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Supplier: Master Bond, Inc.
Description: Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable epoxy has formidable bond strength,
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.4
- Dielectric Strength: 400 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.1
- Dielectric Strength: 420 kV/in
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Supplier: Master Bond, Inc.
Description: Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various hardeners, EP34CA produces a low viscosity 100% reactive system
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Encapsulating / Potting, Flexible / Dampening, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Epoxies Etc...
Description: 50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating
- Coeff. of Thermal Expansion (CTE): 15.56 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: high strength and tough castings, bonds and sealants. It is an excellent choice as a matrix resin for fiber reinforced high performance heat resistant composite structures. which are remarkable resistant to thermal cycling and chemicals including water, oil and many organic
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 435 kV/in
- Elongation: 2.9 %
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M™ Scotch-Weld™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Metal
- Use Temperature: -70 to 300 F
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive EC-2086 is a gray colored, one-part heat curing very high viscosity epoxy. 3M™ Scotch-Weld™ Epoxy Adhesive EC-2086 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Metal
- Use Temperature: -70 to 200 F
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive EC-1386 is a cream colored, one-part heat curing high viscosity epoxy, 3M™ Scotch-Weld™ Epoxy Adhesive EC-1386 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Metal
- Use Temperature: -70 to 250 F
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Description: Two component epoxy adhesive that cures at room temperature or with heat to form a tough, impact-resistant bond. High shear strength. High peel strength. Outstanding environmental resistance. 20 minute worklife. Excellent adhesion to many metal and plastic substrates.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Metal, Plastic
- Viscosity: 8000 to 800000 cP
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Supplier: SAE International
Description: This specification covers a modified epoxy adhesive in the form of supported film supplied in rolls or sheets.
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Supplier: SAE International
Description: This specification covers a modified epoxy adhesive in the form of supported film supplied in rolls or sheets.
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA 9462 is a two component, medium viscosity, impact resistant epoxy adhesive that can be cured either at room temperature or with heat. 50 mL Cartridge.
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Metal, Plastic, Wood / Wood Product
- Viscosity: 60000 to 80000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK CE 3513, Epoxy, Assembly LOCTITE® ABLESTIK CE 3513 adhesive is designed for use in automated assembly and in-line curing operations. Electrically conductive One component Low viscosity No bleed Good dispense behavior Fast cure at high temperatures Long shelf life at
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 2.5 W/m-K
- Use Temperature: 302 F
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1306 Gray is a two component, room temperature and heat curing, acrylic/epoxy hybrid adhesive that has good adhesion and wetting to most surfaces. It is resistant to acids, bases, water and most organic solvents. 50 mL Cartridge.
- Cure Type / Technology: Two Component System
- Dielectric Strength: 110 kV/in
- Elongation: 0.0 to 1 %
- Tensile Strength (Break): 4500 psi
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Supplier: Ellsworth Adhesives
Description: ResinLab EP750 Clear is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids,
- Cure Type / Technology: Two Component System
- Dielectric Strength: 410 kV/in
- Elongation: 4 to 10 %
- Tensile Strength (Break): 3500 to 8000 psi
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Supplier: Ellsworth Adhesives
Description: ResinLab EP750 Black is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids,
- Cure Type / Technology: Two Component System
- Dielectric Strength: 410 kV/in
- Elongation: 5 to 7 %
- Tensile Strength (Break): 7500 psi
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK CE 3511PHV, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3511PHV electrically conductive adhesive is designed for circuit assembly applications. Electrically conductive One component Fast cure at high temperatures Long shelf life at room
- Cure Type / Technology: Single Component System
- Use Temperature: 302 F
- Viscosity: 62500 cP
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Supplier: Epoxies Etc...
Description: 70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies,
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Features: Encapsulating / Potting, Filled, Thermal / Heat Conductive
- Industry: Tooling / Mold Material
- Tensile Strength (Break): 14500 psi
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK G 500HF, Epoxy, Assembly LOCTITE® ABLESTIK G 500HF is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. One component Sag resistant Process ease Non-abrasive No flow during cure even on vertical
- Cure Type / Technology: Single Component System
- Substrate / Material Compatibility: Metal
- Use Temperature: 40 to 356 F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK C 805-1, Epoxy, Heat cure LOCTITE® ABLESTIK C 805-1 is the lower viscosity version of ECCOBOND C 805. Electrically conductive Thermally conductive Thixotropic Bond strength Good adhesion to a variety of substrates Long room temperature stability Process ease Good green
- Cure Type / Technology: Single Component System
- Use Temperature: 49 to 302 F
- Viscosity: 130000 cP
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Supplier: Boyd
Description: Low VOC (volatile organic compound) adhesives for sensitive or enclosed applications Heat & flame resistant solutions Thermally or electrically conductive adhesives & tapes Custom thicknesses, lengths, widths, colors, adhesion ratings Formatted for use
- Adhesive: Acrylic, Epoxy, Rubber, Silicone
- Backing: Plastic / Polymer, Acrylic / Acrylate, Rubber, Silicone
- Type: Double-Sided, Transfer
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Supplier: Accuris
Description: Adhesive, Modified Epoxy Moderate Heat Resistant, 120 Degrees C (250 Degrees F) Curing, Film Type
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Supplier: Hi-Tech Seals, Inc.
Description: . Unlike epoxies acrylics require no direct mixing. Acrylics offer unique performance capabilities. High peel and high impact strengths are combined to deliver tough, durable, shock resistant bonds. Acrylics withstand weathering effects well. Acrylic adhesives do not require
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Coeff. of Thermal Expansion (CTE): 3.94E-4 µin/in-F
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
- Dielectric Constant (Relative Permittivity): 12.34 to 14.92
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Supplier: Graphene Laboratories, Inc.
Description: characteristics. Room temperature curing eliminates the use of a heating oven during curing to allow easier and safer connection of conductive components or materials. G6E-RTC™ epoxy is an ideal choice for applications involving heat sensitive substrates. G6E-RTC™ epoxy is low
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 72 to 302 F
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Supplier: Hernon Manufacturing, Inc.
Description: Tuffbond® 395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond® 395 will change from amber to a reddish brown upon cure. Bonding
- Cure Type / Technology: Two Component System, Single Component System, Thermosetting / Crosslinking
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial
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Supplier: Mitsui Chemicals America, Inc.
Description: The Struct Bond™ is a high adhesion, high heat resistant high-performance adhesive designed based on epoxy or silicone resin. Two types are available, a single-component heat-curing type and two-component mixed curing type, which can be selected based on the type
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Supplier: Techsil Limited
Description: Elecolit® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit® 414 has a viscosity of 20,000 to 25,000 mPas and when
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Supplier: ThreeBond International, Inc.
Description: conductive resins for your application? Our team can help. We offer detailed information about each one of our electro-conductive resins so you can find the right characteristics, including ones that are flame retardant, low halogen, low outgassing, heat resistant, and hard to bond. We
- Features: Electrically Conductive
- Industry: Automotive, Electronics
- Substrate / Material Compatibility: Rubber / Elastomer
- Viscosity: 25000 cP
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Supplier: RS Components, Ltd.
Description: Loctite® Hysol® 9514 is a toughened, single component heat curing epoxy adhesive. Loctite® Hysol® 9514, structural bonding one-component epoxy adhesive. Suitable for induction curing. High shear and peel strength. Excellent chemical resistance. High temperature
- Use Temperature: -67 to 392 F
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Supplier: Epoxies Etc...
Description: 70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 2.5 µin/in-F
- Compound Type: Liquid
- Features: Thermally Conductive
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Supplier: Epoxies Etc...
Description: UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Strength: 425 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting
- Industry: OEM / Industrial
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Supplier: Nylok Corporation
Description: element become effective only when the capsules are ruptured by shear and pressure stress and the adhesive is allowed to cure. Advantages Curing begins in about 10 minutes with full locking in 8 hours Controlled friction to improve joint tension Epoxy chemistry
- Industry: Automotive, Military / Government (MIL-SPEC / GG)
- Substrate / Material Compatibility: Metal
- Use Temperature: -58 to 338 F
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Supplier: Hernon Manufacturing, Inc.
Description: Tuffbond® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond® 394 will change from amber-yellow to a reddish brown upon cure.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System, Two Component System
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial
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Supplier: Fluoro-Plastics, Inc.
Description: to make a non-stick, low coefficient of friction unit. It is important to use the correct temperature epoxy. The epoxy’s heat resistance must be matched to the application environment. If low temperature epoxy is used in a high temperature application, the epoxy
- Backing: Fluoropolymer, Plastic / Polymer
- Dielectric Strength: 1.97E7 V/m
- Features: Abrasion / Scratch Resistant, Dielectric / Insulating
Find Suppliers by Category Top
Featured Products Top
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EP41S-5ND Black Master Bond EP41S-5ND Black is a two part epoxy system for bonding, sealing and coating with a forgiving 100 to 25 mix ratio by weight. EP41S-5ND Black will cure at room temperature or more rapidly at elevated (read more)
Browse Electrical and Electronic Resins Datasheets for Master Bond, Inc. -
Master Bond EP17HTS-DA has a paste consistency and an unlimited working life at room temperature. Its key performance properties include high temperature resistance and high Tg, excellent electrical conductivity, withstands thermal cycling, shock and vibration, and superior heat conductivity. It is NASA low outgassing and meets Mil Std 883. (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
Battery systems face two simultaneous challenges: moving heat away from cells and electrical joints, and surviving exposure to harsh chemicals that may occur during manufacture, maintenance, or in-field abuse. The Sheen TIV series thermal adhesives solve both problems with a silicone (read more)
Browse Adhesive Tapes Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
ADVANTAGES OF HEAT RESISTANT PLASTICS Many heat resistant polymers are made using the reaction injection molding (RIM) and resin transfer molding (RTM). Both RTM and RIM plastics can be reinforced with fibers such as aramid, carbon, glass or graphite. These fibers allow (read more)
Browse Plastic Molding Services Datasheets for Osborne Industries, Inc. -
Dymax OP-81-LS Low-Shrink™ optical positioning epoxy is engineered for bonding delicate optical components where alignment stability is critical. The material cures quickly with UV/Visible or LED light and includes a low-temperature heat-cure option for shadowed areas or heat (read more)
Browse Industrial Adhesives Datasheets for Dymax -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Streamline your electronics manufacturing with 3M™ Scotch-Weld™ 6101 and 6102 one-part epoxies. These fast-curing, no-mix adhesives deliver quick, energy-efficient bonding for sensitive electronics. Ideal for plastics, metals, and composites, they create strong, flexible, and water-resistant (read more)
Browse Epoxy Adhesives Datasheets for Ellsworth Adhesives -
CHT's Silicone Adhesives remain flexible across a wide range of temperatures and operating conditions and are resistant to moisture and many chemicals. These silicone adhesives feature different crosslinking systems and will support various technical requirements. Being particularly (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc. -
Bond glass, metal, plastic components with or without shadow area using Dymax light-cure adhesive technology. Our light-curable bonding materials cure in seconds upon exposure to UV or LED light. Some materials have a secondary heat or activator cure to ensure complete (read more)
Browse Acrylic Adhesives and Acrylate Adhesives Datasheets for Dymax
Conduct Research Top
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Is Epoxy Stronger than Adhesive?
consisting of a resin and a hardener. When mixed, the two parts undergo a chemical reaction that transforms them into a single, solid, and durable material. The cured epoxy is resistant to heat, chemicals, and impact. It can be used to bond, coat, or encapsulate various materials, including metals, glass
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What is the Best Plastic Bonding Epoxy Adhesive?
The use of plastic bonding epoxy adhesive to bond plastic substrates is becoming increasingly popular amongst manufacturers today. Such adhesives are capable of forming strong and invisible bonds between different substrates. This particular type of adhesive is also making headlines because of its
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What is the Hardest Epoxy Glue?
Epoxy glue is a type of adhesive that is made from a variety of different materials. It is typically used for bonding metal, glass, and plastic. Epoxy glue is known for its high strength and durability. It is also resistant to heat and chemicals. Epoxy glue is made from a mixture of a base
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What are the Disadvantages of Epoxy Glue
Epoxy bond contains a two-part bond made from resin material and a hardening agent. These two components create a strong bond resistant to heat, cold, and water when dissolved together. This glue is used in multiple applications, like the construction of boats, airplanes, and automobiles. Epoxy
More Information Top
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Thermally Conductive Adhesives Keep Things Cool
… Part A: 45,000- 55,000 Part B: 100-1000 60-90 2-3 days @ 75°F 2-3 hrs @ 200°F -100°F to +400°F 1.45 Two Component, Thermally Conductive Room Temperature Curable, Heat Resistant Epoxy Adhesive , Sealant, Coating & Casting …
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Sterilization Resistant Adhesives
Heat resistant epoxy adhesive /sealant/coating/casting system.
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05.07.10 -- Heat-Resistant Epoxy Adhesive For High-Performance Structural Bonding
05.07.10 -- Heat - Resistant Epoxy Adhesive For High-Performance Structural Bonding .
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Silicon micromachined ultrasonic scalpel for the dissection and coagulation of tissue
Gluing of the PZT actuators is done by manual application or spin coating of a thin layer of a high-strength, heat - resistant epoxy adhesive (DELOMonopox™ AD066) to one surface of each of the PZT pieces.
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Structural adhesives—characteristics and application
While test results at 250'F. are not necessarily representative of operation at 165'F., these results do give added assurance of the greater heat resistance of epoxy adhesive No. 5.
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Synthesis of Soluble Heat-Resistant Poly(imino ether sulfone)s With Novel Structure--《Chemical Propellants & Polymeric Materials》2013年05期
Qin Chuan xiang (Material Institute of Suzhou University,Suzhou 215021);Investigation & Development of Polyimide in Heat - resistant Epoxy Adhesive System[J];Synthetic Technology and Application;2001-04 .
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Investigation on curing kinetics and thermal properties of a novel epoxy resin system--《Journal of Solid Rocket Technology》2007年02期
Xiangrui Science & Technology Company Ltd,Yiyang 413000);Study on progress of heat - resistant epoxy adhesive [J];New Chemical Materials;2012-09 .
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http://www.cambridgescholars.com/download/sample/60608
The Ukrainian State Research Institute of Plastic Materials has designed single-use package quick-hardening heat - resistant epoxy adhesives combining long vitality under processing and quick hardening at high temperatures.
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Heat-Resistant Epoxy Adhesive For High-Performance Structural Bonding
Heat - Resistant Epoxy Adhesive For High-Performance Structural Bonding .
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Hydrocarbon Online Newsletter: ISO Standards Progress In Oil And Gas Sector
Heat - Resistant Epoxy Adhesive For High-Performance Structural Bonding .