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Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at
- Coeff. of Thermal Expansion (CTE): 36.11 to 38.89 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging, Other
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric
- Industry: Optical Grade / Material
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 104, Epoxy, Assembly LOCTITE® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230ºC. It has also been tested to withstand short term
- Coeff. of Thermal Expansion (CTE): 33.33 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric
- Substrate / Material Compatibility: Ceramic / Glass, Metal
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2116, Epoxy, Staking compound LOCTITE® ABLESTIK 2116 adhesive is designed for bonding and enhancing the mechanical and structural rigidity of assemblies. LOCTITE ABLESTIK 2116 bonds offer resistance to weather, galvanic action, most petroleum solvents, lubricants,
- Coeff. of Thermal Expansion (CTE): 34.44 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera
- Coeff. of Thermal Expansion (CTE): 17.78 to 62.22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Thermal / Heat Conductive
- Industry: Electronics, Medical / Food (Sanitary / FDA), Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: 10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and adjustable flexibility. 10-3003 NS is also very safe to use due to the absence of harmful solvents and toxic
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.11
- Dielectric Strength: 550 kV/in
- Features: Thermal / Heat Conductive
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Supplier: Master Bond, Inc.
Description: Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.2 to 4.4
- Dissimilar Substrates: Yes
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Non-corrosive Cure, Thermal / Heat Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic
- Coeff. of Thermal Expansion (CTE): 61.11 to 72.22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): Over 4.5
- Dissimilar Substrates: Yes
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Epoxy Adhesives - Thermally Conductive, Non-Electrically Conductive, Low Viscosity Epoxy -- G6E-TSALSupplier: Graphene Laboratories, Inc.
Description: Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Features: Electrically Conductive, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Medical / Food (Sanitary / FDA), Other
- Thermal Conductivity: 1.8 W/m-K
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Features: Electrically Conductive, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Medical / Food (Sanitary / FDA), Other
- Thermal Conductivity: 2.9 W/m-K
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Supplier: Master Bond, Inc.
Description: Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.
- Applied Thickness / Gap Fill: 1.00E-3 to 0.0030 inch
- Coeff. of Thermal Expansion (CTE): 2.22E7 to 2.50E7 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.4
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera
- Coeff. of Thermal Expansion (CTE): 32.22 to 154 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Medical / Food (Sanitary / FDA), Optical Grade / Material, Photonics / Optoelectronics
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Supplier: Master Bond, Inc.
Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.
- Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
- Coeff. of Thermal Expansion (CTE): 16.67 to 19.44 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.8
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Supplier: Graphene Laboratories, Inc.
Description: for general purpose applications requiring a bond or connection of electrically conductive components/materials that require good electrical conductivity. A heating oven is strongly recommended for curing. FEATURES: · Silver-Carbon Filled (Non
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material
- Filled / Reinforced: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 45 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to use. 8 lb
- Cure Type / Technology: Two Component System
- Dielectric Strength: 356 kV/in
- Substrate / Material Compatibility: Metal, Plastic
- Thermal Conductivity: 0.3500 W/m-K
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Supplier: Techsil Limited
Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure
- Cure Type / Technology: Two Component System
- Features: Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Thermal / Heat Conductive
- Industry: Electronics
- Substrate / Material Compatibility: Metal, Plastic
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a two component, highly filled, epoxy adhesive paste that is used for applications exposed to cryogenic temperatures and for bonding heat sinks. It offers low coefficient of thermal expansion, low stress,
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 450 kV/in
- Thermal Conductivity: 1.22 to 1.44 W/m-K
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 45 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to use. 29
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 406 kV/in
- Substrate / Material Compatibility: Metal, Plastic
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Supplier: Techsil Limited
Description: Elecolit® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit® 414 has a viscosity of 20,000 to 25,000 mPas and when
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol ECCOBOND CE3513 ) LOCTITE ABLESTIK CE 3513 is a one component, silver-filled, non-bleeding, electrically conductive epoxy adhesive with long shelf life at room temperature.
- Compound Type: Electrically Conductive
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Specialty / Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: packages and electronic assemblies, with the capability to attach a metal can or lid onto a package. STAYCHIP F614-3A was specifically developed for superior adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates. Non-conductive and Electrically Insulating
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 59C Silver, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, epoxy adhesive resin that is used to replace hot soldering for electrical connections. It offers high strength bonds, non-flowing properties, long pot life, high thermal
- Cure Type / Technology: Two Component System
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Supplier: Henkel Corporation - Electronics
Description: Electrically conductive one-component, non-bleeding epoxy adhesive with low outgassing, eliminating wicking and bridging under small components.
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Viscosity: 70000 cP
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Supplier: FX PCB Co., Ltd.
Description: products require an adhesive layer that connects the GLP layers together. Adhesives are made on the basis of acrylic, epoxy, phenolic, and other compounds. CONDUCTIVE LAYER The material of the conductive layer is a foil made of copper, aluminum, or stainless steel.
- Thickness: 0.0118 inches
- Type: Film / Flexible Substrate
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EP40ND is a superb adhesive and bonds well to a variety of substrates including metals, ceramics, composites and plastics. It is most noteworthy for its affinity to bonding engineered plastics such as polycarbonates and acrylics. EP40ND is also capable of withstanding rigorous thermal cycling and shock. EP40ND is a reliable electrical insulator. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Product Advantages Easy to use, non-critical one to one mix ratio by weight Low viscosity, flows evenly and smoothly Reliable thermal conductivity and electrical insulation Low shrinkage and excellent dimensional stability Resists thermal cycling, vibration and shock Well suited for moderate to large encapsulation applications (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
. Other noteworthy properties include a tensile strength of 9,000-10,000 psi, and a Shore D hardness of 75-85. The adhesive provides good heat resistance and is serviceable from -60°F to +400°F. EP21ARHTND-2 does not contain solvents and is RoHS compliant. The product bonds well to (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
AS1802 1 Part Non-Corrosive Neutral Cure Adhesive Sealant (Electronic Grade) This is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is (read more)
Browse Electrical and Electronic Resins Datasheets for CHT USA Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
This fast curing, non-drip compound is ideal for bonding and sealing applications with a forgiving mix ratio of one to one by weight or volume. It has a rapid set up time, convenient handling, and good physical properties. It sets up very quickly at room temperature, with a working life of 3 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
expensive mixing equipment Neutral cure, non-corrosive Thermally conductive Adhesion promoters are added to improve adhesion across a range of substrates. As with all addition cure materials, adhesion can be improved with longer cure times, higher cure temperatures, post (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
Supreme 11AOHTLP Product Information Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Key Features Convenient (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc.
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Best top 10 electronics assembly adhesives manufacturers in china with non conductive epoxy adhesive glue for electronics
The world is slowly changing. The way things were done a few years ago is not the same way they are being done today, thanks to innovations and advanced technology. Embracing the good and discarding the bad is the only way to move forward. One of the areas that have been greatly affected by
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All you need to know about Metal Bonding Epoxy Adhesives
DeepMaterial, as an industrial epoxy adhesive manufacturer, we do lost of research about underfill epoxy, non conductive glue for electronics, non conductive epoxy, adhesives for electronic assembly, underfill adhesive, high refractive index epoxy. Base on that, we have the latest technology
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Choosing the Right Non Conductive Epoxy For Electronics
Non conductive epoxy is a type of adhesive that is specifically designed for use in electronics. It is used to insulate and protect electronic components from electrical currents and environmental factors. Choosing the right non conductive epoxy is crucial to ensure the proper functioning
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An Overview of Non-Conductive Epoxy for Electronics
to assembling electronic goods and other similar products. When it comes to bonding electronics/electrical products, conductive and non-conductive glues are used to achieve special purposes.
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Metal
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Meta
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Manufacturing Optimization for Improved Reliability in TCXO Oscillator Designs
The strength of this adhesion had already been identified as a concern since the mechanical integrity of the I/O pins connection to the substrate is completely dependent on the non - conductive epoxy adhesion .
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MEMS Materials and Processes Handbook
Non - conducting epoxy adhesives and insulating polyimides may be filled with met- als, solders, or solders filled with glasses.
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Thickness effects on magnetoelectric coupling for Metglas/PZT/Metglas laminates
To prepare samples of Metglas/PZT/Metgals laminates with different n, Metglas layers of different num- bers but a fixed thickness of 30 m were glued together using non - conductive epoxy adhesive .
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Recent advances in conductive adhesives for direct chip attach applications
Kristiansen H; Bjorneklett A (1992) fine pitch connection to rigid substrates using non - conductive epoxy adhesive .
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Open Ended Microwave Oven for Packaging
Microwave heating has been successfully applied to heating glob-top and flip-chip underfill encapsulants [12]- [14], conductive and non - conductive epoxy adhesives [11], [15]-[16], polymer dielectrics [17]-[19], lead-free solder interconnects [20] and wafer bonding [21].
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3D stacked MEMS and ICs in a miniaturized sensor node
This is a non - conductive epoxy adhesive that was dispensed onto the underlying ASIC right before the flip-chip process.
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Characterisation of electrical contacts made by non-conductive adhesive
A BjGrneklett, “Fine Pitch Connection to Rigid Substrates using Non - Conductive Epoxy Adhesive ”, Journal of Electronics Manufacturing, Chapman & Hall, 2 (1992), p 7-12 .
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Thermal energy conversion by coupled shape memory and piezoelectric effects
Two pieces were glued together using non - conductive commercial epoxy adhesive ‘3M Scotch-Weld DP460 Off-White’ locally substituted with silver lacquer to provide electrical connection between the electrodes.
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Chip Scale Package Using Standard Lead Frame Technology
In this case LOC device is attached on the leads Iiy clcctrically non - conductive epoxy or adhesive tape and wire bonded to lead tip area.
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Bare chip stacking structure for MCM production
An upper die is fixed by non - conductive epoxy type adhesive on the top of a lower die.