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  • Description: that analyzes X-rays generated by the bombardment of the sample by an electron beam. EDS elemental analysis is fully embedded into the Phenom ProX system. X-ray detector and control software are combined in one package. This Elemental Identification (EID) software package allows

    • Applications: Semiconductor Wafers, CVD / PVD Films, Packaged ICs / Ceramic Substrates
    • Area Mapping: Yes
    • Measurement Capability: Composition, Critical Dimension / Trench Geometry, Defects / ADC, Particle Contamination
    • Mounting / Loading: Manual Loading

  • Description: The FC-4400A represents our largest scale design lift off oriented evaporation and our ultimate high throughput platform. This system is designed to support the metallization of thirty 6 inch wafers per load via high capacity e-beam evaporation. The load locked, 44 inch x 44 inch x 28

    • Applications & Materials Processed: Research / Surface Analysis
    • Gas Control Unit: Yes
    • High Vacuum Pump Type: Cryogenic / Cryosorption
    • Integral Process Controller: Yes

  • Description: The BJD-2000 & FC-2000 are our latest PVD tools for small production or R&D. These flexible evaporation systems accept a multitude of accessories to meet almost any requirement. The BJD-2000 is identical to the FC-2000 but without the load lock feature. Engineered for efficient

    • Applications & Materials Processed: Research / Surface Analysis
    • Coating System Type: Batch System (Single Chamber / Multiple Wafers)
    • Gas Control Unit: Yes
    • High Vacuum Pump Type: Cryogenic / Cryosorption

  • Description: The FC-3800, our latest large-scale evaporator, enables rapid processing of 6 inch diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 6 inch diameter wafers for lift off or thirty-six 6 inch wafers for step coverage. The 38

    • Applications & Materials Processed: Research / Surface Analysis
    • Gas Control Unit: Yes
    • High Vacuum Pump Type: Cryogenic / Cryosorption
    • Integral Process Controller: Yes

  • Description: Static and Dynamic SIMSAuger Electron SpectroscopyIon Beam SputteringSurface Science StudiesRastering / Depth Profiling

    • Applications: Semiconductor Wafers, CVD / PVD Films
    • Area Mapping: Yes
    • Depth Profiling: Yes
    • Measurement Capability: Defects / ADC

  • Description: The newly designed BCD-2800 provides an upgrade and improvement option for customers processing requirements formerly filled by our VES-2550 load lock evaporation system. This mid-sized system offers tooling options that support either lift off or conformal (step coverage) processes,

    • Applications & Materials Processed: Research / Surface Analysis
    • Coating System Type: Batch System (Single Chamber / Multiple Wafers)
    • Gas Control Unit: Yes
    • High Vacuum Pump Type: Cryogenic / Cryosorption


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