Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Aries Electronics, Inc.
Description: need for laser-drilled micro vias motherboards GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces, both sides PADS: finished with ENIG (Electroless Ni Immersion Au), NSMD SOLDER SPHERES: 63/37 Sn/Pb or Lead-free SAC 305 TRACE WIDTH/SPACE:
- Operating Temperature: 105 C
- Contacts Pitch: 0.4 to 1.27 mm
- Socket Type: BGA
- Contact Plating: None
-
Supplier: ERSAELECTRONICS PTE. LTD.
Description: SPECIALTY INTERFACE CIRCUIT, PBGA12, PLASTIC, MICRO, BGA-12 Product overview: TXB0104GXUR from Texas Instruments is a Logic IC for digital control, signal routing, level logic, timing, buffering, and embedded board design. It is useful for engineers and buyers comparing datasheets,
- Propagation Delay: 7.4 ns
- Operating Temperature: -40 C
- IC Package Type: Other
-
Supplier: ERSAELECTRONICS PTE. LTD.
Description: SPECIALTY CONSUMER CIRCUIT, PBGA96, GREEN, PLASTIC, MICRO, BGA-96 Product overview: VSP2254GSJ from Texas Instruments is a Video Processing Ic for embedded electronics, industrial equipment, maintenance repair, OEM production, and component sourcing. It is useful for engineers and
- Operating Temperature: -13 to 185 F
-
-
Supplier: Advanced Interconnections Corp.
Description: This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design offers the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the
- Number of Contacts: 4 to 900
- Contacts Pitch: 0.5 to 0.65 mm
- Socket Type: BGA, CSP, LGA, Receptacle, Test / Prototyping Socket
- Contact Plating: Gold Plating
-
Supplier: ERSAELECTRONICS PTE. LTD.
Description: LED DISPLAY DRIVER, PBGA20, 1.615 X 2.015 MM, 0.60 MM HEIGHT, 0.40 MM PITCH, MICRO, BGA-20 Product overview: LM2756TMX from Texas Instruments is a LED Driver IC for LED lighting, display backlights, indicator control, automotive lighting, signage, and regulated current drive circuits.
-
Supplier: ERSAELECTRONICS PTE. LTD.
Description: TSB43CA42 iceLynx-Micro 2 Port IEEE 1394a-2000 CES Abbrev. DM 176-BGA MICROSTAR 0 to 0 Product overview: TSB43CA42ZGW from Texas Instruments is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and
- Bandwidth: 50 MB/Sec
- Operating Temperature: -20 C
- Package Type: BGA
- Features: Other
-
Supplier: Plastronics Socket Company, Inc.
Description: an enabling cost. BGA sockets with the H-Pin provide a high-performance socket that is affordable for all burn-in operations. The BGA platform serves package sizes from as small as 6.0mm X 6.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages. Click on a
- Current Rating: 1 amps
- Contact Resistance: 35 milliohms
- Operating Temperature: -55 to 150 C
- Number of Contacts: 1,000
-
Supplier: Global American, Inc.
Description: The ME-C79-G MicroATX Industrial motherboard provides excellent CPU, graphics, media performance, flexibility, and enhanced security and is ideally suited for applications requiring multi-tasking capabilities, such as gaming, surveillance, medical, defense, transportation and industrial automation
- Max Speed: 1.333 to 1.6 GHz
- Memory Capacity: 32 GB
- PCI Slots: 2
- LAN / Networking: 2
-
Supplier: Utmel Electronic Limited
Description: 16/32-BITS MICROS
- Clock Speed: 48 MHz
- Internal RAM Size: 128 KB
- Supply Voltage (Vcc): 1.8 volts
- Operating Temperature: -40 to 85 C
-
Supplier: Win Source Electronics
Description: Package: 120-BGA (7x7) Temperature Range - Operating: -40°C ~ 85°C Case / Package: 120-VFBGA ECCN: 5A992C Fake Threat In the Open Market: 84 Voltage - Supply (Vcc/Vdd): 1.85V ~ 3.8V HTSUS: 8542.31.0001 Other Part Number:
- Clock Speed: 48 MHz
- Internal RAM Size: 1,000 KB
- Supply Voltage (Vcc): 1.85 to 3.8 volts
- Number of I/O Ports: 93
-
Supplier: American Portwell Technology Inc.
Description: microATX Form Factor Carrier Board for BGA Type VI COM Express Module
- Features: Other
-
Supplier: Utmel Electronic Limited
Description: 32-bit Microcontrollers - MCU ColdFire Micro- Controller
- Internal RAM Size: 32 KB
- Operating Temperature: -40 to 85 C
- Bits: 32 Bit
- Package Type: BGA
-
Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 745966-HD3SS215ZQER BGA Packaging: Reel Applications: DisplayPort Switch Circuit: SPDT -3db Bandwidth: 7GHz Categories: Integrated Circuits Supplier Device Package: 50-BGA MicroStar Jr. (5x5) Temperature Range - Operating: 0°C ~
- TJ: 0 to 70 C
-
Supplier: Utmel Electronic Limited
Description: ARM Microcontrollers - MCU Stellaris Micro controller
- Internal RAM Size: 96 KB
- Supply Voltage (Vcc): 1.3 volts
- Number of Timers: 4
- Pin Count: 108
-
Supplier: American Portwell Technology Inc.
Description: Micro-ATX Form Factor Carrier Board For COM Express Type VI Module for (BGA) CPU embedded Module Features COM Express carrier board accepts Portwell Type VI BGA COM Express modules Micro-ATX form factor to meet most standard mounting space and provide more expansions
- Operating Temperature: 32 to 140 F
- Operating Humidity: 5 to 90 %
- Form Factor: COM Express Basic
- Features: Keyboard Support, Mouse Support, Other, RJ-45 Connectors, Speaker Support, Watchdog Timer
-
Supplier: Molex Signal Tech Industrial Ltd.
Description: pin-to-pin noise or what is often called crosstalk during testing. DaVinci Micro fully shielded signal path negates the effects of cross-talk during test, allowing an immediate yield enhancement over non-DaVinci products. Features & Benefits Features Spring probe technology using homogenous
- Socket Type: BGA, LGA, QFN, Test / Prototyping Socket
- Product Type: IC Socket
-
Supplier: Texas Instruments
Description: 32-Bit, 33 MHz PCI-to-PCI Bridge, Compact PCI Hot-Swap Friendly, 9-Master, MicroStar Packaging 209-BGA MICROSTAR 0 to 70
- Technology: PCI
- Device Type: PCI / PCI Express Bridge
-
Supplier: Texas Instruments
Description: TSB43CA42 iceLynx-Micro 2 Port IEEE 1394a-2000 CES Abbrev. DM 176-BGA MICROSTAR -20 to 70
- TJ: -20 to 70 C
- Technology: IEEE 1394 (FireWire®)
- Features: Other, RoHS Compliant
-
Supplier: Quarktwin Technology Ltd.
Description: Handheld/Mobile Devices PMIC 169-BGA MicroStar (12x12)
- Supply Voltage (Vi): 3 to 5.5 volts
- Operating Temperature: -40 to 85 C
- Type: BGA
- Features: Other
-
Supplier: Data Device Corporation (DDC)
Description: Mark3 is the industry's smallest ceramic gull-lead 1553 terminal. At 0.815 inches square, the Micro-ACE-TE (BGA package) provides the smallest industry footprint, enabling its use in applications where PC board space is at a premium. These devices integrate dual 3.3 or 5 volt
- Pin Count: 80 #
- Supply Voltage: 3.3 V, 5 V
- Package Type: BGA
- Device Type: CardBus Controller, Transceiver
-
Supplier: Data Device Corporation (DDC)
Description: Supports 1553A/B notice 2, McAir, STANAG 3838 protocols, .80 inches square
- Supply Voltage: 3.3 V, 5 V
- Package Type: BGA
- Device Type: CardBus Controller
- Technology: PCI
-
Supplier: Quarktwin Technology Ltd.
Description: HDMI Interface 50-BGA MicroStar Junior (5x5)
- Supply Voltage: 3.6V
- Package Type: BGA
- Technology: HDMI
- Features: Other, RoHS Compliant
-
Supplier: Quarktwin Technology Ltd.
Description: Controller 421-Micro-BGA (31x31)
-
Supplier: DigiKey
Description: HDMI Interface 50-BGA MicroStar Junior (5x5)
-
Supplier: Quarktwin Technology Ltd.
Description: C28x C2000™ C28x Fixed-Point Microcontroller IC 32-Bit Single-Core 150MHz ROMless 179-BGA MicroStar (12x12)
- Clock Speed: 150 MHz
- Internal RAM Size: 20 KB
- Number of I/O Ports: 56
- Operating Temperature: -40 to 125 C
-
Supplier: DigiKey
Description: Handheld/Mobile Devices PMIC 169-BGA MicroStar (12x12)
- Operating Temperature: -40 to 85 C
- Features: Other
-
Supplier: DigiKey
Description: Analog Switch IC 2 Channel 50-BGA MicroStar Junior (5x5)
- Supply Voltage (VS): 3 to 3.6 volts
- Max Ron: 12 ohms
- Operating Ambient Temperature: -40 to 105 C
- Pin Count: 50
-
Supplier: Rochester Electronics
Description: Micro Peripheral IC, CMOS, PBGA432
- Package Type: BGA
- Features: Other
-
Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 873382-HD3SS214ZQER Operating Temperature Range: 0°C ~ 70°C (TA) Features: Analog Switch IC 2 Channel 50-BGA MicroStar Junior (5x5) Package: Reel - TR Package: 50-VFBGA Mounting: Surface Mount Part Status: Obsolete Family Name: HD3SS214
- TJ: 0 to 70 C
- Package Type: BGA
- Features: Other
-
Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 1042871-HD3SS215IZQET Packaging: Reel - TR Applications: HDMI Mounting: Surface Mount Categories: Integrated Circuits Status: Active Case / Package: 50-BGA MicroStar Jr. (5x5) Supply Voltage - Operating: 3 V to 3.6 V Popularity: Medium
- Package Type: BGA
- Features: Other
Find Suppliers by Category Top
Featured Products Top
-
. High Quality Standards: We adhere to strict quality control processes, including AOI, X-Ray, and function test Complex Assemblies Available: We specialize in assembling, like BGA soldering, micro-BGAs, and 0201 (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
type: SMT, Through-Hole (THT), or Mixed Technology Component density: High I/O BGAs, fine-pitch ICs, PoPs, or micro BGAs may require X-ray or 3D AOI Double-sided assembly: Adds handling steps and complexity Lead-free compliance: If required, specify RoHS per IPC-A-610 (read more)
Browse PCB Design and Layout Services Datasheets for Summit Interconnect
Conduct Research Top
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
each year pose little threat to U.S. electrical and electronics engineers, according to the head of an industry group. Q &A: AMD exec on MPU shortages Stephen DiFranco, corporate vice president of marketing at Advanced Micro Devices, discussed AMD's shortage of desktop processors in the channel, why
More Information Top
Indicates content that may require registration and/or purchase.
-
Pb-free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies
Micro BGA 256 (2 per board) • .
-
Materials for Advanced Packaging
Fig. 3.5 Picture and cross section of micro BGA from Tessera .
-
Micro BGA ram
• Micro BGA ram .
-
Micro BGA ram
• Micro BGA ram .
-
Heated area measurement and analysis of optical setups for focused IR light soldering system
An optimum optical setup design should provide the high performance on temperature control and uniformity, as well as output light spot control for different BGA surface areas, even for micro BGA ’s and further developed IC’s with the latest VLSI technology.