Com Express Compact

Description: COM Express Type 6 Compact module based on 12th Gen Intel® Core™ embedded mobile processors (code name "Alder Lake") Intel® hybrid design combines Performance-cores with Efficient–cores Up to Intel® Iris® XeGraphics® architecture with up to

• Capacity: 64000 MB
• Features: Watchdog Timer
• Form Factor: COM Express Compact
• Memory Type: Other

Description: COM Express Type 6 Compact module based on AMD Embedded Ryzen V2000 embedded processor series COM Express Compact Type 6 Next gen 7nm SOC High performance Zen 2 CPU & VEGA 7 GPU Huge scalability with TDP Range from 10-54W Up to 64GByte dual channel DDR4

• Capacity: 32000 MB
• Form Factor: COM Express Compact
• Memory Type: Other
• Operating Humidity: 10 to 90 %

Description: COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name "Tiger Lake") and soldered down memory Embedded/Industrial use condition Extended temperature options available PCI Express Gen 4 Up to 32 GByte dual channel LPDDR4X soldered down

• Capacity: 32000 MB
• Features: Watchdog Timer
• Form Factor: COM Express Compact
• Memory Type: Other

Description: Low-end AMD Ryzen® on COM Express® Type 6 Compact Computer on Module (CoM)

• Capacity: 32000 MB
• Features: Speaker Support
• Form Factor: COM Express Compact
• Memory Type: Other

Description: The COMeT6-1100 is an industrial COM Express Type 6 Compact module with an Intel® 11th Gen Core™ i3/i5/i7 Processor. This industrial module is designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a

• Capacity: 32000 MB
• Certifications: Other
• Features: Speaker Support
• Form Factor: COM Express Compact

Description: COM Express® 3.0 Type 6 Compact Computer on Module (CoM) with AMD Ryzen™ Embedded V2000 SoCs

• Capacity: 64000 MB
• Features: Speaker Support
• Form Factor: COM Express Compact
• Memory Type: Other

Description: COM Express Type 6 Compact based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series COM Express Type 6 Compact based on Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® J and N Series processors High

• Capacity: 32000 MB
• Features: Watchdog Timer
• Form Factor: COM Express Compact
• Memory Type: Other

Description: COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors

• Capacity: 64000 MB
• Features: Speaker Support
• Form Factor: COM Express Compact
• Memory Type: Other

Description: SOM-COMe-CT6-V1000 is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes with up to two DDR4

• Capacity: 32000 MB
• Features: Speaker Support
• Form Factor: COM Express Compact
• Memory Type: Other

Description: The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board

• Capacity: 8000 MB
• Certifications: RoHS
• Form Factor: COM Express Compact
• Memory Type: Other

Description: PATA x 1, SATA 1.5Gb/s x 2 USB2.0 x 8 PCI x 4, PCI-Express [x1] x 3 Wide DC Input Range, +8.5V To +19V (Optional) COM Express Pin-out Type 2 Compact Module Size, 95mm x 95mm, COM.0 Rev. 1.0

• Features: Watchdog Timer
• Memory Type: DDR2
• Operating Humidity: 0.0 to 90 %
• Operating Temperature: 32 to 140 F

Description: Intel® Mobile Atom Cedar Trail and NM10 based Type VI COM Express module with DDR3 SDRAM, LVDS/Display Port, 10/100 Ethernet, SATA and USB Portwell PCOM-B218VG series are designed with Intel® AtomTM N2800/ D2550 processor + NM10 chipset, cost effective dual

• Capacity: 4000 MB
• Features: Watchdog Timer, Speaker Support
• Form Factor: COM Express Basic
• Memory Type: DDR3, SDRAM

Description: PATA SSD (Up to 4GB) x 1, SATA x 1 or PATA x 1 USB2.0 x 8 PCI-Express [x1] x 1 Wide DC Input Range, +8.5V To +19V (Optional) COM Express Pin-out Type II Compact Module Size, 95mm x 95mm

• Features: Watchdog Timer
• Memory Type: DDR2
• Operating Humidity: 0.0 to 90 %
• Operating Temperature: 32 to 140 F

Description: x 4, PCI-Express [x1] x 5 (x 6: Optional) Wide DC Input Range, +8.5V To +19V (Optional) COM Express Pin-out Type 2 Compact Module Size, 95mm x 95mm, COM.0 Rev. 1.0/2.0

• Features: Watchdog Timer
• Memory Type: DDR2
• Operating Humidity: 0.0 to 90 %
• Operating Temperature: 32 to 140 F

Description: Intel 82583V Gigabit Ethernet CRT, Up to 24-bit Single Channel LVDS LCD SATA 3.0Gb/s x 4, USB2.0 x 8, PATA x 1 PCI-Express [x1] x 2, PCI x 2 COM Express Compact Module, 95mm x 95mm, Pin-out Type 2, COM.0 Rev. 2.0

• Features: Watchdog Timer
• Memory Type: DDR3
• Operating Humidity: 0.0 to 90 %
• Operating Temperature: 32 to 140 F

Description: Computer-On-Modules - COM Compact COM Express Type6 with Intel Apollo Lake Pentium N4200

Description: Computer-On-Modules - COM Compact COM Express Type6 with Intel Apollo Lake Pentium N3350

Description: Computer-On-Modules - COM Compact COM Express Type6 with Intel Apollo Lake-I Atom E3930

Description: Computer-On-Modules - COM Compact COM Express Type 2 module with Intel Atom E3845 at 1.91 GHz

Description: Get your COM Express project off to a fast start with the TEVAL COM Express carrier board. The TEVAL supports Basic and Compact Type 6 COM Express modules. Standard features include six PCI Express X1 slots, one PCI Express X16 slot, one

Description: Get your COM Express project off to a fast start with Sealevel’s COM Express carrier board. The 12000 supports Basic and Compact Type 6 COM Express modules. Standard features include five USB 2.0, two RS-232, one RS-485, dual Gigabit Ethernet, SATA,

Description: Intel® ATOM™ based Type II micro-COM Express module with DDR2 SDRAM, VGA, Gigabit Ethernet, SATA, USB and NAND Flash Features Intel® ATOM™ N450(Pineview-M) / D410 (Pineview-D, Single core) D510(Pineview-D, Duo core) and ICH8M

• Capacity: 4000 MB
• Features: Speaker Support
• Form Factor: COM Express Basic
• Memory Type: DDR2, SDRAM

Description: . The overall dimensions of the COMX-P2020 are 95 mm x 95 mm following the definition of a Compact COM Express module and this enables it to be fitted within a very wide range of enclosures when mounted on a customer carrier. COMX-P2020 is an off-the-shelf processor solution

• Capacity: 2000 MB
• Certifications: RoHS, FCC, UL, Other
• Features: Watchdog Timer
• Form Factor: COM Express Basic

Description: features including USB, PCI Express, Gigabit Ethernet, memory controller, general purpose I/O and SD/MMC flash controller. The overall dimensions of the COMX-P1022 are 95 mm x 95 mm following the definition of a Compact COM Express module and this enables it to be fitted

• Capacity: 2000 MB
• Certifications: RoHS, FCC, UL, Other
• Features: Watchdog Timer
• Form Factor: COM Express Basic

Description: The XTend7103 is a COM Express® carrier card designed to provide a low-cost and compact platform for the XPedite8150 and XPedite8152 COM Express® Type 10 mezzanine modules. The XTend7103, in conjunction with a standard off-the-shelf 12 V power supply, provides a

• Carrier Type: Other

Description: CRT, 18-bit Dual-channel LVDS LCD, SDVO High Definition Audio Interface PATA x 1, SATA 1.5Gb/s x 2 USB2.0 x 8 PCI x 4, PCI-Express [x1] x 3 Wide DC Input Range, +8.5V To +19V (Optional) COM Express Pin-out Type 2 Compact Module

Description: connectors and a conduction cooling kit prepare the carrier card for field deployment. Please contact the factory for lead solder option. Carrier Functions Type 6 COM Express module site for compact or basic size processor board Two Mini PCIe sites for I/O expansion

• Bus / Form Factor: Other
• Carrier Class: Non-intelligent Carrier
• Carrier Type: PMC, Other

Description: Four Independent Channels Series or Parallel Operation Precision Sensor Simulation Low Thermal Offset (=±25 µV) Independent Sense Feedback Dynamic Soft Front Panel Interface IVI-COM, IVI-C, LabVIEW™ Drivers

• Product Type: Bus Interface / Adapter
• Technology: PXI^TM Compliant

Description: NXP (formerly Freescale) QorIQ processor-based development, COM Express® Compact (Type 5FS) and Mini (Type 10FS) modules supported For Intel® Core™ i7 processor-based development, COM Express® Basic (Type 7) and Mini (Type 10) modules supported Single XMC

• Backplane Bus / Standard: PCI, Other
• Number of CPU Slots: Two

Description: Four Independent Channels Series or Parallel Operation Precision Sensor Simulation Low Thermal Offset (=±25 µV) Independent Sense Feedback Dynamic Soft Front Panel Interface IVI-COM, IVI-C, LabVIEW™ Drivers

• Technology: PXI^TM Compliant

Description: applications. The ARM architecture supports several high level operating systems, including Embedded Linux, Micrium uC/OS, Android, QNX, and Windows Embedded Compact. By combining six 3.125Gbps transceivers, one PCIe hard core, up to 133 user I/O, and dual Gigabit Ethernet interfaces, the

• Capacity: 2000 MB
• Form Factor: Other
• Memory Type: DDR3
• Operating Temperature: -40 to 185 F

Description: The BluStar FS-8135 is a Fanless Compact Size Box PC ideal for space critical applications. This embedded hardware platform features the 3rd Generation Intel Core i7-3517UE Processor, Intel® QM77 Express chipset, and DDR3 1333/1600 SO-DIMM. It comes with support for a 2.5” SATA hard

• Operating System: Microsoft®
• Processor: Intel®
• RAM: 16 GB

Description: COM Express Carrier Board Main Feature Supports COM Express Basic Module, Pin-out Type II VGA/ LVDS/ TV-out Connector RJ-45 x 2 CompactFlash Type II Slot x 1 PCI-Express [x16] Slot x 1, PCI-Express [x1] Slot x

• Bus / Form Factor: Other
• Carrier Type: Other

Description: Optional) Integrated Intel Enhanced Graphics Core, VGA Support HD Codec Audio Daughter Board (Optional) Ultra ATA100 x 1, SATA 3.0Gb/s x 2, CompactFlash? Type 2 x 1 USB2.0 x 11, COM x 2, Parallel x 1, IrDA x 1 PCI x 4, PCI-Express [x4] x 1, PCI-Express [x16] x 1

• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet
• Features: Keyboard Support?, Mouse Support?, RJ-45 Connectors?
• Hard Drive Support?: IDE Interface, Other

Description: Feature Fanless Design Intel Core 2 Duo Processor PCI-E x 1, PCI x 1 Wide DC Power Input Dual Ethernet, COM x 4, USB x 4, Audio, CompactFlash? x 1 Anti-Vibration And Shock Resistant Machine Control, Security Node, Data Analyzer Platform ATX Power Function

• Processor: Intel®
• RAM: 2 GB
• Type: Other