Products & Services
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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and
- Chemical / Polymer System Type: Specialty / Other
- Composition: Unfilled
- Cure Type / Technology: Single Component System
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Rego Electronics Inc.
Description: A vapor chamber is a high-end thermal management device that can rapidly spread heat from a small source to a large platform of area. A properly designed vapor chamber with heat sink can improve the thermal performance by 10- 30% over copper, and heat pipe
- Device: Vapor Cooler
- Height: Up to 3 mm
- Length: Up to 400 mm
- Width: Up to 400 mm
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Supplier: Richardson RFPD
Description: The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001 in film with an area
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001 in film with an area
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of
- Compound Type: Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Techspray Silicone Free Heat Sink Compound is used to cool thermistors, calrods, thermocouple wells, and other electrical components. It is non-ozone depleting, easy to apply, and will not harden, separate, or crack. 4 oz Tube.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 0.7000 W/m-K
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Supplier: Boyd
Description: services in the industry. Aavid, Thermal Division of Boyd Corporation provides solutions and services across all industries, utilizing both traditional cooling solutions and breakthrough technologies ranging from standard heat sinks to fully custom two phase or liquid systems.
- Material Type: Gap Filling Compound, Pad
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Supplier: Computer Network Accessories, Inc.
Description: Single application heatsink compound; White. 1 oz. soft pack. -40~204 (degrees C); Thermal Conductivity: 0.0009.
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Dielectric Strength: 210 kV/in
- Thermal Conductivity: 0.6700 W/m-K
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Dielectric Strength: 210 kV/in
- Thermal Conductivity: 0.6700 W/m-K
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Description: CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ? Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ? Available in various thicknesses from 0.3 to 12.0 mm. ? Features natural tackiness for
- Dielectric Strength: 0.0025 kV/in
- Elongation: 10 %
- Industry: Electronics
- Material Type: Pad
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Description: CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ? Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ? Available in various thicknesses from 0.3 to 12.0 mm. ? Features natural tackiness for
- Dielectric Strength: 0.0025 kV/in
- Elongation: 20 %
- Industry: Electronics
- Material Type: Pad
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Supplier: Xoxide
Description: ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material BERGQUIST® GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like”
- Chemical / Polymer System Type: Silicone
- Material Type: Gap Filling Compound
- Thermal Conductivity: 0.1000 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, BERGQUIST GAP
- Chemical / Polymer System Type: Silicone
- Material Type: Gap Filling Compound
- Thermal Conductivity: 0.2000 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Wacker Chemical Corp.
Description: flowable almost constant properties between -40 °C and +180 °C primerless adhesion Application versatile interface material for heat sink applications for the electronics industry thermally conductive adhesive material applicable as thin interface layer between PCB and metal
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Elongation: 90 %
- Features: Electrical Insulation / Dielectric
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Supplier: Fujipoly® America Corp.
Description: transfer from heat generating device to heat spreader or heat sink. FEATURES: Fill large gaps while providing superior thermal transfer. Conformable with very low compression forces. Excellent vibration absorption capabilities. Maintains all
- Chemical / Polymer System Type: Silicone
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Gap Filling Compound
- Thermal Conductivity: 5 W/m-K
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Supplier: Fujipoly® America Corp.
Description: transfer from heat generating device to heat spreader or heat sink. FEATURES: Fill large gaps while providing superior thermal transfer. Conformable with very low compression forces. Excellent vibration absorption capabilities. Maintains all
- Chemical / Polymer System Type: Silicone
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Gap Filling Compound
- Thermal Conductivity: 2 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: adjacent metal case or heat sink. Options and Configurations Spacer Beads - No spacer beads, 0.007" spacer beads Pot Life - 15 min Cartridges - 50cc, 400cc Kits - 1200cc, 10 gallon Custom made configurations available upon request Benefits
- Dielectric Constant (Relative Permittivity): 0.0050
- Material Type: Gap Filling Compound
- Thermal Conductivity: 1 W/m-K
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Industry: Electronics
- Material Type: Grease / Paste
- Thermal Conductivity: 1 W/m-K
- Use Temperature: Up to 302 F
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Supplier: Henkel Corporation - Industrial
Description: material provides a balance of cured material properties and good compression set (memory). The result is a soft, form-in place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure
- Dielectric Constant (Relative Permittivity): 0.0070
- Material Type: Gap Filling Compound
- Thermal Conductivity: 2 W/m-K
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Sandy Bridge EP/EX Processors (for Narrow ILM Mounting Only) up to TDP 150 Watts CPU Socket : 2011 (Narrow Type, 56 x 94mm mounting pitch) Solution : New innovation 60x60x28mm PWM fan, Copper heatsink with pre-print Shin-Etsu G751 thermal compound for 2U Server
- Device: Active Heat Sink
- Fan Airflow: 40.5 SCFM
- Fan Noise: 47.5 dB
- Fan Speed: 7000 rpm
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 11.67 to 52.78 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.95
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ SC 102 Thermally Conductive Compound White is a one component, non-curing, silicone paste that is used to gap fill material between heat sinks and electronic heat sources. It offers low bleed, high temperature stability and thermal conductivity.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Dielectric Strength: 210 kV/in
- Thermal Conductivity: 0.8000 W/m-K
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 8.33 to 35.56 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.22
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Supplier: Hernon Manufacturing, Inc.
Description: Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Industry: Electronics, Electrical Power / HV, Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Material Type: Specialty / Other
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Thermal Compounds and Thermal Interface Materials - Single Component Thermally Conductive -- 50-3120Supplier: Epoxies Etc...
Description: 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Industry: Electronics
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Supplier: Hernon Manufacturing, Inc.
Description: Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap.
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Industry: Electronics, Electrical Power / HV, Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
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Supplier: Henkel Corporation - Electronics
Description: , Low Modulus Material Features And Benefits Thermal Conductivity: 5.0 W/m-K High-compliance, low compression stress Fiberglass reinforced for shear and tear resistance Typical Applications Include Telecommunications ASICs and DSPs Consumer electronics Thermal modules to heat
- Industry: Electronics
- Material Type: Gap Filling Compound, Pad
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.22 to 106 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Silicone
- Dielectric Strength: 381 kV/in
- Features: UL Approved
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Supplier: Techsil Limited
Description: MG Chemicals 860 Silicone Heat Transfer Compound is a low thermal resistance grease with a silicone base. It is electrically insulating, non-corrosive and used to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and
- Chemistry / Constituents: Silicone
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Supplier: Fujipoly® America Corp.
Description: When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving
- Applied Thickness / Gap Fill: 0.0118 to 0.0787 inch
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 7.97 to 9.44
- Dielectric Strength: 178 kV/in
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 32.78 to 120 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.42
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Supplier: Fujipoly® America Corp.
Description: SARCON® SPG-25B-NS from Fujipoly® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m°K and a thermal resistance of only 2.1°K•cm2/W. When applied between heat-generating components and a nearby heat
- Industry: Electronics
- Material Type: Grease / Paste, Gap Filling Compound
- Thermal Conductivity: 2.5 to 25 W/m-K
- Use Temperature: -40 to 248 F
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Supplier: Wacker Chemical Corp.
Description: /mK Low minimum bond line thickness (90-100 µm) Emphasized thermal stability in cured state Primerless adhesion to metal, Al, based heat sinks, to ceramics, FR4. Flexibility in application method superior dispensing performance, screen printability suitable for automated bonding
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 8.33 µin/in-F
- Composition: Single Component System, Filled
- Dielectric Strength: 279 kV/in
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Supplier: MacDermid Alpha Electronics Solutions
Description: Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. Product Overview HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal
- Chemical / Polymer System Type: Silicone
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Grease / Paste
- Thermal Conductivity: 0.9000 W/m-K
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Industry: Electronics
- Material Type: Grease / Paste
- Thermal Conductivity: 4 W/m-K
- Use Temperature: Up to 302 F
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Supplier: FX PCB Co., Ltd.
Description: performance and offer a cheap fix for thermal problems. Using heat sink PCBs will guarantee that your product works without fans or other cooling devices. The PCB’s thermal performance is achieved by transferring the heat produced by the components over time
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound, Die Bonding Adhesive / Compound
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Supplier: Shiu Li Technology Co., Ltd
Description: fiberglass materials increase the strength of its structure making it cut resistant. DCTP140-s is the best choice for high torque screw setting. It functions well with electrical isolative of high power electronic component and the heat sink.
- Applied Thickness / Gap Fill: 0.0098 to 0.0177 inch
- Chemical / Polymer System Type: Silicone
- Dielectric Strength: 4 to 6 kV/in
- Features: Electrical Insulation / Dielectric, UL Approved
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Supplier: Epoxies Etc...
Description: 50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability.
- Chemical / Polymer System Type: Silicone
- Dielectric Constant: 5
- Dielectric Strength: 210 kV/in
- Electrical Resistivity: 2.00E15 ohm-cm
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound
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Supplier: Shiu Li Technology Co., Ltd
Description: insulation and fiberglass materials increase the strength of its structure making it cut resistant. SH1500/2000/3000 is the best choice for high torque screw setting. It functions well with electrical isolative of high power electronic component and the heat sink.
- Applied Thickness / Gap Fill: 0.0091 to 0.0138 inch
- Chemical / Polymer System Type: Silicone
- Features: UL Approved
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 7.22 to 8.33 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Master Bond, Inc.
Description: thermal conductivity measures 10 BTU•in/ft²hr°F. The volume resistivity exceeds 10x1012 ohm cm. This superior thermally conductive film product is widely employed for bonding electronic components to heat sinks along with adhering substrates into microelectronic packages.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.06E-5 to 1.22E-4 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Nehalem-EX Xeon® Processor 7500 Series CPU Socket : 1567 Solution : Copper passive heatsink with pre-print Shin-Etsu G751 thermal compound for 1U server
- Height: 26.5 mm
- Length: 90 mm
- Material: Copper
- Weight: 490 g
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Featured Products Top
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. Designs will vary but in essence all involve some form of heat sink to dissipate the heat away from the active components. It is the interface between the heat sink and component that calls for the use of thermal transfer compounds - without their use any air gaps that exist will act as an (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
Newest Silicone Gap Filler Transfers Heat and Absorbs Electromagnetic Waves Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
ideal balance of softness and rigidity, offer an innovative solution for heat management in automotive wireless chargers. Compared to metal heat sinks, thermal conductive silicone pads are lightweight, thin, and flexible, allowing them to adhere tightly to heat-generating areas for seamless (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Thermal materials are innovative solutions designed to address heat transfer issues. They function between heat sources and heat sinks to enhance thermal conductivity, improve cooling efficiency, and ensure optimal device performance. There are various types of thermal materials, including (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
heat sink hinder the transfer of heat,thereby affecting the cooling performance. Silicone insulator pads are silicone polymer elastomers reinforced with fiberglass as the base material.These pads effectively reduce the thermal resistance between electronic components and heat sinks while (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
combine heat conduction, flexibility, and electrical insulation in one material. In wireless chargers, thermal silicone pads help bridge the gap between heat (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
High-performance CPUs and GPUs generate significant heat, and effective cooling depends on more than just the heatsink. Thermal paste plays a key role by filling the tiny air gaps between the chip and the heat sink, helping heat move out of the component more efficiently. This formula is (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
-suited for environments with operating temperatures ranging from -40 to +150°C. When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
temperature can affect performance, accuracy, and safety. This is where thermal materials play an important role. Between a heat source and a heat sink, small air gaps can reduce heat transfer efficiency. Thermal pads, gels, pastes, phase-change materials (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd.
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
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Thermal Grease vs Thermal Pad
Thermal grease is a thermally conductive compound designed to be used as an interface between heat sinks and heat sources. The main purpose of thermal grease is to eliminate air gaps or micro spaces between the heat sink and heat source. The top surface of a heat source is not perfectly flat.
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What are Thermal Interface Materials (TIMs)
Thermal Interface Materials (TIMs) or Thermal Compounds, is a general reference used to describe any material used between two parts to improve the thermal transfer between those two parts. A thermal interface material (TIM) is inserted between the heat source and the heat dissipation device (e.g.
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Heat Sink - Heat Sink Manufacturers, Suppliers
Silicone Heat Sink Compound Thermal Paste .
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Multiwalled Carbon Nanotube Nanofluid for Thermal Management of High Heat Generating Computer Processor
The heat sinks were mounted on the top of the heated copper block and a heat sink thermal compound was applied between the two surfaces in order to ensure an excellent thermal contact.
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Utility-scale grid-tied PV inverter reliability workshop summary report.
Interconnects IGBT IGBT drive circuitry Electrolytic Capacitor breakdown Transformers Filter Capacitors Filter Inductors Control Circuit Board DC disconnect AC disconnect Fans Liquid cooling loop Heat sink Thermal compound breakdown Thermal measurement circuitry Solder Fatigue Film capacitors Power supply Voltage sense circuitry AC/DC…
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Reliability metrics for IGBT power modules
Heat Sink Thermal Compound .
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CR4 - Thread: Thermal Glue Replacement
Can anyone suggest what brand of thermal heat sink compound best suits my tx1000?
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Cryogenic packaging for multi-GHz electronics
No thermal heat sinking compounds or greases were used.
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ARS | Publication request: Soil Heat Flux Plates: Heat Flow Distortion and Thermal Contact Resistance
Individual experiments determined plate thermal conductivities and measured the effect of air gaps and thermal heat sink compound on plate performance.
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Spatial Characterization of Piezoelectric Materials Using the Scanning Laser Intensity Modulation Method (LIMM)
Figure 3(b) shows a photo of the thermal heat sink compound after removal of the soldering iron, and Fig. 3(a) shows the subsequent LIMM scan at a frequency of 97 Hz.
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Laboratory simulation of infrared astrophysical features
The grains were heated using a soldering iron heating element against which the substrates were cemented with thermal heat sink com- pound .
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Scalar fluxes from urban street canyons. Part I: Laboratory simulation
Depending on the experiment, the street, wall or roof surface was coated with a thermal heat sink compound and sprinkled with finely ground naphthalene powder.