Products & Services
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Supplier: Techsil Limited
Description: Offers self-adhesion properties Non-corrosive to metals and sensitive substrates Excellent dielectric properties Outstanding performance over a wide thermal range Technical Properties Uncured Consistency: Flowable Colour: Blue Tack-Free Time: 20 Mins Cured Shore Hardness: 45 Shore A
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Features: Electrically Insulating / Dielectric, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: accelerated cure Non-corrosive to metals High elongation Good dielectric properties Excellent adhesion properties Technical Properties Uncured Consistency:Flowable Colour: Translucent Cured Shore Hardness: 28 Shore A Elongation: 370% Dielectric Strength: 23kv/ mm
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing. One component
- Features: Electrically Insulating / Dielectric
- Viscosity: 12000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2025D, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2025D die attach adhesive is designed for use in array packaging. Minimum bleed Good adhesion to a variety of substrates High hot/wet die shear strength 260ºC reflow capability for Pb-free applications
- Coeff. of Thermal Expansion (CTE): 26.67 µin/in-F
- Features: Electrically Insulating / Dielectric
- Thermal Conductivity: 0.4000 W/m-K
- Viscosity: 11500 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2025JH, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 2025JH die attach adhesive is designed for use in array packaging. Minimum bleed Good adhesion to a variety of substrates High hot/wet die shear strength 260ºC reflow capability for Pb-free applications
- Coeff. of Thermal Expansion (CTE): 41.67 µin/in-F
- Features: Electrically Insulating / Dielectric
- Viscosity: 9500 cP
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Supplier: Master Bond, Inc.
Description: Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33 to 39 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.76
- Dissimilar Substrates: Yes
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8900NC, Epoxy, Die Attach LOCTITE® ABLESTIK 8900NC die attach adhesive has been formulated for use in high throughput die attach applications. Actual performance will depend on die size, aspect ratio and package design. Fast cure Snap curable
- Coeff. of Thermal Expansion (CTE): 36.11 µin/in-F
- Features: Electrically Insulating / Dielectric
- Thermal Conductivity: 0.3000 W/m-K
- Viscosity: 10000 cP
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Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Flexible / Dampening
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
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Supplier: Protavic America, Inc.
Description: Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulation / Dielectric Material
- Filled / Reinforced: Yes
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Supplier: Accuris
Description: ADHESIVE, ONE COMPONENT SILICONE, THERMALLY CONDUCTIVE, HIGH DIELECTRIC STRENGTH
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Supplier: Accuris
Description: ADHESIVE, TWO COMPONENT SILICONE, THERMALLY CONDUCTIVE, HIGH DIELECTRIC STRENGTH
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Supplier: Fluorocarbon Limited
Description: , non-resilient material of average tensile strength but with great thermal properties and excellent resistance to chemicals and passage of electric current. Withstanding temperatures of -200ºC up to +260ºC whilst retaining most of its properties, PTFE is the most thermally-stable plastic
- Backing: Fluoropolymer, Plastic / Polymer
- Features: Abrasion / Scratch Resistant, Dielectric / Insulating
- Thickness: 0.0051 to 0.0197 inches
- Type: Single-Sided
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Supplier: Epoxies Etc...
Description: 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Strength: 600 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting
- Industry: Electronics, OEM / Industrial, Other
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Supplier: Epoxies Etc...
Description: 10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 3.8
- Dielectric Strength: 450 kV/in
- Features: Electrical Insulation / Dielectric Material
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Supplier: Epoxies Etc...
Description: 10-3213 is a new two part epoxy adhesive system which exhibits high bond strength and outstanding thermal shock resistance. The 10-3213 has proven to be an excellent quick set patch and repair adhesive with excellent sealant capabilities.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 8.25
- Features: Electrical Insulation / Dielectric Material
- Industry: Building / Construction
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Supplier: Protavic America, Inc.
Description: Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm°K. Often used as a die & lid attach material.Requires low heat assist for cure. Ideal for applications requiring low-heat curing.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 3.5 to 4.5
- Dielectric Strength: Over 381 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive), Electrical Insulation / Dielectric Material
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Description: adhesive suitable for use as bonding-layer. T1649 tapes are engineered for use in busbar applications where temperature resistance is key. Features PBDE-Free formulation meets current ROHS regulations. High bond strength provides superior adhesion to copper
- Adhesive: Acrylic, Specialty / Other
- Backing: Specialty / Other
- Dielectric Strength: 7.87E7 V/m
- Features: Abrasion / Scratch Resistant, Dielectric / Insulating, Thermally Insulating / Insulative, UV / Weather Resistant, Other
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Supplier: Epoxies Etc...
Description: 10-3018 is a two component epoxy adhesive and sealant. This two component system has excellent chemical and heat resistance. 10-3018 is widely used as a stencil and screen adhesive due to its bonding strength and toughness.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 3.5
- Dielectric Strength: 450 kV/in
- Features: Electrical Insulation / Dielectric Material
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Supplier: Master Bond, Inc.
Description: Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): Over 4.3
- Dissimilar Substrates: Yes
- Features: Thermal Compound / Interface (Thermally Conductive), Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Leveling / Filling Compound, Non-corrosive Cure
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Supplier: Sauereisen, Inc.
Description: Sauereisen Aluseal Adhesive Cement No. 2 is a ceramic cement paste offering good bond strength and thermal shock resistant properties for assembling, sealing and cementing porcelain, glass, metal and other materials. Its fine particle size and excellent flow characteristics make No. 2
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Cure Type / Technology: Air Setting / Film Drying, Single Component System
- Dielectric Constant (Relative Permittivity): 107
- Dielectric Strength: 50.8 kV/in
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Supplier: Custom Fabricating & Supplies
Description: Length - 60 yards Specifications Dielectric Strength (V/mil) - 690 Dielectric Constant - 2.72 Steel Adhesion (oz/in) - 92 What are Adhesive Transfer Tapes? Adhesive transfer tapes are rolls of pressure sensitive adhesive pre
- Adhesive: Acrylic, Pressure Sensitive (PSA)
- Features: Dielectric / Insulating
- Peel Strength / Adhesion: 5.75 lbs/in
- Type: Transfer
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Supplier: Custom Fabricating & Supplies
Description: .2 Mil 58 lb. polycoated kraft paper liner 9.4 Mil Total Thickness Roll Length - 60 yards Specifications Dielectric Strength (V/mil) - 674 Dielectric Constant - 3.32 Steel Adhesion (oz/in) - 108 What are Adhesive
- Adhesive: Acrylic, Pressure Sensitive (PSA)
- Features: Dielectric / Insulating
- Peel Strength / Adhesion: 6.75 lbs/in
- Type: Transfer
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Supplier: Techsil Limited
Description: Offers self-adhesion properties Non-corrosive to metals and sensitive substrates Excellent dielectric properties Outstanding performance over a wide thermal range Technical Properties Uncured Consistency: Flowable Colour: Blue Cured Shore Hardness: 45 Shore A Elongation: 230%
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 3.94
- Dissimilar Substrates: Yes
- Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material, Flexible / Dampening, Laminating / Composites
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Supplier: Saint-Gobain Tape Solutions
Description: , transformer insulation and power cable field splicing Due to its high dielectric strength, typically used in high power applications requiring the chemical, thermal and Environmental protection of PTFE Electrical submersible pump motors and motor lead extensions especially as
- Adhesive: Acrylic, Pressure Sensitive (PSA)
- Features: Dielectric / Insulating
- Temperature Resistance: -40 C
- Thickness: 0.0059 inches
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Supplier: Techsil Limited
Description: resistance Excellent electrical insulation properties Technical Properties Uncured Consistency: Self-levelling Colour: Translucent Tack-Free Time: 20 Mins Cured Shore Hardness: 25 Shore A Elongation: 325% Dielectric Strength: 16
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Industry: Medical / Food (Sanitary / FDA)
- Use Temperature: -60 to 204 F
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 450 kV/in
- Features: Electrical Insulation / Dielectric Material
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 425 kV/in
- Features: Electrical Insulation / Dielectric Material
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 425 kV/in
- Features: Electrical Insulation / Dielectric Material
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Supplier: Zippertubing Co. (The)
Description: tape for bundling and securing of wires and cables or any application requiring a flame retardant material with good dielectric strength, high and low temperature flexibility and resistance to moisture and outdoor conditions. ZT-TAPE® is the perfect mate to Zippertubing’s
- Adhesive: Acrylic
- Backing: Specialty / Other
- Performance Features: Dielectric / Insulating
- Temperature Resistance: -55 to 107 C
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Supplier: Saint-Gobain Tape Solutions
Description: CHR 2345-5 is manufactured from polyimide film with high-temperature silicone adhesive. It has excellent mechanical and electrical properties, plus excellent dielectric strength. Applications: Used for applications that require holding, insulating or wrapping High voltage motors
- Adhesive: Silicone
- Backing: Polyimide (e.g., Kapton®)
- Temperature Resistance: -73 C
- Thickness: 0.0065 inches
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Supplier: Saint-Gobain Tape Solutions
Description: CHR K103 is manufactured from polyimide film with high-temperature adhesive. K103 has excellent mechanical and electrical properties, plus excellent dielectric strength. Applications: Non-silicone adhesive gold finger connector wave solder protection Solvent and water
- Adhesive: Acrylic
- Backing: Polyimide (e.g., Kapton®)
- Temperature Resistance: -29 C
- Thickness: 0.0025 inches
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Supplier: Saint-Gobain Tape Solutions
Description: CHR K102 is manufactured from polyimide film with high-temperature adhesive. K102 has excellent mechanical and electrical properties, plus excellent dielectric strength. Applications: Non-silicone adhesive gold finger connector wave solder protection Solvent and water
- Adhesive: Acrylic
- Backing: Polyimide (e.g., Kapton®)
- Temperature Resistance: -29 C
- Thickness: 0.0025 inches
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ ME-1070 Silicone Die Attach Adhesive Black is a one component, heat curing, microelectronics adhesive that provides high temperature stability, stress relief, seals packaging, and bonds with a variety of substrates. It offers unprimed adhesion, high strength,
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Features: Electrically Insulating / Dielectric
- Viscosity: 18000 cP
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Selecting the Right Potting Compound for Your Application
Many questions arise when trying to select an appropriate potting compound. An experienced materials expert can help identify the primary concerns, recommend materials, provide testing of the materials, and offer information on dielectric strength, adhesive. characteristics, thermal conductivity
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Silicone Rubber Thermal Interface Materials: Applications and Performance Considerations
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An adhesive selection advisor for PCB assembly using surface mount technology
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Interface Formation Between Metal and Polyimide in High Wiring Density Build-up Substrate
However, the Cu to dielectric adhesion strength of such a line would not be sufficient to prevent peeling off during manufacture and after heat treatment.
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ASTM MNL28 - Manual on Coating and Lining Methods for Cooling Water Systems in Power Plants
Cathodic protection systems on steel and cast iron surfaces are commonly utilized in the submerged zone, and can further reduce the corrosive process, however, protective coatings, when used, must have sufficient dielectric strength and adhesion to withstand cathodic disbondment forces.
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Chapter 2: Intake and Discharge Structures
Cathodic protection systems on steel and cast iron surfaces are commonly utilized in the submerged zone, and can further reduce the corrosive process, however, protective coatings, when used, must have sufficient dielectric strength and adhesion to withstand cathodic disbondment forces.
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Materials Handbook: An Encyclopedia for Managers, Technical Professionals, Purchasing and Production Managers, Technicians, and Supervisors, Fifteenth Edition ...
Electrical varnishes are likely to be silicone, epoxy, or polyester resins that give good dielectric strength and adhesion .