Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight
- Features: Electrical Insulation / Dielectric, Thermal / Heat Conductive
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
-
Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium
- Use Temperature: -55 to 200 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 to 38.888888888888886 µin/in-F
- Tensile Strength (Break): 2,000 psi
- Features: Ceramic / Glass, Electrical Insulation / Dielectric, Electrical Power / HV, Electronics, Liquid, Metal, Plastic, Thermal / Heat Conductive
-
Supplier: Accuris
Description: ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
-
-
Supplier: Accuris
Description: ADHESIVE, ELECTRICALLY NON-CONDUCTIVE MODERATELY RAPID CURE
-
Supplier: Master Bond, Inc.
Description: one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure quickly at
- Use Temperature: -100 to 400 F
- Thermal Conductivity: 1.442279 W/m-K
- Coeff. of Thermal Expansion (CTE): 0.00011111111111111112 to 0.000033333333333333335 µin/in-F
- Industry: Aerospace, Automotive, OEM / Industrial, Optical Grade / Material, Semiconductors / IC Packaging
-
Supplier: SAE International
Description: This specification covers an adhesive in the form of a liquid or paste.
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of
- Thermal Conductivity: 1.22 to 1.44 W/m-K
- Dielectric Strength: 449.58000000000095 kV/in
- Features: Ceramic / Glass, Metal, Thermal / Heat Conductive
- Cure / Technology: Two Component System
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of
- Viscosity: 20 to 105 cP
- Thermal Conductivity: 1.22 to 1.44 W/m-K
- Dielectric Strength: 449.58000000000095 kV/in
- Features: Ceramic / Glass, Metal, Thermal / Heat Conductive
-
Supplier: Graphene Laboratories, Inc.
Description: adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSHV™ Epoxy is formulated with a blend of proprietary nanomaterials, additives
- Viscosity: 400,000 to 450,000 cP
- Use Temperature: 77 to 302 F
- Thermal Conductivity: 2.9 W/m-K
- Industry: Aerospace, Automotive
-
Supplier: Master Bond, Inc.
Description: Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch
- Viscosity: 60,000 to 120,000 cP
- Use Temperature: -100 to 350 F
- Thermal Conductivity: 0.72 to 0.87 W/m-K
- Tensile Strength (Break): 7,000 to 9,000 psi
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of
- Thermal Conductivity: 1.22 to 1.44 W/m-K
- Dielectric Strength: 449.58000000000095 kV/in
- Features: Ceramic / Glass, Metal, Thermal / Heat Conductive
- Cure / Technology: Two Component System
-
Supplier: Master Bond, Inc.
Description: Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.
- Applied Thickness / Gap Fill: 0.001 to 0.003 inch
- Viscosity: 80,000 to 100,000 cP
- Use Temperature: -100 to 300 F
- Thermal Conductivity: 1.16 to 1.6 W/m-K
-
Supplier: Epoxies Etc...
Description: 10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and adjustable flexibility. 10-3003 NS is also very safe to use due to the absence of harmful solvents and toxic chemicals in
- Viscosity: 4,500 to 6,500 cP
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,500 psi
- Dielectric Strength: 550.0000000000008 kV/in
-
Supplier: Fujipoly® America Corp.
Description: SARCON ® Silicone Putty is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of components.
- Applied Thickness / Gap Fill: 0.0393701 to 0.0787402 inch
- Use Temperature: -40 to 302 F
- Thermal Conductivity: 6.2 to 11 W/m-K
- Dielectric Constant (Relative Permittivity): 7.77 to 8.58
-
Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆ Free from siloxane
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 3 W/m-K
- Tensile Strength (Break): 7.977026164645835 psi
- Elongation: 70 %
-
Supplier: Fujipoly® America Corp.
Description: applications. Sarcon® SG-07NS and SG-26NS are non-silicone, polysynthetic-based thermal greases that have high thermal conductivity properties. Infused with heat-conductive metal oxides, this nonmigrating material operates consistently in high temperatures. Sarcon® non silicone
- Use Temperature: -67 to 401 F
- Thermal Conductivity: 2.6 W/m-K
- Dielectric Strength: 411.9999999999988 kV/in
- Features: Electronics, Thermal Compound / Heat Conductive
-
Supplier: CHT USA Inc.
Description: CHT’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a
- Viscosity: 350,000 cP
- Use Temperature: -58 to 428 F
- Thermal Conductivity: 1.55 W/m-K
- Tensile Strength (Break): 406.1031502001516 psi
-
Supplier: Fujipoly® America Corp.
Description: Sarcon ® XR-e is highly conformable/thermally conductive gel materials, 11watt/m-K (No electricity conductive) in a versatile sheet form that easily fit and adhere e to most all shapes and sizes of components, and makes reliable and complete physical contact. The surface consistency of
- Applied Thickness / Gap Fill: 0.0393701 to 0.0787402 inch
- Thermal Conductivity: 11 W/m-K
- Tensile Strength (Break): 29.0073678714394 psi
- Elongation: 40 %
-
Supplier: Gelest, Inc.
Description: Safety Packaging Under Nitrogen
- Chemical System: Silicone
-
Supplier: Budnick Converting, Inc.
Description: tesa 60272 is a black double sided electrically conductive self adhesive tape. It consists of an electrically conductive non-woven backing and an electrically conductive acrylic adhesive.
- Thickness: 0.00197 inches
- Peel Strength / Adhesion: 3.4825 lbs/in
- Features: Double-Sided Adhesive, Electrical, Specialty / Other
-
Supplier: Budnick Converting, Inc.
Description: tesa 60233 is a matte black single sided electrically conductive self adhesive tape. It consists of a matte black PET backing which is laminated with an aluminum foil and a conductive non-woven. The backing is coated on the non-woven side with an electrically
- Thickness: 0.00236 inches
- Peel Strength / Adhesion: 2.854375 lbs/in
- Features: Electrical, Single-Sided Adhesive, Specialty / Other
-
Supplier: All-Spec Industries
Description: A three-layer tape with non-sparking surfaces both inside and outside of tape. A conductive grid is buried between twoanti-static copolymer layers that cannot shed or rub off and provides an effective static shielding ability. Thickness: 1.5 mils. 3" core. 118 FOOT ROLLS.
- Width: 2 inches
- Thickness: 0.0015 inches
- Features: Anti-static / ESD Control, Electrically Conductive, Electronics (PCB, Semiconductor), Removable, Single-Sided Adhesive, Specialty / Other
- Backing: Plastic / Polymer
-
Description: modules. For non-conductive adhesives or tapes used in PV modules, the applicable test methods except for electrical characteristics in this document may be used.
-
Supplier: Budnick Converting, Inc.
Description: 3M™ Electrically Conductive Single-Sided Tape 3304BC-S is a single-sided conductive black foil tape that consists of conductive black copper foil carrier and a unique conductive non-woven carrier based acrylic adhesive. The unique design of 3M tape 3304BC-S
- Thickness: 0.0017699999999999999 inches
- Features: Electrical, Single-Sided Adhesive, Specialty / Other
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 539IA, Epoxy Film, Assembly, Non-conductive Adhesive LOCTITE® ABLESTIK 539IA non-conductive film adhesive is designed for assembly applications. This adhesive film may be die cut to customer specifications.
- Adhesive: Epoxy
- Features: Specialty / Other
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 1.7 W/m-K
- Dielectric Strength: 381.0000000000008 kV/in
-
Supplier: Shenzhen You-San Technology Co., Ltd.
Description: P89000Artificial lawn adhesive tape to non-woven fabric as the substrate, opalescent release film for the backing, coated with hot melt adhesive pressure-sensitive adhesive production and become, with non-woven single-sided with adhesive (double-open release
- Thickness: 0.023622047244094488 inches
- Features: Anti-static / ESD Control, Electrically Conductive, Single-Sided Adhesive
- Backing: PET / Polyester, Paper, Plastic / Polymer
- Adhesive: Pressure Sensitive (PSA)
-
Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Viscosity: 2,200 to 3,200 cP
- Use Temperature: 707 F
- Coeff. of Thermal Expansion (CTE): 32.22222222222222 to 154.44444444444443 µin/in-F
- Form / Shape: Die Bonding Adhesive / Compound, Grease / Paste
-
Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and fillers. G6E-SG™ epoxy has
- Viscosity: 110,000 to 120,000 cP
- Use Temperature: 77 to 302 F
- Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrical Power / HV, Electronics, Other, Specialty / Other
-
Supplier: Can-Do National Tape
Description: Thermally Conductive Transfer Tape 3M 8805 3M 8805 Thermally Conductive Adhesive Transfer Tape is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). The
- Features: Electrical Insulation / Dielectric, Sound Proofing / Insulation
-
Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Viscosity: 1,400 to 2,200 cP
- Use Temperature: 572 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 17.77777777777778 to 62.22222222222222 µin/in-F
-
Supplier: Graphene Laboratories, Inc.
Description: requiring a bond or connection of electrically conductive components/materials that require good electrical conductivity. A heating oven is strongly recommended for curing. FEATURES: · Silver-Carbon Filled (Non-Magnetic) · Very Good Electrical Conductivity · Resistant to Temperature
- Viscosity: 80,000 to 85,000 cP
- Use Temperature: 77 to 302 F
- Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrical Power / HV, Electronics, Other, Specialty / Other
-
Supplier: Master Bond, Inc.
Description: conductive version called EP121AN with similar properties and cure schedule is also available. EP121AO is widely used in electronic, electrical and appliance industries.
- Viscosity: 55,000 to 95,000 cP
- Use Temperature: -60 to 500 F
- Thermal Conductivity: 1.44 W/m-K
- Coeff. of Thermal Expansion (CTE): 10 to 11.67 µin/in-F
-
Supplier: Epoxies Etc...
Description: stringent and non-burning requirements of UL 94 V-O. The 50-2185 has outstanding thermal cycling properties and low embedment stress to sensitive components. This system will maintain its’ integrity over a wide operating temperature range, -50 to 120°C. Its’ low glass transition temperature
- Viscosity: 27,000 cP
- Use Temperature: -58 to 248 F
- Thermal Conductivity: 1.22593715 W/m-K
- Tensile Strength (Break): 800 psi
-
Supplier: Graphene Laboratories, Inc.
Description: similar applications. FEATURES: · Flexible (after curing) · Carbon Filled (Non-Metallic & Non-Magnetic) · Electrically Conductive · Resistant to Temperature Variations · Impact / Shock Resistant · Corrosion Resistant TYPICAL APPLICATIONS: · Wearable Electronics · Medical Sensors
- Viscosity: 285,000 to 295,000 cP
- Use Temperature: 77 to 248 F
- Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrical Power / HV, Electronics, Flexible / Dampening, Other, Specialty / Other
Find Suppliers by Category Top
Featured Products Top
-
AS1802 1 Part Non-Corrosive Neutral Cure Adhesive Sealant (Electronic Grade) This is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is (read more)
Browse Electrical and Electronic Resins Datasheets for CHT USA Inc. -
expensive mixing equipment Neutral cure, non-corrosive Thermally conductive Adhesion promoters are added to improve adhesion across a range of substrates. As with all addition cure materials, adhesion can be improved with longer cure times, higher cure temperatures, post (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
and elongation of 1-3% at 75°F. Serviceable from -80°F to +350°F, it is electrically non-conductive with a volume resistivity greater than 1014 ohm-cm. It is available in EFD® syringes, ½ pint, pint and quart containers. (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc. -
also have some additional functionality which will be of benefit to the designer. Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional mechanical fastening systems. It will also prevent the possibility of movement and air (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
designed to be used as a single key or in arrays behind non-conductive surfaces. The standard CHS is designed to mount behind a glass surface up to 2mm in thickness. Simply remove the protective cover and adhere the switch. The switch is programmed so that it does not false trigger in (read more)
Browse Pushbutton Switches Datasheets for SCHURTER Inc -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Industrial Adhesives Datasheets for CHT USA Inc. -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc.
Conduct Research Top
-
An Overview of Non-Conductive Epoxy for Electronics
to assembling electronic goods and other similar products. When it comes to bonding electronics/electrical products, conductive and non-conductive glues are used to achieve special purposes.
-
Choosing the Right Non Conductive Epoxy For Electronics
Non conductive epoxy is a type of adhesive that is specifically designed for use in electronics. It is used to insulate and protect electronic components from electrical currents and environmental factors. Choosing the right non conductive epoxy is crucial to ensure the proper functioning
-
All the Facts you Need to Understand Non Conductive Glue for Electronics
Non conductive glue for electronics is a very useful industrial adhesive that many electronics brands find valuable for their assembly facilities. Adhesive manufacturers usually cater to the needs of the electronics industry by making various adhesive products. When it comes to the manufacturing
-
Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Metal
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
-
Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Meta
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
-
Best top 10 electronics assembly adhesives manufacturers in china with non conductive epoxy adhesive glue for electronics
The world is slowly changing. The way things were done a few years ago is not the same way they are being done today, thanks to innovations and advanced technology. Embracing the good and discarding the bad is the only way to move forward. One of the areas that have been greatly affected by
-
All you need to know about Metal Bonding Epoxy Adhesives
DeepMaterial, as an industrial epoxy adhesive manufacturer, we do lost of research about underfill epoxy, non conductive glue for electronics, non conductive epoxy, adhesives for electronic assembly, underfill adhesive, high refractive index epoxy. Base on that, we have the latest technology
-
Controlling Static: Alternatives to Tinsel (.pdf)
Converters of non-conductive web surfaces, such as pressure sensitive adhesive (PSA) tapes, need to be constantly vigilant in controlling static electricity. High levels of electrostatic charges can be dangerous, and moderate levels can permanently destroy an adhesive system, cause fouling
More Information Top
Indicates content that may require registration and/or purchase.
-
Micro ribbon cable bonding for an implantable device
Bonding with non conductive adhesive has also been shown as an alternative, rendering higher bond strength.
-
Overview of conductive adhesive interconnection technologies for LCD's
According to the amount of conductive particles, adhesives are classified as non conductive adhesives (no added particles), anisotropic conductive adhesives (5-10 volume percent with particles) and isotropic conductive adhesive (25-35volume percent).
-
Towards a predictive behavior of non-conductive adhesive interconnects in moisture environment
Journal of /Solid Structures, Vo1.19, No6, pp541-551,1983 Gunawan, M. et al. “Static and cyclic relaxation studies in non conductive adhesives ” Proc. ICMAT, December 2003, Singapore, in press .
-
Evolution of mechanical properties and cure stresses in non-conductive adhesives used for flip chip interconnects
M. Gunawan, E. H. Wong, S. G. Mhaisalkar, L. T. Davila, Yu Wong , J. F. J. M. Caers, and T. K. Tsai, “Characterization and Modeling of Static and Cyclic Relaxation In Non Conductive Adhesives ”, Journal of Electronic Materials, pp. 104-1047 …
-
Roadmap “Adhesives Technologies in Automotive and Harsh Environment Applications”
In production isotropically conductive and non conductive adhesives are used for chip & wire technology and undcrfills are used for flip chip technology.
-
A New Method of Flip Chip Assembly Using a Light Silver Filled Glue
The assembling and contacting process of the chips by the novel method looks as follows: Since lightly Ag filled adhesives are not avail- able, a standard conductive and a non conductive adhesive have been mixed, whereas both adhesives are based on the …
-
Overview of conductive adhesive interconnection technologies for LCDs
Examples of different techniques using both non conductive adhesives , ACA’s and isotropic conductive adhesive (ICA) are given.
-
Overview of conductive adhesive joining technology in electronics packaging applications
The mechanical alignment was simplified by the use of a non conductive adhesive , as opposed to anisotropicconductivefilm [151.