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Supplier: Hot Disk AB
Description: and very high-conducting samples. Kapton sensors for thin film measurements, operating temperature from -196 °C up to 300 °C (400 °C in vacuum): Sensor design: Radius (mm): 7854 10.72 7280 14.97 7281 30.00 Also available: Specific heat capacity sensor equipped with gold cell sample holder.
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Description: telecommunications technology since it can be processed using both thick and thin film technologies. As a result, Aluminum Nitride ceramic is utilized as a substrate for semiconductors as well as high-power electronic devices, housings, and heat sinks. Typical Features Very high
- Thermal Conductivity: 180 to 200 W/m-K
- Dielectric Strength: 20,000,000 V/m
- Material Type: Aluminum Nitride
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY AS02-s is a material with double sided inherent tack, low thermal resistance and high thermal conductivity. It has excellent compressive strength characteristics and good electrical isolation function for high-power electronic components, making it the best choice
- Applied Thickness / Gap Fill: 0.005905515 to 0.00787402 inch
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 4.5 W/m-K
- Elongation: 10 %
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY AS200 is a thermally conductive gel designed for gap filling. The thermal conductivity is 2.0 W/m*K. The hardness is Shore 00/30, with high flexibility and compressibility. AS200 has ultra-low oil bleeding properties, which helps reduce pollutants from silicon oil,
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 2 W/m-K
- Dielectric Strength: 279.4000000000006 kV/in
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Supplier: Hot Disk AB
Description: The Hot Disk TPS 2500 S is the flagship instrument in the system portfolio of Hot Disk AB. This general-purpose R&D instrument is designed for precision analysis of thermal transport properties - including thermal conductivity (0.005 to 1800 W/m/K), thermal diffusivity
- Temperature Range: -252.99999999999997 to 1,000 C
- Accuracy: 5 (%)
- User Interface: Digital Front Panel
- Display: Digital Readout
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Supplier: Nordson EFD
Description: electrical industries. Features & Benefits Excellent heat transfer Good wetting Low bond line Low thermal resistance High thermal conductivity (high bulk thermal conductivity) for thick-film and gap-fill applications Non-silicone Does not dry
- Use Temperature: -40 to 392 F
- Thermal Conductivity: 0.92 W/m-K
- Features: Air Setting / Film Drying, Specialty / Other, Thermally Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800C-s is made of non-silicon resin material. No low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. N800C-s can have low thermal resistance and high thermal
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 257 F
- Thermal Conductivity: 17 W/m-K
- Dielectric Strength: 203.20000000000041 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink.
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 11 W/m-K
- Dielectric Strength: 203.20000000000041 kV/in
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Supplier: Ohmite Manufacturing Co.
Description: Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and
- Use Temperature: -40 to 752 F
- Thermal Conductivity: 800 W/m-K
- Coeff. of Thermal Expansion (CTE): 15 µin/in-F
- Industry: Electrical Power / HV, Electronics, OEM / Industrial
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Supplier: Henkel Corporation - Industrial
Description: interfacial resistances to adjacent surfaces. BERGQUIST GAP PAD TGP 3004SF is designed for applications that are silicone-sensitive. BERGQUIST GAP PAD TGP 3004SF is constructed using a 0.25 mil PET film that provides a no tack surface on one side and natural tack on the other side.
- Use Temperature: 40 to 257 F
- Thermal Conductivity: 3 W/m-K
- Form / Shape: Gap Filling Compound
- Chemical System: Silicone
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Supplier: Matexcel
Description: structure of graphene, which has high electrical conductivity, high thermal conductivity and excellent mechanical properties. This product has broad application prospects in the fields of conductive ink, thermal and conductive composite materials, heat dissipation
- Shape / Form: Powder / Aggregate (Grain / Grog)
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Description: conductivity High thermal conductivity Low cure temperature
- Thermal Conductivity: 7 W/m-K
- Chemical System: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: P8700 Series is an aerogel heat insulation film made of nano-insulated aerogel film as the base material and coated with acrylic glue. It has excellent heat insulation, excellent insulation performance, low heat conductivity, heat preservation, combined with heat
- Thickness: 0.011811023622047244 inches
- Temperature Resistance: -20 to 120 C
- Dielectric Strength: 4,000,000 V/m
- Adhesive: Acrylic
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Supplier: Morgan Advanced Materials
Description: Diamond has long been the technologically preferred material for critical thermal management applications due to its extremely high thermal conductivity, low coefficient of thermal expansion and high electrical resistivity. High costs, however, have traditionally
- Applications: Battery / Fuel Cell, Electronics / Microelectronics, Medical / Biotech
- Type: CVD / Chemical Precursor
- Material: Carbon / Diamond-like Carbon (DLC)
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Supplier: Henkel Corporation - Industrial
Description: adhesion strength at elevated temperatures High electrical conductivity High thermal conductivity Low cure temperature Custom preforms Adhesion with flexibility Uniform bondline adhesion Void-free bondline
- Thermal Conductivity: 7 W/m-K
- Chemical System: Epoxy (EP)
- Features: Thermal / Heat Conductive
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Description: flexible films. High strength film with high thermal conductivity Thin bondline Uniform bondline control Good heat transfer
- Thermal Conductivity: 1.1 W/m-K
- Chemical System: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Description: conductivity – superior grounding and minimum thermal resistance to heat sink Compatible with temperature-sensitive substrates and components – cures at a low temperature of 125°C Flexible – allows use of material combinations with CTE mismatches
- Viscosity: 7,500 cP
- Coeff. of Thermal Expansion (CTE): 11.38888888888889 µin/in-F
- Chemical System: Epoxy (EP)
- Industry: OEM / Industrial
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Supplier: MacDermid Alpha Electronics Solutions
Description: lamination. The film forms a pure silver bond line that provides high thermal and electrical conductivity. Designed for low-pressure sintering, it supports high-yield manufacturing with die attach temperatures compatible with semiconductor assembly processes.
- Thick Film Type: Conductor
- Applications: Die Bonding, Electronics / Microelectronics
- Material: Silver / Silver Alloy
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Supplier: Master Bond, Inc.
Description: one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure quickly at
- Use Temperature: -100 to 400 F
- Thermal Conductivity: 1.442279 W/m-K
- Coeff. of Thermal Expansion (CTE): 0.00011111111111111112 to 0.000033333333333333335 µin/in-F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Optical Grade / Material, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era of high-performance materials. Product Features Thermal Conductivity The ATROX 558-2C31 offers good thermal conductivity,
- Thermal Conductivity: 5 W/m-K
- Features: Die Bonding Adhesive / Compound, Electrically Conductive, Film / Sheet, Grease / Paste, Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics, Semiconductors / IC Packaging
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Henkel Corporation - Industrial
Description: on one side of the material, eliminating the need for thermally impeding adhesive layers. It is highly recommended that the PEN film be left intact. However, film removal will not have a significant impact on thermal performance. Thermal Conductivity: 1.3 W/m-K
- Features: Gap Filling Compound, Leveling / Filling Compound, Thermal / Heat Conductive
- Chemical System: Silicone
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Supplier: Richardson RFPD
Description: Accu-P® meets the fast-growing demand for low-loss (high-Q) capacitors for use in surface mount technology especially for the mobile communications market, such as cellular radio of 450 and 900 MHz, UHF walkie-talkies, UHF cordless telephones to 2.3 GHz, low noise blocks at 11-12.5 GHz
- Capacitance Range: 0.00000015 microF
- DC Rated Voltage Range (WVDC): 25 volts
- Features: Other
- Packing Method: Tape Reel
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Supplier: Henkel Corporation - Electronics
Description: applications. The material's construction features a 0.5 mil PET film on one side and natural tack on the other. The natural tack eliminates the need for an additional adhesive layer. Your benefits Thermal conductivity: 2.0 W/m-K Silicone-free formulation Minimal compression set
- Industry: Electronics
- Features: Thermally Conductive
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Supplier: Henkel Corporation - Electronics
Description: is constructed using a 0.25 mil PET film that provides a no tack surface on one side and natural tack on the other side. Your benefits Thermal Conductivity: 3.0 W/m-K Silicone-free formulation 0.25 mil PET provides easy disassembly, leaving no residue Tacky side allows for ease
- Industry: Electronics
- Features: Thermally Conductive
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Supplier: IHS ESDU
Description: ESDU 01009 provides a method for predicting the local condensate film coefficient for the downflow of a pure vapour or azeotropic mixture over horizontal integral low-fin tubes and tube bundles, typically in TEMA X-shells. The condensation rate on integral low-fin tubes is
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Supplier: Allied Electronics, Inc.
Description: The resistive element comprises a thin film of nickel-chrome alloy evaporated onto a high thermal conductivity ceramic element. Metal end caps are force fitted to the element prior to spiraling to value. Tinned copper lead wires and the components are then coated. One coat of
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Supplier: Allied Electronics, Inc.
Description: The resistive element comprises a thin film of nickel-chrome alloy evaporated onto a high thermal conductivity ceramic element. Metal end caps are force fitted to the element prior to spiraling to value. Tinned copper lead wires and the components are then coated. One coat of
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Supplier: Allied Electronics, Inc.
Description: The resistive element comprises a thin film of nickel-chrome alloy evaporated onto a high thermal conductivity ceramic element. Metal end caps are force fitted to the element prior to spiraling to value. Tinned copper lead wires and the components are then coated. One coat of
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Supplier: Allied Electronics, Inc.
Description: The resistive element comprises a thin film of nickel-chrome alloy evaporated onto a high thermal conductivity ceramic element. Metal end caps are force fitted to the element prior to spiraling to value. Tinned copper lead wires and the components are then coated. One coat of
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Description: Unipretec offers 99.6% alumina substrates. This high purity alumina substrate exhibits excellent physical, chemical, and mechanical properties, including exceptional insulating properties, high thermal conductivity, low dielectric constant, low dielectric loss, high
- Density: 3.8999975386044725 to 3.9499975070481197 g/cc
- Max Use / Curie Temperature: 1,500 to 1,650 C
- Dielectric Strength: 17,000,000 to 20,000,000 V/m
- Material Type: Alumina / Aluminum Oxide
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Supplier: ASC Capacitors
Description: ASC™ X382 (Three Phase) capacitors are manufactured with very high quality metallized polypropylene film, designed for long life, low dielectric losses, higher RMS current ratings, and low ESR. The capacitors are filled with ASC™ soft gel or biodegradable vegetable based oil
- DC Rated Voltage Range (WVDC): 240 to 850 volts
- Applications: General Purpose
- Configuration / Form Factor: Heavy Duty / Electric Power Capacitors
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Heat Transfer Handbook Complete Document
in Boiling of Liquids on Surfaces Coated with Low Thermal Conductivity Films , Heat .
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ENCYCLOPEDIA OF THERMAL PACKAGING - SET 1: THERMAL PACKAGING TECHNIQUES (A 6-VOLUME SET)
For low thermal conductivity films that are substantially thicker than the bubble departure diameter, boiling will occur along the wetted surface.
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Handbook of Heat Transfer > TECHNIQUES TO ENHANCE HEAT TRANSFER
V. M. Zhukov, G. M. Kazakov, S. A. Kovalev, and Y. A. Kuzmakichta, "Heat Transfer in Boiling of Liquids on Surfaces Coated With Low Thermal Conductivity Films ," Heat Transfer Sov. Res. (7/3): 16–26, 1975.
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Optically readable bi-material infrared detector
To increase the BM beam temperature efficiently with the minute energy, the leg is made of low thermal conductivity film to isolate between Si .
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Hydrodynamic instability induced liquid--solid contacts in film boiling. [Saturated ethanol and water]
29 Zhukov, V. M., jet ajl., "Heat Transfer in Boiling of Liquids on Surfaces Coated with Low Thermal Conductivity Films ," Heat Transfer-Soviet Research, Vol. 7, Ho.
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Photo-Thermoelectric Technique for Anisotropic Thermal Diffusivity Measurements
On the other hand, low thermal conductivity films de- posited on high thermal conductivity samples reduce the effec- tive cross-plane thermal diffusivity.
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A photo-thermoelectric technique for anisotropic thermal diffusivity characterization of nanowire/nanotube composites
On the other hand, low thermal conductivity films deposited on high thermal conductivity samples reduce the effective cross-plane thermal diffusivity.
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Direct Liquid Cooling of High Flux Micro and Nano Electronic Components
For low thermal conductivity films that are substantially thicker than the bubble departure diameter, boiling will occur along the wetted surface.
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Thermomechanics of thin films and interfaces
A comprehensive review of thermal con- ductivity measurements of thin films has been re- cently given by Guenther and McIver. is For dielectric films (such as oxides and fluorides) the low film thermal conductivity leads to impor- tant implications about the laser…
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Measurements of adhesive bondline effective thermal conductivity and thermal resistance using the laser flash method
Another possible exqhnation for the lower film thermal conductivity is a difference in the orientation of the silver particles within the adhesive.