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Supplier: Techsil Limited
Description: Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primer less adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics
- Features: Electrically Conductive
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Supplier: Techsil Limited
Description: Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features Low volume resistivity Thixotropic paste Solvated Excellent adhesion to many substrates Application SEMICOSIL® 979 EC is an electrically conductive adhesive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing, Reactive / Moisture Cured
- Elongation: 200 %
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: Techsil® Zemrex C200 is a semi-conductive paste silicone adhesive which offers primer less adhesion to a range of substrates including many metals, plastics and glass. Zemrex C200 uses a moisture vapor cure system, which release an acetic vapor from the sealant surface during
- Compound Type: Electrically Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE SI 5421, Silicone, Bonding or Gasketing, Flexible, Formed-in-place, Electrically Conductive Adhesive LOCTITE® SI 5421 is used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures. It cures to make a flexible, formed-in-place, electrically
- Cure Type / Technology: Single Component System, RTV / Room Temperature Curing
- Thermal Conductivity: 0.8100 W/m-K
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Description: providing shock absorption. ? High electrical insulation, with dielectric strength up to 8 kV/mm. ? Excellent flame resistance, achieving a UL94 V-0 rating. ? Curing time adjustable based on temperature. ? Two-component structure for easy storage. ? Can
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 6.5
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: also used as a sealant and adhesive for assembly and repair of industrial furnaces, ovens, boilers, exhaust stacks, high temperature ducting, and heating elements in electrical appliances. This product is typically used in applications with an operating range of -50 °C to +250 °C and
- Cure Type / Technology: Single Component System, RTV / Room Temperature Curing
- Viscosity: 73500 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 59C, Silicone, Heat cure LOCTITE® ABLESTIK 59C adhesive is designed for applications used at high temperatures which require electrical conductivity and do not need a high bond strength. It can be used in its cured or uncured state. LOCTITE ABLESTIK 59C can be used
- Cure Type / Technology: Single Component System, Contact / Pressure Sensitive (PSA)
- Use Temperature: 67 to 500 F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive Reworkable Unfilled
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System
- Substrate / Material Compatibility: Metal
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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Description: Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent adhesive output
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Description: Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Description: . ? Free from siloxane and the risk of silicone oil bleed. ? Self-adhesive for easy application and rework. ? Exceptional tensile strength and abrasion resistance. ? Customizable die-cut shapes to meet specific customer needs. ? Excellent electrical
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 70 %
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Supplier: Master Bond, Inc.
Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Coeff. of Thermal Expansion (CTE): 77.78 to 94.44 µin/in-F
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
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Supplier: ThreeBond International, Inc.
Description: conductive filler. They are used to connect various electrical contacts and for conduction. Silver, nickel, carbon, etc. are used as the electro-conductive fillers, and epoxy resin, urethane resin, silicone resin, and synthetic rubber are used as binders. With different
- Features: Electrically Conductive, Filled
- Industry: Automotive, Electronics
- Substrate / Material Compatibility: Rubber / Elastomer
- Viscosity: 41000 cP
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Description: The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m·K. ? High bonding performance. ? Good stability, long
- Chemical / Polymer System Type: Silicone
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Elongation: 90 %
- Features: Electrical Insulation / Dielectric Material
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Supplier: Techsil Limited
Description: Techsil RTV 1084G is a non-corrosive, 1-part, grey silicone rubber. RTV 1084 G has amazing thermal conductivity (2.3 W/mK) and is non corrosive, fast skinning with low linear shrinkage. It is one of a new family of products called acetone cure sealants that are solvent free. It
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive
- Industry: Electronics, OEM / Industrial
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System
- Features: Electrical Insulation / Dielectric Material
- Thermal Conductivity: 2.31 W/m-K
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.78 µin/in-F
- Compound Type: Encapsulating / Potting, Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.9
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Supplier: Master Bond, Inc.
Description: MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal
- Applied Thickness / Gap Fill: Over 1 inch
- Compound Type: Encapsulating / Potting, Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Specialty / Other
- Dissimilar Substrates: Yes
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Description: The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m·K. ? High bonding performance. ? Good stability, long
- Compound Type: Thermal Compound / Heat Conductive
- Industry: Electronics
- Thermal Conductivity: 1 W/m-K
- Use Temperature: -58 to 392 F
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass,
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System
- Features: Electrical Insulation / Dielectric Material
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity
- Applied Thickness / Gap Fill: 0.0039 to 0.0591 inch
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 254 kV/in
- Features: Gap Filling Sealant / FIP Gasket, Thermal Compound / Interface (Thermally Conductive)
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Supplier: Master Bond, Inc.
Description: Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing, Reactive / Moisture Cured
- Dielectric Constant (Relative Permittivity): 4.2
- Dielectric Strength: 850 kV/in
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electroni c encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Hardener, 1 gal Pail.
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 599 kV/in
- Tensile Strength (Break): 50 psi
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electroni c encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Resin, 1 gal Pail.
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 599 kV/in
- Tensile Strength (Break): 50 psi
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty2-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 5.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It also can overcome
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 305 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, OEM / Industrial
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800C-s is made of non-silicon resin material. No low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. N800C-s can have low thermal resistance and high thermal conductivity.
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 203 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive)
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 203 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive)
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Supplier: Wacker Chemical Corp.
Description: Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating. Application WACKER® SILICONE PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 3.5
- Dielectric Strength: 254 kV/in
- Features: Electrical Insulation / Dielectric Material
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Dow DOWSIL™ 844 RTV Silicone Adhesive-Sealant is a one-part, fast cure, RTV adhesive useful in automated or manual dispensing systems. It is ideal for the sealing of modules and multi-component assemblies; or for formed-in-place gasketing. This non-flowing adhesive has high (read more)
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components and impart gloss, shine and water repellence to aftermarket car care products. They can be used under the bonnet, on the drive train, in the cabin and on the bodywork in both conventional and electric & hybrid vehicles of all types. Silicone product types include, adhesives, sealants (read more)
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CHT have formulated these neutral cure 1-part RTV silicone adhesive sealants specifically to meet the high performance standards of MIL-A-46146B, to withstand the most demanding physical conditions. They are neutral cure so they do not give off any harmful by-products making them ideal for use (read more)
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, electrical insulation, environmental protection, vibration control and thermal transfer. Industries: Electronics, automotive, aerospace, LED and lighting, domestic appliances. Finding the right silicone for your application is not limited to CHT’s (read more)
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CHT's Silicone Adhesives remain flexible across a wide range of temperatures and operating conditions and are resistant to moisture and many chemicals. These silicone adhesives feature different crosslinking systems and will support various technical requirements. Being particularly (read more)
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Silicones With Optical Clarity CHT’s series of optically clear silicones can be used to bond glass and plastics to flat screen panel and LCD displays and feature high refractive indices to provide contrast enhancement that yields high resolution. For LED (read more)
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sections. This silicone has excellent flexibility, with an elongation of 150-250% at room temperature, a Shore A hardness of 35-45 and a low tensile modulus of 100-175 psi at 75°F for stress relief. It is capable of withstanding rigorous thermal cycling and shock without cracking or exerting stress on components. Additionally, MasterSil 323 has a low dielectric constant of 2.8 at 75°F, 1 MHz. (read more)
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Master Bond MasterSil 323S-LO is an addition cured silicone that is electrically and thermally conductive.
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Why are silicones used in LED & Lighting applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life (read more)
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Indicates content that may require registration and/or purchase.
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Reassessment of degradation mechanisms in anodic tantalum oxide capacitors under high electric fields
For the anodization, a Cu belt (5 mm wide, 50 mm long) was attached to the tantalum with electrically conductive adhesive and then sealed against electrolyte ingress with acid-resistant silicone sealant on the edge of each Ta film used as working …
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Performance of different types of time domain reflectometry probes for water content measurement in partially saturated rocks
An electrically conductive room temperature-vulcanized adhesive sealant SSP-779-Silver (Specialty Silicone Prod- ucts Inc., New York, volumetric resistivity = 0.01 Wcm, hereinafter referred to as conductive silicone) was used to fill the gaps.
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Two Part Silicones - Properties of Two Part Silicone Adhesives, Sealants, and Coatings by Master Bond
Thermally conductive silicone adhesive (thermal conductivity of 1.5 Watts/meter Kelvin), electrically isolating adhesive/ sealant .
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Polymers In Solar Modules
Koemmerling Chemische Fabrik compared moisture vapour transmission rates of silicone and polyisobutylene (PIB) and found that PIB was … … it="" is="" used="" in="" sealants ,="" and="" thermoset … … roofing="" membranes.="" electrically - conductive ="" adhesives="" are …
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http://dspace.mit.edu/bitstream/handle/1721.1/72887/808382690-MIT.pdf?sequence=2
… Moisture curable silylated polymer containing free polyols for coating, adhesive and sealant application Method for production of high solids silicone resin coating solution Cyclic … … quartz using deuterium Thermal conductive silicone composition Silane compositions … … Thermal conductive material utilizing electrically conductive Silica-rubber mixtures …
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Silicone Surface Science
In cases such as thermally or electrically con- ductive silicones , the structure of these dispersed interfaces can be critical to bulk performance. Even with adhesives and sealants , a reinforcing silica filler can act to absorb significant quantities of adhesion …
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Thermal Management for LED Applications
This is an important factor that is determined in part by factors which include: – Presence of silicone oils or other constituents which may tend to dissipate … … flake or decay or to shed particles, especially if electrically conductive , as may occur with … … which may be required to form a fillet or to act as a sealant or which must …
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Products and Literature (August 2008)
CONDUCTIVE EPOXY Flexible bonding Henkel Corp., Rocky Hill, Conn., introduces the Terostat 7100 Adhesive/ Sealant and Terostat 7700, which are designed for wide range of flexible metal bonding applications. These one-component, odorless adhesives are non-corrosive and free of solvents, isocyanates, silicones , and PVC. http://www.henkelna. com/industrial Epoxies, Cranston, R.I., introduces 40-3910, a new one-component electrically conductive epoxy adhesive that forms strong bonds while providing excellent …
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Conductive sealing compound provides corrosion resistant EMI shielding
Chomerics Europe, a division of Parker Hannifin Corporation, has introduced a new corrosion resistant, electrically conductive sealant . CHO-BOND 1016 is a single component RTV silicone filled with nickel-plated graphite particles.
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Advanced Materials for Thermal Management of Electronic Packaging
Silicones are becoming more popular for their use as sealants , elastomers, adhesives, paints, conformal coatings, encapsulants and interface materials due to their thermal stability and low modulus which can protect the components within the microelectronic package. … unique properties such as thermal stability in extreme temperatures, Tg typically less than À115 C, low modulus, low shrinkage (<1%), dielectric strength about 500 V/mil (0.001 in.) or 20 kV/mm, versatile usage configurations (optically clear, thermally conductive , electrically conductive, silica filled).