Products & Services
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Supplier: Aries Electronics, Inc.
Description: and trace spacing Eliminate the need for laser-drilled micro vias motherboards GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces, both sides PADS: finished with ENIG (Electroless Ni Immersion Au
- Output (Bottom) Side Package: BGA
- Product Type: Package Adapters / Converters
- Top (Input) Side Package: BGA
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Supplier: Advanced Interconnections Corp.
Description: This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design offers the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device
- Features: Machined Pins, Open Top Socket
- Output (Bottom) Side Package: BGA, LGA
- Product Type: Package Adapters / Converters, Programming Adapters
- RoHS Compliant: Yes
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Supplier: Utmel Electronic Limited
Description: 16/32-BITS MICROS
- Clock Speed: 50 MHz
- Data Bus: 32 Bit
- IC Package Type: BGA, Other
- Internal RAM Size: 320 KB
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Supplier: Utmel Electronic Limited
Description: 16/32-BITS MICROS
- Clock Speed: 48 MHz
- Data Bus: 32 Bit
- IC Package Type: BGA, Other
- Internal RAM Size: 128 KB
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Supplier: Utmel Electronic Limited
Description: 16/32-BITS MICROS
- Clock Speed: 26 MHz
- Data Bus: 32 Bit
- IC Package Type: BGA, Other
- Internal RAM Size: 256 KB
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Supplier: Utmel Electronic Limited
Description: 32-bit Microcontrollers - MCU ColdFire Micro- Controller
- Data Bus: 32 Bit
- IC Package Type: BGA, Other
- Internal RAM Size: 32 KB
- Life Cycle Stage: Other
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Supplier: Plastronics Socket Company, Inc.
Description: Plastronics patented technologies are based on solving the difficult industry problems associated with high frequency, high current, low stable resistance and adequate contact travel to accommodate larger package footprints. Our BGA socket platform takes advantage of the H-Pin®, a high
- Contact Plating: Gold Plating
- Contact Resistance: 35 milliohms
- Contacts Pitch: 0.4000 to 0.5000 mm
- Current Rating: 1 amps
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Supplier: Global American, Inc.
Description: The ME-C79-G MicroATX Industrial motherboard provides excellent CPU, graphics, media performance, flexibility, and enhanced security and is ideally suited for applications requiring multi-tasking capabilities, such as gaming, surveillance, medical, defense, transportation and industrial
- Chipset Type: Intel® Chipset
- LAN / Networking: 2
- Max Speed: 1.33 to 1.6 GHz
- Memory Capacity: 32 GB
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Supplier: American Portwell Technology Inc.
Description: microATX Form Factor Carrier Board for BGA Type VI COM Express Module
- Bus / Form Factor: Other
- Carrier Type: Other
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Supplier: Win Source Electronics
Description: Manufacturer: Silicon Labs Win Source Part Number: 1318546-EFM32GG890F1 024-BGA112 Category: Integrated Circuits (ICs)>Embedded>Micro controllers Packaging: Reel - TR Core Processor: ARM® Cortex®-M3 Speed: 48MHz Standard Package: 1
- Clock Speed: 48 MHz
- Data Bus: 32 Bit
- IC Package Type: Other
- Internal RAM Size: 1000 KB
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Supplier: Win Source Electronics
Description: Manufacturer: Silicon Labs Win Source Part Number: 1322691-EFM32LG395F2 56G-E-BGA120 Category: Integrated Circuits (ICs)>Embedded>Micro controllers Packaging: Tray Core Processor: ARM® Cortex®-M3 Speed: 48MHz Standard Package: 260 Mounting
- Clock Speed: 48 MHz
- Data Bus: 32 Bit
- IC Package Type: Other
- Internal RAM Size: 256 KB
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Supplier: Win Source Electronics
Description: Manufacturer: Silicon Labs Win Source Part Number: 1318544-EFM32GG295F1 024-BGA120 Category: Integrated Circuits (ICs)>Embedded>Micro controllers Packaging: Reel - TR Core Processor: ARM® Cortex®-M3 Speed: 48MHz Standard Package: 1
- Clock Speed: 48 MHz
- Data Bus: 32 Bit
- IC Package Type: Other
- Internal RAM Size: 1000 KB
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Supplier: Data Device Corporation (DDC)
Description: -ACE Mark3 is the industry's smallest ceramic gull-lead 1553 terminal. At 0.815 inches square, the Micro-ACE-TE (BGA package) provides the smallest industry footprint, enabling its use in applications where PC board space is at a premium. These devices integrate dual 3.3 or 5 volt
- IC Package Type: BGA
- Pin Count: 80 #
- Supply Voltage: 3.3 V, 5 V
- Technology: PCI
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Supplier: Molex Signal Tech Industrial Ltd.
Description: -on-chip affect pin-to-pin noise or what is often called crosstalk during testing. DaVinci Micro fully shielded signal path negates the effects of cross-talk during test, allowing an immediate yield enhancement over non-DaVinci products. Features & Benefits Features
- Package Type: BGA, LGA, QFN, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Data Device Corporation (DDC)
Description: Supports 1553A/B notice 2, McAir, STANAG 3838 protocols, .80 inches square
- IC Package Type: BGA
- Supply Voltage: 3.3 V, 5 V
- Technology: PCI
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 745966-HD3SS215ZQER BGA Packaging: Reel Applications: DisplayPort Switch Circuit: SPDT -3db Bandwidth: 7GHz Categories: Integrated Circuits Supplier Device Package: 50-BGA MicroStar Jr. (5x5) Temperature
- TJ: 0.0 to 70 C
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Description: LP8727 MICRO - MINI USB INTERFAC
- IC Package Type: BGA
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Supplier: Amphenol Communications Solutions
Description: CSTACK/CLGA CONNECTORS, CSTACK MICROPOD, BGA-1.9, 9X9, 0.7424mm Pitch, Amphenol is one of the leading manufacturers of Mezzanine Connectors. Contact us today for more details of part number 13465-001
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Supplier: American Portwell Technology Inc.
Description: Micro-ATX Form Factor Carrier Board For COM Express Type VI Module for (BGA) CPU embedded Module Features COM Express carrier board accepts Portwell Type VI BGA COM Express modules Micro-ATX form factor to meet most standard mounting space and provide more
- Features: Watchdog Timer, Keyboard Support, Mouse Support, Speaker Support, RJ-45 Connectors
- Form Factor: COM Express Basic
- Operating Humidity: 5 to 90 %
- Operating Temperature: 32 to 140 F
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Supplier: Texas Instruments
Description: 32-Bit, 33 MHz PCI-to-PCI Bridge, Compact PCI Hot-Swap Friendly, 9-Master, MicroStar Packaging 209-BGA MICROSTAR -40 to 85
- Device Type / Applications: PCI / PCI Express Bridge
- Technology: PCI
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Supplier: Texas Instruments
Description: 32-Bit, 33 MHz PCI-to-PCI Bridge, Compact PCI Hot-Swap Friendly, 9-Master, MicroStar Packaging 209-BGA MICROSTAR 0 to 70
- Device Type / Applications: PCI / PCI Express Bridge
- RoHS Compliant: Yes
- Technology: PCI
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Supplier: Texas Instruments
Description: TSB43CA42 iceLynx-Micro 2 Port IEEE 1394a-2000 CES Abbrev. DM 176-BGA MICROSTAR -20 to 70
- Device Type / Applications: Other
- IC Package Type: Other
- RoHS Compliant: Yes
- TJ: -20 to 70 C
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Supplier: Quarktwin Technology Ltd.
Description: Handheld/Mobile Devices PMIC 169-BGA MicroStar (12x12)
- Operating Temperature: -40 to 85 C
- Package Type: BGA, Other
- Supply Voltage (Vi): 3 to 5.5 volts
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Supplier: Quarktwin Technology Ltd.
Description: Handheld/Mobile Devices, OMAP™ PMIC 169-BGA MicroStar (12x12)
- Operating Temperature: -40 to 85 C
- Package Type: BGA, Other
- Supply Voltage (Vi): 2.7 to 4.5 volts
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Supplier: Quarktwin Technology Ltd.
Description: Display (LED Drivers), Handheld/Mobile Devices, Power Supply PMIC 169-BGA MicroStar (12x12)
- Operating Temperature: -40 to 85 C
- Package Type: BGA, Other
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Description: MICRO-USB INTERFACE CIRCUIT PLUS
- IC Package Type: BGA
- Supply Voltage: Other
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Supplier: Quarktwin Technology Ltd.
Description: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply PMIC 169-BGA MicroStar (12x12)
- Package Type: BGA, Other
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Description: MICRO PERIPHERAL IC PBGA421
- IC Package Type: BGA
- Supply Voltage: Other
- Technology: USB, Other
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Supplier: Rochester Electronics
Description: DSP MicroComputer, 16-Bit
- Data Bus: 16-Bit
- Package Type: BGA, Other
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Supplier: Rochester Electronics
Description: DSP MicroComputer, 16-Bit
- Data Bus: 16-Bit
- Package Type: BGA, Other
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Supplier: Rochester Electronics
Description: DSP MicroComputer, 16-Bit
- Data Bus: 16-Bit
- Package Type: BGA, Other
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Supplier: Rochester Electronics
Description: MIC2274 - Dual Micro-Power Low Voltage Supervisor
- Package Type: BGA, Other
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Supplier: RS Components, Ltd.
Description: The Analog Devices ADSP-BF60x range of dual core processors are members of the Blackfin® family of products. Incorporating Analog Devices/Intel Micro Signal Architecture (MSA), Blackfin® processors combine a dual-MAC signal processing engine, an orthogonal RISC-like microprocessor
- Clock Speed: 500 MHz
- Data Bus: 16-Bit
- Package Type: BGA
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Supplier: RS Components, Ltd.
Description: The Analog Devices ADSP-BF60x range of dual core processors are members of the Blackfin® family of products. Incorporating Analog Devices/Intel Micro Signal Architecture (MSA), Blackfin® processors combine a dual-MAC signal processing engine, an orthogonal RISC-like microprocessor
- Clock Speed: 500 MHz
- Data Bus: 16-Bit
- Package Type: BGA
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Supplier: RS Components, Ltd.
Description: The Analog Devices ADSP-BF60x range of dual core processors are members of the Blackfin® family of products. Incorporating Analog Devices/Intel Micro Signal Architecture (MSA), Blackfin® processors combine a dual-MAC signal processing engine, an orthogonal RISC-like microprocessor
- Clock Speed: 500 MHz
- Data Bus: 32-Bit
- Package Type: BGA
- Pin Count: 349
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Supplier: RS Components, Ltd.
Description: The Analog Devices ADSP-BF60x range of dual core processors are members of the Blackfin® family of products. Incorporating Analog Devices/Intel Micro Signal Architecture (MSA), Blackfin® processors combine a dual-MAC signal processing engine, an orthogonal RISC-like microprocessor
- Clock Speed: 500 MHz
- Data Bus: 32-Bit
- Package Type: BGA
- Pin Count: 349
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. High Quality Standards: We adhere to strict quality control processes, including AOI, X-Ray, and function test Complex Assemblies Available: We specialize in assembling, like BGA soldering, micro-BGAs, and 0201 (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
type: SMT, Through-Hole (THT), or Mixed Technology Component density: High I/O BGAs, fine-pitch ICs, PoPs, or micro BGAs may require X-ray or 3D AOI Double-sided assembly: Adds handling steps and complexity Lead-free compliance: If required, specify RoHS per IPC-A-610 (read more)
Browse PCB Design and Layout Services Datasheets for Summit Interconnect
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
each year pose little threat to U.S. electrical and electronics engineers, according to the head of an industry group. Q &A: AMD exec on MPU shortages Stephen DiFranco, corporate vice president of marketing at Advanced Micro Devices, discussed AMD's shortage of desktop processors in the channel, why
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Heated area measurement and analysis of optical setups for focused IR light soldering system
An optimum optical setup design should provide the high performance on temperature control and uniformity, as well as output light spot control for different BGA surface areas, even for micro BGA ’s and further developed IC’s with the latest VLSI technology.