Epoxy Cure Catalysts

Description: ThermostripTM DC is a highly accurate heat indicator designed for use within a drying, curing, laminating or bonding process. The individual strip has 5 temperature settings that when exposed to heat will permanently change color from silver to black Indicating attained temperature Attach to the

• Indicating Temperature: 14 to 156.2 F
• Type: Ink
• Industry: OEM / Industrial

Description: Henkel Loctite Catalyst 43, formerly Emerson and Cuming, is a low temperature curing, epoxy hardener that offers low viscosity, non-staining properties, and high temperature resistance. 1 lb Bottle.

• Applications: Adhesives / Sealants, Elastomers / Rubbers, Plastics / Composites
• Function: Catalyst
• Form & Features: Liquid / Solution

Description: Henkel Loctite Catalyst 11 Brown, formerly Emerson and Cuming, is a general purpose, low viscosity, elevated temperature curing epoxy hardener that offers resistance to chemicals and thermal shock. 4 oz Bottle.

• Applications: Adhesives / Sealants, Elastomers / Rubbers, Plastics / Composites
• Function: Catalyst
• Form & Features: Liquid / Solution

Description: Henkel Loctite Catalyst 14 White, formerly Emerson Cuming, is a high temperature curing, powdered epoxy hardener that offers a long pot life, high temperature performance, and chemical resistance. 1 lb Can.

• Applications: Adhesives / Sealants, Elastomers / Rubbers, Plastics / Composites
• Function: Catalyst
• Form & Features: Liquid / Solution

Description: Henkel Loctite Catalyst 11 Brown, formerly Emerson and Cuming, is a general purpose, low viscosity, elevated temperature curing epoxy hardener that offers resistance to chemicals and thermal shock. 1 lb Bottle.

• Applications: Adhesives / Sealants, Elastomers / Rubbers, Plastics / Composites
• Function: Catalyst
• Form & Features: Liquid / Solution

Description: GP Chemicals has a line of phenolic novolac resins for use as curing agents for epoxy resins in various industrial applications and cure accelerators that promote rapid cure in resins for use in FRP composite applications.

• Function: Curing Agent ( Hardener / Curative)
• Applications: Plastics / Composites, Wood Products

Description: 20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652 is easily machined and exhibits outstanding adhesion to metals, ceramics and plastics. When cured with Catalyst

• Use Temperature: -85 to 320 F
• Thermal Conductivity: 0.66344834 W/m-K
• Tensile Strength (Break): 9,000 psi
• Dielectric Strength: 449.9999999999993 kV/in

Description: fast curing is desired.DYTEK® DCH-99 Amine (1,2-Diaminocyclohexane)DYTEK® DCH-99 amine is valuable in the curing of epoxy coatings, composites, and in polyurethanes and polyureas. In coatings, DYTEK® DCH-99 amine is suitable for use in epoxy-based flooring coatings, industrial

• Applications: Adhesives / Sealants
• Function: Catalyst, Initiator

Description: Two-part permanent inks for circuit board legends and markings, available in a wide variety of colors. Product Overview ENTHONE 50-Series Cat L Inks are permanent, two-component epoxy-based screen printing inks designed for use with various catalysts that cure at either elevated

• Industry: Electronics

Description: HYSOL STYCAST 2850KT with CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arcing or tracking is a concern.

• Use Temperature: -40 to 266 F
• Thermal Conductivity: 2.68 W/m-K
• Viscosity: 174,000 cP
• Industry: Electronics (PCB / SMT Assembly)

Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose

• Thermal Conductivity: 1.31247389 W/m-K
• Coeff. of Thermal Expansion (CTE): 15.222222222222221 µin/in-F
• Dielectric Strength: 369.99999999999903 kV/in
• Dielectric Constant (Relative Permittivity): 5.41

Description: HYSOL STYCAST 2651MM CATALYST 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.

• Use Temperature: -40 to 266 F
• Thermal Conductivity: 0.6 W/m-K
• Viscosity: 14,000 cP
• Industry: Electronics (PCB / SMT Assembly)

Description: (Known as Hysol ECCOBOND 45-Catalyst 15 ) A two component, room temperature curing, variable flexibility epoxy adhesive.

• Industry: Electronics
• Cure / Technology: Two Component System

Description: for faster cures. Shrinkage upon cure is 2-3%, substantially lower than that exhibited by most free radical types of UV curable compositions. UV16 can be used over the exceptionally wide temperature range of -60°F to 300°F. UV16 will cure in thicknesses up to .125 of an inch. A

• Viscosity: 120 to 150 cP
• Use Temperature: -60 to 300 F
• Thermal Conductivity: 0.029 W/m-K
• Coeff. of Thermal Expansion (CTE): 33 µin/in-F

Description: for faster cures. Shrinkage upon cure is 2-3%, substantially lower than that exhibited by most free radical types of UV curable compositions. UV16 can be used over the exceptionally wide temperature range of -60°F to 300°F. UV16 will cure in thicknesses up to .125 of an inch. A

• Operating / Use Temperature: -60 to 300 F
• Resistivity: 1,600,000,000,000,000 ohm-cm
• Industry: Automotive, Electronics, Marine, Military Specification, OEM / Industrial
• Substrate: Ceramic / Porcelain, Glass, Metal, Plastic, Wood

Description: This specification covers thermoset plastics based on diglycidyl ethers of bisphenol A and amino functional curing agents or amine catalysts for implantable epoxy electronic encapsulants. Encapsulants shall be classified depending on contact with tissues or physiological fluids.

Description: of epoxy plastics as a class has not been established. Epoxy plastic is a generic term relating to the class of polymers formed from epoxy resins, certain curing agents or catalysts, and various additives. Since many compositions and formulations fall under this class, it

Description: electromagnetic shielding effectiveness are readily formed which are highly resistant to weathering, abrasion, humidity and corrosion. Master Bond Polymer Systems X5N Nickel, X5G Graphite and X5SC Silver one component electrically conductive adhesive/sealants cure readily at ambient

• Operating / Use Temperature: -80 to 300 F
• Form: Liquid
• Features: Protective
• Chemistry: Resin Base / Polymer Binder, Rubber / Elastomer Based

Description: Epoxy curing agent, polyimide, polyamide, and polyurethane(polyurea),Heat-resistant epoxy resin for a curing agent

Description: 45 can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. General purpose Easy mix ratio Extremely flexible Variable

• Viscosity: 37,000 cP
• Coeff. of Thermal Expansion (CTE): 33.333333333333336 µin/in-F
• Substrate Compatibility: Ceramic / Glass, Metal, Plastic
• Chemical System: Epoxy (EP)

Description: (Known as STYCAST 2651-40 ) LOCTITE STYCAST 2651-40 is a filled, general purpose, dielectric grade epoxy encapsulant. It is a lower viscosity version of STYCAST 2651. It has excellent adhesion to a wide variety of substrates and excellent electrical properties. It can be cured with

• Use Temperature: -103 to 347 F
• Thermal Conductivity: 0.5 W/m-K
• Viscosity: 5,000 cP
• Industry: Electronics (PCB / SMT Assembly)

Description: 2651-40 W 1 can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. Low viscosity Room temperature cure capability

• Viscosity: 33,000 cP
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: CAT 9 can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. LOCTITE ABLESTIK 56C CAT 9 passes NASA outgassing standards.

• Use Temperature: 76 to 248 F
• Substrate Compatibility: Ceramic / Glass, Metal, Plastic
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: Product Overview ENTHONE M-Series Inks are permanent, two-component, epoxy-based transfer marking inks designed for use with a selection of catalysts that cure at elevated and/or room temperatures. When properly applied and cured, they offer excellent adhesion to glass, metal,

• Industry: Electronics

Description: 50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and

• Use Temperature: -76 to 392 F
• Thermal Conductivity: 2.1634185 W/m-K
• Coeff. of Thermal Expansion (CTE): 14 µin/in-F
• Tensile Strength (Break): 9,850 psi

Description: CS 91 is a 100% Solids, Modified Epoxy sealing compound suitable for sealing and moisture proofing adhesive bonded structures when applied by injection, spatula or brushing. CS 91 consists of two parts, a base compound and a catalyst which when mixed together cure at ordinary

• Chemical System: Polysulfide

Description: inhibited and exhibits a desirably fast cure rate at ambient temperatures even in the presence of air. The superior performance profile of UV15LV is due to its exceptionally effective cationic catalyst curing mechanism. Post curing the UV15LV at 90° to 125°C for 30 minutes will give it

• Viscosity: 60 cP
• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.029 W/m-K
• Coeff. of Thermal Expansion (CTE): 44 µin/in-F

Description: Magna-Tac® M648T is a high-strength, room-temperature-curing, 100%-Reactive, two-component, formulated epoxy adhesive designed for bonding all metals and other rigid materials (such as glass, ceramics, plastics, plastic foams and structural laminates) to themselves and to each other. Fully

Description: and reinforcing Variable pot life with variable catalyst addition Ambient cure or heated postcure Excellent chemical resistance Time tested and proven technology RECOMMENDED USAGE Cor-Cote® VEN Vinyl Ester Novolac is used as a binder resin with select aggregate in self-leveling,

• Cure / Dry Temperature: 60 to 90 F
• Operating / Use Temperature: 60 to 90 F
• Industry: Automotive, Electronics, Food and Beverage, Marine, OEM / Industrial
• Dispensing Method: Brush / Roll-on

Description: components such as fillers or catalysts. Adhesives based on GENIOSIL® XB cure upon contact with humidity in the ambient air to form thermosets and attain hardness in the upper Shore D range. In terms of adhesive strength, these adhesives are making advances into what used to be the

• Viscosity: 2 cP
• Industry: Building / Construction
• Substrate Compatibility: Ceramic / Glass, Metal, Wood / Wood Product
• Chemical System: Silicone

Description: hydrocarbon and chlorinated solvents. The viscosity, processing and cure properties of our phenolic system often avoid the need for any special processing or equipment adjustments. Hand Lay-Up and Resin Transfer Molding (RTM) Several phenolic resins and acid catalysts are available for

• Filler: Aramid Fiber
• Type: Casting Resin, Thermoset
• Features: Composite Material
• Chemical System: Phenolics (Melamine, Furan)