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  • Dynamic Fracture Mechanics
    Dynamic Fracture Mechanics. Covering a wide variety of topics in dynamic fracture mechanics, this volume presents state-of-the-art experimental techniques and theoretical analysis on dynamic fracture in standard and exotic materials.
  • Advances in Precision Positioning Stage Design-Optimized Outgassing and Motion Performance in Ultra-High Vacuum Applications
    Many processes in advanced research and industrial manufacturing can only be performed in a vacuum, such as thin-film sputtering and ion milling, and technologies formerly reserved for exotic materials processing are seeing application in new fields.
  • Material Selection Guide
    in your operation down the road. Luckily, Smalley is here to help! Identifying the best suited standard or exotic alloys early in the design process can ensure that you have the right fit for your environment and budget. The number of materials offered by Smalley can be slightly intimidating so we
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Innovation to drive chip performance curve In the early days of 0.13 micron, it looked like Moore's Law was in danger of becoming Moore's Flaw, and that the lawful doubling of transistors every 18 months would be thwarted by skyrocketing design costs and exotic new materials that resulted in poor
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    , and that the lawful doubling of transistors every 18 months would be thwarted by skyrocketing design costs and exotic new materials that resulted in poor yields. Magma to focus on silicon compilation During a recent visit to this country chairman and CEO Rajeev Madhavan affirmed that Magma Design Automation
  • Using FIB for Wafer Lot acceptance and Design Verification
    The capabilities of modern FIB machines utterly overshadow the primitive capabilities I so revered from the 80s. In the current era of System-on-Chip (SoC) designs with 10 and 11 metal layers, copper metallizations, exotic dielectric materials, and the use of area pads scattered across the entire
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    in the 2013 time frame and beyond, Intel Corp. on Friday (Oct. 22) disclosed that it is investigating a breathtaking range of novel and exotic technologies. The chip giant is working on tri-grate transistors, carbon nanotubes, silicon nanowires, III-V materials, spintronics, phase change logic

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