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Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 36.11 to 38.89 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications High thermal conductivity High reflectivity Excellent anti-yellowing
- Compound Type: Thermally Conductive
- Thermal Conductivity: 0.8000 W/m-K
- Viscosity: 21000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive Reworkable
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced stress
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Material Form: Specialty / Other
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Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to 5.0 mm
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Dielectric Strength: 2.03E-4 kV/in
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Supplier: SAE International
Description: This specification covers an adhesive in the form of a liquid or paste.
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Supplier: Master Bond, Inc.
Description: developed one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.33E-5 to 1.11E-4 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Accuris
Description: ADHESIVE, ELECTRICALLY NON-CONDUCTIVE MODERATELY RAPID CURE
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Supplier: Graphene Laboratories, Inc.
Description: . Strong Electrical Resistance: Strong electrical resistance is a crucial characteristic for thermal conductive adhesives, especially in electronic applications. It prevents electrical short circuits and maintains the electrical integrity of the assembly. Great Mechanical Properties: A
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxies Etc...
Description: 10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and adjustable flexibility. 10-3003 NS is also very safe to use due to the absence of harmful solvents and toxic chemicals in
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.11
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Supplier: All-Spec Industries
Description: A three-layer tape with non-sparking surfaces both inside and outside of tape. A conductive grid is buried between two anti-static copolymer layers that cannot shed or rub off and provides an effective static shielding ability. Thickness: 1.5 mils. 3" core. 118 FOOT ROLLS.
- Backing: Plastic / Polymer
- Features: Anti-static / ESD Control, Electrically Conductive, Removable
- Thickness: 0.0015 inches
- Type: Single-Sided
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.78 to 62.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a two component, highly filled, epoxy adhesive paste that is used for applications exposed to cryogenic temperatures and for bonding heat sinks. It offers low coefficient of thermal expansion, low stress, versatility,
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 450 kV/in
- Thermal Conductivity: 1.22 to 1.44 W/m-K
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Supplier: Gelest, Inc.
Description: Safety Packaging Under Nitrogen
- Chemical / Polymer System Type: Silicone
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Supplier: Techsil Limited
Description: Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits Easy to use, one-component material Fast cure at elevated temperature
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Rubber Based / Elastomeric: Yes
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Supplier: All-Spec Industries
Description: A three-layer tape with non-sparking surfaces both inside and outside of tape. A conductive grid is buried between twoanti-static copolymer layers that cannot shed or rub off and provides an effective static shielding ability. Thickness: 1.5 mils. 3" core. 118 FOOT ROLLS.
- Carrier / Backing Material: Plastic / Polymer
- Features: Anti-static / ESD Control, Electrically Conductive, Removable
- Thickness: 0.0015 inches
- Type: Single-Sided Adhesive
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Supplier: Budnick Converting, Inc.
Description: 3M™ Electrically Conductive Double-Sided Tapes 9701-100 is XYZ-electrically conductive pressure sensitive adhesive (PSA) tape. 3M tapes 9701-100 consist of a conductive matrix carrier (nickel/copper coated conductive non-woven fabric matrix) designed for PSA
- Adhesive: Specialty / Other
- Peel Strength / Adhesion: 2.19 lbs/in
- Thickness: 0.0040 inches
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Supplier: Master Bond, Inc.
Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace,
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Coeff. of Thermal Expansion (CTE): 77.78 to 94.44 µin/in-F
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 381 kV/in
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of
- Cure Type / Technology: Two Component System
- Dielectric Strength: 450 kV/in
- Features: Thermal / Heat Conductive
- Substrate / Material Compatibility: Ceramic / Glass, Metal
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Supplier: Master Bond, Inc.
Description: Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related
- Coeff. of Thermal Expansion (CTE): 61.11 to 72.22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): Over 4.5
- Dissimilar Substrates: Yes
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: P89000Artificial lawn adhesive tape to non-woven fabric as the substrate, opalescent release film for the backing, coated with hot melt adhesive pressure-sensitive adhesive production and become, with non-woven single-sided with adhesive (double-open release
- Adhesive: Pressure Sensitive (PSA)
- Backing: Paper, Plastic / Polymer, PET / Polyester
- Features: Anti-static / ESD Control, Electrically Conductive
- Thickness: 0.0295 inches
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Supplier: Cri-Tech, Inc.
Description: Cri-plastMP? PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conducti ve, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static
- Elongation: 280 %
- Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics, Electrical Power / HV
- Tensile Strength (Break): 493125 psi
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Supplier: Sauereisen, Inc.
Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Budnick Converting, Inc.
Description: tesa 60272 is a black double sided electrically conductive self adhesive tape. It consists of an electrically conductive non-woven backing and an electrically conductive acrylic adhesive.
- Adhesive: Specialty / Other
- Peel Strength / Adhesion: 3.48 lbs/in
- Thickness: 0.0020 inches
- Type: Double-Sided Adhesive
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Graphene Laboratories, Inc.
Description: for general purpose applications requiring a bond or connection of electrically conductive components/materials that require good electrical conductivity. A heating oven is strongly recommended for curing. FEATURES: · Silver-Carbon Filled (Non
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material
- Filled / Reinforced: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
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Supplier: CHT USA Inc.
Description: CHT’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System, Specialty / Other
- Dielectric Strength: 991 kV/in
- Elongation: 94 %
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Supplier: Thermon, Inc
Description: T-99 is a specialty high temperature heat transfer compound formulated to provide high thermal stability and bond strength up to 1204°C (2200°F). Unlike other grades of heat transfer compounds, it is also electrically non-conductive (when cured). It is supplied ready to use and may be applied
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Die Bonding Adhesive / Compound, Grease / Paste
- Thermal Conductivity: 25.96 to 51.92 W/m-K
Find Suppliers by Category Top
Featured Products Top
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AS1802 1 Part Non-Corrosive Neutral Cure Adhesive Sealant (Electronic Grade) This is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is (read more)
Browse Electrical and Electronic Resins Datasheets for CHT USA Inc. -
expensive mixing equipment Neutral cure, non-corrosive Thermally conductive Adhesion promoters are added to improve adhesion across a range of substrates. As with all addition cure materials, adhesion can be improved with longer cure times, higher cure temperatures, post (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
and elongation of 1-3% at 75°F. Serviceable from -80°F to +350°F, it is electrically non-conductive with a volume resistivity greater than 1014 ohm-cm. It is available in EFD® syringes, ½ pint, pint and quart containers. (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc. -
also have some additional functionality which will be of benefit to the designer. Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional mechanical fastening systems. It will also prevent the possibility of movement and air (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
designed to be used as a single key or in arrays behind non-conductive surfaces. The standard CHS is designed to mount behind a glass surface up to 2mm in thickness. Simply remove the protective cover and adhere the switch. The switch is programmed so that it does not false trigger in (read more)
Browse Pushbutton Switches Datasheets for SCHURTER Inc -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Datasheets for CHT USA Inc. -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Industrial Adhesives Datasheets for CHT USA Inc.
Conduct Research Top
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An Overview of Non-Conductive Epoxy for Electronics
to assembling electronic goods and other similar products. When it comes to bonding electronics/electrical products, conductive and non-conductive glues are used to achieve special purposes.
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Choosing the Right Non Conductive Epoxy For Electronics
Non conductive epoxy is a type of adhesive that is specifically designed for use in electronics. It is used to insulate and protect electronic components from electrical currents and environmental factors. Choosing the right non conductive epoxy is crucial to ensure the proper functioning
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All the Facts you Need to Understand Non Conductive Glue for Electronics
Non conductive glue for electronics is a very useful industrial adhesive that many electronics brands find valuable for their assembly facilities. Adhesive manufacturers usually cater to the needs of the electronics industry by making various adhesive products. When it comes to the manufacturing
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Metal
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Meta
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Best top 10 electronics assembly adhesives manufacturers in china with non conductive epoxy adhesive glue for electronics
The world is slowly changing. The way things were done a few years ago is not the same way they are being done today, thanks to innovations and advanced technology. Embracing the good and discarding the bad is the only way to move forward. One of the areas that have been greatly affected by
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All you need to know about Metal Bonding Epoxy Adhesives
DeepMaterial, as an industrial epoxy adhesive manufacturer, we do lost of research about underfill epoxy, non conductive glue for electronics, non conductive epoxy, adhesives for electronic assembly, underfill adhesive, high refractive index epoxy. Base on that, we have the latest technology
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Controlling Static: Alternatives to Tinsel (.pdf)
Converters of non-conductive web surfaces, such as pressure sensitive adhesive (PSA) tapes, need to be constantly vigilant in controlling static electricity. High levels of electrostatic charges can be dangerous, and moderate levels can permanently destroy an adhesive system, cause fouling
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Micro ribbon cable bonding for an implantable device
Bonding with non conductive adhesive has also been shown as an alternative, rendering higher bond strength.
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Overview of conductive adhesive interconnection technologies for LCD's
According to the amount of conductive particles, adhesives are classified as non conductive adhesives (no added particles), anisotropic conductive adhesives (5-10 volume percent with particles) and isotropic conductive adhesive (25-35volume percent).
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Towards a predictive behavior of non-conductive adhesive interconnects in moisture environment
Journal of /Solid Structures, Vo1.19, No6, pp541-551,1983 Gunawan, M. et al. “Static and cyclic relaxation studies in non conductive adhesives ” Proc. ICMAT, December 2003, Singapore, in press .
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Evolution of mechanical properties and cure stresses in non-conductive adhesives used for flip chip interconnects
M. Gunawan, E. H. Wong, S. G. Mhaisalkar, L. T. Davila, Yu Wong , J. F. J. M. Caers, and T. K. Tsai, “Characterization and Modeling of Static and Cyclic Relaxation In Non Conductive Adhesives ”, Journal of Electronic Materials, pp. 104-1047 …
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Roadmap “Adhesives Technologies in Automotive and Harsh Environment Applications”
In production isotropically conductive and non conductive adhesives are used for chip & wire technology and undcrfills are used for flip chip technology.
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A New Method of Flip Chip Assembly Using a Light Silver Filled Glue
The assembling and contacting process of the chips by the novel method looks as follows: Since lightly Ag filled adhesives are not avail- able, a standard conductive and a non conductive adhesive have been mixed, whereas both adhesives are based on the …
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Overview of conductive adhesive interconnection technologies for LCDs
Examples of different techniques using both non conductive adhesives , ACA’s and isotropic conductive adhesive (ICA) are given.
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Overview of conductive adhesive joining technology in electronics packaging applications
The mechanical alignment was simplified by the use of a non conductive adhesive , as opposed to anisotropicconductivefilm [151.