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Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at
- Use Temperature: -55 to 200 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 to 38.888888888888886 µin/in-F
- Tensile Strength (Break): 2,000 psi
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Epoxies Etc...
Description: 10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and adjustable flexibility. 10-3003 NS is also very safe to use due to the absence of harmful solvents and toxic
- Viscosity: 4,500 to 6,500 cP
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,500 psi
- Dielectric Strength: 550.0000000000008 kV/in
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Supplier: Master Bond, Inc.
Description: Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2
- Viscosity: 60,000 to 120,000 cP
- Use Temperature: -100 to 350 F
- Thermal Conductivity: 0.72 to 0.87 W/m-K
- Tensile Strength (Break): 7,000 to 9,000 psi
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers
- Features: Electrical Insulation / Dielectric, Epoxy (EP), Thermal / Heat Conductive
- Cure / Technology: Single Component System
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Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Viscosity: 20,000 to 30,000 cP
- Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
- Substrate Compatibility: Ceramic / Glass
- Features: Die Bonding Adhesive / Compound, Electrical Insulation / Dielectric, Epoxy (EP), Gel, Other, Thermal / Heat Conductive, Unfilled
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Supplier: Graphene Laboratories, Inc.
Description: adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSHV™ Epoxy is formulated with a blend of proprietary nanomaterials,
- Viscosity: 400,000 to 450,000 cP
- Use Temperature: 77 to 302 F
- Thermal Conductivity: 2.9 W/m-K
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Medical / Food (Sanitary / FDA)
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Supplier: Master Bond, Inc.
Description: Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 1.31 to 1.44 W/m-K
- Coeff. of Thermal Expansion (CTE): 61.11 to 72.22 µin/in-F
- Tensile Strength (Break): 1,000 to 1,500 psi
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Epoxy Adhesives - Thermally Conductive, Non-Electrically Conductive, Low Viscosity Epoxy -- G6E-TSALSupplier: Graphene Laboratories, Inc.
Description: is a crucial characteristic for thermal conductive adhesives, especially in electronic applications. It prevents electrical short circuits and maintains the electrical integrity of the assembly. Great Mechanical Properties: A thermal conductive adhesive with excellent
- Viscosity: 40,000 to 50,000 cP
- Use Temperature: 77 to 302 F
- Thermal Conductivity: 1.8 W/m-K
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Medical / Food (Sanitary / FDA)
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Supplier: Master Bond, Inc.
Description: Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.
- Applied Thickness / Gap Fill: 0.001 to 0.003 inch
- Viscosity: 80,000 to 100,000 cP
- Use Temperature: -100 to 300 F
- Thermal Conductivity: 1.16 to 1.6 W/m-K
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Supplier: Master Bond, Inc.
Description: Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold sterilants. This electrically isolating epoxy is well suited for bonding,
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 1.2981 to 1.4423 W/m-K
- Coeff. of Thermal Expansion (CTE): 12.219999999999999 to 13.889999999999999 µin/in-F
- Tensile Strength (Break): 5,000 to 6,000 psi
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 45 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to
- Viscosity: 36,000 to 37,000 cP
- Thermal Conductivity: 0.35 W/m-K
- Dielectric Strength: 355.60000000000076 kV/in
- Features: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 45 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to
- Viscosity: 20,000 to 21,000 cP
- Dielectric Strength: 406.40000000000083 kV/in
- Features: Epoxy (EP)
- Substrate Compatibility: Metal, Plastic
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and fillers. G6E-SG™
- Viscosity: 110,000 to 120,000 cP
- Use Temperature: 77 to 302 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera
- Viscosity: 1,400 to 2,200 cP
- Use Temperature: 572 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 17.77777777777778 to 62.22222222222222 µin/in-F
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or
- Viscosity: 285,000 to 295,000 cP
- Use Temperature: 77 to 248 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Flexible / Dampening, Grease / Paste, Other, Specialty / Other
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera
- Viscosity: 2,200 to 3,200 cP
- Use Temperature: 707 F
- Coeff. of Thermal Expansion (CTE): 32.22222222222222 to 154.44444444444443 µin/in-F
- Features: Die Bonding Adhesive / Compound, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Optoelectronics / Photonics, Thermal / Heat Conductive
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 104 White, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, powder epoxy adhesive that is used for the assembly of thermoset plastics, metal, ceramics, and glass. It offers a long pot life, high shear strength, non-conductive
- Dielectric Strength: 398.7800000000008 kV/in
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 45 Black, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to
- Viscosity: 36,000 to 37,000 cP
- Thermal Conductivity: 0.35 W/m-K
- Dielectric Strength: 355.60000000000076 kV/in
- Features: Epoxy (EP)
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 539IA, Epoxy Film, Assembly, Non-conductive Adhesive LOCTITE® ABLESTIK 539IA non-conductive film adhesive is designed for assembly applications. This adhesive film may be die cut to customer specifications.
- Adhesive: Epoxy
- Features: Specialty / Other
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Supplier: Techsil Limited
Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure
- Industry: Electronics
- Features: Encapsulating / Potting, Epoxy (EP), Flame Retardant (e.g. UL 94 Rated), Liquid, Thermal / Heat Conductive
- Substrate Compatibility: Metal, Plastic
- Cure / Technology: Two Component System
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol ECCOBOND CE3513 ) LOCTITE ABLESTIK CE 3513 is a one component, silver-filled, non-bleeding, electrically conductive epoxy adhesive with long shelf life at room temperature.
- Viscosity: 35,000 to 45,000 cP
- Type: Electrically Conductive
- Industry: Electronics (PCB / SMT Assembly)
- Cure / Technology: Single Component System
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Supplier: Henkel Corporation - Electronics
Description: Electrically conductive one-component, non-bleeding epoxy adhesive with low outgassing, eliminating wicking and bridging under small components.
- Viscosity: 70,000 cP
- Industry: Electronics
- Cure / Technology: Single Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: electronic assemblies, with the capability to attach a metal can or lid onto a package. STAYCHIP F614-3A was specifically developed for superior adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates. Non-conductive and Electrically Insulating Ensures
- Features: Electrical Insulation / Dielectric Material, Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics, Semiconductors / IC Packaging
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL XE80100 ) LOCTITE ABLESTIK XE 80100 is a solventless modified epoxy adhesive that combines low stress with good adhesion on nearly all surfaces and is flexible for mismatched CTE applications. XE80100 is the non-conductive version of ECCOBOND CE8500
- Industry: Electronics
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Supplier: FX PCB Co., Ltd.
Description: lower than polyamide materials. ADHESIVE LAYER Adhesives are not used in all flexible printed circuit boards. There are boards that have only a base material and a conductive layer in their composition, without the use of adhesive. But most products require an
- Thickness: 0.011811023622047244 inches
- Type: Film / Flexible Substrate
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EP40ND is a superb adhesive and bonds well to a variety of substrates including metals, ceramics, composites and plastics. It is most noteworthy for its affinity to bonding engineered plastics such as polycarbonates and acrylics. EP40ND is also capable of withstanding rigorous thermal cycling and shock. EP40ND is a reliable electrical insulator. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Product Advantages Easy to use, non-critical one to one mix ratio by weight Low viscosity, flows evenly and smoothly Reliable thermal conductivity and electrical insulation Low shrinkage and excellent dimensional stability Resists thermal cycling, vibration and shock Well suited for moderate to large encapsulation applications (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
. Other noteworthy properties include a tensile strength of 9,000-10,000 psi, and a Shore D hardness of 75-85. The adhesive provides good heat resistance and is serviceable from -60°F to +400°F. EP21ARHTND-2 does not contain solvents and is RoHS compliant. The product bonds well to (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
AS1802 1 Part Non-Corrosive Neutral Cure Adhesive Sealant (Electronic Grade) This is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is (read more)
Browse Electrical and Electronic Resins Datasheets for CHT USA Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
This fast curing, non-drip compound is ideal for bonding and sealing applications with a forgiving mix ratio of one to one by weight or volume. It has a rapid set up time, convenient handling, and good physical properties. It sets up very quickly at room temperature, with a working life of 3 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
expensive mixing equipment Neutral cure, non-corrosive Thermally conductive Adhesion promoters are added to improve adhesion across a range of substrates. As with all addition cure materials, adhesion can be improved with longer cure times, higher cure temperatures, post (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
Supreme 11AOHTLP Product Information Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Key Features Convenient (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc.
Conduct Research Top
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Best top 10 electronics assembly adhesives manufacturers in china with non conductive epoxy adhesive glue for electronics
The world is slowly changing. The way things were done a few years ago is not the same way they are being done today, thanks to innovations and advanced technology. Embracing the good and discarding the bad is the only way to move forward. One of the areas that have been greatly affected by
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All you need to know about Metal Bonding Epoxy Adhesives
DeepMaterial, as an industrial epoxy adhesive manufacturer, we do lost of research about underfill epoxy, non conductive glue for electronics, non conductive epoxy, adhesives for electronic assembly, underfill adhesive, high refractive index epoxy. Base on that, we have the latest technology
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Choosing the Right Non Conductive Epoxy For Electronics
Non conductive epoxy is a type of adhesive that is specifically designed for use in electronics. It is used to insulate and protect electronic components from electrical currents and environmental factors. Choosing the right non conductive epoxy is crucial to ensure the proper functioning
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An Overview of Non-Conductive Epoxy for Electronics
to assembling electronic goods and other similar products. When it comes to bonding electronics/electrical products, conductive and non-conductive glues are used to achieve special purposes.
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Metal
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Meta
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Manufacturing Optimization for Improved Reliability in TCXO Oscillator Designs
The strength of this adhesion had already been identified as a concern since the mechanical integrity of the I/O pins connection to the substrate is completely dependent on the non - conductive epoxy adhesion .
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MEMS Materials and Processes Handbook
Non - conducting epoxy adhesives and insulating polyimides may be filled with met- als, solders, or solders filled with glasses.
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Thickness effects on magnetoelectric coupling for Metglas/PZT/Metglas laminates
To prepare samples of Metglas/PZT/Metgals laminates with different n, Metglas layers of different num- bers but a fixed thickness of 30 m were glued together using non - conductive epoxy adhesive .
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Recent advances in conductive adhesives for direct chip attach applications
Kristiansen H; Bjorneklett A (1992) fine pitch connection to rigid substrates using non - conductive epoxy adhesive .
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Open Ended Microwave Oven for Packaging
Microwave heating has been successfully applied to heating glob-top and flip-chip underfill encapsulants [12]- [14], conductive and non - conductive epoxy adhesives [11], [15]-[16], polymer dielectrics [17]-[19], lead-free solder interconnects [20] and wafer bonding [21].
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3D stacked MEMS and ICs in a miniaturized sensor node
This is a non - conductive epoxy adhesive that was dispensed onto the underlying ASIC right before the flip-chip process.
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Characterisation of electrical contacts made by non-conductive adhesive
A BjGrneklett, “Fine Pitch Connection to Rigid Substrates using Non - Conductive Epoxy Adhesive ”, Journal of Electronics Manufacturing, Chapman & Hall, 2 (1992), p 7-12 .
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Thermal energy conversion by coupled shape memory and piezoelectric effects
Two pieces were glued together using non - conductive commercial epoxy adhesive ‘3M Scotch-Weld DP460 Off-White’ locally substituted with silver lacquer to provide electrical connection between the electrodes.
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Chip Scale Package Using Standard Lead Frame Technology
In this case LOC device is attached on the leads Iiy clcctrically non - conductive epoxy or adhesive tape and wire bonded to lead tip area.
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Bare chip stacking structure for MCM production
An upper die is fixed by non - conductive epoxy type adhesive on the top of a lower die.