Metal Lithography

Description: The TWINSCAN XT:1000H 248-nm Step-and-Scan system is a new dual-stage KrF lithography tool with the highest NA and productivity in the industry, designed for 200-mm and 300-mm wafer production. Combining the imaging power of the variable 0.93-NA Carl Zeiss Starlith 4X reduction lens with

Description: As the leading global lithography event, the technical program will focus on works in optical lithography, metrology, and EUV. Leaders come to solve challenges in lithography, patterning technologies, and unique materials, while sharing the latest advancements in the

• Frequency: Annually
• Type: Conference, Exhibition
• Industry: Electronics and Semiconductor, Metals and Metal Fabrication

Description: to handle tape expansion and contraction and achieves a high level of overlay accuracy. APPLICATIONS COF T-BGA FPC Touch panels Two-metal COF TAB and more

Description: semiconductor chips, the so called 14 nm node of Complementary Metal–Oxide–Semiconductor (CMOS) chips, in mass production features a second generation three dimensional (3D) FinFET, a metal one pitch of about 55 nm and copper (Cu)/low-k (and air-gap) interconnects. The Cu/low-k

• Type: Course
• Delivery: On-site / In Plant
• Technology / Subject Expertise: Photonics / Optics
• Features: Specialty / Other

Description: Graphic technology - Process control for the production of half-tone colour separations, proof and production prints Part 9: Metal decoration printing processes using offset lithography

Description: Graphic technology \x97 Process control for the production of half-tone colour separations, proof and production prints \x97 Part 9: Metal decoration printing processes using offset lithography

Description: The HELICOFLEX® seal is a high performance, flexible metal seal that has exceptional compression and elastic recovery properties. This seal is composed of a close wound helical spring surrounded by one or more metal jackets. The spring is designed to have a specific compression

• Temperature: -457.6 to 1,472 F
• Pressure: 43,511.31 psi
• Outside Diameter: 0.1574804 to 314.9608 inch
• Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Silver, Stainless Steel, Steel, Titanium

Description: Graphic technology. Process control for the production of half-tone colour separations, proof and production prints. Part 9: Metal decoration printing processes using offset lithography

Description: The CHP6013 is a L-band monolithic 6-bit phase shifter. The circuit is manufactured with a standard 0.7µm MESFET process : via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in surface mount ceramic-metal package.

• Frequency Range: 1,200 to 1,400 MHz
• Insertion Loss: 8.5 dB
• Features: Other
• Package Type: Surface Mount Technology (SMT)

Description: The CHX2193-FAA is a 6.25-8.25GHz frequency doubler designed for a wide range of applications, from military to commercial communication systems. It is proposed in leadless surface mount hermetic metal ceramic 6x6mm² package. The circuit is manufactured with a pHEMT process, 0.25µm gate

• Input Frequency Range: 6,250 to 8,250 MHz
• Input Power: 14 dBm
• Multiplying Factor: 2X
• Features: Other

Description: Increase the overall sealing performance for your installations with TEXEAL®, the new patented texturing process, applied to HELICOFLEX®, already the resilient metal seal standard for high-performance sealing. HELICOFLEX® TEXEAL® can help reduce operating costs during maintenance. It is a

• Temperature: -315.4 to 1,202 F
• Pressure: 52,576.16625 to 117,799.61994 psi
• Material: Nickel / Nickel-Based Alloy
• Application / Industry: Nuclear

Description: Used beneath photoresists in a bilayer stack, PMGI and LOR resists create a controlled undercut profile that extends lift-off performance beyond the limits of single-layer systems. These materials support both ultra-high-resolution metallization (<0.25 µm) and thick metal deposition (>3 µm),

• Applications: Electronics / Microelectronics
• Thick Film Type: Resistor

Description: Mimix Broadband's three stage 43.5-46.5 GHz GaAs MMIC power amplifier has a small signal gain of 14.0 dB with +24.0 dBm P1dB output compression point. This MMIC uses Mimix Broadband's GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability

• Frequency Range: 43,500 to 46,500 MHz
• Maximum Gain: 14 dB
• Output Power( P_1dB): 24 dBm
• Features: Other

Description: Mimix Broadband's three stage 17.0-26.0 GHz GaAs MMIC power amplifier has a small signal gain of 19.0 dB with a +23.0 dBm saturated output power. This MMIC uses Mimix Broadband's GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and

• Frequency Range: 17,000 to 26,000 MHz
• Maximum Gain: 19 dB
• Output Power( P_1dB): 23 dBm
• Features: Other

Description: procedures are covered in Test Methods D1308, D1647, and D2248. 1.3 This test method is applicable to prints on any flat substrate including paper, paperboard, metallic foil, metal plate, and plastic films, and produced by any printing process including letterpress, offset lithography,

Description: covered in Test Methods D1308, D1647, and D2248. 1.3 This practice is applicable to prints on any flat substrate including paper, paperboard, metallic foil, metal plate, and plastic films, and produced by any printing process including letterpress, offset lithography, flexography,

Description: design with zero wear. Closed-loop control with highly temperature stable metal foil strain gauges allows fast and linear motion. The unit is driven with Mars-rover tested high performance PICMA® piezo actuators guarded by all-ceramic insulation for longer lifetime and protection from

• Diameter, Square Side, Rectangular Length, or Elliptical Major Axis: 25 mm
• Shape: Circular
• Adjustment Type: Kinematic
• Mount Type: Mirror Mount

Description: LaserSintering.com has provided customers with rapid prototyping & manufacturing services and solutions for over five years, and is the world's first site for instant online quoting for plastics and metals. With our state-of-the-art technology and equipment, we provide you with instant

• Services: 3D Printing, Bills of Material (BOM), Finite Element Analysis (FEA), Part Design, Solid Modeling, Stereolithography
• Industry: Aerospace, Agricultural, Automotive, Biotechnology, Building and Construction, Chemical Processing, Computer, Consumer, Education, Electronics, Energy, Environment, Food and Beverage, General Industrial, Government, Marine, Medical, Metals and Mining, Military, Pharmaceutical, Rail,
• File Types: IGES, SolidWorks
• Software Capabilities: Industrial Design CAD, Mechanical CAD (MCAD)

Description: topography of the living cells at a high spatial resolution and force sensitivity. Besides surface characterization, AFM based local anodic oxidation (LAO) lithography has been used to fabricate micro- and nano-structures on organic or inorganic surfaces. For example, AFM has been used to cut

• Forms Tested / Certified: Components / Parts, Products, Samples or Materials
• Capabilities: Consulting / Training, Failure Analysis / Troubleshooting, Test Development
• Applications / Industry: Health Care / Medical, Materials
• Features: Specialty / Other

Description: covered in Test Methods D1308, D1647, and D2248. 1.3 This practice is applicable to prints on any flat substrate including paper, paperboard, metallic foil, metal plate, and plastic films, and produced by any printing process including letterpress, offset lithography, flexography,

Description: of extreme precision optical systems manufacturing, including some of the world's challenging lithography and metrology systems, and both space-based and terrestrial optical systems. With more than 80 years of experience, ASML Optics is able to bring to its customers a history of innovation

• Features: East Asia / Pacific Only, Europe Only, Midwest US Only, North America, Northeast US Only, Northwest US Only, Southern US Only, Southwest US Only, United States Only
• Materials: Glass, Metal
• Wavelength Range: IR, UV, Visible

Description: metallic foil, metal plate, and plastic film, and are produced by any printing process including letterpress, offset lithography, flexography, gravure, and silk screen. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the

Description: lasers are used at 193 nm. Visual inspection and metrology Optics and micro-optics inspection Laser patterning and scribing Micromachining brittle materials, such as ceramic, metal, or plastic Laser ablation / Pulsed laser deposition (ICP-MS) Dermatology, e. g. treatment of psoriasis and

• Wavelength Range: 193 to 248 nm
• Laser Power: 1,200 to 10,000 milliwatts
• Pulse Energy: 6 to 10 mJ
• Pulse Length: 5 to 10 ns

Description: RS-232 serial interface. The RS-232 offers reporting functions only. Each probe is configured with a smart sensor tip. The sensor tip is protected by a sintered metal filter cartridge. Both the filter and the sensor tip are replaceable. The probe may be directly inserted into process

• Relative Humidity Range: 0 to 99.9 %
• Relative Humidity Accuracy: 1.8 %
• Operating Temperature: -40 to 257 F
• RH/a_w Range: 0 to 99.9 %