Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Epoxies Etc...
Description: 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. This is a 100% solids resin system that does not contain any solvents. Its’ convenient 1:1 mix ratio and lack of fillers make it an ideal material for
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 5,700 psi
- Dielectric Strength: 557.9999999999993 kV/in
-
Supplier: Georgia-Pacific Corporation
Description: requirements, phenolic resin systems have advantages over polyesters, epoxies, and vinyl esters. Cured phenolic resins from GP Chemicals are formulated to be inherently fire-resistant, demonstrate low smoke generation and high-temperature resistance. Phenolic FRP resins are used
- Filler: Aramid Fiber
- Type: Casting Resin, Thermoset
- Features: Composite Material
- Chemical System: Phenolics (Melamine, Furan)
-
Supplier: FORREST Technical Coatings
Description: FirmFoot® Slip Resistant EpoxyEpoxy Skid Resistant Floor Paint Pre-mixed epoxy paint with grit to eliminate slippery spots on stairs, walkways, ramps, boat decks, diving boards and dozens of other common locations! Offers firm footing under wet conditions. Easy to use, no mixing Meets
- Form: Aerosol, Liquid
- Coating Material: Aluminum, Epoxy, Resin Base / Polymer Binder
- Features: Brush / Roll-on, Exterior, Floor, Interior, Other, Pavement / Walkway, Specialty / Other, Touch-Up, Weather / UV Resistant
- Type: Clear Coat / Top Coat, Paint, Traction Coating / Friction Modifier
-
-
Supplier: ACCRAbond, Inc.
Description: 85-90 Shore D durometer is obtained. FR-1046 is an excellent choice when automatic meter, mix, and dispensing equipment is used because of non-abrasive fillers in the resin.
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
-
Supplier: Master Bond, Inc.
Description: compound readily develops a high bond strength of 3000 psi at room temperature which unlike that of many other epoxy compositions, is relatively insensitive to mixing ratio. Master Bond Polymer System EP22 produces durable, high strength, and tough bonds with outstanding adhesion to
- Use Temperature: -60 to 250 F
- Coeff. of Thermal Expansion (CTE): 45 µin/in-F
- Tensile Strength (Break): 8,000 psi
- Dielectric Strength: 110 kV/in
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or
- Viscosity: 10,000 to 15,000 cP
- Use Temperature: -60 to 275 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 17 µin/in-F
-
Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONAPOXY FR-1046 Epoxy Encapsulant Black is an epoxy potting and casting system used for automatic meter, mix, and dispensing equipment because of non-abrasive fillers in the resin. It offers low viscosity, excellent resistance to thermal shock, and very good
- Viscosity: 17,000 cP
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP41S is a two component epoxy resin compound for durable, high performance, tough, high strength coatings, liners and adhesive/sealants with outstanding resistance to organic solvents including alcohols and fuels. The EP41S compound which is formulated to
- Operating / Use Temperature: -60 to 250 F
- Dielectric Strength: 17,322,834.645669255 V/m
- Substrate: Ceramic / Porcelain, Glass, Metal, Plastic, Wood
- Industry: Electronics, Food and Beverage, Medical / Healthcare
-
Supplier: Master Bond, Inc.
Description: food equipment applications where there is an indirect exposure to food and related products.
- Use Temperature: -60 to 250 F
- Coeff. of Thermal Expansion (CTE): 27.779999999999998 to 30.560000000000002 µin/in-F
- Tensile Strength (Break): 9,000 psi
- Elongation: 5 %
-
Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F
- Use Temperature: 380 F
- Applications: Aerospace, Automotive / Transportation
- Material: Carbon / Graphite
-
Supplier: Hernon Manufacturing, Inc.
Description: to the cone has been a challenge for engineers, specifically when the adhesive temperature resistance requirement is above 200°F (93°C). Two component epoxy was commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification in
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System, Thermosetting / Crosslinking, Two Component System
- Features: Specialty / Other
-
Supplier: Hernon Manufacturing, Inc.
Description: cone has been a challenge for engineers, specifically when the adhesive temperature resistance requirement is above 200°F (93°C). Two component epoxy systems have been most commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification in
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System, Thermosetting / Crosslinking, Two Component System
- Features: Specialty / Other
-
Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST 2651MM ) LOCTITE STYCAST 2651MM is a filled, low viscosity, general purpose, epoxy encapsulant. It contains a soft filler that both reduces abrasion in meter/mix equipment and enhances machinability in the cured product.
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
-
Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F
- Use Temperature: 180 F
- Industry: Aerospace, Marine
- Chemical System: Epoxy (EP)
- Features: Other, Specialty / Other
-
Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F
- Use Temperature: 180 F
- Industry: Aerospace, Marine, OEM / Industrial
- Chemical System: Epoxy (EP)
- Features: Other, Specialty / Other
-
Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F
- Use Temperature: 200 F
- Industry: Aerospace, Military / Government (MIL-SPEC / GG)
- Chemical System: Epoxy (EP)
- Features: Specialty / Other
-
Supplier: Epoxies Etc...
Description: cleaning performance for demanding applications. It is compatible with metals, has a low tendency to cause corrosion and may be used in current meter mix manufacturing equipment. 11-350 is able to remove and/or dissolve a wide range of thermoset resin systems such as epoxy,
- Type: Cleaner / Cleaning Agent, Solvent / Solvent-based, Stripper (Paint, Resins)
- Industry Applications: Electrical / Electronics
-
Supplier: Glass Shield Industrials Paints Ltd.
Description: to damaging U.V. raysUltimate protection when used as a finishing coat over Glass Shield epoxies, moisture cure urethane primers or polyurethane topcoats Can be applied and cured at temperatures below freezing (-4C) Single component product avoids mixing errors Can be applied in damp and
- Type: Clear Coat / Top Coat
- Chemistry: Polyurethane, Resin Base / Polymer Binder
-
Supplier: Hangzhou X-mag Inc.
Description: applications (e.g., instrument panel motors, seat motors and air bag sensors) and home ventilation systems (e.g., ceiling fans). Compression Molding Compression molded magnets involves mixing magnetic powder (such as NdFeB, SmCo or AlNiCo) with a thermosetting epoxy resin
- Maximum Energy Product, BHmax: 1.45 to 12 MGOe
- Residual Induction, Br: 2.2 to 7.6 kilogauss
- Coercive Force, Hc: 2,000 to 6,000 Oersted
- Intrinsic Coercive Force, Hci: 2,600 to 16,000 Oersted
-
Supplier: FX PCB Co., Ltd.
Description: What Are Light PCB Board MaterialS? CEM 1 and CEM 3 CEM-1 Three components are typically used to create composite materials. These comprise paper core and woven glass fabric linked together. After that, epoxy resin is added to these two. The printed circuit board industry frequently
- Features: East Asia / Pacific Only, United States Only
- Supplier Capability: PCB Assembly
Find Suppliers by Category Top
Featured Products Top
-
Eliminate the weighing and mixing of adhesives and resins. Ellsworth Adhesives works with KitPackers, a custom resin packager that offers pre-mixed and frozen (PMF (read more)
Browse Industrial Adhesives Datasheets for Ellsworth Adhesives -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
handling Excellent heat resistance Toughened system Passes NASA low outgassing Master Bond Supreme 11AOHTLP is a two component epoxy resin system for high performance bonding, sealing and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
EP21LSCL-2Med Master Bond EP21LSCL-2Med is a two component, low viscosity epoxy resin system featuring superb optical clarity. This system has a forgiving mix ratio of 100 to 20 by weight. The (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
The Mk IX Rollo-Mixer® Batch Coater The Mk IX Rollo-Mixer® Batch Coater was originally designed to evenly spray two-part polymer epoxies, resin and hardeners onto a wide range of substrates (read more)
Browse Industrial Homogenizers Datasheets for Continental Products Corp. -
molding – involves creating a tool in the desired shape and then pouring the liquid thermoset resin into the mold. The polyurethane expands to fill the cavity during the reaction and becomes polyurethane foam. After the foam cures and hardens, it is removed from the mold and the tool is prepared to (read more)
Browse Plastic Molding Services Datasheets for General Plastics Manufacturing Co.
Conduct Research Top
-
The best epoxy resin manufacturer in china for high-quality electronic products
Synthetic epoxy resin can be used for different purposes. This is usually made by mixing a hardener and a resin that match one another in a given ratio. After they are mixed, a chemical reaction is initiated. The curing process depends on the kind of epoxy resin and the ratio used.
-
Tech Tip 11 - Converting Mix Ratios
Mix ratio of a two part epoxy is extremely important in achieving a proper cure. Epoxies use a chemical reaction between a resin and hardener which have a stoichiometric ratio that determines the relative proportions in which the two substances react for this reaction. This ratio can vary from
-
TriggerBond - The Pre-mixed Epoxy Solution (Case Study)
, using epoxies can pose difficulties. Mixing them is a very precise practice, requiring the perfect ratio of resin and hardener. "You have to be very careful," she warned. "The mixing process has to be exactly right. Improperly mixed epoxy can ruin our electronics. It can also be really messy. Our
More Information Top
Indicates content that may require registration and/or purchase.
-
Influence of different concentrations of glycidylisobutyl‐ POSS on the glass transition of cured epoxy resin
To obtain the nanocomposites, 1, 5, and 10% by weight (wt %) of glycidylisobutyl—POSS was added from a pre- mix to the epoxy resin using Sonics sonica- tion equipment (VCX 750) operated at 225 W for 20 min.
-
The appearance of neutral lipid signals in the 1 H NMR spectra of a myeloma cell line correlates with the induced formation of cytoplasmic lipid droplets
The samples were postfixed in osmium tetroxide in phosphate buffer for 1 h, dehydrated in ethanol, treated with propylene oxide, and embedded in epoxy resin (E mix , Fisons Scientific Equipment , UK).