Epoxy Cure Catalysts

Description: . In addition, GP Chemicals has a line of phenolic novolac resins for use as curing agents for epoxy resins in various industrial applications and cure accelerators that promote rapid cure in resins for use in FRP composite applications.

• Applications: Plastics / Composites, Wood Products
• Function: Curing Agent ( Hardener / Curative)

Description: Henkel Loctite Catalyst 15LV Clear, formerly Emerson and Cuming, is a room temperature curing, epoxy hardener that offers a long pot life, flexibility, low cost, and low toxicity. 1 lb Can.

• Applications: Adhesives / Sealants, Elastomers / Rubbers, Plastics / Composites
• Form: Liquid / Solution
• Function: Catalyst

Description: Henkel Loctite Catalyst 15LV Black, formerly Emerson and Cuming, is a room temperature curing, epoxy hardener that offers a long pot life, flexibility, low cost, and low toxicity. 1 lb Can.

• Applications: Adhesives / Sealants, Elastomers / Rubbers, Plastics / Composites
• Form: Liquid / Solution
• Function: Catalyst

Description: Henkel Loctite Catalyst 15 Clear, formerly Emerson and Cuming, is a high viscosity, room temperature curing, epoxy hardener that offers a long pot life, flexibility, low cost, and low toxicity. 8 lb Pail.

• Applications: Adhesives / Sealants, Elastomers / Rubbers, Plastics / Composites
• Form: Liquid / Solution
• Function: Catalyst

Description: Henkel Loctite Catalyst 9 Amber, formerly Emerson and Cuming, is a room temperature curing, epoxy hardener that offers excellent physical strength, low viscosity, low cost, and good chemical resistance. 1 lb Bottle.

• Applications: Adhesives / Sealants, Elastomers / Rubbers, Plastics / Composites
• Form: Liquid / Solution
• Function: Catalyst

Description: applications where fast curing is desired.DYTEK® DCH-99 Amine (1,2-Diaminocyclohex ane)DYTEK® DCH-99 amine is valuable in the curing of epoxy coatings, composites, and in polyurethanes and polyureas. In coatings, DYTEK® DCH-99 amine is suitable for use in epoxy-based

• Applications: Adhesives / Sealants
• Function: Catalyst, Initiator

Description: ThermostripTM DC is a highly accurate heat indicator designed for use within a drying, curing, laminating or bonding process. The individual strip has 5 temperature settings that when exposed to heat will permanently change color from silver to black Indicating attained temperature Attach to

• Indicating Temperature: 14 to 156 F
• Industry: OEM / Industrial
• Type: Ink

Description: due to its exceptionally effective cationic catalyst curing mechanism. Post curing the UV16 at 90° to 125°C for 30 minutes will give it a glass transition temperature over 125°C, far higher than conventional type UV systems. This post cure is also effective in enhancing

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): Over 33 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.76
• Dissimilar Substrates: Yes

Description: 20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652 is easily machined and exhibits outstanding adhesion to metals, ceramics and plastics. When cured with

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Dielectric Constant (Relative Permittivity): 4.8

Description: Two-part permanent inks for circuit board legends and markings, available in a wide variety of colors. Product Overview ENTHONE 50-Series Cat L Inks are permanent, two-component epoxy-based screen printing inks designed for use with various catalysts that cure at either elevated

• Industry: Electronics

Description: HYSOL STYCAST 2850KT with CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arcing or tracking is a concern.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System
• Cure Type / Technology: Room Temp. Cure / Vulcanizing
• Industry: Electronics

Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 17.72 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System

Description: HYSOL STYCAST 2651MM CATALYST 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System
• Cure Type / Technology: Room Temp. Cure / Vulcanizing
• Industry: Electronics

Description: (Known as Hysol ECCOBOND 45-Catalyst 15 ) A two component, room temperature curing, variable flexibility epoxy adhesive.

• Cure Type / Technology: Two Component System
• Industry: Electronics

Description: due to its exceptionally effective cationic catalyst curing mechanism. Post curing the UV16 at 90° to 125°C for 30 minutes will give it a glass transition temperature over 125°C, far higher than conventional type UV systems. This post cure is also effective in enhancing

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Features: Protective
• Form: Liquid
• Operating / Use Temperature: -60 to 300 F

Description: ABLESTIK 45 can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. General purpose Easy mix ratio Extremely flexible

• Coeff. of Thermal Expansion (CTE): 33.33 µin/in-F
• Cure Type / Technology: Single Component System
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
• Viscosity: 37000 cP

Description: even in the presence of air. The superior performance profile of UV15TK is due to its exceptionally effective cationic catalyst curing mechanism. Post curing the UV15TK at 90° to 125°C for 30 minutes will give it a glass transition temperature over 125°C, far higher than

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 39 to 44 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.76
• Dissimilar Substrates: Yes

Description: superior performance profile of UV15FL is due to its exceptionally effective cationic catalyst curing mechanism. Post curing the UV15FL at 90° to 125°C for 30 minutes will give it a glass transition temperature over 120°C, far higher than conventional type UV systems. This post

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 42 to 47 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.81
• Dissimilar Substrates: Yes

Description: LOCTITE ABLESTIK 56C CAT 9, Epoxy, Assembly LOCTITE® ABLESTIK 56C CAT 9 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures

• Cure Type / Technology: Two Component System
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
• Use Temperature: 76 to 248 F

Description: Epoxy curing agent, polyimide, polyamide, and polyurethane(polyure a),Heat-resistant epoxy resin for a curing agent

Description: This specification covers thermoset plastics based on diglycidyl ethers of bisphenol A and amino functional curing agents or amine catalysts for implantable epoxy electronic encapsulants. Encapsulants shall be classified depending on contact with tissues or physiological fluids.

Description: LOCTITE STYCAST 2651-40 W1, Epoxy, Potting, Encapsulant LOCTITE® STYCAST 2651-40 W1 epoxy encapsulant is designed for general purpose applications and has excellent adhesion to a wide variety of substrates. When fully cured, the material is readily machined with carbide tools.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Viscosity: 33000 cP

Description: 1.1 These criteria cover thermoset plastics based on diglycidyl ethers of bisphenol A(DGEBPA) and appropriate curing agents or catalysts as opposed to thermoplastics based on epoxy structures. 1.2 These criteria are generic and are intended to provide definitions and a standard

Description: 1.1 This specification covers thermoset plastics based on diglycidyl ethers of bisphenol A and amino functional curing agents or amine catalysts. 1.2 The epoxy encapsulants covered by this specification are intended to provide a tissue-compatible protective covering for

Description: 1.1 These criteria cover thermoset plastics based on diglycidyl ethers of bisphenol A (DGEBPA) and appropriate curing agents or catalysts as opposed to thermoplastics based on epoxy structures. 1.2 These criteria are generic and are intended to provide definitions and a standard

Description: STYCAST 2850FT/Catalyst 23LV is recommended for encapsulation of components that require heat dissipation and thermal shock properties.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System
• Cure Type / Technology: Room Temp. Cure / Vulcanizing
• Industry: Electronics

Description: 20-3063 is an electronic grade potting and encapsulating compound. This epoxy system is designed for applications requiring an easy and affordable potting process. 20-3063 has an easy to use one to one mix ratio by weight or volume. The resin is pigmented black and the catalyst white

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Dielectric Strength: 450 kV/in
• Features: Encapsulanting / Potting

Description: easily wets out aggregate and reinforcing Variable pot life with variable catalyst addition Ambient cure or heated postcure Excellent chemical resistance Time tested and proven technology RECOMMENDED USAGE Cor-Cote® VEN Vinyl Ester Novolac is

• Chemistry: Epoxy, Resin Base / Polymer Binder, Vinyl, Other
• Cure / Dry Temperature: 60 to 90 F
• Features: Chemical / Oil Resistant, Heat Resistant / High Temperature, Other
• Form: Liquid

Description: . Fully cured bonds exhibit minimal shrinkage, are electrical insulators and provide excellent resistance to weather, galvanic action and most chemical, acids and alkalis. Magna-Tac® M648T may be used with Catalyst CH8 or CH16.

Description: CS 91 is a 100% Solids, Modified Epoxy sealing compound suitable for sealing and moisture proofing adhesive bonded structures when applied by injection, spatula or brushing. CS 91 consists of two parts, a base compound and a catalyst which when mixed together cure at ordinary

• Chemical / Polymer System Type: Polysulfide

Description: high-temperature requirements, phenolic resin systems have advantages over polyesters, epoxies, and vinyl esters. Cured phenolic resins from GP Chemicals are formulated to be inherently fire-resistant, demonstrate low smoke generation and high-temperature resistance. Phenolic FRP

• Chemical / Polymer System Type: Phenolics (Melamine, Furan)
• Compound Type: Casting Resin
• Filler Material: Aramid Fiber
• Material Type / Grade: Composite Material, Thermoset

Description: components such as fillers or catalysts. Adhesives based on GENIOSIL® XB cure upon contact with humidity in the ambient air to form thermosets and attain hardness in the upper Shore D range. In terms of adhesive strength, these adhesives are making advances into what used to be the

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Industry: Building / Construction
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Wood / Wood Product