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Supplier: Cypress Semiconductor Corp.
Description: virtually all modern chipsets. NOR Flash is the ideal memory for code storage in embedded systems due to its fast random read performance. This performance also supports XIP (eXecute In Place) functionality which allows host controllers to execute code directly from the NOR
- Density: 16,000 to 1,000,000 kbits
- Pin Count: 8 to 24
- Supply Voltage: 1.8 V, 3 V
- Package Type: BGA, SOIC
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Supplier: Infineon Technologies AG
Description: of 10+ years from the date of release. By selecting NOR flash products covered by the program, ensure peace of mind and a robust supply chain for critical memory devices. Learn more about longevity program. Chipset partners Pre-qualified solutions and reference designs Infineon
- Density: 512,000 kbits
- Operating Temperature: -40 to 85 C
- Supply Voltage: 2.7 V, 3 V, 3.6 V
- Memory Category: Flash
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Supplier: QUALCOMM, Incorporated
Description: Technology Digital Microphone Input 1 digital mic Channel Output Stereo DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type QFN Pitch 0.4mm
- Technology: Bluetooth
- Features: Bluetooth® Single Chip Solutions, Other
- Interface: I2C, USB
- Package Type: QFN
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Supplier: Infineon Technologies AG
Description: of 10+ years from the date of release. By selecting NOR flash products covered by the program, ensure peace of mind and a robust supply chain for critical memory devices. Learn more about longevity program. Chipset partners Pre-qualified solutions and reference designs Infineon
- Density: 128,000 kbits
- Operating Temperature: -40 to 105 C
- Supply Voltage: 2.7 V, 3 V, 3.6 V
- Memory Category: Flash
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Supplier: QUALCOMM, Incorporated
Description: 150 mA Memory RAM 48KB RAM Flash 16MB Interface Supported Interfaces UART USB 2.0 PCM I²S SPDIF Input/Output ADC 2 ADCs DAC 2 DACs General Purpose IOs 16 PWM (LED) 2 Package Package Type 8 x 8 x 0.9 mm 0.4 mm pitch QFN
- Operating Frequency: 32 MHz
- Technology: Bluetooth
- Features: Bluetooth® Single Chip Solutions, Other, PCM, UART
- Package Type: QFN
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Supplier: Microchip Technology, Inc.
Description: The SST49LF008A flash memory devices are designed to be read-compatible with the Intel 82802 Firmware Hub (FWH) device for PC-BIOS application. These devices provide protection for the storage and update of code and data in addition to adding system design flexibility through five
- Density: 8,000 kbits
- Data Rate: 33 MHz
- Data Retention: 100 years
- Endurance: 100,000 Write/Erase Cycles
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module,
- Package Type: BGA
- Features: Other
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Supplier: American Portwell Technology Inc.
Description: 3.5" Embedded System Board with Intel® Atom™ D510 Processor and Intel® ICH8M chipset, up to 2GB SO-DIMM DDR2 memory, VGA/18 bit LVDS, dual gigabit ethernet, type II Compact Flash and two SATA ports
- Memory Capacity: 2 GB
- PCI Express: 1
- SATA: 2
- USB: 6
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Supplier: Ant Computer, Inc.
Description: Pentium M Embedded Board w / VGA / Audio/ LAN FEATURES > Support LV Pentium M / ULV Celeron M CPU up to 1.4GHz > Equipped with Intel 855GME Chipset with FSB 400MHz > Memory Supports DDR 333 SDRAM up to 2 GB > Expansion Slots for PC104, Mini-PCI > Support Compact Flash
- CPU Speed: 1,000 to 1,400 MHz
- RAM: 2,000 MB
- Operating Temperature: 32 to 140 F
- Operating Humidity: 20 to 90 %
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Supplier: Aaeon Systems Inc.
Description: The HSB-945P utilizes the Intel® 945GSE and ICH7M chipset in order to support the Intel® AtomTM 1.6 GHz processor. The SBC has one SODIMM socket for one 200-pin DDR II SODIMM for system memory, up to 1 GB. Network communications is achieved with the option of having Ethernet devices
- Operating Temperature: 32 to 140 F
- Operating Humidity: 10 to 80 %
- Chipset: Intel® Chipset
- Ports: Serial Ports, USB
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Supplier: Acromag, Inc.
Description: integrated graphics, and expanded memory performance with up to 32GB of high-bandwidth DDR4 memory and ECC memory controllers. This board is designed and manufactured to meet VITA 46.0 and has at least a 7-year life expectancy. Cutting-edge technology features programmable power
- CPU Speed: 2,800 MHz
- RAM: 32,000 MB
- Operating Temperature: -40 to 185 F
- Communication Networks: Ethernet
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Supplier: Acromag, Inc.
Description: advancements such as: enhanced microarchitecture, integrated graphics, and expanded memory performance with up to 16GB of high-bandwidth DDR3L memory and ECC memory controllers. 4th Generation Intel Core: Quad Core i7 CPU for high performance (47W) Programmable CPU power for
- CPU Speed: 2,400 MHz
- RAM: 16,000 MB
- Cache Memory (L1 & L2): 6,000 KB
- Flash Memory (RAM): 32,000,000 KB
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Supplier: Aaeon Systems Inc.
Description: The HSB-965P utilizes the GME965 and ICH8M chipset, supporting Intel Core 2 Duo processors with a FSB of 533/667/800MHz. To achieve a balance of cost and performance, you may choose the lower cost GLE960 chipset. Offering two 200-pin DDRII SODIMM sockets, the HSB-965P supports
- RAM: 256 MB
- Operating Temperature: 32 to 140 F
- Chipset: Intel® Chipset
- Computer Bus: PCI
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Single Board Computers (SBC) - EPIC Board With Onboard Intel Atom N270 Processor -- EPIC-9457 Rev. BSupplier: Aaeon Systems Inc.
Description: EPIC-9457 Rev.B supports onboard Intel Atom N270 1.6 GHz processor. The chipset is Intel® 945GSE + ICH7M. Moreover, the model features 200-pin DDR SODIMM and system memory up to 2GB for DDR2 400/533. It performs at better speed and performance. In addition, EPIC-9457 Rev.A offers two
- RAM: 224 MB
- Operating Temperature: 32 to 140 F
- Operating Humidity: 0 to 90 %
- Chipset: Intel® Chipset
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Supplier: Aaeon Systems Inc.
Description: FSB-865G also provides high memory capacity up to 4 GB DDR DRAM (DDR 200/266/333/400) and supports the Dual-channel (128 bits wide) DDR memory interface. In addition to its powerful computing engine, the full functional design of the board includes features such as i82865GV on-chip
- RAM: 64 MB
- Operating Temperature: 32 to 140 F
- Chipset: Intel® Chipset
- Ports: Parallel Ports, Serial Ports, USB
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Supplier: AAEON Electronics, Inc.
Description: ISA Half-Size SBC With Intel® Atom™ D525 Processor Main Feature Intel® Atom™ D525 Processor, FSB 800 MHz Intel® Atom™ D525 + ICH8M 204-pin DDR3 800MHz SODIMM Memory x 2, Up To 4GB Gigabit Ethernet x 2 Intel® Atom™ D525 Integrated VGA, Shared Memory Up To 324MB With DVMT4.0. Optional HD
- Operating Temperature: 32 to 140 F
- Communication Networks: Ethernet
- Computer Bus: ISA / EISA
- Processor / CPU: Intel® AtomTM
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Supplier: Indocomp Systems, Inc.
Description: resolution 1280x1024@24bpp, 1600x1200@8bpp Intel 82815 & 82801BA chipset include Graphic Memory Controller Hub, I/I controller Hub 2, and Firmware Hub Dual LAN, Intel 81559 controller, 10/100 Mbps, autoswitch, with dual RJ-45 connectors CompactFlash socket for up to 512MByte, 8 Mbit
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include microcontroller, MCU, embedded control, ARM Cortex, Flash memory,
- Features: Other
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Supplier: Infineon Technologies AG
Description: Infineon releases its second generation AURIX™ microcontroller in embedded flash 40 nm technology. It comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive trends and challenges. This family has more than 20 products
- Internal RAM Size: 6,624 KB
- Number of A/D Converters: 34
- Operating Temperature: -40 to 125 C
- Bits: 32 Bit
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Supplier: Radicom Research, Inc.
Description: modules using BlueCore4-External Chipset from CSR, the leader in Bluetooth chipsets. These embedded modules are Bluetooth V.2.0 + EDR (Enhanced Data Rate) compliant that increase throughput, reduce battery consumption and improve security. It provides faster pairing and allows superior
- Form Factor: Board
- Network Equipment: Modem
- Features: Point-to-Point, Radio Modem
- Network Media: Wireless
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Supplier: Indocomp Systems, Inc.
Description: Features Full-size PICMG Bus Compatible Single Board Supports Socket-478 Intel Pentium-M Processors Two 184-pin DIMM memory, suport DDR266 SDRAM up to 2GB Integrated graphics, support CRT, digital video out & LVDS LCD Intel® 855GME chipset include Graphic Memory Controller Hub,
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Supplier: VersaLogic Corporation
Description: companion chipset, the 855GME with integrated Extreme Graphics 2 and audio functions. The Pentium M version Cobra incorporates a number of power saving features, including SpeedStep technology, and performance enhancing features such as a large 1 MB level 2 cache. The advanced graphics
- CPU Speed: 1,300 MHz
- RAM: 1,000 MB
- Operating Temperature: 32 to 140 F
- Operating Humidity: 0 to 94 %
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Supplier: Indocomp Systems, Inc.
Description: Features Half-size ISA Bus Compatible Single Board Computer NS GeodeTM GX1 Low power CPU CPU Frequency 300 MHz CPU Voltage 2.0 Volt. Chipset NS GeodeTM CS5530 One 168-pin DIMM up to 256MB Socket for DiskOnChip supports up to 144MB Flash Disk Multi I/O for One EIDE DMA-33, one FDD
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Supplier: Indocomp Systems, Inc.
Description: Features 5.25" form factor Single Board Computer Pentium III Socket 370 Processors 533-1G mhz Intel Celerion, Cyrix III, VIA C3 Up to 256 MB SDRAM in one 168-Pin DIMM socket, PC100/PC133 supported Intel 815E chipset integrates graphics ITE 8712 I/O chipset integrates Ethernet and audio
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Supplier: Global American, Inc.
Description: Form factor Micro-ATX Processor Socket H2 (LGA 1155) Intel® 2nd Generation Core i7/i5/i3, Pentium and Celeron processor supported Memory 2x 240-pin DDR3 DIMM sockets Supports up to 32 GB DDR3 non-ECC 1333/1066MHz unbuffered DDR3 Chipset Intel® Q67 Express chipset Audio Realtek
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Supplier: ELMA Electronic Inc.
Description: The SBC347A Rugged Single Board Computer (SBC) from GE Intelligent Platforms features the high performance, highly integrated 5th Generation Core i7 processor platform from Intel. The 5th Generation Core i7 offers integrated graphics and memory controller plus quad core processing up to 2.7
- CPU Speed: 2,700 MHz
- RAM: 16,000 MB
- Flash Memory (RAM): 32,000,000 KB
- Communication Networks: Ethernet
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Supplier: ELMA Electronic Inc.
Description: Intel® Core™ i7 2655LE (or 2610UE / 2715QE) Core speed = 2.2GHz (or 1.5GHz / 2.1GHz) Cache = 4MB (4MB / 6MB) Thermal design power = 25W (17W / 45W) DDR3-1333 with ECC (up to 2 * 4 GBytes) Boot flash memory Calendar clock with supercap and/or battery backup Thermal monitoring sensor
- CPU Speed: 1,500 to 2,100 MHz
- RAM: 8,000 MB
- Communication Networks: Ethernet
- Features: Other
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Supplier: ACCES I/O Products, Inc.
Description: ETX-PM800 or ETX-LX800 SODIMM-512MB DDR 512MB memory module for ETX-PM800 or ETX-LX800 SODIMM-1GB DDR 1GB memory module for ETX-PM800 or ETX-LX800 SODIMM2-2GB DDR2 2GB memory module for ETX-CD1.66G only (call for smaller memory) Industrial Compact Flash Cards: All
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Supplier: Small PC Computers
Description: RJ45 Ethernet port, 3 USB ports and a HDMI Video port. Extra Ethernet and USB ports are optional. Configuration options include memory to 16GB, solid state flash drives to 512G, RS232/RS422 serial ports, Wireless LAN and Bluetooth. The unit also supports dual video options with a
- RAM: 16 GB
- General Features: Integrated BluetoothTM Technology
- Processor: Intel®
- Operating System: Linux, Microsoft®
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Supplier: Handheld
Description: Humidity: MIL-STD 810G, Method 507.4, 90%RH temp cycle 30~60 °C Altitude: 15.000 ft (4572 m), MIL-STD 810G, Method 500.4, Procedures I, II & III Processor/memory Processor: Marvell PXA310 806 MHz Memory: 128 MB SDRAM Data storage 4 GB iNAND Flash Operating system Microsoft
- Speed: 806 MHz
- RAM: 0.128 GB
- Display Size: 3.5 inch
- Operating Temperature: -22 to 140 F
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Peripheral Interface) interface is simple to use and is supported by virtually all modern chipsets. Cypress offers the widest range of AEC-Q100-qualified Serial NOR Flash Memory with support for temperatures up to +125°C. (read more)
Browse Embedded Programming Software Datasheets for RS Components, Ltd.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
phase-change memory as the technology most likely to succeed flash memory, and could move its development work to volume manufacture in the 45-nm process generation. The company currently has a 128-Mbit large area demonstrator implemented on 90-nanometer process technology. Dow Corning sees LED makers
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
on Wi-Fi chip sets Seeking to solidify its presence in the Wi-Fi/cellular market, Atheros Communications Inc. has collaborated Qualcomm Inc. to develop interoperability between its single-chip Radio-on-Chip for Mobile solution and select Qualcomm Mobile Station Modem chipsets. ITC opens ST flash chip
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
industry, has appointed Metron Inc. as its representative for Colorado, New Mexico, and Texas. Nanya to boost '03 capital spending by 40% Seeking to boost its position in the memory market, Taiwanese DRAM maker Nanya Technology Corp. plans to increase its capital expenditures by 40% to $400 million
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Intel® E8870IO Server I/O Hub (SIOH)
Datasheet
This is the chipset Flash Memory component that typically provides the BIOS firmware code.
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hd dvb - offers from hd dvb manufacturers, suppliers, exporters & wholesalers
DVB-C full hd decoder support Jiexun/Conax CA Main System Main Processor MSTAR7821 chipset Memory Flash 4MB DDRII ...
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Reducing variability in a semiconductor manufacturing environment
The company manufactures microprocessors (MPUs), flash memories , chipsets and related software for computers, servers, and consumer electronic products.
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FLARE: A design environment for FLASH-based space applications
Designer should discriminate among which technology to choose (Flash-memory Technology) and they may also have to select the most appropriate flash - memory chipset (Flash- .
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Engineering Careers at Intel Support Computing Platforms
There are opportunities in networking, wireless communications, flash memory , chipsets , motherboards, and more.
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Optimization of in-line semiconductor measurement rates : balancing cost and risk in a high mix, low volume environment
In 2003, over 75% of wafer manufacturing at Intel including its microprocessor, chipset , flash memory and networking silicon products was done in the U.S. at fabs in Oregon, Arizona, New Mexico, Massachusetts, California and Colorado.
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Global Manufacturing Q2 2012 Market Tracker Database
Their array of products include microprocessors, chipsets and flash memory .
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Global Manufacturing Q1 2012 Market Tracker Database
Their array of products include microprocessors, chipsets and flash memory .
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A forecasting and inventory model for short lifecycle products with seasonal demand patterns
Intel Corporation manufactures and distributes a wide variety of semiconductor products, including processors, chipsets , flash memory , communications products, and motherboards.
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US Firms’ Business Competence in the Taiwanese IT Industry
$55,870106,700650182Microprocessors, flash memory ,motherboard chipsets ,networkinter- facecards,Bluetooth chipsets .
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