Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Georgia-Pacific Corporation
Description: high-temperature requirements, phenolic resin systems have advantages over polyesters, epoxies, and vinyl esters. Cured phenolic resins from GP Chemicals are formulated to be inherently fire-resistant, demonstrate low smoke generation and high-temperature resistance. Phenolic
- Filler Material: Aramid Fiber
- Form: Casting Resin
-
Supplier: Epoxies Etc...
Description: 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. This is a 100% solids resin system that does not contain any solvents. Its’ convenient 1:1 mix ratio and lack of fillers make it an ideal
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or
- Coeff. of Thermal Expansion (CTE): 17 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.2
- Dielectric Strength: 250 kV/in
-
-
Supplier: FORREST Technical Coatings
Description: FirmFoot® Slip Resistant EpoxyEpoxy Skid Resistant Floor Paint Pre-mixed epoxy paint with grit to eliminate slippery spots on stairs, walkways, ramps, boat decks, diving boards and dozens of other common locations! Offers firm footing under wet conditions
- Chemistry: Resin Base / Polymer Binder, Epoxy
- Features: Brush / Roll-on, Touch-Up, Weather / UV Resistant
- Form: Aerosol, Liquid
- Industry: Marine, OEM / Industrial, Process Equipment
-
Supplier: Master Bond, Inc.
Description: temperature or more rapidly at elevated temperatures with a convenient five-to-one non-critical mix ratio by weight, offers a degree of resistance to organic solvents and toughness unmatched by any other currently available epoxy resin composition. It can successfully withstand,
- Coeff. of Thermal Expansion (CTE): 19.44 to 22.22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 440 kV/in
- Features: Electrical Insulating / Dielectric
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 45 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
-
Supplier: Master Bond, Inc.
Description: With convenient handling, EP21NDFG has a non-drip viscosity and a one to one mix ratio by weight or volume. It produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. This system is primarily
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 to 30.56 µin/in-F
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
-
Supplier: ACCRAbond, Inc.
Description: hardness of 85-90 Shore D durometer is obtained. FR-1046 is an excellent choice when automatic meter, mix, and dispensing equipment is used because of non-abrasive fillers in the resin.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONAPOXY FR-1046 Epoxy Encapsulant Black is an epoxy potting and casting system used for automatic meter, mix, and dispensing equipment because of non-abrasive fillers in the resin. It offers low viscosity, excellent resistance to thermal shock, and
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 17000 cP
-
Description: • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold storage Mitsubishi Chemical Carbon Fiber and Composites is dedicated to constantly expanding our machine capability and improving our technical responsiveness to the market through new product development and
- Applications: Aerospace, Automotive / Transportation
- Material Type: Carbon / Graphite
- Use Temperature: 380 F
-
Supplier: Hernon Manufacturing, Inc.
Description: the voice coil to the cone has been a challenge for engineers, specifically when the adhesive temperature resistance requirement is above 200°F (93°C). Two component epoxy was commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Single Component System, Two Component System
- Cure Type / Technology: Thermosetting / Crosslinking
- Form: Specialty / Other
-
Supplier: Hernon Manufacturing, Inc.
Description: voice coil to the cone has been a challenge for engineers, specifically when the adhesive temperature resistance requirement is above 200°F (93°C). Two component epoxy systems have been most commonly used for this application, but limitations such as mixing ratio, cure speed, potential
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Single Component System, Two Component System
- Cure Type / Technology: Thermosetting / Crosslinking
- Form: Specialty / Other
-
Description: • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold storage Mitsubishi Chemical Carbon Fiber and Composites is dedicated to constantly expanding our machine capability and improving our technical responsiveness to the market through new product development and
- Cure Type / Technology: Specialty / Other
- Industry: Aerospace, Military / Government (MIL-SPEC / GG)
- Use Temperature: 200 F
-
Description: • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold storage Mitsubishi Chemical Carbon Fiber and Composites is dedicated to constantly expanding our machine capability and improving our technical responsiveness to the market through new product development and
- Cure Type / Technology: Specialty / Other
- Features: Flame Retardant (e.g. UL 94 Rated)
- Industry: Aerospace
- Use Temperature: 180 F
-
Description: • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold storage Mitsubishi Chemical Carbon Fiber and Composites is dedicated to constantly expanding our machine capability and improving our technical responsiveness to the market through new product development and
- Cure Type / Technology: Specialty / Other
- Industry: Aerospace, Military / Government (MIL-SPEC / GG)
- Use Temperature: 200 F
-
Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST 2651MM ) LOCTITE STYCAST 2651MM is a filled, low viscosity, general purpose, epoxy encapsulant. It contains a soft filler that both reduces abrasion in meter/mix equipment and enhances machinability in the cured product.
- Industry: Electronics
- Use: Encapsulant / Potting Compound
-
Supplier: Glass Shield Industrials Paints Ltd.
Description: ) Single component product avoids mixing errors Can be applied in damp and humid conditions Easy to apply with any traditional painting equipment
- Chemistry: Polyurethane, Resin Base / Polymer Binder
- Type: Clear Coat / Top Coat
-
Supplier: Epoxies Etc...
Description: solvent with enhanced cleaning performance for demanding applications. It is compatible with metals, has a low tendency to cause corrosion and may be used in current meter mix manufacturing equipment. 11-350 is able to remove and/or dissolve a wide range of thermoset resin
- Industry Applications: Electrical / Electronics
- Solvent / Solvent-based: Yes
- Type: Cleaner / Cleaning Agent, Stripper (Paint, Resins)
-
Supplier: Hangzhou X-mag Inc.
Description: thermosetting epoxy resin binder, mechanically pressing that compound in a die, and then curing the epoxy in an oven. To improve the corrosion resistance of the product, these components are often finished with a surface treatment such as Epoxy resin/Parylene after
- Coating: Yes
- Coercive Force, Hc: 2000 to 6000 Oersted
- Geometry: Block / Bar, Rod, Round / Ring / Disc, Arc Segment, Other
- Intrinsic Coercive Force, Hci: 2600 to 16000 Oersted
-
Supplier: FX PCB Co., Ltd.
Description: materials. These comprise paper core and woven glass fabric linked together. After that, epoxy resin is added to these two. The printed circuit board industry frequently uses this material. It often has great electrical characteristics and is simple to punch. In comparison to grades
- Location: United States Only, East Asia / Pacific Only
- Supplier Capability: PCB Assembly
Find Suppliers by Category Top
Featured Products Top
-
Eliminate the weighing and mixing of adhesives and resins. Ellsworth Adhesives works with KitPackers, a custom resin packager that offers pre-mixed and frozen (PMF (read more)
Browse Industrial Adhesives Datasheets for Ellsworth Adhesives -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
handling Excellent heat resistance Toughened system Passes NASA low outgassing Master Bond Supreme 11AOHTLP is a two component epoxy resin system for high performance bonding, sealing and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
EP21LSCL-2Med Master Bond EP21LSCL-2Med is a two component, low viscosity epoxy resin system featuring superb optical clarity. This system has a forgiving mix ratio of 100 to 20 by weight. The (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
The Mk IX Rollo-Mixer® Batch Coater The Mk IX Rollo-Mixer® Batch Coater was originally designed to evenly spray two-part polymer epoxies, resin and hardeners onto a wide range of substrates (read more)
Browse Industrial Homogenizers Datasheets for Continental Products Corp. -
molding – involves creating a tool in the desired shape and then pouring the liquid thermoset resin into the mold. The polyurethane expands to fill the cavity during the reaction and becomes polyurethane foam. After the foam cures and hardens, it is removed from the mold and the tool is prepared to (read more)
Browse Plastic Molding Services Datasheets for General Plastics Manufacturing Co.
Conduct Research Top
-
The best epoxy resin manufacturer in china for high-quality electronic products
Synthetic epoxy resin can be used for different purposes. This is usually made by mixing a hardener and a resin that match one another in a given ratio. After they are mixed, a chemical reaction is initiated. The curing process depends on the kind of epoxy resin and the ratio used.
-
Tech Tip 11 - Converting Mix Ratios
Mix ratio of a two part epoxy is extremely important in achieving a proper cure. Epoxies use a chemical reaction between a resin and hardener which have a stoichiometric ratio that determines the relative proportions in which the two substances react for this reaction. This ratio can vary from
-
TriggerBond - The Pre-mixed Epoxy Solution (Case Study)
, using epoxies can pose difficulties. Mixing them is a very precise practice, requiring the perfect ratio of resin and hardener. "You have to be very careful," she warned. "The mixing process has to be exactly right. Improperly mixed epoxy can ruin our electronics. It can also be really messy. Our
More Information Top
Indicates content that may require registration and/or purchase.
-
Influence of different concentrations of glycidylisobutyl‐ POSS on the glass transition of cured epoxy resin
To obtain the nanocomposites, 1, 5, and 10% by weight (wt %) of glycidylisobutyl—POSS was added from a pre- mix to the epoxy resin using Sonics sonica- tion equipment (VCX 750) operated at 225 W for 20 min.
-
The appearance of neutral lipid signals in the 1 H NMR spectra of a myeloma cell line correlates with the induced formation of cytoplasmic lipid droplets
The samples were postfixed in osmium tetroxide in phosphate buffer for 1 h, dehydrated in ethanol, treated with propylene oxide, and embedded in epoxy resin (E mix , Fisons Scientific Equipment , UK).