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Supplier: Master Bond, Inc.
Description: Bond EP30LTE is formulated with a unique blend of polymeric and inorganic materials to obtain thermal expansion coefficients as low as 12x10-6 in/in°C as well as unmatched dimensional stability, making possible new standards of performance for bonding, coating, sealing,
- Viscosity: 15,000 to 20,000 cP
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 0.721 W/m-K
- Coeff. of Thermal Expansion (CTE): 19 to 22 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
- Applied Thickness / Gap Fill: 0.003 to 0.006 inch
- Viscosity: 40,000 to 80,000 cP
- Use Temperature: -100 to 400 F
- Coeff. of Thermal Expansion (CTE): 7,222,222.222222222 to 8,888,888.888888888 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.
- Applied Thickness / Gap Fill: 0.004 to 0.006 inch
- Viscosity: 70,000 to 100,000 cP
- Use Temperature: -100 to 250 F
- Coeff. of Thermal Expansion (CTE): 5,555,555.555555555 to 7,222,222.222222222 µin/in-F
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Supplier: Leading Edge Metals & Alloys, Inc.
Description: With an extremely low coefficient of thermal expansion, approximately one-tenth that of carbon steel at temperatures up to 400° F, Invar® is often thought of as the material of choice for low expansion nickel alloy applications. The ability to maintain
- Overall Width / OD: 12 to 24 inch
- Overall Thickness: 0.001 to 2 inch
- Overall Length: 75 to 144 inch
- Type: Alloy, Nickel / Nickel Alloy (UNS N)
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Supplier: Master Bond, Inc.
Description: Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding dimensional stability and will bond well to a wide variety of substrates,
- Use Temperature: -60 to 300 F
- Coeff. of Thermal Expansion (CTE): 56.99999999999999 to 6.677 µin/in-F
- Tensile Strength (Break): 6,000 to 7,000 psi
- Dielectric Strength: 400.00000000000006 to 450.00000000000006 kV/in
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Supplier: Sauereisen, Inc.
Description: Sauereisen Low Expansion Cement No. 29 is an inorganic cement used for embedding heating elements, insulating thermocouples, coating resistors and coils, and mechanically sealing parts where high resistance to electricity, chemicals and thermal shock is required. A strong
- Use Temperature: 1,550 F
- Thermal Conductivity: 1.1538232 W/m-K
- Coeff. of Thermal Expansion (CTE): 4.6 µin/in-F
- Tensile Strength (Break): 425 psi
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Description: range of normal atmospheric conditions. The alloy has a low coefficient of thermal expansion up to 500 °F (260 °C).
- Tensile Strength (UTS, Break): 71,000 psi
- Yield Strength (YS): 35,000 psi
- Elongation: 42 %
- UNS Number: 93,600
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Supplier: SPIE - Education
Description: dissipation, thermal stresses, warpage, alignment, weight, size, cost, and manufacturing yield. Decades-old traditional low-coefficient-of-thermal-expansion (CTE) materials like tungsten/copper, molybdenum/copper, copper-Invar-copper, "Kovar", etc., have
- Type: Course
- Technology / Subject Expertise: Electronics, Photonics / Optics
- Delivery: On-site / In Plant
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Supplier: Indium Corporation
Description: coefficient of thermal expansion (CTE) Pb-free solders that reflow in the range of the traditional SnPb and SnPbAg options
- Solder Alloy: Indium (In)
- Features: Other
- Joining Process / Product Form: Paste
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Supplier: ASTM International
Description: creep, insofar as significantly affecting the precision of thermal length change measurements. 1.3 It is recognized that many rigid solids require detailed preconditioning and specific thermal test schedules for correct evaluation of linear thermal expansion behavior for
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Description: Programmable High Low Temperature Thermal Shock Environmental Test Chamber is used to test the bearing extent of the material structures and composite material in an instant and continuous high temperature and extremely low temperature environment, which is in the
- Features: Other Test Mode
- Applications: Product Qualification / Testing, R&D / Product Design Verification, Reliability / Durability Testing, Semiconductors / Electronics Screening
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Description: high low temperature fast change programmable thermal shock chamber is used to test the bearing extent of the material structures and composite material in an instant and continuous high temperature and extremely low temperature environment, which is in the
- Features: Other Test Mode
- Applications: Product Qualification / Testing, R&D / Product Design Verification, Reliability / Durability Testing, Semiconductors / Electronics Screening
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI FORM TLF 2000, Thermally Conductive, One-Part, Liquid Formable Material BERGQUIST® LIQUI FORM TLF 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component
- Features: Thermal / Heat Conductive
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are
- Thermal Conductivity: 1.31247389 W/m-K
- Coeff. of Thermal Expansion (CTE): 15.222222222222221 µin/in-F
- Dielectric Strength: 369.99999999999903 kV/in
- Dielectric Constant (Relative Permittivity): 5.41
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Supplier: Epoxies Etc...
Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system
- Viscosity: 3,000 to 90,000 cP
- Use Temperature: -67 to 401 F
- Thermal Conductivity: 1.65862085 W/m-K
- Coeff. of Thermal Expansion (CTE): 16.666666666666668 µin/in-F
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Supplier: Allied Electronics, Inc.
Description: Aavid's Ultrastick is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free, paraffin-based thermal compound changes phase at 60°C, with a concurrent volumetric expansion
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Supplier: Epoxies Etc...
Description: 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system
- Viscosity: 3,000 to 15,000 cP
- Use Temperature: -67 to 401 F
- Thermal Conductivity: 3.6056975 W/m-K
- Coeff. of Thermal Expansion (CTE): 16.666666666666668 µin/in-F
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Supplier: Haida International Equipment Co., Ltd.
Description: Product Introduction Environment Thermal Shock Chamber is used to test the bearing extent of the material structures and composite material in an instant and continuous high temperature and extremely low temperature environment, which is in the shortest time to test its
- Temperature Range: -40 to 80 C
- Temperature Control: Cooling, Heating
- Configuration: Floor Mount
- Features: Programmable
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Supplier: Haida International Equipment Co., Ltd.
Description: Product usage: Temperature Shock Chambers can test the material’s chemical change or physics change by expansion and contraction in high and low temperature environment within short time. This type climatic environmental shcok test chamber is application to metal, plastic,
- Temperature Range: -65 to 175 C
- Temperature Control: Cooling, Heating
- Configuration: Floor Mount
- Features: Programmable
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Supplier: Mid-Mountain Materials, Inc.
Description: Manufactured from bulk refractory fibers, THERMOSEAL® Refractory Cements, Moldables and Coatings are excellent for use in high- temperature resistant sealing and thermal insulation applications. All of our THERMOSEAL® products are carefully formulated to withstand thermal
- Max Use Temperature: 538 C
- Max Use: 538 C
- Technology / Cure Type: Air Setting
- Cement / Raw Material Form: Cement / Binder
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Supplier: EQYO
Description: This excellent multi-purpose, wear-resistant material is suitable for bearing, thrust washer, and piston ring applications. It also has a low coefficient of thermal expansion.
- Extreme Environment: Extreme Environment
- Bearing Surface: Plastic
- Bushing Type: Sleeve
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Supplier: DeZURIK, Inc.
Description: occasional contact with oil, weathering, ozone and corrosives. The SL-53 Triple Arch Expansion Joint is simple and economical to use. The SL-53 Expansion Joint will absorb movement from vibration, thermal expansion and contraction, and allow for misalignment of piping.
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Supplier: ASTM International
Description: method shall not be used for measurements on materials having a very low coefficient of expansion (less than 1 X 10 -6 1°C). For materials having very low coefficient of expansion, interferometer or capacitance techniques are recommended. 1.2 The
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Supplier: Fountyl Technologies Pte. Ltd.
Description: AISiC is a composite material, with high specific strength and specific stiffness, low thermal expansion coefficient, low density, high micro yield strength, good dimensional stability, thermal conductivity, wear resistance, fatigue resistance and other
- Shape / Form: Fabricated / Custom Shape
- Features: Other
- Specialty Ceramic Type: Silicon Carbide
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Supplier: ASTM International
Description: 1.1 This test method covers determination of the coefficient of linear thermal expansion for plastic materials having coefficients of expansion greater than 1 µm/(m.°C) by use of a vitreous silica dilatometer. At the test temperatures and under the stresses imposed, the
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Supplier: Ellsworth Adhesives
Description: expansion, non-sagging, versatility, low stress bonds, and excellent thermal cycling properties. 22 kg Pail.
- Viscosity: 20 to 105 cP
- Thermal Conductivity: 1.22 to 1.44 W/m-K
- Dielectric Strength: 449.58000000000095 kV/in
- Substrate Compatibility: Ceramic / Glass, Metal
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 Black is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is resistant to
- Thermal Conductivity: 1.37 W/m-K
- Dielectric Strength: 381.0000000000008 kV/in
- Viscosity: 50,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: expansion, non-sagging, versatility, low stress bonds, and excellent thermal cycling properties. 1 qt Can.
- Thermal Conductivity: 1.22 to 1.44 W/m-K
- Dielectric Strength: 449.58000000000095 kV/in
- Substrate Compatibility: Ceramic / Glass, Metal
- Features: Thermal / Heat Conductive
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Description: which is the largest among ceramic materials above 530 ℃. Low thermal expansion coefficient: 2×10-6 is the smallest expansion coefficient in ceramics, next only to quartz glass The lower friction coefficient: U is 0.16 and does not increase at high temperature Good
- Density: 2.2699985673415775 g/cc
- Thermal Conductivity: 33 W/m-K
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Applications: Electrical / HV Parts
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Supplier: Ellsworth Adhesives
Description: expansion, non-sagging, versatility, low stress bonds, and excellent thermal cycling properties. 1 gal Pail.
- Thermal Conductivity: 1.22 to 1.44 W/m-K
- Dielectric Strength: 449.58000000000095 kV/in
- Substrate Compatibility: Ceramic / Glass, Metal
- Features: Thermal / Heat Conductive
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Description: Composite heat-sinks made of molybdenum/copper (Mo/Cu) or copper tungsten (Cu/W) are then integrated into strategic locations of the structure. This combination of titanium and Mo/Cu or Cu/W is ideal for achieving lightweight, low-coefficient of thermal expansion (CTE), and
- Features: Other
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Supplier: Matexcel
Description: This product adopts the original "solid phase intercalation-liquid phase expansion" process, which realizes the large-scale production of graphene materials with high quality, high efficiency, high yield and low pollution. The process is free of oxidation and reduction, and
- Shape / Form: Powder / Aggregate (Grain / Grog)
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Supplier: CHT USA Inc.
Description: low modulus, QSil 553 will minimize cooefficient of thermal expansion (CTE) strain. QSil 553 is thermally conductive to aid in efficient heat dissipation. This silicone elastomer is also flame retardant and is UL Listed in file QMFZ2.E205830.
- Use Temperature: -67 to 464 F
- Thermal Conductivity: 0.68 W/m-K
- Elongation: 240 %
- Tensile Strength (Break): 249.46336369437884 psi
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Supplier: Protavic America, Inc.
Description: combination of excellent wetting, flow, good thermal expansion properties, thermal shock resistance, and outstanding electrical properties. Adhesion is excellent to metals, most engineered plastics, and glass.
- Viscosity: 625 cP
- Use Temperature: -85 to 347 F
- Dielectric Constant (Relative Permittivity): 4.3
- Water Absorption: 1.5 %
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Featured Products Top
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Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
ideal for heat dissipation. EP53TC meets ASTM E595 NASA low outgassing specifications and provides reliable electrical insulation with a volume resistivity greater than 1014 ohm-cm. The material offers a thermal resistance of 10-15 x 10-6 K•m2/W and a (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
temperatures, making them suitable for demanding thermal environments. Low Thermal Expansion: The combination of metal and ceramic reinforcement gives MMCs a low coefficient of thermal expansion, ensuring dimensional stability even under temperature variations. (read more)
Browse Ultra-hard Materials Machining Datasheets for Top Seiko Co., Ltd. -
, low thermal expansion, and chemical resistance. Key features include: Excellent optical transmittance from ultraviolet to (read more)
Browse Glass Materials Datasheets for Fountyl Technologies Pte. Ltd. -
Long Description Engineers in semiconductor, optics, and photonics applications often face thermal distortion, chemical corrosion, and insufficient material (read more)
Browse Silica, Quartz, and Silicate Materials Datasheets for Fountyl Technologies Pte. Ltd. -
N ceramic components ideal for demanding industrial applications requiring thermal management and precision. Furthermore, their low thermal expansion and chemical stability enable engineers to maintain performance in high-temperature or thermally stressed environments. By choosing our Al (read more)
Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
V/mm Thermal Stability: Operating temperature from –200?°C to +800?°C, with low thermal expansion Vacuum Compatible: Extremely low (read more)
Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
Low thermal expansion for improved dimensional stability Designed for Clean and Demanding Environments (read more)
Browse Industrial Ceramic Materials Datasheets for Fountyl Technologies Pte. Ltd. -
2200°C. Acid, alkali, salt, and organic reagent resistance. Meanwhile, it does not react with the majority of molten metal and semiconductor material. Excellent thermal shock resistance, excellent thermal conductivity, low thermal expansion coefficient. High (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
damage from mechanical stress or vibration. Compatibility with Modern Electronics Ceramics' low thermal expansion coefficient aligns well with the requirements of semiconductor materials, reducing the risk of thermal stress and enhancing the overall performance and longevity of electronic devices. (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited
Conduct Research Top
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Why Is Titanium Such An Attractive Material For Fasteners Used In Critical Environments?
. It provides a low coefficient of thermal expansion and is not prone to embrittlement at extremely low temperatures. How are these benefits for a screw?
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AMB AlN Ceramic Substrate
Aluminum nitride (AlN) ceramics as a high thermal conductivity, thermal expansion coefficient close to silicon semiconductor material, has good insulation and mechanical properties, aluminum nitride copper clad plate has very high thermal conductivity in thermal characteristics, heat dissipation
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Direct Bonded Copper Ceramic Substrates
thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications.
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The Differences Between DBC and DPC Ceramic Substrates
mechanical strength, and low coefficient of thermal expansion, and they are the common substrate materials for power semiconductor device packaging.
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Borosilicate Glass (PYREX 7740; Schott 8330)
Borosilicate glass is composed of 80.6% SiO2, 12.6% NaO2, 2.2% Al2O3 and traces of other key materials. This glass was formulated to achieve excellent thermal shock resistance and high-temperature resistance. Additional benefits include low thermal expansion and high resistance to chemical attack
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Invar
Invar alloys are widely known and utilized because they exhibit a coefficient of thermal expansion (CTE) that is close to zero. The fact that Invar maintains this low CTE over room temperature has made it one of the most effective alloys for use in precision instruments. You will find Invar alloys
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Isonics says study confirms thermal improvements in silicon-28 material Rambus to seek range of licensing deals after settling with Hitachi Oki plans CMOS single-chip Bluetooth solution TI to buy wireless chip supplier Alantro for $300 million in stock Motorola completes $30 million purchase
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FAST, ECONOMICAL TOOLING OPTIONS FOR PROTOTYPING AND CUSTOM BUILDS
managers have the challenge of keeping costs low and turnaround times fast while still producing accurate models. These objectives are top-of-mind when selecting the best tooling method, whether you†TMre creating prototype parts, one-off components, or composite layup tools. The tooling material
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Advanced Materials, ICAMMP 2011
A simplified method with much lower time and energy costs is presented for the rapid synthesis of low thermal expansion materials of CaZr4P6O24, SrZr4P6O24 and their solid solution Ca0.5Sr0.5Zr4P6O24.
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Low thermal expansion behavior and transport properties of Ni and Ge co-doped manganese nitride materials at cryogenic temperatures
To avoid these problems, one of the possible methods is the development of very low thermal expansion material .
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Optimal design of periodic frame structures with negative thermal expansion via mixed integer programming
The low thermal expansion material (M2) is placed outside of the high thermal expansion material (M1), as expected.
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Advanced Ceramic Technologies & Products
Low thermal expansion mate- rials (thermal shock resistant materials) are essential for hon- eycombs and so on, that are used in environments with sudden temperature changes.
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Thermal Design and Thermal Behaviour of Radio Telescopes and their Enclosures
…radiation and low emission in the infrared; the coatings may have little specular reflection; (4) surfaces with micro–grooves or sand blasted finish to reduce specular reflec- tion; (5) insulation, air gaps, radiation shields; (6) low thermal expansion materials like CFRP and invar.
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EUV Lithography
low thermal expansion material .
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A miniature 1×2 mechanical optical switch with anti-thermal design
Shaft Housing (Steel, low thermal expansion material )Relay .
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CUVAR-a new controlled expansion, high conductivity material for electronic thermal management
CUVAROis an alternative to low thermal expansion materials such as Kovar and Alloy 42 with a much higher thermal conductivity.