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Supplier: Sauereisen, Inc.
Description: Sauereisen Low Expansion Cement No. 29 is an inorganic cement used for embedding heating elements, insulating thermocouples, coating resistors and coils, and mechanically sealing parts where high resistance to electricity, chemicals and thermal shock is required. A strong
- Coeff. of Thermal Expansion (CTE): 4.6 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Constant (Relative Permittivity): 5 to 7
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Supplier: Master Bond, Inc.
Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
- Applied Thickness / Gap Fill: 0.0030 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 7.22E6 to 8.89E6 µin/in-F
- Composition: Unfilled
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Supplier: Leading Edge Metals & Alloys, Inc.
Description: With an extremely low coefficient of thermal expansion, approximately one-tenth that of carbon steel at temperatures up to 400° F, Invar® is often thought of as the material of choice for low expansion nickel alloy applications. The ability to maintain
- Alloy: Yes
- Nonferrous Metals: Non-ferrous - Any Type, Nickel / Nickel Alloy (UNS N)
- Overall Length: 75 to 144 inch
- Overall Thickness: 1.00E-3 to 2 inch
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Description: maintains constant dimensions over the range of normal atmospheric conditions. The alloy has a low coefficient of thermal expansion up to 500 °F (260 °C).
- Applications: Chemical / Materials Processing, Electronics / RF-Microwave, Other
- Coil Stock: Yes
- Features: Cold Finished / Rolled / Drawn, Corrosion Resistant, Controlled / Low Expansion Alloy, Hot Rolled
- Shape / Form: Semi-finished Shape / Mill Stock, Sheet, Foil, Strip, Wire / Shaped Wire, Other
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Supplier: Master Bond, Inc.
Description: . Master Bond EP30LTE is formulated with a unique blend of polymeric and inorganic materials to obtain thermal expansion coefficients as low as 12x10-6 in/in°C as well as unmatched dimensional stability, making possible new standards of performance for bonding, coating,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 19 to 22 µin/in-F
- Dissimilar Substrates: Yes
- Elongation: 3.2 %
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Supplier: Master Bond, Inc.
Description: processability. Master Bond EP30LTE-LO is formulated with a unique blend of polymeric and inorganic materials so as to obtain thermal expansion coefficients as low as 12x10-6 in/in/°C as well as unmatched dimensional stability. This makes possible new standards of
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 4.1
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Supplier: DeZURIK, Inc.
Description: Red Valve manufactures a range of slip-on expansion joints to suit special low-pressure applications where a quick installation is important. The SL-50 Expansion Joint is designed to be quickly installed onto standard schedule 40 pipe. The SL-50 uses slip-on connections with
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Description: , microwave tubes, transistors, diodes, inter-grated circuits and has been used for the flat pack and the dual-in-line package. DESCRIPTION Alloy 29-17 (Kovar®) is a vacuum melted, iron-nickel-cobalt, low expansion alloy whose chemical composition is controlled within narrow limits to
- Alloy: Yes
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
- Ferrous / Iron Based: Ferrous / Iron Based - Any Type, Specialty / Other Ferrous (UNS K)
- Performance Features: Coiled Stock, Controlled / Low Expansion Alloy, Corrosion Resistant, Cold Work (Die / Mold)
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Supplier: Master Bond, Inc.
Description: Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 5.56E6 to 7.22E6 µin/in-F
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Epoxies Etc...
Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI FORM TLF 2000, Thermally Conductive, One-Part, Liquid Formable Material BERGQUIST® LIQUI FORM TLF 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.72 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxies Etc...
Description: 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
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Description: conductivity: the thermal conductivity of hot pressed products is 33W / M.K, which is the largest among ceramic materials above 530 ?. Low thermal expansion coefficient: 2×10-6 is the smallest expansion coefficient in ceramics, next only to quartz glass The
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Density: 2.27 g/cc
- Performance Features: Machinable
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Supplier: Mid-Mountain Materials, Inc.
Description: thermal expansion and contraction, and have excellent thermal insulation properties, very low shrinkage, and high strength. Features Excellent for adhering gaskets and seals Can be formed into shapes or linings, and pushed into cracks or holes Offers protection against
- Applications: Foundry / Metal Processing
- Max Use Temperature: 538 C
- Product Type / Form: Cement / Binder
- Refractory Aggregate / Fill: Silica / Silicate Materials
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Supplier: ASTM International
Description: 1.1 This test method covers the determination of linear thermal expansion of rigid solids using either a Michelson or Fizeau interferometer. 1.2 For this purpose, a rigid solid is defined as a material which, at test temperature and under the stresses imposed by instrumentation,
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Supplier: ASTM International
Description: 1.1 This test method covers the determination of linear thermal expansion of rigid solids using either a Michelson or Fizeau interferometer. 1.2 For this purpose, a rigid solid is defined as a material which, at test temperature and under the stresses imposed by instrumentation,
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Supplier: ASTM International
Description: 1.1 This test method covers the determination of linear thermal expansion of rigid solids using either a Michelson or Fizeau interferometer. 1.2 For this purpose, a rigid solid is defined as a material which, at test temperature and under the stresses imposed by instrumentation,
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Supplier: Top Seiko Co., Ltd.
Description: consumption and downtime. Especially, these Refractory Metals can improve thermal performance dramatically when replaced from conventional metals. For example, Molybdenum has 9 times higher thermal conductivity but 1/3 of thermal expansion coefficient than that of
- CNC Machining: Yes
- Capabilities: Drilling, Milling, Turning, Screw Machining, Deep Hole Drilling, Wire EDM
- Location: East Asia / Pacific Only
- Materials: Glass, Glass Ceramics, Hardened Metals, Ultra-hard Materials, Other
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Supplier: Protavic America, Inc.
Description: a unique combination of excellent wetting, flow, good thermal expansion properties, thermal shock resistance, and outstanding electrical properties. Adhesion is excellent to metals, most engineered plastics, and glass.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Thermal Insulation / Heat Insulating
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: SPIE - Education
Description: dissipation, thermal stresses, warpage, alignment, weight, size, cost, and manufacturing yield. Decades-old traditional low-coefficient-of-t hermal-expansion (CTE) materials like tungsten/copper, molybdenum/copper, copper-Invar-copper, "Kovar", etc., have thermal
- Industry: Electronics
- Modality: On-site / In Plant
- Technology / Subject: Electronics, Photonics / Optics
- Type: Course
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Supplier: CHT USA Inc.
Description: its low modulus, QSil 553 will minimize cooefficient of thermal expansion (CTE) strain. QSil 553 is thermally conductive to aid in efficient heat dissipation. This silicone elastomer is also flame retardant and is UL Listed in file QMFZ2.E205830.
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 600 kV/in
- Elongation: 240 %
- Features: Flame Retardant (e.g. UL 94 Rated), UL Approved
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Description: Very high thermal conductivity Outstanding thermal shock resistance Good dielectric properties Low thermal expansion coefficient Good metalization capacity Applications High power electrical insulators Power
- Dielectric Strength: 2.00E7 V/m
- Material Type: Aluminum Nitride
- Thermal Conductivity: 180 to 200 W/m-K
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Supplier: ASTM International
Description: 1.1 This test method covers the determination of linear thermal expansion of rigid solids using either a Michelson or Fizeau interferometer. 1.2 For this purpose, a rigid solid is defined as a material which, at test temperature and under the stresses imposed by instrumentation,
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Supplier: Indium Corporation
Description: Mating parts that have significant difference in their coefficient of thermal expansion (CTE) Pb-free solders that reflow in the range of the traditional SnPb and SnPbAg options
- Form / Shape: Paste
- Soldering Filler Alloys: Indium (In), Other
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Description: Advantages Of Aluminum nitride ceramic gasket Aluminum nitride ceramic gasket has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Description: Advantages Of Aluminum nitride backing plate Aluminum nitride backing plate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal high
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Supplier: Boyd
Description: heat spreader that allows engineers to tailor the coefficients of thermal expansion (CTE) as needed. Due to its flexibility in materials and construction, k-Core® technology can easily replace traditional solid metal conductors or heat spreaders to substantially improve heat
- Device: Passive Heat Sink
- Material: Other Materials
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Tensile Strength (Break): 7250 psi
- Thermal Conductivity: 1.36 W/m-K
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Description: Programmable High Low Temperature Thermal Shock Environmental Test Chamber is used to test the bearing extent of the material structures and composite material in an instant and continuous high temperature and extremely low temperature environment, which is in the
- Application: Product Qualification / Testing, Reliability / Durability Testing, R&D / Product Design Verification, Semiconductors / Electronics Screening
- Test Mode: Other Test Mode
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Description: high low temperature fast change programmable thermal shock chamber is used to test the bearing extent of the material structures and composite material in an instant and continuous high temperature and extremely low temperature environment, which is in the
- Application: Product Qualification / Testing, Reliability / Durability Testing, R&D / Product Design Verification, Semiconductors / Electronics Screening
- Test Mode: Other Test Mode
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Supplier: Chemac Inc./Uraca/Uhde HPT/Gather/BHDT
Description: For gaseous media with a low solids content, Kempchen manufactures fabric compensators from heat-resistant abd acid-proof materials as a flexible connection in pipelines and conduit in order to accomodate positional alterations that result from thermal expansion or
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Supplier: Mid-Mountain Materials, Inc.
Description: thermal expansion and contraction, and have excellent thermal insulation properties, very low shrinkage, and high strength. Features Excellent for adhering gaskets and seals Can be formed into shapes or linings, and pushed into cracks or holes Offers protection against
- Applications: Foundry / Metal Processing
- Max Use Temperature: 1260 C
- Refractory Aggregate / Fill: Silica / Silicate Materials
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Description: material. Composite heat-sinks made of molybdenum/copper (Mo/Cu) or copper tungsten (Cu/W) are then integrated into strategic locations of the structure. This combination of titanium and Mo/Cu or Cu/W is ideal for achieving lightweight, low-coefficient of thermal
- Materials: Other
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Supplier: EQYO
Description: This excellent multi-purpose, wear-resistant material is suitable for bearing, thrust washer, and piston ring applications. It also has a low coefficient of thermal expansion.
- Bearing Surface Material: Plastic
- Bushing Type: Sleeve
- Extreme Environment: Yes
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Supplier: Henkel Corporation - Industrial
Description: recommendations. High temperature resistance High thermal conductivity Excellent chemical resistance Low coefficient of thermal expansion Low shrinkage
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Viscosity: 25000 cP
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): 4.5 to 5.5
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 41.67 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Matexcel
Description: This product adopts the original "solid phase intercalation-liquid phase expansion" process, which realizes the large-scale production of graphene materials with high quality, high efficiency, high yield and low pollution. The process is free of oxidation and reduction, and
- Shape / Form: Powder / Aggregate (Grain / Grog)
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Description: . Easy machinability and fast availability make Boron Nitride an outstanding choice for prototypes to large quantities requiring its unique properties. Typical Features Low density Low thermal expansion Good thermal shock resistance Low
- Material Type: Aluminum Nitride, Boron Nitride
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about 1 mm in width. The glass transition temperature is over 150°C, which helps to improve
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): 4.5 to 5.5
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Supplier: Henkel Corporation - Industrial
Description: catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. High thermal conductivity Low thermal expansion Low CTE Electrically
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.38 W/m-K
- Viscosity: 250000 cP
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Supplier: Accuratus Corporation
Description: . Silicon carbide is not attacked by any acids or alkalis or molten salts up to 800°C. In air, SiC forms a protective silicon oxide coating at 1200°C and is able to be used up to 1600°C. The high thermal conductivity coupled with low thermal expansion and high strength
- Material Type: Carbide Materials, Silicon Carbide
- Shape / Form: Fabricated / Custom Shape
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Description: mechanical polishing (CMP) blocks and susceptors. Its thermal expansion match to silicon, high elastic modulus, chemical inertness ensures the economic benefits of maintenance and reuse, and high thermal conductivity for even, rapid heating of the silicon wafer. Hexoloy® SA
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Supplier: Haida International Equipment Co., Ltd.
Description: Product Introduction Environment Thermal Shock Chamber is used to test the bearing extent of the material structures and composite material in an instant and continuous high temperature and extremely low temperature environment, which is in the shortest time to test its
- Configuration: Floor Mount
- Features: Programmable
- Temperature Control: Heating, Cooling
- Temperature Range: -40 to 80 C
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Supplier: Accuratus Corporation
Description: materials for mullite are easily obtainable and are reasonably priced. It has excellent high temperature properties with improved thermal shock and thermal stress owing to the low thermal expansion, good strength and interlocking grain structure.
- Applications: Electrical / HV Parts, Refractory / High Temperature Materials
- Bore Diameter (I.D.): 0.1850 inch
- Coeff. of Thermal Expansion (CTE): 5.4 µm/m-C
- Compressive / Crushing Strength: 189998 psi
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Supplier: Accuratus Corporation
Description: materials for mullite are easily obtainable and are reasonably priced. It has excellent high temperature properties with improved thermal shock and thermal stress owing to the low thermal expansion, good strength and interlocking grain structure.
- Applications: Electrical / HV Parts, Refractory / High Temperature Materials
- Bore Diameter (I.D.): 0.3740 inch
- Coeff. of Thermal Expansion (CTE): 5.4 µm/m-C
- Compressive / Crushing Strength: 189998 psi
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Supplier: Edmund Optics Inc.
Description: window surface, large apertures, and minimal thermal expansion coupled with low absorption from 8 - 14µm make them ideal for a range of infrared applications.
- Window Type: Plane Windows
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Supplier: Edmund Optics Inc.
Description: window surface, large apertures, and minimal thermal expansion coupled with low absorption from 8 - 14µm make them ideal for a range of infrared applications.
- Window Type: Plane Windows
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Supplier: Edmund Optics Inc.
Description: window surface, large apertures, and minimal thermal expansion coupled with low absorption from 8 - 14µm make them ideal for a range of infrared applications.
- Window Type: Plane Windows
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Supplier: Edmund Optics Inc.
Description: window surface, large apertures, and minimal thermal expansion coupled with low absorption from 8 - 14µm make them ideal for a range of infrared applications.
- Window Type: Plane Windows
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Supplier: Graphene Laboratories, Inc.
Description: conductive adhesive with excellent mechanical properties can withstand thermal expansions, mechanical stresses, and environmental conditions without compromising the bond's integrity. TYPICAL APPLICATION: Electronic Assembly, Thermal Interface Materials (TIMs), Solar
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Features: Electrically Conductive
- Filled / Reinforced: Yes
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATITE®650 is an alloy of silicon nitride and aluminum oxide. This superior refractory material has the combined properties of silicon nitride (high strength, hardness, fracture toughness, and low thermal expansion) and aluminum oxide (corrosion resistance, chemically
- Applications: Abrasive / Erosive Wear Protection, Corrosion Protection, Dielectric / Electrical Insulation, Foundry / Metal Processing, Refractory / High Temperature Materials, Thermal Insulation / Fire Proofing, Other
- Bore Diameter (I.D.): 0.2559 to 0.6299 inch
- Coeff. of Thermal Expansion (CTE): 3 µm/m-C
- Density: 3.24 g/cc
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Featured Products Top
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Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
ideal for heat dissipation. EP53TC meets ASTM E595 NASA low outgassing specifications and provides reliable electrical insulation with a volume resistivity greater than 1014 ohm-cm. The material offers a thermal resistance of 10-15 x 10-6 K•m2/W and a (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
1. Easily machine to custom design 2. Good thermal resistance 3. Low thermal expansion 4. Good thermal shock resistance 5. High electrical insulation 6. Non wet to molten metal and glass 7. Good corrosion resistance (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
temperatures, making them suitable for demanding thermal environments. Low Thermal Expansion: The combination of metal and ceramic reinforcement gives MMCs a low coefficient of thermal expansion, ensuring dimensional stability even under temperature variations. (read more)
Browse Ultra-hard Materials Machining Datasheets for Top Seiko Co., Ltd. -
, low thermal expansion, and chemical resistance. Key features include: Excellent optical transmittance from ultraviolet to (read more)
Browse Glass Materials Datasheets for Fountyl Technologies Pte. Ltd. -
Long Description Engineers in semiconductor, optics, and photonics applications often face thermal distortion, chemical corrosion, and insufficient material (read more)
Browse Silica, Quartz, and Silicate Materials Datasheets for Fountyl Technologies Pte. Ltd. -
N ceramic components ideal for demanding industrial applications requiring thermal management and precision. Furthermore, their low thermal expansion and chemical stability enable engineers to maintain performance in high-temperature or thermally stressed environments. By choosing our Al (read more)
Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
V/mm Thermal Stability: Operating temperature from –200?°C to +800?°C, with low thermal expansion Vacuum Compatible: Extremely low (read more)
Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
Low thermal expansion for improved dimensional stability Designed for Clean and Demanding Environments (read more)
Browse Industrial Ceramic Materials Datasheets for Fountyl Technologies Pte. Ltd. -
2200°C. Acid, alkali, salt, and organic reagent resistance. Meanwhile, it does not react with the majority of molten metal and semiconductor material. Excellent thermal shock resistance, excellent thermal conductivity, low thermal expansion coefficient. High (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd.
Conduct Research Top
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Why Is Titanium Such An Attractive Material For Fasteners Used In Critical Environments?
. It provides a low coefficient of thermal expansion and is not prone to embrittlement at extremely low temperatures. How are these benefits for a screw?
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AMB AlN Ceramic Substrate
Aluminum nitride (AlN) ceramics as a high thermal conductivity, thermal expansion coefficient close to silicon semiconductor material, has good insulation and mechanical properties, aluminum nitride copper clad plate has very high thermal conductivity in thermal characteristics, heat dissipation
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Direct Bonded Copper Ceramic Substrates
thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications.
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The Differences Between DBC and DPC Ceramic Substrates
mechanical strength, and low coefficient of thermal expansion, and they are the common substrate materials for power semiconductor device packaging.
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Borosilicate Glass (PYREX 7740; Schott 8330)
Borosilicate glass is composed of 80.6% SiO2, 12.6% NaO2, 2.2% Al2O3 and traces of other key materials. This glass was formulated to achieve excellent thermal shock resistance and high-temperature resistance. Additional benefits include low thermal expansion and high resistance to chemical attack
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Invar
Invar alloys are widely known and utilized because they exhibit a coefficient of thermal expansion (CTE) that is close to zero. The fact that Invar maintains this low CTE over room temperature has made it one of the most effective alloys for use in precision instruments. You will find Invar alloys
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Isonics says study confirms thermal improvements in silicon-28 material Rambus to seek range of licensing deals after settling with Hitachi Oki plans CMOS single-chip Bluetooth solution TI to buy wireless chip supplier Alantro for $300 million in stock Motorola completes $30 million purchase
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FAST, ECONOMICAL TOOLING OPTIONS FOR PROTOTYPING AND CUSTOM BUILDS
managers have the challenge of keeping costs low and turnaround times fast while still producing accurate models. These objectives are top-of-mind when selecting the best tooling method, whether you†TMre creating prototype parts, one-off components, or composite layup tools. The tooling material
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Indicates content that may require registration and/or purchase.
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Advanced Materials, ICAMMP 2011
A simplified method with much lower time and energy costs is presented for the rapid synthesis of low thermal expansion materials of CaZr4P6O24, SrZr4P6O24 and their solid solution Ca0.5Sr0.5Zr4P6O24.
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Low thermal expansion behavior and transport properties of Ni and Ge co-doped manganese nitride materials at cryogenic temperatures
To avoid these problems, one of the possible methods is the development of very low thermal expansion material .
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Optimal design of periodic frame structures with negative thermal expansion via mixed integer programming
The low thermal expansion material (M2) is placed outside of the high thermal expansion material (M1), as expected.
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Advanced Ceramic Technologies & Products
Low thermal expansion mate- rials (thermal shock resistant materials) are essential for hon- eycombs and so on, that are used in environments with sudden temperature changes.
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Thermal Design and Thermal Behaviour of Radio Telescopes and their Enclosures
…radiation and low emission in the infrared; the coatings may have little specular reflection; (4) surfaces with micro–grooves or sand blasted finish to reduce specular reflec- tion; (5) insulation, air gaps, radiation shields; (6) low thermal expansion materials like CFRP and invar.
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EUV Lithography
low thermal expansion material .
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A miniature 1×2 mechanical optical switch with anti-thermal design
Shaft Housing (Steel, low thermal expansion material )Relay .
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CUVAR-a new controlled expansion, high conductivity material for electronic thermal management
CUVAROis an alternative to low thermal expansion materials such as Kovar and Alloy 42 with a much higher thermal conductivity.