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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ? Available in various thicknesses from 0.3 to 10.0 mm. ? Highly
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 9
- Dielectric Strength: 2.03E-4 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ? Available in various thicknesses from 0.3 to 10.0 mm. ? Highly
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 7
- Dielectric Strength: 2.03E-4 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice
- Applied Thickness / Gap Fill: 0.0197 to 0.3937 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 12 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice
- Applied Thickness / Gap Fill: 0.0197 to 0.3937 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 15 kV/in
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: Thermally conductive silicone pad is a kind of thermally conductive medium, which is used to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat dissipation device. It is specially produced for the design scheme of
- Backing: Plastic / Polymer, Silicone
- Performance Features: Other, Dielectric / Insulating, Electrically Conductive, Anti-static / ESD Control
- Temperature Resistance: -40 to 200 C
- Thickness: 0.0118 to 0.2362 inches
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to 5.0 mm
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Dielectric Strength: 2.03E-4 kV/in
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ? Available in various thicknesses from 0.3 to 10.0 mm. ? Highly
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 5.6
- Dielectric Strength: 1.27E-4 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800C-s is made of non-silicon resin material. No low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. N800C-s can have low thermal resistance and high thermal conductivity.
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 203 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
- Applied Thickness / Gap Fill: 0.0197 to 0.3937 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics, Semiconductors / IC Packaging
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Supplier: Henkel Corporation - Electronics
Description: Poly-Pad 400 is a fiberglass-reinforce d insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone
- Compound Type: Electrically Conductive, Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Electronics
Description: Poly-Pad 1000 is a fiberglass-based insulator coated with a filled polyester resin. The mterial offers superior thermal resistance for high performance applications. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone
- Compound Type: Electrically Conductive, Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP 1416, a highly thermally conductive, electrically insulating silicone elastomeric material BERGQUIST® SIL PAD TSP 1416 is a highly thermally conductive, electrically insulating silicone elastomeric material. Excellent cut-through
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1.6 W/m-K
- Use Temperature: 76 to 356 F
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP PAD TGP 1500, Thermally Conductive, Un-Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1.5 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP PAD TGP 1000VOUS, Ultra Conformable, Thermally Conductive Material for Filling Air Gaps BERGQUIST® GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: American Floor Mats
Description: . Resistivity up to 500,000,000 Ohms This three-layer material has a conductive scrim sandwiched between two layers of vinyl. This provides excellent electrical properties. FOR MAXIMUM EFFECTIVENESS, ground the mat using our Wrist Grouding Cord and ground the worker with our Wrist
- Features: Conductive
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Supplier: Henkel Corporation - Electronics
Description: Poly-Pad K-10 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2°C-in2/W as well as excellent dielectric strength. Polyeste- based, thermally conductive insulators
- Compound Type: Electrically Conductive, Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Electronics
Description: Poly-Pad K-4 is a composite of film coated with a polyester resin. The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of material for
- Compound Type: Electrically Conductive, Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Ohmite Manufacturing Co.
Description: Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation
- Chemical / Polymer System Type: Specialty / Other
- Coeff. of Thermal Expansion (CTE): 15 µin/in-F
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
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Supplier: R. S. Hughes Company, Inc.
Description: 3M 5589H-15 gray / white conductive pad comes in a 240 mm width, 20 m length and is packaged 1 roll per case. Can be used in the following temperature range: +194 F to +212 F. Many tape products can have either conductive or insulating properties which are used across a variety
- Dielectric Strength: 2.10E7 V/m
- Thickness: 0.0600 inches
- Type: Electrical
- Width: 9.45 inches
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Supplier: R. S. Hughes Company, Inc.
Description: 3M 5589H-10 gray / white conductive pad comes in a 240 mm width, 20 m length and is packaged 1 roll per case. Can be used in the following temperature range: +194 F to +212 F. Many tape products can have either conductive or insulating properties which are used across a variety
- Dielectric Strength: 2.10E7 V/m
- Thickness: 0.0400 inches
- Type: Electrical
- Width: 9.45 inches
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Supplier: R. S. Hughes Company, Inc.
Description: 3M 5519 conductive pad comes in a 210 mm width, 155 mm length, uses a silicone adhesive and is packaged 20 per case. Can be used in the following temperature range: +302 F to +320 F. Many tape products can have either conductive or insulating properties which are used across a
- Adhesive: Silicone, Specialty / Other
- Dielectric Strength: 1.50E6 V/m
- Thickness: 0.0800 inches
- Type: Electrical
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Supplier: Ellsworth Adhesives
Description: Bergquist Hi-Flow 650P Thermally Conductive Polyimide Pad that is used as an insulated barrier between electrical devices and the heat sink. It offers high temperature reliabililty, dielectric strength, and cut-through resistance. 11 in x 12 in, 0.0055 in thick.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Elongation: 40 %
- Tensile Strength (Break): 7000 psi
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Supplier: RS Components, Ltd.
Description: The pen contains a silver loaded polymer which can be used to repair faulty tracks, link components, make smooth jumpers and shield delicate electronics. Easy to make instant conductive silver traces. Can be used on both rigid and flexible materials, including key pads, circuit film,
- Compound Type: Electrically Conductive
- Material Form: Specialty / Other
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Supplier: Xoxide
Description: ultimately much more effective.) Not Electrically Conductive: Arctic Silver 5 was formulated to conduct heat, not electricity. (While much safer than electrically conductive silver and copper greases, Arctic Silver 5 should be kept away from electrical traces,
- Compound Type: Thermally Conductive
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Supplier: MacDermid Alpha Electronics Solutions
Description: Ultra-low stress, thermally conductive die attach for high-power, exposed pad semiconductor applications. Product Overview ATROX® 800HT6B: Conductive die attach paste providing a balance of thermal conductivity and mechanical flexibility for stress-sensitive components.
- Compound Type: Electrically Conductive, Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Material Form: Die Bonding Adhesive / Compound
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Supplier: Fujipoly® America Corp.
Description: : Conductive Type EMI/RFI shielding Electrostatic discharge Electrical, electronic and general use Over-moldings, pottings Die-cut gasket Replacement of custom insulator pads Insulation Type Two profiles are
- Adhesive: Specialty / Other
- Backing: Rubber, Silicone
- Performance Features: UV / Weather Resistant, Electrically Conductive, EMI / RFI Shielding, Anti-static / ESD Control, Permanent, Protective Tape
- Temperature Resistance: -45 to 250 C
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Supplier: Power Amp Design
Description: selectable external compensation tailors the amplifier’s response to the application requirements. Four-wire current limit is built-in. The amplifier circuitry is built on a thermally conductive but electrically insulating substrate. No BeO is used in the PAD111. The resulting
- CMRR: 98 to 106 dB
- Gain-Bandwidth Product (GBW): 6 MHz
- Input Bias Current (IBIAS): 1.00E-4 µA
- Input Impedance (Zi): 100000 Mohms
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Supplier: Power Amp Design
Description: selectable external compensation tailors the amplifier’s response to the application requirements. Four-wire current limit is built-in. The amplifier circuitry is built on a thermally conductive but electrically insulating substrate. No BeO is used in the PAD108. The resulting
- CMRR: 98 to 106 dB
- Gain-Bandwidth Product (GBW): 10 MHz
- Input Bias Current (IBIAS): 1.00E-4 µA
- Input Offset Voltage (VOS): 1 to 3 millivolts
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Supplier: RS Components, Ltd.
Description: Gap Pad® 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad® 2200SF is reinforced for
- Material Type: Pad
- Thermal Conductivity: 2 W/m-K
- Use Temperature: -76 to 257 F
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Supplier: UL Standards & Engagement
Description: anesthetic-air mixtures. These products provide an electrically conductive path from other electrically conductive objects and patients to ground. 1.2 The products covered by this standard include bonding appliances, casters, anesthesia face masks and anesthesia reservoir
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Supplier: Adhesive Applications
Description: EMI/RFI applications, ESD pads, and flexible circuits, SCT20 offers excellent conformability. Bonds well to silicone foam, plastics, metals, glass, and composites as well as a wide range of other materials. Electrically conductive transfer adhesive Bonds well to low surface
- Adhesive: Pressure Sensitive (PSA), Silicone
- Peel Strength / Adhesion: 2 lbs/in
- Temperature Resistance: -40 to 260 C
- Thickness: 0.0020 inches
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Supplier: Saint-Gobain Tape Solutions
Description: ThermaCool R10404 series is a thermally conductive closed-cell silicone sponge rubber. This material offers thermal conductivity, electrical isolation and compression set resistance (vibration absorption). R10404 is the superior choice for battery pack gap filling, optimizing the
- Features: Color Options
- Material: Foam, Silicone Rubber
- Operating Temperature: -79.6 F
- Thickness: 0.0315 to 0.2520 inch
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Supplier: ASTM International
Description: 1.1 This standard practice describes standard procedures for using a conductive geotextile with electrical methods to locate leaks in exposed geomembranes and geomembranes covered with water or earth materials containing moisture. 1.2 This standard practice provides guidance for the
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Supplier: Richardson RFPD
Description: GORE-SHIELD® SMT EMI Gaskets are electrically conductive EMI gasket building blocks. They are comprised of a conformable electrically conductive gasket material bonded to a thin, solderable metal support layer via an electrically conductive adhesive. The
- Thickness: 0.0787 inch
- Width: 0.1260 inch
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safety of the heating system. Thermal silicone pads, composed of a silicone matrix and thermally conductive fillers, are flexible thermal interface materials known for their excellent heat conduction, high-temperature resistance, and electrical insulation. Their (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
As electric vehicles become more prevalent, wireless charging technology has garnered widespread attention. However, the persistent issue of heat generation during wireless charging has long troubled the industry. Thermal conductive silicone pads, with their superior thermal conductivity and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
When pressure is applied to the top layer of the membrane switch circuit, it flexes through the punched openings of the spacer to establish electrical contact between conductive pads of the upper and lower sheets, momentarily closing the membrane switch circuit. When pressure is released from (read more)
Browse Industrial Keypads Datasheets for Flexible Circuit Technologies, Inc. -
. Introduction of the gold fingers A PCB case will have graphics cards installed in the slots when you open it. These PCB assemblies have a clean row of PCB pads along the edge that is both long and thin. Because the conductive pads utilized for connection in the rectangular row of PCB (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
design, black aluminum oxide can absorb and reflect electromagnetic waves while maintaining electrical insulation, achieving effective electromagnetic interference (EMI) shielding. It not only prevents internal signals from leaking out but also guards against external interference waves, ensuring (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd.
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Flip Chip Packaging Underfill Bonding Adhesive Die Attach And Its Advantages
Flip chip is a method used to attach die. In this attachment method, the electrical connections between substrate and the chip are directly made through the inversion of the die with face down onto the package. Conductive bumps are used to electrically, mechanically, and physically connect bond
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What is a PCB Connector?
A ‘PCB†TM or Printed Circuit Board connects electrical components on a conductive track or between pads on the board. Some devices hold more than one PCB and will utilise a variety of equipment to build a connection between the boards. PCB connectors are mounted on the PCB and are typically
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HDPE Geomembranes in Geotechnics
An electrically conductive pad is placed on top of the geomembrane and a high voltage source is connected to the pad and to a metal broom, which is then swept gradually over the whole sur- face of the geomembrane (Fig. 11.8).
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Electromagnetic shielding
An electroconducting block in the quasistationären magnetic field with frequency) increasing of a) after c.
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Mechanisms and Mechanical Devices Sourcebook, Fifth Edition > NEW DIRECTIONS IN MECHANICAL ENGINEERING
During surface micromachining, electrically conductive pads and conductive paths are deposited by selective plating of gold or other suitable metal on the substrate to connect the power source to the commutator segments of the stator.
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A Guide to Polymeric Geomembranes
electrically conductive pad hole in geomembrane battery .
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Encyclopedia of Smart Materials 2 Volume Set Complete Document
Flux is a chemical that is commonly used to en- hance the ability of the solder alloy to form a good in- termetallic joint with electrically conductive pads such as copper and gold by increasing the mutual solubility of the solder alloy …
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Fundamentals of Microsystems Packaging > INTRODUCTION TO MICROSYSTEMS PACKAGING
The second interconnection is typically achieved by means of solder bonding between the lead frame of the first-level package and electrically conductive pads on the second-level package, which is typically a “card” or “board.” .