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Supplier: Boyd
Description: Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for integrated circuits like Ball Grid Arrays (BGAs). Choose from a number of sizes,
- Device: Active Heat Sink
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Supplier: DigiKey
Description: Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Other
- Thermal Resistance: 30.6 °C / W
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Supplier: DigiKey
Description: Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Adhesive / Tape
- Thermal Resistance: 30.6 °C / W
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Supplier: Boyd
Description: heat sink, an Aavid fan, attachment hardware, and thermal interface material. These drop-in solutions provide localized, device specific cooling which increases the performance of the heat sink as well as the reliability of your FPGA/BGA device. Aavid Fan
- Device: Active Heat Sink
- Fan Voltage: 5 VDC, 12 VDC
- Material: Aluminum
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Supplier: Boyd
Description: Heat Sinks – Board Level, BGA/FPGA, Extruded Aluminum, Skived, Zipper, Bonded, Brazed Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded
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Supplier: Acromag, Inc.
Description: system with modern technology. This high-performance SBC features a FPGA-based VME to PCIe-bridge that solved the end of life issue with the TSI148 VME interface chip. Ruggedized SODIMM removable memory is surrounded by heat sink material to provide a robust hold-down mechanism.
- CPU Speed: 1500 MHz
- Chipset Type: Intel® Chipset
- Communication Networks: Ethernet
- I/O Bus Specifications: PCI, VMEbus
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Supplier: Advantech
Description: . Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial
- Operating System: LynxOS®
- Technology: VPX
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Supplier: Advantech
Description: instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis
- Operating System: LynxOS®
- Technology: VPX
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Supplier: Advantech
Description: and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point)
- Operating System: LynxOS®
- Technology: VPX
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Higher heat dissipation, may need Heat Sinks Lower heat dissipation, more efficient overall Size Compact, suitable for small, low-power devices (read more)
Browse General Purpose Diodes Datasheets for ODG (Origin Data Global)
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Design optimization of thermal paths in spacecraft systems
FPGA Heat Sink .
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FPGA-based module for SURF extraction
The two stand-offs are designed for a FPGA heat sink , which also helps to hold the mini-module firmly attached to the baseboard.
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The Calorimeter Trigger Processor Card: the next generation of high speed algorithmic data processing at CMS
Figure 1 shows an image of the card without FPGA heat sinks installed.
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Evolution of the design of a second generation FireWire based data acquisition system
…required for operation (such as in our MRI insert scanner designs), the air is introduced along the bottom edge of the card and removed along the top edge of the card assuring good flow across the FPGA heat sink and the memories.
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Thermal management of a multi-core master processing unit (MPU) for an ultrascalable computing platform
They were marked as number 1, 3, 8, 11, 17 and19, six thermocouples were located on the top of FPGA heat sinks .
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Digital Spectro-Correlator System for the Atacama Compact Array of the
Atacama Large Millimeter/submillimeter Array
Two FPGAs with heat sinks are DFR parts.
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Thermal Design of a Satellite Borne FPGA
Thermal-conductive glue, vias and an aluminum bar were used to the FPGA and the PCB under the FPGA in order to help conduct the heat of the FPGA to heat sink .
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Simulation of voltage based efficient fire sensor on FPGA using SSTL IO standards
Keywords—Fire Sensor, SSTL, Airflow, Heat Sink , FPGA .
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Real-time airborne data management system
ITT Intellectual Property running on Xilinx FPGA (under heat sink ) .
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Drive-independent data recovery: the current state-of-the-art
Note: Heat sinks obscure the FPGA and DMUX.