Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: DuPont Electronics & Imaging
Description: TAS124500: Single sided clad with electro deposited copper TAH125012B: Double sided clad with rolled annealed copper TAHS124500B: Single sided clad with rolled annealed copper
- Thickness: 0.002 inches
- Width: 19.7 inches
- Length: 328 ft
- Materials: Plastic / Polymer, Polyimide (e.g., Kapton®)
-
RF and Microwave Laminates - Copper Clad Laminate, Coverlay, Bondply & Sheet Adhesive -- Pyralux® FRSupplier: DuPont Electronics & Imaging
Description: withstand multiple lamination cycles without degradation UL 94 VTM-0 flammability rating UL maximum operating temperature (MOT) 105C Pyralux® FR Copper-Clad Laminate Pyralux® FR acrylic based laminates are made with DuPont™ Kapton® polyimide film and are available in
- Materials: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Features: Specialty / Other, Tested to IPC, UL Listed
-
Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications. Specifically formulated with FEP fluoropolymer film and DuPont™ Kapton® polyimide film for high
- Features: Dielectric / Insulating, Tested to IPC
- Materials: Fluoropolymer, Plastic / Polymer, Polyimide (e.g., Kapton®)
-
-
Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment. Features Excellent dimensional stability (-0.02%, as received) Low moisture absorption (<1%)
- Thickness: 0.0017716535433070866 inches
- Width: 24.015748031496063 inches
- Temperature Resistance: 155 C
- Materials: Plastic / Polymer, Polyimide (e.g., Kapton®)
-
Supplier: Accuris
Description: General rules of copper-clad laminates for printed wiring boards
-
Supplier: Accuris
Description: Test methods of copper-clad laminates for printed wiring boards
-
Supplier: Accuris
Description: Copper-Clad Laminates for Printed Wiring Boards - Paper Base, Phenolic Resin
-
Supplier: Accuris
Description: Test methods of copper-clad laminates for flexible printed wiring boards
-
Supplier: Polyflon Company - a Crane Co. Company
Description: Polyflon had added another microwave laminate to its product list. Polyflon's Copper-Clad ULTEM® laminates, made from the engineering amorphous thermoplastic PEI (Polyetherimide), have isotropic electrical and mechanical properties with exceptional thermal stability. The
-
Supplier: ASTM International
Description: This specification covers twelve grades of thermosetting laminate with copper foil cladded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. The laminates shall meet the following
-
Supplier: ASTM International
Description: This specification covers twelve grades of thermosetting laminate with copper foil cladded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. The laminates shall meet the following
-
Supplier: ASTM International
Description: These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring boards. The properties that these test methods shall examine are as follows:
-
Supplier: ASTM International
Description: These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring boards. The properties that these test methods shall examine are as follows:
-
Description: Gives requirements for properties of phenolic cellulose paper copper-clad laminated sheet, of defined flammability and high electrical quality, in thicknesses of 0.5 mm up to 6.4 mm. The sheet consists of an insulating base (phenolic resin bonded cellulose paper laminate) with
-
Description: Gives requirements for properties of phenolic cellulose paper copper-clad laminated sheet, high electrical quality, in thicknesses of 0.5 mm up to 6.4 mm. The sheet consists of an insulating base phenolic resin bonded cellulose paper laminate with metal foil bonded to one or
-
Description: Gives requirements for properties of epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, in thicknesses of 0.5 mm up to 6.4 mm. The sheet consists of an insulating base (epoxide resin bonded woven glass fabric laminate) with metal foil bonded to one or
-
Description: Gives requirements for properties of phenolic cellulose paper copper-clad laminated sheet, economic quality, in thicknesses of 0.5 mm up to 6.4 mm. The sheet consists of an insulating base (phenolic resin bonded cellulose paper laminate) with metal foil bonded to one or both
-
Supplier: CSA Group
Description: Gives requirements for properties of epoxide woven E-glass laminated sheet 0,05 mm up to 3,2 mm, of defined flammability, copper-clad.
-
Description: layers of vacuum-deposited ITO, or PSA (Pressure Sensitive Adhesive) on the back of a copper laminate. Our product offerings include Copper metalized films Aluminum metalized films ITO coated films Copper foil laminates Aluminum foil laminates Flat
- Materials: Aluminum Foil / Cladding, Copper Foil / Cladding, Metal Foil / Cladding
-
Supplier: Allied Electronics, Inc.
Description: microns). A 1⁄32" (30 mil) fiberglass laminate with 1 ounce copper (1 mil = 0.001 inch = 25.4 microns) (inches are approximate). A 1⁄64" (10 mil) fiberglass laminate with 1 ounce copper (1 mil = 0.001 inch = 25.4 microns) (inches are approximate). We offer 1⁄16", 1⁄32"
-
Supplier: Allied Electronics, Inc.
Description: microns). A 1⁄16" (62 mil) fiberglass laminate with 1 ounce copper (1 mil = 0.001 inch = 25.4 microns) (inches are approximate). We offer 1⁄16", 1⁄32" and 1⁄64" FR4 laminate with 1 ounce copper per square foot. This flame retardant laminate is translucent in color
-
Supplier: Allied Electronics, Inc.
Description: microns). A 1⁄16" (62 mil) fiberglass laminate with 1 ounce copper (1 mil = 0.001 inch = 25.4 microns) (inches are approximate). We offer 1⁄16", 1⁄32" and 1⁄64" FR4 laminate with 1 ounce copper per square foot. This flame retardant laminate is translucent in color
-
Supplier: Allied Electronics, Inc.
Description: microns). A 1⁄16" (62 mil) fiberglass laminate with 1 ounce copper (1 mil = 0.001 inch = 25.4 microns) (inches are approximate). We offer 1⁄16", 1⁄32" and 1⁄64" FR4 laminate with 1 ounce copper per square foot. This flame retardant laminate is translucent in color
-
Supplier: CSA Group
Description: IEC 61249-2-36:2008 gives requirements for properties of di-functional brominated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 120 °C minimum.
-
Supplier: FX PCB Co., Ltd.
Description: Description Copper base PCB board Manufacturer in 2022 Metal Copper Base PCB Capability: Items Capability Board Classification Aluminum Base,Copper Base,Ceramics Base,Copper-Clad,Combined Bade Board Material Domestic Aluminum,Domestic copper,lmported
- Thickness: 0.01968503937007874 to 0.1968503937007874 inches
- Materials: Aluminum Foil / Cladding, Copper Foil / Cladding
- Features: Specialty / Other
-
Supplier: CSA Group
Description: Gives requirements for properties of epoxide non-woven aramid copper clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.
-
Supplier: CSA Group
Description: Gives requirements for properties of epoxide linear fibreglass reinforced copper-clad laminated sheet, of defined flammability, with a tickness range from 0,05 mm to 0,40 mm.
-
Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: This material is a single sided coated copper which contains a high Dk ceramic powder. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and other high
- Materials: Copper Foil / Cladding, Metal Foil / Cladding
-
Supplier: SAE International
Description: This specification covers polytetrafluoroethylene-impregnated glass laminates in the form of sheet clad on one or both sides with electrolytically deposited copper foil.
-
Supplier: SAE International
Description: This specification covers polytetrafluoroethylene-impregnated glass laminates in the form of sheets clad on one or both sides with electrolytically-deposited copper foil.
-
Supplier: SAE International
Description: This specification covers polytetrafluoroethylene-impregnated glass laminates in the form of sheets clad on one or both sides with electrolytically-deposited copper foil.
-
Supplier: SAE International
Description: This specification covers epoxy-resin-impregnated glass fabric laminates in the form of sheet clad on one or both sides with electrolytically-deposited copper foil.
-
Supplier: AENOR
Description: METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. PHENOLIC CELLULOSE PAPER COPPER. CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY
-
Supplier: AENOR
Description: BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
Find Suppliers by Category Top
Featured Products Top
-
BT Copper-Clad Laminates for SMD LEDs The BT copper-clad laminates, especially the CCL-HL 820 series, are widely used in SMD LED applications. CCL-HL 820WDI is the latest version and comes in thicknesses of 0.10mm, 0.20mm, 0.40mm, and 0.46mm. The copper foil (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
-time decision-making. Communication problems can have catastrophic consequences when they impact operations like stopping time or blind spot detection. Using Fluon+™ PFA EA-2000 fluorinated resins to coat copper clad laminates (CCL) in PCBs helps to prevent communication slowdowns and (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
product, like PI (polyimide)? FR4 and etc Using the Photolithography process to make the conductive pattern Inner Layer Circuit Fabrication Inner Layer Pattern Transfer: Transfer the designed circuit pattern onto the copper-clad laminate using (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
Boyu Aluminum Huizhou China Mingrong Aluminum Shenzhen China Naya Metal Copper Dongguan China Shengyi Copper Clad Laminate Guangdong China (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
copper foil side, while holes are used to connect component leads or Pins through the board to establish the electrical connections. Production Process: Cut Lamination? Cut the base material to the required size per the MI (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
circuits: Single-Sided Flexible Circuits: Single copper conductor layer on a flexible dielectric film. Double-Sided Flexible Circuits: Double-sided copper clad material with top and bottom cover films (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for Summit Interconnect
Conduct Research Top
-
Characteristics and Application of 96% Alumina Ceramic Substrate
96% alumina ceramic substrates are mainly used in high-power circuit substrates such as copper clad laminates, printers, LED lighting, communications, automobile chips and other electronic components.
-
E&I Materials Power and Protect Space Exploration Vehicles and Satellites
NASA is again using DuPont technology, including Kapton (R) polyimide films and Pyralux (R) copper-clad flexible circuit laminate materials, to power and protect the Perseverance mission to Mars.
More Information Top
Indicates content that may require registration and/or purchase.
-
Electronic Chemicals: PCB Chemicals and Semiconductor Packaging Materials
Etching is a chemically simple procedure during which unwanted copper is removed from the copper clad laminate .