PCI-Express[x1] COM Express Compact Module, 95mm x 95mm, Pin-out Type 6, COM.0

• Operating Temperature: 32 to 140 F
• Operating Humidity: 0 to 90 %
• Memory Type: DDR3
• Processor / CPU: Intel® Atom^TM

Description: deployment. Please contact the factory for lead solder option. Carrier Functions Type 6 COM Express module site for compact or basic size processor board Two Mini PCIe sites for I/O expansion Single or dual PMC/XMC sites High-density, high-speed connector for CPU, I/O, and

• Carrier Class: Non-intelligent Carrier
• Features: Other
• Carrier Type: PMC

Description: 2.0 Pin-out Type 1/2 RJ-45 x 2, Supports Gigabit Ethernet VGA/ DVI-D Connector 7.1 Channel Audio PATA Connector x 1, SATA Port x 3 (4), CompactFlash¢Ã¢ Type 2 Slot x 1 USB Port x 5, COM Port x 2 PCI-Express [x16] Slot x 1, PCI-Express [x1] Slot x 1, PCI Slot x 1 ExpressCard Slot

Description: Intel® ATOM™ based Type II micro-COM Express module with DDR2 SDRAM, VGA, Gigabit Ethernet, SATA, USB and NAND Flash Features Intel® ATOM™ N450(Pineview-M) / D410 (Pineview-D, Single core) D510(Pineview-D, Duo core) and ICH8M platform provides cost effective solution with low power and

• Capacity: 4,000 MB
• Operating Temperature: 32 to 140 F
• Operating Humidity: 5 to 90 %
• Form Factor: COM Express Basic

Description: The ACEX4040 carrier card allows you to quickly combine a COM Express Type 10 CPU module with a mix of I/O modules for custom computing applications. With its rugged design and compact Mini-ITX form factor, this carrier card is easily mounted in a variety of enclosures for rapid

• Module Voltage: 12 V, 3.3 V, 5 V
• Carrier Class: Non-intelligent Carrier
• Features: Other

Description: XPand6000 Series, including support for a COM Express® module and an XMC or PMC. With the XPand1400 Series, the transition from development to the target XPand6000 Series system or custom COM Express® carrier card is made easy. The XPand1400 Series provides basic

• Features: Other
• Backplane Bus: PCI
• CPU Slot: Two

Description: overall dimensions of the COMX-P2020 are 95 mm x 95 mm following the definition of a Compact COM Express module and this enables it to be fitted within a very wide range of enclosures when mounted on a customer carrier. COMX-P2020 is an off-the-shelf processor solution that is

• Capacity: 2,000 MB
• Operating Temperature: 32 to 131 F
• Form Factor: COM Express Basic
• Memory Type: DDR3

Description: PCI x 4, PCI-Express [x1] x 3 Wide DC Input Range, +8.5V To +19V (Optional) COM Express Pin-out Type 2 Compact Module Size, 95mm x 95mm, COM.0 Rev. 1.0 Application Healthcare Retail & Advertising Test & Measurement Gaming & Entertainment Industrial Automation

Description: The BluStar FS-8135 is a Fanless Compact Size Box PC ideal for space critical applications. This embedded hardware platform features the 3rd Generation Intel Core i7-3517UE Processor, Intel® QM77 Express chipset, and DDR3 1333/1600 SO-DIMM. It comes with support for a 2.5” SATA hard

• RAM: 16 GB
• Processor: Intel®
• Operating System: Microsoft®

Description: Four Independent Channels Series or Parallel Operation Precision Sensor Simulation Low Thermal Offset (≤±25 µV) Independent Sense Feedback Dynamic Soft Front Panel Interface IVI-COM, IVI-C, LabVIEW™ Drivers 3-Year Warranty Combining AMETEK VTI Instruments' proven industry track record with

• Features: Bus Interface / Adapter
• Technology: PXI^TM Compliant

Description: The BluStar MS-8113 is a compact size Box PC ideal for space critical applications. This embedded hardware platform features 3rd Generation Intel® Core™ i3/i5/i7 Processors, Intel® HM76 Express chipset, and DDR3 1066/1333/1600 SO-DIMM. It comes with support for a 2.5” SATA hard drive

• RAM: 8 GB
• Processor: Intel®
• Operating System: Microsoft®

Description: CPU & Chip Coolers COM-Express Compact 2nd-pc Cooler

Description: 2.5” SATA hard drive or SSD, Compact Flash slot, HDMI, DVI, 4 x USB 3.0, 1 x USB 2.0, 2 x COM Ports, and HD Audio. The BluStar FS-8118 provides high reliability for harsh environments, compact size, high performance and is highly suited to a wide range of industrial applications

• RAM: 16 GB
• Processor: Intel®

Description: ARM architecture supports several high level operating systems, including Embedded Linux, Micrium uC/OS, Android, QNX, and Windows Embedded Compact. By combining six 3.125Gbps transceivers, one PCIe hard core, up to 133 user I/O, and dual Gigabit Ethernet interfaces, the system can

• Capacity: 2,000 MB
• Operating Temperature: -40 to 185 F
• Memory Type: DDR3
• Ports / Buses: I²C, PCI Express, SPI, USB

Description: Intel® Atom™ N270 Processor IntelR 945GSE and ICH7-M chipset based Mini-ITX Board with Dual Display, Gigabit Ethernet, Two SATA Ports, Three COM ports, Compact Flash Socket, Eight USB Ports and IDE/PCI/PCI-E Slot Ethernet, four serial ports, two SATA, one LPT, one PCI slot and one

• Max Speed: 1.6 GHz
• Memory Capacity: 2 GB
• PCI Slots: 1
• PCI Express: 1