Products & Services
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview STAYDRY HICAP3000 PSA is a high-capacity moisture absorber film with a pressure sensitive adhesive (PSA) for easy and fast assembly into electronic devices. Its primary use is in hermetic and non-hermetic applications requiring moisture absorption in electronic devices
- Configuration: Desiccator
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Supplier: ASTM International
Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks in a package
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Supplier: ASTM International
Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks in a package
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Supplier: Douglas Electrical Components
Description: vapor and condensation or creates a hermetic barrier between the circuit and housing assembly or enclosure. Non-hermetic connectors offer more design options and are lower cost than their hermetic counterparts. Douglas Electrical can hermetically seal a non-hermetic
- Additional Services: Design Assistance
- Industry: Electrical / Electronics, Military / Law Enforcement
- Sealing Method Capabilities: Epoxies
- Features: North America, Northeast US Only, United States Only
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Supplier: ProPhotonix, Ltd.
Description: Receptacle Packaged laser diodes are suitable for OEM applications ranging from scientific equipment and optical instruments requiring a laser diode light source to visual fibre optic fault locators for communications networks, telecomms systems and instrumentation and free space optical
- Laser Type: Alignment Lasers, Laser Diodes
- Laser Output: Continuous Wave
- Laser Wavelength: Red
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Supplier: Palomar Technologies, Inc
Description: bonding. High Vacuum Furnace Applications MEMS Package Sealing Infrared Sensor Package Sealing Crystal Oscillator Package Sealing Hermetic Package Sealing Wafer Level Packaging Void-Free Eutectic Die Attach Low Moisture Package Sealing Nobel Gas Miniature Lamp Sealing Military
- Type: Factory / Free Standing
- Vacuum / Pressure Range: High Vacuum (< 10-3, >10-8 torr)
- Features: Integral Process Controller, MEMS, Other
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Supplier: ValueTronics International, Inc.
Description: The 83440C is a Lightwave Converter from Agilent. Additional Features: Fast 22 ps Full-Width Half-Max (FWHM) pulse response Broad 20 GHz bandwidth (3 dB opt) Small, convenient package Low pulse aberrations Integral bias regulation Ideal for high-speed digitizing oscilloscopes The Agilent 83440C
- Test Equipment Type: Hand Held
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Supplier: Douglas Electrical Components
Description: StudSeal™ hermetic terminal seals provide a secure barrier for high current or high voltage transfers in sealed environments. Our products are designed for high vacuum and pressure applications, including air conditioning and refrigeration compressors, semiconductor processing
- Voltage Rating: 1,000 volts
- Current Rating: 500 amps
- Connector Type: USB Connector
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Supplier: Douglas Electrical Components
Description: StudSeal™ hermetic terminal seals provide a secure barrier for high current or high voltage transfers in sealed environments. Our products are designed for high vacuum and pressure applications, including air conditioning and refrigeration compressors, semiconductor processing
- Voltage Rating: 1,000 volts
- Connector Type: USB Connector
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Supplier: Douglas Electrical Components
Description: StudSeal™ hermetic terminal seals provide a secure barrier for high current or high voltage transfers in sealed environments. Our products are designed for high vacuum and pressure applications, including air conditioning and refrigeration compressors, semiconductor processing
- Voltage Rating: 1,000 volts
- Connector Type: USB Connector
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Supplier: ASTM International
Description: 1.1 This test method applies to hermetic package leak testing to detect leaks of a broad spectrum in size with a minimum detection level equal to the sensitivity of the helium mass spectrometer equipment used in the test.
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Supplier: ASTM International
Description: 1.1 This test method applies to hermetic package leak testing to detect leaks of a broad spectrum in size with a minimum detection level equal to the sensitivity of the helium mass spectrometer equipment used in the test. 1.2 This standard does not purport to address all of the safety
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Supplier: Sunstone Engineering
Description: AC Resistance Seam Welders are used to complete AC Resistance welds. These would include both spot welds and seam welds. Ideal for creating a continuous seam weld, foil welding, Pouch cell welding, and mesh or screen welding. The primary applications include the creation of hermetic seal with
- Process Capability: Welding Equipment
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Supplier: AMADA Weld Tech
Description: hermetically sealing microelectronic packages or joining a variety of metal parts, Pulsar’s broad range of precision power choices provide technically advanced process solutions. Pulsar can be easily integrated into atmospheric enclosures to insure high yield hermetic sealing results. Short
- Equipment Type: Complete System
- Features: Other Brazing / Soldering Unit, Other Welding Processes
- Process Capability: Welding Equipment
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Supplier: Littelfuse, Inc.
Description: environmental or thermal conditions. Their uniform dimensions make them especially suitable for use with automatic insertion equipment. Options: Non-standard resistance values and tolerances Point matched at specified temperatures Tape and reel packaging High temperature capability to
- Temperature Range: -55 to 220 C
- Resistance (@25°C): 250,000 ohms
- Lead Style: Leadless
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Supplier: Littelfuse, Inc.
Description: or thermal conditions. Their uniform dimensions make them especially suitable for use with automatic insertion equipment. Options: Non-standard resistance values and tolerances Point matched at specified temperatures Tape and reel packaging High temperature capability to +220°C Surface
- Temperature Range: -55 to 220 C
- Resistance (@25°C): 2,252 ohms
- Lead Style: Leadless
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Supplier: Littelfuse, Inc.
Description: environmental or thermal conditions. Their uniform dimensions make them especially suitable for use with automatic insertion equipment. Options: Non-standard resistance values and tolerances Point matched at specified temperatures Tape and reel packaging High temperature capability to
- Sensor Type: Temperature Sensor
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Supplier: Littelfuse, Inc.
Description: environmental or thermal conditions. Their uniform dimensions make them especially suitable for use with automatic insertion equipment. Options: Non-standard resistance values and tolerances Point matched at specified temperatures Tape and reel packaging High temperature capability to
- Sensor Type: Temperature Sensor
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Supplier: Sunstone Engineering
Description: Seam sealers are used for lid placement and seam sealing applications to encase electronic components such as crystal devices, MEMS, sensors, optical devices, and other optoelectronic packaging applications. Similar to our other welding products, our seam sealer systems deliver an electric
- Features: Other
- Applications: Semiconductor Manufacturing
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Supplier: Richardson RFPD
Description: 30 GHz Broadband Amplifier Module. The UA0L30VM Amplifier is a general-purpose broadband amplifier designed for microwave communications, test equipment, and military systems. Its small size and exceptional performance make it a versatile gain block which can improve power and gain in a
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: Connector Accessories Hermetic Seal Product overview: 1055331-1 from TE Connectivity is a Circuit Protection Fuse for overcurrent protection, power input protection, equipment safety, automotive electronics, and industrial control panels. It is useful for engineers and buyers comparing
- Features: Other
- Approvals / Standards: RoHS Compliant
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Description: respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require
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Supplier: OSI Optoelectronics
Description: pigtail, which allows excellent coupling with either single mode or multimode fiber systems. Product Features High Sensitivity High Overload Power Wide Dynamic Range 850 nm, 1310 nm, 1550 nm Operation Hermetic Package Custom Bandwidths Available Product Applications Line-Terminating
- Data Rate: 6 to 350 Mbps
- Sensitivity: -56 to -32 dB
- Dynamic Range: 25 to 53 dB
- Bandwidth: 3 to 250 MHz
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Supplier: OSI Optoelectronics
Description: OSI Laser Diode, Inc.’s High Power SMF coupled laser modules are designed to meet the performance demands of the optical test equipment marketplace. The high peak optical power SCW Series lasers serve 1310nm through 1650nm wavelengths and are available in fully hermetic laser welded
- Wavelength Range: 1,310 to 1,650 nm
- Laser Power: 180 milliwatts
- Operating Temperature Range: -30 to 70 C
- CDRH Classification: Class IIIb
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Supplier: Richardson RFPD
Description: sealed, making this switch ideal for space, military radios, and other environmentally harsh applications. Typical applications include synthesizer switching, transmit/receive switching, switch matrices and filter banks in systems such as radio and cellular equipment, PCM, GPS, and fiber
- Frequency Range: 0 to 3,000 MHz
- Insertion Loss: 1.8 dB
- Isolation (Port to Port): 40 dB
- Switching Speed: 0.000004 ms
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Supplier: Hamamatsu Photonics Europe
Description: small size, less than half the volume of the previous mini-spectrometer MS series (C10988MA-01). In addition, the employment of hermetic packaging has improved humidity resistance. This product is suitable for integration into a variety of devices, such as integration into printers and
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: RF and Baseband Circuit, ROHS COMPLIANT, HERMETIC SEALED, LCC-18 Product overview: MAX-7C-0-000 from u-blox is a Rf Receiver for embedded electronics, industrial equipment, maintenance repair, OEM production, and component sourcing. It is useful for engineers and buyers comparing
- Features: RoHS
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: Duplexer, HERMETIC SEALED PACKAGE-9 Product overview: FAR-D5PE-881M50-P3EZ-Z from TAIYO YUDEN is an Analog Switch and Multiplexer IC for embedded electronics, industrial equipment, maintenance repair, OEM production, and component sourcing. It is useful for engineers and buyers
- Operating Ambient Temperature: -40 C
- Features: Other
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Supplier: ProPhotonix, Ltd.
Description: Fibre pigtailed laser diodes are suitable for OEM applications ranging from scientific equipment and optical instruments requiring a laser diode light source to visual fibre optic fault locators for communications networks, telecomms systems and instrumentation and free space optical
- Wavelength Range: 635 to 850 nm
- Laser Output: Continuous Wave
- Features: Fiber Pigtailed
- Laser Type: Laser Diodes
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Supplier: AMADA Weld Tech
Description: Based on the industry-leading AX-5000, Miyachi Unitek's laser glovebox systems offer precise control of moisture, pressure, and gas composition in the processing environment. Capable of coordinated motion/laser weld firing in complex paths in up to 5 axes of both linear and rotary motion, the
- Laser Output Power: 5 to 600 watts
- Type: Complete / Turnkey System
- Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure
- Laser Operation: Laser Welding
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Supplier: Schott Japan
Description: difficult environmental conditions on a long-term basis. Building on more than 70 years of experience in manufacturing hermetically-sealed housings and feedthroughs, SCHOTT Electronic Packaging offers custom-made, autoclavable connectors for medical equipment that are manufactured with
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: IC COMPARATOR, 4000 uV OFFSET-MAX, 200 ns RESPONSE TIME, MBCY8, HERMETIC SEALED, METAL CAN-8, Comparator Product overview: LM111H from National Semiconductor is a Linear Comparator IC for embedded electronics, industrial equipment, maintenance repair, OEM production, and component
- Operating Temperature: -55 C
- Pin Count: 8
- Features: Comparators
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Supplier: Richardson RFPD
Description: The 172 Centigrid® relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profile height (0.280"") and 0.100"" grid spaced terminals, which preclude the need for spreader pads, make it an ideal choice where extreme packaging density and/or close
- Poles: Double Pole (DP)
- Throw: Double Throw
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, and durability in mission-critical applications such as navigation, communication, and scientific data collection. Douglas Electrical Components provides hermetic feedthroughs and sealed packages designed for aerospace applications, helping reduce size and weight while improving (read more)
Browse Hermetic Sealing Services Datasheets for Douglas Electrical Components -
compact, lightweight packages while shielding electronics from moisture, condensation, corrosion, and electrical shorts. The process enables greater design flexibility by allowing non-hermetic connectors to be sealed and directly integrated into circuits, delivering cost-effective solutions (read more)
Browse Wire to Board Connectors Datasheets for Douglas Electrical Components -
conveyor and crank handle head height adjustment. Materials: PE, PP, Kraft/PE, Tyvek, Polymylar, Foil/PE, Cryovac, Coextrusions, Polylaminates, Military Specs, Nylon 3/8" wide hermetic seal Synchronized lower support conveyor makes pouch loading easy. Speeds up to 35 (read more)
Browse Sealing Machines Datasheets for All Packaging Machinery Corporation -
delivers 10mA of forward current, and a reverse recovery time of 100nS. Starting with VMI's standard glass-body, hermetically sealed diodes, these devices are over-molded in a rigid epoxy. The leads are then (read more)
Browse High Voltage Diodes Datasheets for Voltage Multipliers, Inc. -
Our Advanced Al2O3/AIN Ceramic Packages are engineered to deliver precision, durability, and superior sealing in demanding electronic environments. These packages offer (read more)
Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Our ceramic filters are manufactured in two basic styles for both commercial and military applications. The high-volume, cost-effective units in open frame, non-hermetic packages are most often used in commercial applications. The lower volume, custom designed hermetic packages find wide usages in military applications. Both styles are available in various mounting configurations. (read more)
Browse RF Filters and Microwave Filters Datasheets for Molex Signal Tech Industrial Ltd. -
Cost-effective alternative to CMC and CPC materials Applications: Electronics packaging, hermetic seals, aerospace components, power (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd -
High volume and various mounting configurations Ceramic Filters are manufactured in two basic styles for both commercial and military applications. The high-volume, cost-effective units in open frame, non-hermetic packages (read more)
Browse RF Filters and Microwave Filters Datasheets for Molex Signal Tech Industrial Ltd. -
terminal seals feature solid copper, heavy-current conductors sealed in NPT and face seal packages housing styles and stainless steel materials, with a hermetic, moisture-tight epoxy (read more)
Browse Wire to Wire Connectors Datasheets for Douglas Electrical Components -
-chip, allowing customers to easily generate a negative voltage reference or a gain of 2 with minimal impact on the output accuracy or drift. The ADR1001 is packaged in a hermetic, ceramic, 20-terminal leadless chip carrier (LCC). The surface-mount ceramic package allows customers to eliminate the (read more)
Browse Current Sensors Datasheets for DigiKey
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Rochester Electronics Qualifies Hermetic Packages for MC68040FE Microcontrollers
A valued Rochester customer required an ongoing supply of the MC68040FE processor to produce medical ventilators to be used in the fight against COVID-19.
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Package Hermeticity and Gas Analysis
processing or may be generated internally after seal from material outgassing or decomposition, a primary source is the ingress of moisture that occurs because of a non-hermetic package seal. Usually, to evaluate overall package integrity, both fine and gross leak tests are required to test the full
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How Getters Improve Reliability of Hermetically Sealed Electronic Packages
Electronic components may fail if they are exposed to corrosive agents or chemical attack by moisture or other reactive gases that may be present within an electronic package or enclosure. The reliability of sensitive electronic components can be improved by hermetically sealing them within
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Providing a Continuous Source of Supply for Critical Processors
Rochester Electronics worked with an OCM supplier partner to provide an assembly solution for their 240 lead CQFP hermetic package, which was no longer available in the market.
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HR1 Getter for Removal of Hydrogen from Hermetic Microelectronic Packaging
Outlines methodology for quantifying a getter's performance related to hydrogen (H2) absorption performance in uptake capacity and uptake rate, and provide a fundamental understanding on how to select a getter for keeping microelectronic packages free from an H2 outgassing induced failure mode.
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Two Solutions to Static Problems in Semiconductor Die Bonder Operation
to opposing leads on the hermetic package. Eventually, this hermetic package encases the entire die or chip. These leads are the link from the semiconductor die to the rest of the circuit when it is mounted on a circuit board or flex circuit substrate.
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Moisture-resistant sealing materials for downhole HPHT electrical feedthrough packages
Downhole logging tools and electrical circuits are packaged in a hermetically-sealed metal enclosure, which is either sealed and pressurized, or filled with fluid, to protect the circuits from downhole corrosive environment and humidity. The sealed tool enclosure uses an electrical feedthrough
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Hermetic Solutions DiaCool TM Materials offer Superior Thermal Management for the Next Generation of Higher Power Density
Electronic systems are rapidly evolving, where electronic circuits and components are being designed to handle greater amounts of power in smaller packages. The amount of power used or transmitted per unit mass, area or volume is often referred to as the "power density. "
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Front matter
Board Level Reliability Testing of Hermetic Packages Equipped with High-Rel Interconnection Solutions and Dedicated to Space Applications .
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What's baking?
Aspects considered include: computerized transport robot for automated dough production; baking ovens; deck ovens; packaging of bakery products (use of modified atmosphere packaging ); hermetic sealing equipment ; bag-and-clip technology; and end of line inspection (metal detectors, quality control units, high-speed …
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Study of the spectral response of CZT multiple-electrode detectors
As shown in Fig. 2, the detectors, the FET and the Peltier coolers are mounted in hermetic TO-8 packages , equipped with light- vacuum tight Beryllium windows,.
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Sandia National Laboratories/New Mexico Facilities and Safety Information Document [NOTE: Volume 1, Chapters 6 through 10]
• Surface-mount, hermetic sealing, and integrated circuit packaging equipment .
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Characterization of tantalum oxide-ruthenium oxide hybrid capacitors
In addition, he has 12 years’ experience in the design of formed components, hermetic packages , production processes, and equipment .
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WFC: Model order reduction methods and applications
… and High Speed Inregared Packaging, D. Bmwn, W P C E RI; Syarem-in-Package(SiP): Achiwing Cmi and Size in Laminate Package Solutions, D. Marhcws, ArMKOR Techuology E Quari- Hermetic Packaging Approach for Next Genemion Space Equipment , P. Monfraix, AlradSjiarr Z …
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WFB: Microwave filter synthesis and realization
… and High Speed Inregared Packaging, D. Bmwn, W P C E RI; Syarem-in-Package(SiP): Achiwing Cmi and Size in Laminate Package Solutions, D. Marhcws, ArMKOR Techuology E Quari- Hermetic Packaging Approach for Next Genemion Space Equipment , P. Monfraix, AlradSjiarr Z …
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Friday Tutorials
… RP, Wireless and High Speed Inregrated Packaging, D. Brown, IWPC f RP System-in-Package (SIP):Achieving Cost and Size in Laminate Package Solutions, D. Mathews, AMKOR T~htlology I( Quasi- Hermetic Packaging Approach for Next Generation Space Equipment , P. Monfraix, AlcutelSpaiz I …