Products & Services
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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and
- Use Temperature: -40 to 392 F
- Thermal Conductivity: 0.92 W/m-K
- Features: Air Setting / Film Drying, Specialty / Other, Thermally Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Newark, An Avnet Company
Description: HEAT SINK COMPOUND, JAR, 0.23KG; Dispensing Method:Jar; Volume:-; Weight:0.23kg; Product Range:-; SVHC:No SVHC (15-Jan-2019); Coating Type:Conductive; Colour:Opaque White; Material Composition:Silicon oil; Operating Temperature RoHS Compliant: Yes
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Supplier: Richardson RFPD
Description: The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001 in film with an area
- Features: Thermally Conductive
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Supplier: Allied Electronics, Inc.
Description: Heat Sink, 2.350 Specific Gravity Silicone Heat Sink Compound, Odorless, 1 Fl. Oz Tube All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons
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Supplier: Allied Electronics, Inc.
Description: high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by
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Supplier: Allied Electronics, Inc.
Description: Wrist Strap Ground Cords, Ground Cord Zinc oxide filled silicone grease with heat transfer properties. Does not soften under elevated temperatures. Will not dry and harden. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons
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Supplier: Newark, An Avnet Company
Description: HEAT SINK COMPOUND, TUBE, 4OZ; Dispensing Method:Tube; Volume:-; Weight:4oz; Product Range:-; Coating Applications:Heat Sinks, Power Transistors; Coating Type:Conductive; Colour:White RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: HEAT SINK COMPOUND, SYRINGE, 10G ROHS COMPLIANT: YES
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Supplier: Allied Electronics, Inc.
Description: Wrist Strap Ground Cords, Ground Cord Non-contaminating Synthetic-Ester based, capable of moving 46% more heat than other compounds. Meets Belcore spec. K521334 and Mil spec. C-47113. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons
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Supplier: Newark, An Avnet Company
Description: HEAT SINK COMPOUND, TUBE, 100G; Dispensing Method:Tube; Volume:-; Weight:100g; Product Range:- RoHS Compliant: Yes
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Supplier: Computer Network Accessories, Inc.
Description: Single application heatsink compound; White. 1 oz. soft pack. -40~204 (degrees C); Thermal Conductivity: 0.0009.
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Description: CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application and
- Use Temperature: 320 F
- Thermal Conductivity: 45 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 10 %
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Description: CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application and
- Use Temperature: 320 F
- Thermal Conductivity: 30 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 20 %
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Supplier: Wacker Chemical Corp.
Description: and +180 °C primerless adhesion Application versatile interface material for heat sink applications for the electronics industry thermally conductive adhesive material applicable as thin interface layer between PCB and metal housings of electric control units heat ablation in
- Viscosity: 25,000 to 120,000 cP
- Thermal Conductivity: 0.8 W/m-K
- Tensile Strength (Break): 580.147357428788 psi
- Elongation: 90 %
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in²/W at 30psi. ◆ Minimum interface
- Use Temperature: 302 F
- Thermal Conductivity: 1 W/m-K
- Industry: Electronics
- Form / Shape: Grease / Paste
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Supplier: Fujipoly® America Corp.
Description: most of surfaces, shapes, and sizes of components. Sarcon® SPG-20A makes complete and reliable physical contact with the component and opposing surfaces. It provides handling properties that are superior to thermal grease & potting materials. Thermal transfer from heat
- Use Temperature: -40 to 302 F
- Thermal Conductivity: 2 W/m-K
- Industry: Electronics, Semiconductors / IC Packaging
- Form / Shape: Gap Filling Compound
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Supplier: Fujipoly® America Corp.
Description: most of surfaces, shapes, and sizes of components. Sarcon® SPG-50A makes complete and reliable physical contact with the component and opposing surfaces. It provides handling properties that are superior to thermal grease & potting materials. Thermal transfer from heat
- Use Temperature: -40 to 302 F
- Thermal Conductivity: 5 W/m-K
- Industry: Electronics, Semiconductors / IC Packaging
- Form / Shape: Gap Filling Compound
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Supplier: Richardson RFPD
Description: The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is
- Height: 12.699993142003704 mm
- Thermal Resistance: 12 °C / W
- Features: Other
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Supplier: Rego Electronics Inc.
Description: A vapor chamber is a high-end thermal management device that can rapidly spread heat from a small source to a large platform of area. A properly designed vapor chamber with heat sink can improve the thermal performance by 10- 30% over copper, and heat pipe
- Length: 400 mm
- Width: 400 mm
- Height: 3 mm
- Device: Vapor Cooler
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Supplier: FX PCB Co., Ltd.
Description: problem with the dissipation of heat loss from processors. There are various ways to connect a heat sink to the heat source. A separate metal heat sink must be made to fabricate a heat sink PCB. Then, producers will affix this heat
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Supplier: RS Components, Ltd.
Description: Heat Sink Compound tube 100g
- Thermal Conductivity: 0.41 W/m-K
- Form / Shape: Grease / Paste
- Features: Thermally Conductive
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Supplier: Techsil Limited
Description: MG Chemicals 860 Silicone Heat Transfer Compound is a low thermal resistance grease with a silicone base. It is electrically insulating, non-corrosive and used to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and
- Composition / Chemistry: Silicone
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Supplier: Boyd
Description: Aavid, Thermal Division of Boyd Corporation provides solutions and services across all industries, utilizing both traditional cooling solutions and breakthrough technologies ranging from standard heat sinks to fully custom two phase or liquid systems. Aavid, Thermal
- Form / Shape: Gap Filling Compound, Pad
- Features: Thermal / Heat Conductive, Thermal / Heat Insulating
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Supplier: Ohmite Manufacturing Co.
Description: makes the TL Series easily adaptable to most heat sink systems. Thermal compound is always recommended when heat sinking. Power rating 275 watts with proper heatsink Resistance range 0.3-4 meg ohms 10 % Tolerance standard, others available TCR 250ppm 0.25 inch
- Resistance Range: 0.3 to 4,000,000 ohms
- Power Rating: 26.99999999999997 to 274.99999999999966 watts
- Operating DC Voltage: 1,200 volts
- Dielectric Strength: 2.5 kilovolts
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 4000, High Performance Thermal Interface Compound for Copper-Based Heat Sinks BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based
- Features: Thermal / Heat Conductive
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Description: The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing shock
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 5 W/m-K
- Dielectric Constant (Relative Permittivity): 7.5
- Industry: Electronics
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Supplier: Epoxies Etc...
Description: 50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability.
- Thermal Conductivity: 1.1538232 W/m-K
- Electrical Resistivity: 2,000,000,000,000,000 ohm-cm
- Dielectric Strength: 209.99999999999991 kV/in
- Dielectric Constant: 5
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Supplier: Henkel Corporation - Industrial
Description: formulated to provide a balance of cured material properties highlighted by low modulus and good compression set (memory). The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or
- Thermal Conductivity: 1 W/m-K
- Dielectric Constant (Relative Permittivity): 0.005
- Form / Shape: Gap Filling Compound
- Features: Thermally Conductive
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Supplier: MacDermid Alpha Electronics Solutions
Description: Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. Product Overview HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal
- Use Temperature: 266 F
- Thermal Conductivity: 0.9 W/m-K
- Industry: Electronics, Semiconductors / IC Packaging
- Form / Shape: Grease / Paste
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Supplier: Henkel Corporation - Electronics
Description: Conductivity: 5.0 W/m-K High-compliance, low compression stress Fiberglass reinforced for shear and tear resistance Typical Applications Include Telecommunications ASICs and DSPs Consumer electronics Thermal modules to heat sinks
- Industry: Electronics
- Form / Shape: Gap Filling Compound, Pad
- Features: Thermal Compound / Interface (Thermally Conductive)
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Thermal Compounds and Thermal Interface Materials - Single Component Thermally Conductive -- 50-3120Supplier: Epoxies Etc...
Description: 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications.
- Use Temperature: 752 F
- Thermal Conductivity: 1.1538232 W/m-K
- Tensile Strength (Break): 7,500 psi
- Form / Shape: Die Bonding Adhesive / Compound, Grease / Paste
Find Suppliers by Category Top
Featured Products Top
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. Designs will vary but in essence all involve some form of heat sink to dissipate the heat away from the active components. It is the interface between the heat sink and component that calls for the use of thermal transfer compounds - without their use any air gaps that exist will act as an (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
Newest Silicone Gap Filler Transfers Heat and Absorbs Electromagnetic Waves Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
ideal balance of softness and rigidity, offer an innovative solution for heat management in automotive wireless chargers. Compared to metal heat sinks, thermal conductive silicone pads are lightweight, thin, and flexible, allowing them to adhere tightly to heat-generating areas for seamless (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Thermal materials are innovative solutions designed to address heat transfer issues. They function between heat sources and heat sinks to enhance thermal conductivity, improve cooling efficiency, and ensure optimal device performance. There are various types of thermal materials, including (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
heat sink hinder the transfer of heat,thereby affecting the cooling performance. Silicone insulator pads are silicone polymer elastomers reinforced with fiberglass as the base material.These pads effectively reduce the thermal resistance between electronic components and heat sinks while (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
combine heat conduction, flexibility, and electrical insulation in one material. In wireless chargers, thermal silicone pads help bridge the gap between heat (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
High-performance CPUs and GPUs generate significant heat, and effective cooling depends on more than just the heatsink. Thermal paste plays a key role by filling the tiny air gaps between the chip and the heat sink, helping heat move out of the component more efficiently. This formula is (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
-suited for environments with operating temperatures ranging from -40 to +150°C. When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
any size or proprietary shape for the perfect component fit. Once installed, the uniquely formulated silicone rubber material efficiently transfers heat from a heat-generating electronic component to a nearby heat sink. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp.
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
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Thermal Grease vs Thermal Pad
Thermal grease is a thermally conductive compound designed to be used as an interface between heat sinks and heat sources. The main purpose of thermal grease is to eliminate air gaps or micro spaces between the heat sink and heat source. The top surface of a heat source is not perfectly flat.
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What are Thermal Interface Materials (TIMs)
Thermal Interface Materials (TIMs) or Thermal Compounds, is a general reference used to describe any material used between two parts to improve the thermal transfer between those two parts. A thermal interface material (TIM) is inserted between the heat source and the heat dissipation device (e.g.
More Information Top
Indicates content that may require registration and/or purchase.
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Heat Sink - Heat Sink Manufacturers, Suppliers
Silicone Heat Sink Compound Thermal Paste .
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Multiwalled Carbon Nanotube Nanofluid for Thermal Management of High Heat Generating Computer Processor
The heat sinks were mounted on the top of the heated copper block and a heat sink thermal compound was applied between the two surfaces in order to ensure an excellent thermal contact.
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Utility-scale grid-tied PV inverter reliability workshop summary report.
Interconnects IGBT IGBT drive circuitry Electrolytic Capacitor breakdown Transformers Filter Capacitors Filter Inductors Control Circuit Board DC disconnect AC disconnect Fans Liquid cooling loop Heat sink Thermal compound breakdown Thermal measurement circuitry Solder Fatigue Film capacitors Power supply Voltage sense circuitry AC/DC…
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Reliability metrics for IGBT power modules
Heat Sink Thermal Compound .
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CR4 - Thread: Thermal Glue Replacement
Can anyone suggest what brand of thermal heat sink compound best suits my tx1000?
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Cryogenic packaging for multi-GHz electronics
No thermal heat sinking compounds or greases were used.
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ARS | Publication request: Soil Heat Flux Plates: Heat Flow Distortion and Thermal Contact Resistance
Individual experiments determined plate thermal conductivities and measured the effect of air gaps and thermal heat sink compound on plate performance.
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Spatial Characterization of Piezoelectric Materials Using the Scanning Laser Intensity Modulation Method (LIMM)
Figure 3(b) shows a photo of the thermal heat sink compound after removal of the soldering iron, and Fig. 3(a) shows the subsequent LIMM scan at a frequency of 97 Hz.
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Laboratory simulation of infrared astrophysical features
The grains were heated using a soldering iron heating element against which the substrates were cemented with thermal heat sink com- pound .
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Scalar fluxes from urban street canyons. Part I: Laboratory simulation
Depending on the experiment, the street, wall or roof surface was coated with a thermal heat sink compound and sprinkled with finely ground naphthalene powder.