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Description: LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable
- Thermal Conductivity: 1.6 W/m-K
- Features: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA 529WCG AERO is a modified epoxy film adhesive on a synthetic carrier that is used for bonding metal to metal and metal to honeycomb. It is designed for applications that require a wide service temperature range. It offers 100% solids, moderate tack, durability,
- Features: Epoxy (EP)
- Substrate Compatibility: Metal
- Cure / Technology: Single Component System
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Supplier: DuPont Electronics & Imaging
Description: Product Description DuPont™ Pyralux® GPL epoxy-based adhesive is part of our FPC total solution featuring low loss properties designed for high speed & high frequency applications in consumer electronics. With good processability and high thermal resistivity, Pyralux® GPL
- Coeff. of Thermal Expansion (CTE): 58.33333333333333 µin/in-F
- Tensile Strength (Break): 1,595.40523292917 psi
- Elongation: 222 %
- Dielectric Strength: 3,124.2000000000066 kV/in
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Supplier: Accuris
Description: Adhesive Film, Epoxy-Base for High Durability Structural Adhesive Bonding
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 517, Epoxy Film, Assembly LOCTITE® ABLESTIK 517 epoxy film adhesive is developed for microelectronic applications. This adhesive is not recommended for gold plated packages. Tack-free Non-conductive Low temperature cure
- Thickness: 0.001 inches
- Adhesive: Epoxy
- Features: Specialty / Other
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Supplier: SAE International
Description: This specification and its supplementary detail specifications cover film adhesives compounded from modified epoxy resins in the form of ready-to-use sheet, supplied in rolls, either supported by mat or by woven monofilaments or unsupported.
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Supplier: Accuris
Description: ADHESIVE, EPOXY FILM - HEAT CURING - CLINCH FLANGE
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Supplier: Accuris
Description: Unidirectional Carbon Fiber Tape Epoxy Repair Prepreg, Vacuum Curing Part 4 - Purchasing Specification for Film Adhesive
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Supplier: SAE International
Description: This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film, supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.
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Supplier: SAE International
Description: This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.
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Supplier: SAE International
Description: This specification covers a modified epoxy adhesive in the form of supported film supplied in rolls or sheets.
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Supplier: Accuris
Description: Adhesive Film, Epoxy-Base, High Durability for 175 Degrees C (350 Degrees F) Service
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Supplier: Win Source Electronics
Description: Mfr: TE Connectivity Aerospace, Defense and Marine Category: Fans, Thermal Management>Thermal>Adhesives, Epoxies, Greases, Pastes Packaging: Bulk Part Status: Obsolete Capacitance: 0.22μF Tolerance: ±20% Voltage - Rated: 1.3VDC Temperature Coefficient: Y6P Operating Temperature: -40°C ~ 85°C
- Capacitance Range: 0.22000000000000003 microF
- Capacitance Tolerance: 20 (+/- %)
- Packing Method: Bulk Pack
- Features: Other
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Description: 3M™ Scotch-Weld™ Structural Adhesive Film AF 147 is a thermosetting nonvolatile, modified epoxy film adhesive designed for bonding of honeycomb and metal to metal components where high strengths at 300°F (149°C) are required. Scotch-Weld AF 147 is a higher metal to
- Use Temperature: -67 to 300 F
- Industry: Aerospace, OEM / Industrial
- Features: Epoxy (EP), Other
- Substrate Compatibility: Metal
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Description: LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. High adhesion strength at
- Thermal Conductivity: 7 W/m-K
- Features: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Description: LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes Excellent
- Thermal Conductivity: 6.5 W/m-K
- Features: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Epoxies Etc...
Description: 10-3011 is a two component fast curing epoxy adhesive. This system provides a rapid cure in thin films and at low temperatures.
- Viscosity: 10,000 cP
- Tensile Strength (Break): 2,900 psi
- Dielectric Constant (Relative Permittivity): 3.5
- Features: Electrical Insulating / Dielectric, Epoxy (EP)
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Description: LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength over a wider temperature range than is normally
- Thermal Conductivity: 1.1 W/m-K
- Features: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 550, Epoxy Film, Assembly LOCTITE® ABLESTIK 550 adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during cure. Using LOCTITE ABLESTIK 550
- Thermal Conductivity: 0.2 W/m-K
- Dielectric Constant (Relative Permittivity): 0
- Features: Epoxy (EP)
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require
- Use Temperature: -100 to 400 F
- Thermal Conductivity: 1.442279 W/m-K
- Coeff. of Thermal Expansion (CTE): 0.00012222222222222221 to 0.000030555555555555554 µin/in-F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Kayaku Advanced Materials, Inc.
Description: Designed for cavity definition and capping in applications such as BAW, SAW, and microfluidic devices, these resists provide excellent alignment accuracy, low‑temperature processing, and high‑quality bond formation. Perminex adhesives enable patterning and bonding of wafers with high bond
- Applications: Electronics / Microelectronics
- Thick Film Type: Resistor
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Description: 3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3028 is a 250°F to 350°F (121°C to 176°C) curing, low density, expandable core splice adhesive film. Scotch-Weld AF 3028 adhesive was designed for filling mismatch areas or reinforcing and splicing honeycomb core.
- Applied Thickness / Gap Fill: 0.05 inch
- Use Temperature: -67 to 350 F
- Industry: Aerospace, OEM / Industrial
- Features: Epoxy (EP), Gap Filling Sealant / FIP Gasket, Other
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Description: 3M™ Scotch-Weld™ Lightning Strike Structural Adhesive Film AF 163 2LS is thermosetting, laminated metal foil films that adheres to cold and release coated tools.
- Industry: Aerospace, OEM / Industrial
- Substrate Compatibility: Composites
- Features: Epoxy (EP)
- Cure / Technology: Single Component System, Thermosetting / Crosslinking
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Description: Deepmaterial provide customized adhesive services on your demand, custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant,
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Supplier: Master Bond, Inc.
Description: Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration is recommended to maximize the shelf life. This
- Use Temperature: -100 to 400 F
- Thermal Conductivity: 1.442279 W/m-K
- Coeff. of Thermal Expansion (CTE): 0.00011111111111111112 to 0.000033333333333333335 µin/in-F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Optical Grade / Material, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 958-8C, Epoxy, Die Attach LOCTITE® ABLESTIK 958-8C is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metalizations or traditional printed circuit board surfaces Electrically conductive
- Viscosity: 22,000 cP
- Features: Epoxy (EP)
- Cure / Technology: Single Component System
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Supplier: Newport MKS
Description: The NOA-85S UV-curing adhesive is a clear, colorless, liquid photopolymer that will cure when exposed to ultraviolet light and or visible light, between 320 – 450 nm. Since it is a one part system and 100% solids, it offers many advantages in bonding where the adhesive can be exposed
- Features: Epoxy (EP)
- Cure / Technology: UV / Radiation Cured (also EB, Light)
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Supplier: Boyd
Description: identify what PSA or adhesive is best for an application, like mating substrate polymer type, surface contact, dwell time or potential environmental exposures. The success or failure of an adhesive is much more dynamic than simply the strength of the adhesive. Boyd is an
- Adhesive: Acrylic, Epoxy, Rubber, Silicone, Transfer
- Backing: Acrylic / Acrylate, Plastic / Polymer
- Features: Double-Sided Adhesive
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,
- Use Temperature: 221 to 500 F
- Thermal Conductivity: 1.03844088 to 1.38458784 W/m-K
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Tensile Strength (Break): 2,000 to 2,700 psi
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Supplier: Allied Electronics, Inc.
Description: SDR Wire Marking Tapes, 0.215 in. Width, 96 in. Length, 3 mils Thickness 5.5 mil reinforced flame-retardant epoxy film tape with an acrylic high tack pressure-sensitive adhesive. Tape resists abrasion, oil and water. Excellent adhesion to clean Neoprene™, Hypalon, nylon and PVC
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Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold
- Use Temperature: 200 F
- Industry: Aerospace, Military / Government (MIL-SPEC / GG)
- Features: Epoxy (EP), Specialty / Other
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Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold
- Use Temperature: 180 F
- Industry: Aerospace, Marine
- Features: Epoxy (EP), Other, Specialty / Other
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Supplier: Newark, An Avnet Company
Description: 3M Epoxy Film Electrical Tape Super 10-1"X60YDS, White, Rubber Thermosetting Adhesive, 1 in x 60 yds (25,40 mm x 55 m), 36 per case
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Supplier: Newark, An Avnet Company
Description: 3M Epoxy Film Electrical Tape Super 20-3/4"X60YDS, White, Acrylic Adhesive, 3/4 in x 60 yd (19,05 mm x 66 m), 48 per case
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Supplier: Newark, An Avnet Company
Description: 3M Epoxy Film Electrical Tape Super 20-1/2"X60YDS, White, Acrylic Adhesive, 1/2 in x 60 yd (12,70 mm x 55 m), 72 per case
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Featured Products Top
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Easypoxy®product range of adhesives for industrial applications are versatile epoxy systems that can bond a wide variety of materials. Epoxylite® Hi-Temp adhesives and potting materials have been used in the aerospace industry since the (read more)
Browse Epoxy Adhesives Datasheets for ELANTAS North America LLC -
Fluon+™ PFA EA-2000 Adhesive Resins Serve as PCB Coatings to Speed Up Communication Rates in Autonomous Vehicles By 2025, it is projected that the global market (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
the adhesive choice which fall into three groups: cyanoacrylate, silicone, and epoxy based. Cold bonding does not use dies instead the ends are pressed together by hand. It is generally used for low volume projects because it is more labor intensive and expensive than the other methods. In (read more)
Browse Edge Trims and Trim Seals Datasheets for Device Technologies, Inc. -
-4700 boards and a high temperature ambient-cure epoxy adhesive are stacked together to form a bonded block of foam. The bonded blocks are vacuum bagged to ensure thin bond lines, then it is cured, and prepared for machining. 2.Machining A rough cut of the tool is made (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co.
Conduct Research Top
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High-tech Adhesives for Thin-film Solar Cells
Deepmaterial presents adhesives for solar cells for the first time. The light-curing products based on epoxy resins or acrylates are particularly well suited for bonding the protective films of thin-film solar cells, while at the same time forming an effective barrier against humidity. Thin-film
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Optical Transmission Properties of Adhesives
transmission of an epoxy, a cured film, usually about 0.002 to 0.004 inches (2 to 4 mils) in thickness, is prepared. This specimen would then be put through a UV-Vis and IR spectrophotometers to obtain the transmission curve. Some of the products that Master Bond sent out for independent testing include EP30
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Tensile Bond Strength Variance of Thermally Sprayed Coatings with Respect to Adhesive Type (.pdf)
types (film vs. liquid epoxy) were used. The results showed the average tensile strengths for the coating system using the liquid epoxy systems (EC2086/EC2214) were consistently higher than the average values which resulted using the film epoxy system (FM1000_. However, less scatter in the results
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Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
This paper presents a case history of a failure analysis performed on a die bond adhesion failures. Silicone contamination caused intermittent adhesive failures at the die back metallization/conductive epoxy interface. The source of the silicone contamination was identified as the adhesive film
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Handbook of Adhesion Technology
> Figures 23.1 and > 23.2 show the application of the model described above to the stress– strain and stress-whitening behaviors of a bulk thermosetting epoxy film adhesive containing a nonwoven nylon mat, as obtained by Sancaktar and Beachtle (1993).
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Adhesion 99
of an epoxy film adhesive .
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Development of Infrared Techniques for Practical Defect Identification in Bonded Joints
Figure 5.16 a PPT phase image of PTFE defects with epoxy film adhesive in CFRP (4 ply) bonded joint. b Profile plot taken across full image width through the three defects.
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Film structural adhesives
The creation of epoxy film adhesives is a further development.
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Handbook of Paint and Coating Raw Materials Volume 1 and 2
Uses: Corrosion inhibitor primer for use with structural epoxy film adhe- sives in aerospace and general industries .
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Structural Composite Materials
8.3.2 Epoxy Film Adhesives .
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The applicability of adhesives in Arctic conditions
Further work in the development of the film adhe sives led to the creation of epoxy film adhesives , since honeycomb structures have become widespread in the aircraft industry, application of which has significantly reduced the weight of airplane units.
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Analysis of “Kiss” Bonds Between Composite Laminates
In the current work, we attempt to create kiss bonds in between carbon fiber composite laminates that have been bonded with epoxy film adhesive and epoxy paste adhesive.
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Joining: Understanding the Basics
The properties of two toughened and two untoughened epoxy film ad- hesives are shown in Table 9.4.
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Handbook of Adhesives and Sealants, Second Edition > EPOXY, POLYURETHANE, ACRYLIC, AND CYAIMOACRYLATE ADHESIVES
Epoxy film adhesives .