Heat Resistant Epoxy Adhesives

Description: Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable epoxy has formidable bond strength,

• Use Temperature: -452 to 500 F
• Thermal Conductivity: 1.3 to 1.44 W/m-K
• Tensile Strength (Break): 7,000 to 8,000 psi
• Dielectric Strength: 400.00000000000006 to 450.00000000000006 kV/in

Description: Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. This low heat curing schedule is useful in bonding applications involving temperature sensitive

• Viscosity: 40,000 to 70,000 cP
• Use Temperature: -100 to 500 F
• Thermal Conductivity: 0.58 to 0.72 W/m-K
• Tensile Strength (Break): 6,000 to 10,000 psi

Description: 3M™ Scotch-Weld™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M™ Scotch-Weld™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing

• Viscosity: 40,000 to 80,000 cP
• Use Temperature: -70 to 300 F
• Industry: Aerospace, OEM / Industrial
• Features: Epoxy (EP)

Description: Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500°F and outstanding chemical resistance. This unique high performance epoxy adhesive compound can also

• Tensile Strength (Break): 2,200 psi
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
• Substrate Compatibility: Ceramic / Glass, Composites, Dissimilar Substrates, Metal, Plastic
• Features: Epoxy (EP), Flame Retardant (e.g. UL 94 Rated), Liquid, Non-corrosive Cure, Other, Powder, Specialty / Other, Unfilled

Description: excellent adhesive/sealant forming durable, flexibilized bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It has a wide service temperature range of -60°F to 250°F. EP30FLAO has a desirably low coefficient of themal expansion

• Viscosity: 10,000 to 15,000 cP
• Use Temperature: -60 to 275 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 17 µin/in-F

Description: ADHESIVE, EPOXY BASED, STRUCTURAL, 10 - 40 % EXPANDING, HEAT CURING, WELDABLE, IMPACT RESISTANT

Description: Adhesive, Modified Epoxy Moderate Heat Resistant, 120 Degrees C (250 Degrees F) Curing, Film Type

Description: Henkel Loctite EA 9462 is a two component, medium viscosity, impact resistant epoxy adhesive that can be cured either at room temperature or with heat. 50 mL Cartridge.

• Viscosity: 60,000 to 80,000 cP
• Features: Epoxy (EP)
• Substrate Compatibility: Metal, Plastic, Wood / Wood Product
• Cure / Technology: Two Component System

Description: This specification covers a modified epoxy adhesive in the form of supported film supplied in rolls or sheets.

Description: This specification covers a modified epoxy adhesive in the form of supported film supplied in rolls or sheets.

Description: 50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating

• Use Temperature: -40 to 446 F
• Thermal Conductivity: 1.38458784 W/m-K
• Coeff. of Thermal Expansion (CTE): 15.555555555555555 µin/in-F
• Tensile Strength (Break): 2,700 psi

Description: ResinLab EP750 Black is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids,

• Viscosity: 14,500 to 15,000 cP
• Tensile Strength (Break): 7,500 psi
• Elongation: 5 to 7 %
• Dielectric Strength: 410 kV/in

Description: ResinLab EP750 Clear is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids,

• Viscosity: 14,500 to 15,000 cP
• Tensile Strength (Break): 3,500 to 8,000 psi
• Elongation: 4 to 10 %
• Dielectric Strength: 410 kV/in

Description: ResinLab EP750 Black is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids,

• Viscosity: 14,500 to 15,000 cP
• Tensile Strength (Break): 7,500 psi
• Elongation: 5 to 7 %
• Dielectric Strength: 410 kV/in

Description: Technical Standard

Description: Technical Standard

Description: TAPE ADHESIVE, EPOXY BASED, STRUCTURAL, MEDIUM-EXPANDING HIGH TEMPERATURE HEAT CURING, WELDABLE, FLOW WASH RESISTANT ***TO BE USED WITH FORD WSS-M99P1111-A***

Description: LOCTITE ABLESTIK CE 3511PHV, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3511PHV electrically conductive adhesive is designed for circuit assembly applications. Electrically conductive One component Fast cure at high temperatures Long shelf life at room

• Viscosity: 62,500 cP
• Use Temperature: 302 F
• Features: Epoxy (EP)
• Cure / Technology: Single Component System

Description: 70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies,

• Viscosity: 85,000 cP
• Thermal Conductivity: 1.80284875 W/m-K
• Tensile Strength (Break): 14,500 psi
• Features: Die Bonding Adhesive / Compound, Encapsulating / Potting, Epoxy (EP), Filled, Room Temp. Cure / Vulcanizing, Thermal / Heat Conductive

Description: 70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat

• Use Temperature: -103 to 572 F
• Thermal Conductivity: 1.80284875 W/m-K
• Coeff. of Thermal Expansion (CTE): 2.5 µin/in-F
• Tensile Strength (Break): 14,500 psi

Description: effective only when the capsules are ruptured by shear and pressure stress and the adhesive is allowed to cure. Advantages Curing begins in about 10 minutes with full locking in 8 hours Controlled friction to improve joint tension Epoxy chemistry for robust structural bonding

• Use Temperature: -58 to 338 F
• Industry: Automotive, Military / Government (MIL-SPEC / GG)
• Substrate Compatibility: Metal

Description: identify what PSA or adhesive is best for an application, like mating substrate polymer type, surface contact, dwell time or potential environmental exposures. The success or failure of an adhesive is much more dynamic than simply the strength of the adhesive. Boyd is an

• Adhesive: Acrylic, Epoxy, Rubber, Silicone, Transfer
• Backing: Acrylic / Acrylate, Plastic / Polymer
• Features: Double-Sided Adhesive

Description: Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure.

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Encapsulating / Potting, Epoxy (EP)
• Cure / Technology: Single Component System, Thermosetting / Crosslinking

Description: The Struct Bond™ is a high adhesion, high heat resistant high-performance adhesive designed based on epoxy or silicone resin. Two types are available, a single-component heat-curing type and two-component mixed curing type, which can be selected based on the type

Description: UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good

• Viscosity: 4,500 cP
• Use Temperature: -58 to 392 F
• Tensile Strength (Break): 6,200 psi
• Dielectric Strength: 425.0000000000001 kV/in

Description: HERNON® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive”

• Viscosity: 300,000 to 800,000 cP
• Use Temperature: -65 to 300 F
• Thermal Conductivity: 0.808 W/m-K
• Coeff. of Thermal Expansion (CTE): 0.0003833333333333333 µin/in-F

Description: temperature curing eliminates the use of a heating oven during curing to allow easier and safer connection of conductive components or materials. G6E-RTC™ epoxy is an ideal choice for applications involving heat sensitive substrates. G6E-RTC™ epoxy is low cost (compared with

• Viscosity: 320,000 to 500,000 cP
• Use Temperature: 72 to 302 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other

Description: LOCTITE EDAG 5810 E&C, Two-component, Epoxy, Coating Adhesive LOCTITE® EDAG 5810 E&C two-component epoxy adhesive is designed to cure at ambient temperatures. Two component Room temperature cure Electrically conductive Thermally conductive High strength Heat

• Substrate: Metal
• Industry: OEM / Industrial
• Form: Transfer Tape

Description: Tuffbond® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond® 394 will change from amber-yellow to a reddish brown upon cure.

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Epoxy (EP), Specialty / Other
• Cure / Technology: Single Component System, Thermosetting / Crosslinking, Two Component System

Description: (Known as ECCOBOND 927-10 ) LOCTITE ABLESTIK 927-10 one component epoxy adhesive is designed for medical applications. It is also recommended for bonding, sealing or insulating heat sensitive parts. It is resistant to gamma sterilization.

• Industry: Electronics

Description: STYCAST EO2000HV one-component, oxide filled epoxy adhesive is designed to bond heat resistant plastics in applications requiring heat and chemical resistance. It is especially suited for use in harsh environments such as automotive applications.

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: anaerobic adhesives, polymer adhesives, instant adhesives, and more. Don’t see what you need? Be sure to reach out to our team to develop customized solutions to suit your unique application.

• Viscosity: 25,000 cP
• Features: Anaerobic, Electrically Conductive, Epoxy (EP)
• Industry: Automotive, Electronics
• Substrate Compatibility: Rubber / Elastomer

Description: make a non-stick, low coefficient of friction unit. It is important to use the correct temperature epoxy. The epoxy’s heat resistance must be matched to the application environment. If low temperature epoxy is used in a high temperature application, the epoxy will

• Dielectric Strength: 19,685,039.3700787 V/m
• Features: Abrasion / Scratch Resistant, Dielectric / Insulating
• Backing: Fluoropolymer, Plastic / Polymer

Description: removal Backing leaves a sharp paint line Silicone adhesives offer high heat resistance compared to many rubber and acrylic adhesives, reducing failure due to softening, oozing, and adhesive transfer Silicone adhesives adhere well to tough-to-stick-to surfaces like

• Width: 0.125 to 7 inches
• Peel Strength / Adhesion: 2.75 lbs/in
• Temperature Resistance: -17.77777777777778 to 204.44444444444443 C
• Adhesive: Acrylic, Pressure Sensitive (PSA), Silicone

Description: Diameter (Min) : 45 MM  [1.77 INCH ] Feedthrough Inside Diameter (Max) : 40.2 MM  [1.58 INCH ] Recovered Inside Diameter (Max) : 16.8 MM  [.66 INCH ] Thread Length : 48 MM  [1.89 INCH ] Mechanical Attachment Mounting Style : Bulkhead Screw & Hole Thread Size : M48 x 1.5 Other Adhesive Type :

• Features: Electrical, Other