Products & Services
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Supplier: Douglas Electrical Components
Description: integrate it into the circuit board or flex circuit offering a moisture tight seal as well as connector headers and receptacles. CircuitSeal hermetic packages create cost-effective solutions be enabling customers to use smaller mechanical packages to protect electronics. The
- Additional Services: Design Assistance
- Industry: Electrical / Electronics, Military / Law Enforcement
- Location: North America, United States Only, Northeast US Only
- Sealing Method Capabilities: Epoxies
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Supplier: Douglas Electrical Components
Description: StudSeal™ hermetic terminal seals provide a secure barrier for high current or high voltage transfers in sealed environments. Our products are designed for high vacuum and pressure applications, including air conditioning and refrigeration compressors, semiconductor processing
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Supplier: Douglas Electrical Components
Description: StudSeal™ hermetic terminal seals provide a secure barrier for high current or high voltage transfers in sealed environments. Our products are designed for high vacuum and pressure applications, including air conditioning and refrigeration compressors, semiconductor processing
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Supplier: Douglas Electrical Components
Description: StudSeal™ hermetic terminal seals provide a secure barrier for high current or high voltage transfers in sealed environments. Our products are designed for high vacuum and pressure applications, including air conditioning and refrigeration compressors, semiconductor processing
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Supplier: Palomar Technologies, Inc
Description: , which can load parts onto the wire bonder while it is bonding. High Vacuum Furnace Applications MEMS Package Sealing Infrared Sensor Package Sealing Crystal Oscillator Package Sealing Hermetic Package Sealing Wafer Level Packaging Void-Free Eutectic Die
- Coating System Type: Factory / Free Standing
- Features: Integral Process Controller?
- Technology / Process: Other
- Vacuum / Pressure Range: High Vacuum (< 10-3, >10-8 torr)
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Supplier: ProPhotonix, Ltd.
Description: Receptacle Packaged laser diodes are suitable for OEM applications ranging from scientific equipment and optical instruments requiring a laser diode light source to visual fibre optic fault locators for communications networks, telecomms systems and instrumentation and free space
- Laser Output: Continuous Wave
- Laser Type: Alignment Lasers, Laser Diodes
- Laser Wavelength: Red
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Supplier: ValueTronics International, Inc.
Description: The 83440C is a Lightwave Converter from Agilent. Additional Features: Fast 22 ps Full-Width Half-Max (FWHM) pulse response Broad 20 GHz bandwidth (3 dB opt) Small, convenient package Low pulse aberrations Integral bias regulation
- Form Factor: Hand Held
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Supplier: ASTM International
Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks
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Supplier: ASTM International
Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks
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Supplier: Sunstone Engineering
Description: AC Resistance Seam Welders are used to complete AC Resistance welds. These would include both spot welds and seam welds. Ideal for creating a continuous seam weld, foil welding, Pouch cell welding, and mesh or screen welding. The primary applications include the creation of hermetic seal with
- Equipment Type: Welding Equipment
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Supplier: AMADA Weld Tech
Description: . Whether hermetically sealing microelectronic packages or joining a variety of metal parts, Pulsar’s broad range of precision power choices provide technically advanced process solutions. Pulsar can be easily integrated into atmospheric enclosures to insure high yield hermetic
- Brazing & Soldering: Other Brazing / Soldering Unit
- Equipment Type: Welding Equipment
- Frictional / Specialty Processes: Other Welding Processes
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Supplier: ASTM International
Description: 1.1 This test method applies to hermetic package leak testing to detect leaks of a broad spectrum in size with a minimum detection level equal to the sensitivity of the helium mass spectrometer equipment used in the test.
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Supplier: ASTM International
Description: 1.1 This test method applies to hermetic package leak testing to detect leaks of a broad spectrum in size with a minimum detection level equal to the sensitivity of the helium mass spectrometer equipment used in the test. 1.2 This standard does not purport to address all of the
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Supplier: Sunstone Engineering
Description: current while applying force from an electrode. Our seam sealer systems allow users to hermetically seal components in an air tight package that ensure part integrity for long periods of time. We offer fully-automated and semi-automated seam sealer systems with either nitrogen-filled
- Applications & Materials Processed: Semiconductor Manufacturing
- Coating System Type: Other
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Supplier: AMADA Weld Tech
Description: systems ensure reliable weld spot overlap resulting in superior hermeticity. In addition, tooling, optimized stage configuration, and innovative focus head mounting add value to system functionality. The systems are perfectly suited for laser welding sensitive electronic packages such
- Automation / Control: Manual Workstation
- Laser Output Power: 5 to 600 watts
- Laser Type: Nd:YAG / Solid State
- Materials Processed: Metal / Conductive Materials
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Supplier: Richardson RFPD
Description: 30 GHz Broadband Amplifier Module. The UA0L30VM Amplifier is a general-purpose broadband amplifier designed for microwave communications, test equipment, and military systems. Its small size and exceptional performance make it a versatile gain block which can improve power and gain in a
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Supplier: OSI Optoelectronics
Description: OSI Laser Diode, Inc.’s High Power SMF coupled laser modules are designed to meet the performance demands of the optical test equipment marketplace. The high peak optical power SCW Series lasers serve 1310nm through 1650nm wavelengths and are available in fully hermetic laser welded
- CDRH Classification: Class IIIb
- Features: Fiber Pigtailed, Thermoelectric Cooling
- Laser Output: Pulsed
- Laser Power: 180 milliwatts
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Supplier: Richardson RFPD
Description: hermetically sealed package potentially replacing 2 or 3 narrower band amplifiers. The UA0L65VM provides a complete amplifier module package with a wide frequency range of 100 kHz to 65 GHz, low power dissipation, ample output power, low noise figure and gain control.
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Supplier: OSI Optoelectronics
Description: Features High Reliability and Long Life High Efficiency and Low Drive Currents Stable Output from -40°C to +80°C Single and Stacked Devices up to 140 Watts 905 nm Wavelength Hermetic Package Custom Packaging Available
- CDRH Classification: Class IIIb
- Fiber Pigtailed: Yes
- Laser Output: Pulsed
- Laser Power: 2000 to 100000 milliwatts
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Supplier: Hamamatsu Photonics Europe
Description: nm - Spectral resolution: 15 nm max. - Hermetic package: High reliability against humidity - Installation into mobile measurement equipment - Wavelength conversion factor is listed on test result sheet.
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Supplier: OSI Optoelectronics
Description: OSI Laser Diode, Inc.‘s (LDI) PINFET provides an excellent solution for optical receiver systems that require both high sensitivity and wide dynamic range. Applications include telecommunication line-terminating equipment or repeaters and optical sensor systems. The receiver package
- Amplifier Type: Transimpedance
- Bandwidth: 3 to 250 MHz
- Cable Type: Single Mode / Multimode
- Connector Type: FC, LC, SC, ST, Other
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Description: -5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with
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Description: IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical
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Supplier: Hamamatsu Photonics Europe
Description: compact devices. Features - Fingertip size: 20.1 × 12.5 × 10.1 mm - Weight: 5 g - Spectral response range: 340 to 850 nm - High sensitivity - Spectral resolution: 15 nm max. - Supports synchronized integration (electronic shutter function) - For integration into mobile measurement equipment -
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Supplier: Richardson RFPD
Description: MACOM's SW-283-PIN is a GaAs MMIC transfer switch package in lead-free, surface mount CR-4 ceramic style packages. SW-283-PIN offers low insertion loss, high isolation, and fast switching. This ceramic switch platform has a common footprint for all three designs. The CR-4
- Actuator Type: Other
- Frequency Range: 0.0 to 3000 MHz
- Insertion Loss: 1.8 dB
- Isolation (Port to Port): 40 dB
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Supplier: Richardson RFPD
Description: monotonic with respect to control voltage. The control port has a modulation bandwidth of 50 MHz. The low insertion loss and extremely robust packaging enable this part to be used in a wide range of applications including the phase adjustment of clocks in fiber optic systems and test
- Frequency Range: 6000 to 15000 MHz
- Insertion Loss: 7 dB
- Package Type: Connectorized, Other
- Phase Shift Range: Other
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Supplier: Silicon Designs, Inc.
Description: Model 1527 MEMS DC Accelerometer combines two patented capacitive silicon sense elements and a precision, custom CMOS integrated circuit in a hermetically sealed LCC package. The differential output voltage of the MEMS accelerometer is converted on the PCB into a current proportional
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Supplier: Silicon Designs, Inc.
Description: MEMS DC accelerometer combines two patented capacitive silicon sense elements and a precision, custom CMOS integrated circuit in a hermetically sealed LCC package. The differential output voltage of the MEMS accelerometer is converted on the PCB into a current proportional to the
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Supplier: Amphenol Aerospace Corporation
Description: The Amphenol® Energy Shunting Assembly (ESA) is a simple, compact unit which provides lightning and electromagnetic pulse (EMP) protection of systems in which many signal lines enter sensitive electronic equipment. The effcient packaging of the ESA circumvents the concept of one
- Category: Military Connector
- Coupling / Adapter: Yes
- Gender: Male / Plug, Female / Jack
- Geometry: Straight
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Supplier: Rieker, Inc.
Description: Normally Open or Closed Output Lamp / Buzzer / Solenoid Driver Single Supply Input (8-30VDC) Reverse Polarity Protection Output Short Circuit Protected High Current-Sink Capability Inductive Load Protection -40°C to +75°C Operating Temperatures Rugged Hermetic Packaging Shockproof to
- Number of Axes: 2
- Operating Temperature: -40 to 167 F
- Output: Other
- Tilt Angle: -55 to 90 degrees
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Supplier: ACE Controls Inc.
Description: . Self-compensating shock absorbers react to changing energy conditions, without adjustment. These self compensating miniature shock absorbers are capable of universal mounting even inside a cylinder. These shocks are ideal for use in multitude of applications including material handling
- Absorber Stroke: 1 inch
- Body Material: Stainless Steel, Steel
- Dampening Method: Hydraulic
- Energy per Cycle: 1200 In-lbs
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Supplier: Glenair, Inc.
Description: environmental requirements of commercial and military aerospace (temperature extremes, vibration and shock, EMI shielding, hermetic packaging and so on) are not adequately addressed by commercial-off-the-s helf fiber optic interconnects and transceiver/receiver assemblies. Many other
- Data Rate: 1000 to 10000 Mbps
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Supplier: Glenair, Inc.
Description: environmental requirements of commercial and military aerospace (temperature extremes, vibration and shock, EMI shielding, hermetic packaging and so on) are not adequately addressed by commercial-off-the-s helf fiber optic interconnects and transceiver/receiver assemblies. Many other
- Form Factor: Module
- Primary Network: Other
- Secondary Network: Other
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Supplier: Glenair, Inc.
Description: environmental requirements of commercial and military aerospace (temperature extremes, vibration and shock, EMI shielding, hermetic packaging and so on) are not adequately addressed by commercial-off-the-s helf fiber optic interconnects and transceiver/receiver assemblies. Many other
- Form Factor: Module
- Primary Network: Other
- Secondary Network: Other
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Supplier: Silicon Designs, Inc.
Description: -to-medium frequency instrumentation applications, ranging from DC to 2000 Hz, and including both center of gravity acceleration measurements and equipment calibrations. ?The SDI Model 2290 incorporates SDI's hermetically sealed, low noise, Model 1527 MEMS DC Inertial-Grade surface
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Supplier: Littelfuse, Inc.
Description: environmental or thermal conditions. Their uniform dimensions make them especially suitable for use with automatic insertion equipment. Options: Non-standard resistance values and tolerances Point matched at specified temperatures Tape and reel packaging High temperature capability to
- Lead Style: Leadless
- Resistance (@25°C): 20000 ohms
- Temperature Range: -55 to 220 C
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Supplier: Littelfuse, Inc.
Description: severe environmental or thermal conditions. Their uniform dimensions make them especially suitable for use with automatic insertion equipment. Options: Non-standard resistance values and tolerances Point matched at specified temperatures Tape and reel packaging High temperature
- Lead Style: Leadless
- Resistance (@25°C): 100000 ohms
- Temperature Range: -55 to 220 C
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Supplier: Littelfuse, Inc.
Description: severe environmental or thermal conditions. Their uniform dimensions make them especially suitable for use with automatic insertion equipment. Options: Non-standard resistance values and tolerances Point matched at specified temperatures Tape and reel packaging High temperature
- Lead Style: Leadless
- Resistance (@25°C): 10000 ohms
- Temperature Range: -55 to 220 C
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Supplier: Littelfuse, Inc.
Description: Littelfuse low cost glass encapsulated thermistors are manufactured using super stable NTC chips which are hermetically sealed in a glass (DO-41 diode style) package. The result is a device which exhibits excellent long term reliability and stability even when subjected to severe
- Lead Style: Leadless
- Resistance (@25°C): 33000 ohms
- Temperature Range: -55 to 300 C
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Featured Products Top
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-High-power laser TO packages -Automotive relay sealing -Discrete semiconductor devices -Multilayer Ceramic Substrates -Surface-Mount Power Packages -Optical Communications: 400G transceiver hermetic sealing -Automotive Electronics: LiDAR emitter packaging for autonomous driving -Optical Communications: 400G transceiver hermetic sealing -New Energy: Insulation terminals for battery management systems (BMS) (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
, and durability in mission-critical applications such as navigation, communication, and scientific data collection. Douglas Electrical Components provides hermetic feedthroughs and sealed packages designed for aerospace applications, helping reduce size and weight while improving (read more)
Browse Hermetic Sealing Services Datasheets for Douglas Electrical Components -
compact, lightweight packages while shielding electronics from moisture, condensation, corrosion, and electrical shorts. The process enables greater design flexibility by allowing non-hermetic connectors to be sealed and directly integrated into circuits, delivering cost-effective solutions (read more)
Browse Wire to Board Connectors Datasheets for Douglas Electrical Components -
conveyor and crank handle head height adjustment. Materials: PE, PP, Kraft/PE, Tyvek, Polymylar, Foil/PE, Cryovac, Coextrusions, Polylaminates, Military Specs, Nylon 3/8" wide hermetic seal Synchronized lower support conveyor makes pouch loading easy. Speeds up to 35 (read more)
Browse Sealing Machines Datasheets for All Packaging Machinery Corporation -
delivers 10mA of forward current, and a reverse recovery time of 100nS. Starting with VMI's standard glass-body, hermetically sealed diodes, these devices are over-molded in a rigid epoxy. The leads are then (read more)
Browse High Voltage Diodes Datasheets for Voltage Multipliers, Inc. -
Our Advanced Al2O3/AIN Ceramic Packages are engineered to deliver precision, durability, and superior sealing in demanding electronic environments. These packages offer (read more)
Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Our ceramic filters are manufactured in two basic styles for both commercial and military applications. The high-volume, cost-effective units in open frame, non-hermetic packages are most often used in commercial applications. The lower volume, custom designed hermetic packages find wide usages in military applications. Both styles are available in various mounting configurations. (read more)
Browse RF Filters and Microwave Filters Datasheets for Molex Signal Tech Industrial Ltd. -
Cost-effective alternative to CMC and CPC materials Applications: Electronics packaging, hermetic seals, aerospace components, power (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd -
High volume and various mounting configurations Ceramic Filters are manufactured in two basic styles for both commercial and military applications. The high-volume, cost-effective units in open frame, non-hermetic packages (read more)
Browse RF Filters and Microwave Filters Datasheets for Molex Signal Tech Industrial Ltd. -
terminal seals feature solid copper, heavy-current conductors sealed in NPT and face seal packages housing styles and stainless steel materials, with a hermetic, moisture-tight epoxy (read more)
Browse Wire to Wire Connectors Datasheets for Douglas Electrical Components
Conduct Research Top
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Rochester Electronics Qualifies Hermetic Packages for MC68040FE Microcontrollers
A valued Rochester customer required an ongoing supply of the MC68040FE processor to produce medical ventilators to be used in the fight against COVID-19.
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Package Hermeticity and Gas Analysis
processing or may be generated internally after seal from material outgassing or decomposition, a primary source is the ingress of moisture that occurs because of a non-hermetic package seal. Usually, to evaluate overall package integrity, both fine and gross leak tests are required to test the full
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How Getters Improve Reliability of Hermetically Sealed Electronic Packages
Electronic components may fail if they are exposed to corrosive agents or chemical attack by moisture or other reactive gases that may be present within an electronic package or enclosure. The reliability of sensitive electronic components can be improved by hermetically sealing them within
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Providing a Continuous Source of Supply for Critical Processors
Rochester Electronics worked with an OCM supplier partner to provide an assembly solution for their 240 lead CQFP hermetic package, which was no longer available in the market.
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HR1 Getter for Removal of Hydrogen from Hermetic Microelectronic Packaging
Outlines methodology for quantifying a getter's performance related to hydrogen (H2) absorption performance in uptake capacity and uptake rate, and provide a fundamental understanding on how to select a getter for keeping microelectronic packages free from an H2 outgassing induced failure mode.
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Two Solutions to Static Problems in Semiconductor Die Bonder Operation
to opposing leads on the hermetic package. Eventually, this hermetic package encases the entire die or chip. These leads are the link from the semiconductor die to the rest of the circuit when it is mounted on a circuit board or flex circuit substrate.
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Moisture-resistant sealing materials for downhole HPHT electrical feedthrough packages
Downhole logging tools and electrical circuits are packaged in a hermetically-sealed metal enclosure, which is either sealed and pressurized, or filled with fluid, to protect the circuits from downhole corrosive environment and humidity. The sealed tool enclosure uses an electrical feedthrough
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Hermetic Solutions DiaCool TM Materials offer Superior Thermal Management for the Next Generation of Higher Power Density
Electronic systems are rapidly evolving, where electronic circuits and components are being designed to handle greater amounts of power in smaller packages. The amount of power used or transmitted per unit mass, area or volume is often referred to as the "power density. "
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Front matter
Board Level Reliability Testing of Hermetic Packages Equipped with High-Rel Interconnection Solutions and Dedicated to Space Applications .
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What's baking?
Aspects considered include: computerized transport robot for automated dough production; baking ovens; deck ovens; packaging of bakery products (use of modified atmosphere packaging ); hermetic sealing equipment ; bag-and-clip technology; and end of line inspection (metal detectors, quality control units, high-speed …
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Study of the spectral response of CZT multiple-electrode detectors
As shown in Fig. 2, the detectors, the FET and the Peltier coolers are mounted in hermetic TO-8 packages , equipped with light- vacuum tight Beryllium windows,.
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Sandia National Laboratories/New Mexico Facilities and Safety Information Document [NOTE: Volume 1, Chapters 6 through 10]
• Surface-mount, hermetic sealing, and integrated circuit packaging equipment .
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Characterization of tantalum oxide-ruthenium oxide hybrid capacitors
In addition, he has 12 years’ experience in the design of formed components, hermetic packages , production processes, and equipment .
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WFC: Model order reduction methods and applications
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WFB: Microwave filter synthesis and realization
… and High Speed Inregared Packaging, D. Bmwn, W P C E RI; Syarem-in-Package(SiP): Achiwing Cmi and Size in Laminate Package Solutions, D. Marhcws, ArMKOR Techuology E Quari- Hermetic Packaging Approach for Next Genemion Space Equipment , P. Monfraix, AlradSjiarr Z …
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Friday Tutorials
… RP, Wireless and High Speed Inregrated Packaging, D. Brown, IWPC f RP System-in-Package (SIP):Achieving Cost and Size in Laminate Package Solutions, D. Mathews, AMKOR T~htlology I( Quasi- Hermetic Packaging Approach for Next Generation Space Equipment , P. Monfraix, AlcutelSpaiz I …
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