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Supplier: Polyflon Company - a Crane Co. Company
Description: Polyflon has taken advantage of the qualities of PTFE and coupled them with a proprietary plating process to produce a microwave substrate whose electrical performance cannot be equaled by any other substrate at this time.
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Supplier: Accuris
Description: Design Guide for Microwave Circuit Boards Utilizing Soft Substrates
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR PERMITTIVITY (DIELECTRIC CONSTANT) AND DISSIPATION FACTOR OF PLASTIC-BASED MICROWAVE CIRCUIT SUBSTRATES
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Supplier: Accuris
Description: Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
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Description: Alumina substrate, also known as aluminum oxide substrate or ceramic substrate, is primarily composed of aluminum oxide (Al2O3). The excellent electrical, thermal, and mechanical characteristics of alumina, a well-known ceramic material, lead to its selection. The manufacturing
- Density: 3.6999976648298842 g/cc
- Max Use / Curie Temperature: 1,500 to 1,650 C
- Dielectric Strength: 17,000,000 V/m
- Material Type: Alumina / Aluminum Oxide, Silicon Carbide
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Supplier: Accuratus Corporation
Description: pressing produces substrates up to 2 inches square and .250 inches thick. A list of standard substrate sizes can be found on the Aluminum Nitride Substrate Sizes page. Standard aluminum nitride process methods yield strong substrates with consistent material properties
- Thickness / Wall Thickness: 0.04 inch
- Length: 2 inch
- Diameter: 2 inch
- Density: 3.26 g/cc
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Supplier: CoorsTek
Description: and spaceborne environments. RF & Microwave Components CoorsTek provides advanced ceramic components used in high-power, high-frequency systems such as medical imaging, airport scanning, and microwave gyrotrons. Custom Microwave & RF Components & Assemblies CoorsTek works with
- Features: Specialty / Other
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Description: DPC ceramic substrates are typically composed of aluminium nitride or alumina ceramic materials, to which a copper layer is directly bonded on one or both sides. DPC ceramic substrates are frequently used in applications like electronic packaging and power electronics because they are
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Performance Features: Metallized / Silvered (Electrode, Mirror)
- Features: Specialty Ceramic
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR RELATIVE PERMITTIVITY (DIELECTRIC CONSTANT) AND DISSIPATION FACTOR OF POLYMER-BASED MICROWAVE CIRCUIT SUBSTRATES - INCLUDES STANDARD + REDLINE (PDF)
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Description: Innovacera standard aluminum nitride wafer diameters are from 50.8 mm (2 inch) to 200 mm (8 inch) ; mostly use are 6" aluminum nitride wafers and 8" AlN wafer substrates . AlN Wafers can be produced in various thicknesses from 0.125mm to 1mm with polished or lapped sides, customized sizes or
- Specialty Ceramic Type: Aluminum Nitride
- Features: Other, Specialty / Other, Specialty Ceramic
- Shape / Form: Wafer / Substrate
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Supplier: Knowles Precision Devices
Description: High-K substrates are used for circuit miniaturization. DLI offers complete fabrication services!
- Length: 1 to 4 inch
- Width / O.D.: 1 to 4 inch
- Thickness / Wall Thickness: 0.025 inch
- Coeff. of Thermal Expansion (CTE): 0.55 to 10.1 µm/m-C
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Description: AlN substrate possesses a wide range of superior physical properties, including high breakdown electric field strength, thermal conductivity, resistivity, and so forth. In fields like LED packaging, power modules, wafer bonding, power resistors, and metalized substrates (such as thin
- Density: 3.2499979488370605 to 3.349997885724355 g/cc
- Max Use / Curie Temperature: 1,200 C
- Dielectric Strength: 17,000,000 V/m
- Specialty Ceramic Type: Aluminum Nitride
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Supplier: 3X Ceramic Parts Company Limited
Description: process, alumina ceramic substrate are mainly used in high-tech fields, such as metallurgy, chemical industry, electronics, national defense, aerospace and nuclear technology. Alumina Ceramic Substrate Properties Alumina Ceramic Substrate is a kind of special ceramics, which has
- Density: 3.5999977279425903 to 3.8999975386044725 g/cc
- Material Type: Alumina / Aluminum Oxide
- Shape / Form: Bar Stock, Fabricated / Custom Shape, Rod Stock
- Applications: Electronics / RF-Microwave
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Description: DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules must exhibit excellent
- Features: Alumina / Aluminum Oxide, Specialty Ceramic
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Battery / Fuel Cell, Construction & Building / Architectural, Electrical / HV Parts, Electronics / RF-Microwave
- Performance Features: Metallized / Silvered (Electrode, Mirror)
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Description: process (below 300℃) guarantee the quality of ceramic and the metallized layer, also reduce the cost. Direct Plated Copper Substrate Applications:- High Power LED Packaging- Hybrid and electric automobile power management electronics- RF microwave communication- Substrates for
- Features: Other, Specialty / Other, Specialty Ceramic
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Supplier: ASTM International
Description: 1.1 This test method permits the rapid measurement of apparent relative permittivity and loss tangent (dissipation factor) of metal-clad polymer-based circuit substrates in the X-band (8 to 12.4 GHz). 1.2 This test method is suitable for testing PTFE (polytetrafluorethylene) impregnated glass
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Supplier: CoorsTek
Description: Ceramic print head substrates provide reliable long-life print performance for high-resolution printers. CoorsTek provides custom engineered components and precision assemblies for a wide variety of computer peripheral and data storage electronics. Advanced technical ceramics provide high
- Features: Dielectric / Electrical Insulation, Other
- Applications: Electronics / RF-Microwave
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Supplier: APITech
Description: 2 to 40 GHz Ideal for broadband multiplexing Chebyshev and elliptic response Well suited for high shock and vibration applications Highly repeatable (ideal for matched filters) Broadband receivers Easily integrated with other components Design a Filter
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Supplier: LG Chemical of America Inc.
Description: LCD Glass Substrate A key material for TFT-LCD LCD glass substrate is a thin glass board on which a thin circuit is deposited with precision. It is a key material for LCD. Ever since LG Chem ventured into the LCD market in 2009, it has remained fully committed to relentless research
- Applications: Electronics / RF-Microwave
- Shape / Form: Plate
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Supplier: 3X Ceramic Parts Company Limited
Description: Laser Scribining Drilling Aluminum Nitride Substrate Aluminum nitride ceramic substrate has very good thermal conductivity. It is one of the materials with good thermal conductivity in the field of thermal conductivity at present. It is used in hybrid integrated circuit interconnection
- Density: 3.3299978983468956 g/cc
- Thermal Conductivity: 170 W/m-K
- MOR / Flexural Strength: 58,014.7357428788 psi
- Specialty Ceramic Type: Aluminum Nitride
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Supplier: CoorsTek
Description: thin-film process. CoorsTek substrates are available in "as-fired" and finished form, and in both standard and resistor grades. SUPERSTRATE® THIN-FILM SUBSTRATES CoorsTek SuperStrate® substrates are the industry standard for high-performance, thin-film substrates —
- Thermal Conductivity: 27 W/m-K
- Coeff. of Thermal Expansion (CTE): 6.3 to 8.2 µm/m-C
- MOR / Flexural Strength: 98,915.1244416084 psi
- Modulus of Elasticity: 53,953,704.2408773 psi
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Supplier: CoorsTek
Description: CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates? Alumina is the
- Thermal Conductivity: 26 W/m-K
- Coeff. of Thermal Expansion (CTE): 6.4 to 8.2 µm/m-C
- MOR / Flexural Strength: 58,014.7357428788 psi
- Modulus of Elasticity: 48,007,193.8272322 psi
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Description: Advantages Of Beryllium Oxide Ceramic Substrate Beryllium oxide ceramic substrate has the characteristics of high thermal conductivity, high melting, strength, high insulation, low dielectric constant, low dielectric loss and good packaging process adaptability. It is used in
- Density: 3.019998093996284 g/cc
- Thermal Conductivity: 200 to 250 W/m-K
- Specialty Ceramic Type: Beryllia / Beryllium Oxide
- Applications: Electrical / HV Parts
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Supplier: Anatech Electronics, Inc.
Description: 19500 MHz Suspended Substrate Low Pass Filter
- Frequency (Fc): 19,500 MHz
- Package Type: Connectorized
- Filter Type: Low Pass
- Features: Other
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Supplier: Anatech Electronics, Inc.
Description: 12000 MHz Suspended Substrate Low pass filter
- Insertion Loss: 1 dB
- Package Type: Connectorized
- Filter Type: Low Pass
- Features: Other
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Supplier: Anatech Electronics, Inc.
Description: 4.8 GHz Suspended Substrate High Pass Filter
- Frequency (Fc): 4,800 MHz
- Insertion Loss: 1 dB
- Package Type: Connectorized
- Filter Type: High Pass
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Description: text for R&D engineers, professionals, and specialists working on the topic of microwave filters. Post graduate students and Masters students in the field of microwave engineering and wireless communications, especially those involved in courses related to microwave filters, and
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Supplier: Anatech Electronics, Inc.
Description: 18 GHz – 40 GHz Suspended Substrate High Pass Filter
- Frequency (Fc): 18,000 MHz
- Insertion Loss: 2 dB
- Package Type: Connectorized
- Filter Type: High Pass
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Description: importance of this technology as a fast and simple fabrication technique especially on flexible organic substrates such as Liquid Crystal Polymer (LCP) or paper-based substrates. Chapter three demonstrates several compact inkjet-printed UHF RFID antennas using antenna matching
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Description: Substrate integrated waveguide (SIW) is a new type of transmission line. It implements a waveguide on a piece of printed circuit board by emulating the side walls of the waveguide using two rows of metal posts. It inherits the merits both from the microstrip for compact size and easy
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Description: IEC 63185:2020 relates to a measurement method for complex permittivity of a dielectric substrates at microwave and millimeter-wave frequencies. This method has been developed to evaluate the dielectric properties of low-loss materials used in microwave and millimeter-wave
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Supplier: Richardson RFPD
Description: The ADRF5424 is a reflective, single-pole double-throw (SPDT)switch manufactured in a silicon process attached on a galliumarsenide (GaAs) carrier substrate. The substrate incorporates thebond pads for chip and wire assembly, and the bottom of the deviceis metalized, connected to
- Frequency Range: 100 to 60,000 MHz
- Insertion Loss: 1.3 dB
- Isolation (Port to Port): 35 dB
- Switching Speed: 0.00001 ms
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Description: through substrate via • Low-temperature co-fired ceramic and liquid crystal polymer based microwave devices • Large-area printing, inkjet printing and 3D printing materials and processes for RF and THz applications • Engineered metamaterials and plasmonics for absorption, cloaking, and
- Type: Conference
- Industry: Electronics and Semiconductor
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Supplier: Hitachi High Technologies America, Inc.
Description: High Precise & Fine Patterning Technology for Al2O3 and AlN Substrate High Grade Al2O3 Substrate
- Features: Alumina / Aluminum Oxide
- Applications: Electronics / RF-Microwave
- Shape / Form: Wafer / Substrate
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Rogers PCB is mostly used in high-frequency and high-power applications such as RF and microwave. the Rogers material normally has the advantages of low dielectric loss, stable dielectric constant, high thermal conductivity, thermal stability, etc. That’s why there are so many (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
-frequency copper PCB. The high-frequency copper PCB is designed for high-frequency PCBs, and it can be widely used in wireless communications, radar systems, microwave technology, etc. Copper Core PCB Manufacturing Process The (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
and development. The combination of metal and ceramic is thickened through electroplating, and the line precision is increased while the line distance is decreased. The DPC ceramic substrates are commonly used in industries including semiconductor equipment, microwave wireless (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
substrates are particularly valued in: Power Electronics: The high thermal conductivity and electrical insulation of AIN substrates are crucial in power electronic devices, where efficient heat dissipation and electrical isolation are required. RF and Microwave Devices: AIN’s low (read more)
Browse Specialty Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
In high-frequency applications, including microwave and RF circuits, ceramic substrates are used to maintain signal integrity and reduce signal loss. Their low dielectric constant and low loss tangent are crucial for minimizing signal attenuation and ensuring high performance in (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
. Advantages of the microwave powered UV system: Highest intensities at the substrate resulting in high production speeds Consistent and reliable curing for better process control Less maintenance and downtime Reduces product scrap rates (read more)
Browse UV Curing Equipment Datasheets for Excelitas Technologies Corp. -
Today, there is no doubt that it belongs to the era of information technology. With the rapid development of microelectronics industry, aluminum nitride (AlN) ceramics have been widely used in the manufacture of VLSI. As a high thermal conductivity ceramic substrate and packaging material, Al (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Silicon nitride ceramic substrate is a high-performance ceramic material with Si?N? as the main component, with high strength, high thermal conductivity, wear resistance, and excellent insulation. It is made by casting, sintering, and other processes, with controllable thickness (0.25 mm-1.00 mm (read more)
Browse Silicon Nitride and Silicon Nitride Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
environment. EES are a class of passive metasurfaces that enhance wireless coverage at microwave and millimeter-wave frequencies via printed conductive patterns on substrates such as plastic or glass. When placed on a wall, window, or other structure, the scattering properties of (read more)
Browse Communications Software Datasheets for Remcom (USA) -
and microwave power circuits, as well as printed circuit boards. Flexible heaters are produced from metal-clad insulating substrates into which the resistor heating element pattern is chemically etched. Resistor element alloys include stainless steel, copper and some nickel-copper alloys. Substrates may be may from rubber, silicone or polyamide materials. (read more)
Browse Datasheets for Conard Corporation (The)
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PTFE Microwave Substrates For Automotive Applications
With PTFE's low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established. The growth in wireless-technology has by extension, driven the RF Microwave industry to design and develop lower-cost PCB substrates for the requirements of an ever
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A New Dielectric Analyzer for Rapid Measurement of Microwave Substrates up to 6 GHz
This paper from Compass Technology Group presents a new measurement method based on the parallel plate capacitor concept, which determines complex permittivity of dielectric sheets and films with thicknesses up to about 3 mm. Unlike the conventional devices, this new method uses a greatly simplified
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Microwave Office Enables First Pass Design Success for World's Only Pocket-Sized Sports Radar Gun
The Pocket Radar team set out to completely redesign the size and shape of traditional radar guns, opening a new market for a small, low-cost, accurate and convenient product. This required operation at 24 GHz using tiny, low-cost, off-the-shelf components and inexpensive substrates. The first
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How PTFE Can Compete With The Best In Thermosets
With PTFE's low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established. The growth in wireless-technology has by extension, driven the RF Microwave industry to design and develop lower-cost PCB substrates for the requirements of an ever
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
built, and the IEEE Microwave Technology and Techniques Symposium (MTT-S) this week was a showcase for its construction. Nonorganic EL display rides on blue phosphor Toronto-based iFire Technology Inc. demonstrated a prototype display in Tokyo that uses a strontium-sulfide material as the blue phosphor
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To the sphere of action of the chemical synthesis: structure of a mini pipeline in an academic laboratory
The thioacids after our observations, are significantly more reactive than corresponding acids and can be converted to 2 CC reactions at room temperature whereas the clutch of carboxylic acid substrates microwave irradiation requires.
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Foundations for Microstrip Circuit Design
Topics new to this edition: microwave substrates , multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and…
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Ferroelectrics in Microwave Devices, Circuits and Systems
Silicon as a Microwave Substrate ....................................
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RF and Microwave Microelectronics Packaging
6 RF/ Microwave Substrate Packaging Roadmap for Portable Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Millimetre Wave Antennas for Gigabit Wireless Communications: A Practical Guide to Design and Analysis in a System Context
Table 3.1 Electrical properties of microwave substrates [8] .
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Microwave Electronics: Measurement and Materials Characterization
T-resonator technique for electrical characterization of microwave substrates ”, IEEE Microwave and .
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RFIC and MMIC Design and Technology
These elements had excellent radiation pattern characteristics, which were similar to those obtained from antennas on a conventional low permittivity microwave substrate material.
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RF/Microwave Hybrids
For optimum performance, microwave substrates should have: 1.
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Design of small-size wide-bandwidth microstrip-patch antennas
Several techniques are utilized to reduce the resonant length of these wideband microstrip-patch antennas: increasing the dielectric constant of the microwave substrate material, the addition of a shorting wall between the conducting patch and the ground plane, and the addition…
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Polymer–Ceramic Composites of 0–3 Connectivity for Circuits in Electronics: A Review
In this brief review, we gather together the research carried out within 0–3 ceramic–polymer composites for microwave substrates , also including embedded capacitor, inductor, or microwave‐absorbing performances.