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Supplier: Gelest, Inc.
Description: Safety Packaging Under Nitrogen
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to 5.0 mm
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 70 %
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 300 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 596, Silicone, Gasketing & sealing LOCTITE® 596 cures on exposure to moisture in the air to form a tough, flexible, waterproof, oil-resistant silicone rubber bond. This product resists aging, weathering and thermal cycling without hardening, shrinking or cracking. This product
- Cure Type / Technology: Single Component System, RTV / Room Temperature Curing
- Viscosity: 73500 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive Reworkable Unfilled
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System
- Substrate / Material Compatibility: Metal
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Supplier: Henkel Corporation - Industrial
Description: Silicone paste primarily designed for a wide variety of applications in the fiber optic industry. LOCTITE® SI 3407 is a black, silicone paste primarily designed for a wide variety of applications in the fiber optic industry. Wide variety of applications in the fiber optic industry
- Cure Type / Technology: Single Component System
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Supplier: Master Bond, Inc.
Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace,
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Coeff. of Thermal Expansion (CTE): 77.78 to 94.44 µin/in-F
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System
- Viscosity: 40000 cP
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Strength: 350 kV/in
- Features: Gap Filling Sealant / FIP Gasket, Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing, Reactive / Moisture Cured
- Dielectric Constant (Relative Permittivity): 4.2
- Dielectric Strength: 850 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 203 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive)
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800B is made of non-silicon resin material and none low-molecular-weight siloxane. N800B helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 203 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive)
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.78 µin/in-F
- Compound Type: Encapsulating / Potting, Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.9
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to 5.0 mm
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 10
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 30 %
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to 5.0 mm
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 5.5
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 100 %
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to 5.0 mm
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 6
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 70 %
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive
- Industry: Electronics, OEM / Industrial
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Supplier: Techsil Limited
Description: Techsil RTV 1084G is a non-corrosive, 1-part, grey silicone rubber. RTV 1084 G has amazing thermal conductivity (2.3 W/mK) and is non corrosive, fast skinning with low linear shrinkage. It is one of a new family of products called acetone cure sealants that are solvent
- Compound Type: Electrically Conductive, Thermally Conductive
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Silicone Adhesives and Sealants - Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/BSupplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: Techsil® TIM11123 (GB) Grey is a 200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanizing (RTV) silicone rubber. It is one of a new family of products called acetone cure sealants. These products are cured rapidly in contact with atmospheric moisture to a
- Compound Type: Electrically Conductive, Thermally Conductive
- Material Form: Gap Filling Compound
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Supplier: Techsil Limited
Description: Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits Easy to use, one-component material Fast cure at elevated temperature
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Rubber Based / Elastomeric: Yes
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Supplier: Master Bond, Inc.
Description: MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics as well as many types of rubbers
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): Over 4.1
- Dielectric Strength: Over 450 kV/in
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Supplier: CHT USA Inc.
Description: CHT’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It
- Cure Type / Technology: Single Component System, Specialty / Other
- Dielectric Strength: 991 kV/in
- Elongation: 94 %
- Features: Flame Retardant (e.g. UL 94 Rated), UL Approved
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Supplier: Techsil Limited
Description: Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof
- Compound Type: Thermal Compound / Heat Conductive
- Industry: Electronics
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 178 kV/in
- Industry: Electronics
- Viscosity: 150000 cP
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 450 kV/in
- Elongation: 17 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity,
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 450 kV/in
- Elongation: 17 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 450 kV/in
- Elongation: 17 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity,
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 450 kV/in
- Elongation: 17 %
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Supplier: Materion Corporation
Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure
- Compound Type: Electrically Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: RS Components, Ltd.
Description: These non-corrosive, 1-part, room temperature vulcanising (RTV) silicone rubbers are part of a new family of acetone cure sealants that are solvent free. They are suitable for a wide range of bonding and sealing applications particularly in the electronics industries. They
- Compound Type: Thermally Conductive
- Material Form: Specialty / Other
- Thermal Conductivity: 1.55 W/m-K
- Use Temperature: -58 to 428 F
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Supplier: Hosco Finishing System Components
Description: PSH – non-conductive, PTFE lined, fiberglass reinforced innercore, overbraided with 300 series stainless steel. PSHC – conductive (carbon impregnated), PTFE lined, fiberglass reinforced innercore, overbraided with 300 series stainless steel. PDH – .030 wall, non-conductive
- Application: Other
- Construction Options: Corrugated, Reinforced
- Material: Fluoropolymers / Silicone
- Outside Diameter: 0.5000 to 2 inch
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Supplier: Materion Corporation
Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure
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AS1802 1 Part Non-Corrosive Neutral Cure Adhesive Sealant (Electronic Grade) This is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is (read more)
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using silicone rubbers is silicone-coated rope, which is designed as a high-temperature resistant sealant for numerous industrial applications. This blog post will explore the properties and applications of silicone-coated rope in more detail. What is Silicone-Coated Rope? (read more)
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expensive mixing equipment Neutral cure, non-corrosive Thermally conductive Adhesion promoters are added to improve adhesion across a range of substrates. As with all addition cure materials, adhesion can be improved with longer cure times, higher cure temperatures, post (read more)
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The Creep Testing Apparatus (CRETA): A New Testing Device for Measuring the Viscoelasticity of Joint Sealant
Creep tests were conducted on two types of silicone sealant : self-leveling (SL) and non -self-leveling (NS).
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Aluminum Alloys as Potential O.T.E.C. Heat Exchanger Materials
The samples are coated on the outside with a sealant to prevent corrosion from condensation, etc., and are coupled to one another with non - conducting , flexible silicone couplings.
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Effects of Stem‐Injected Plant Growth Regulators, with or without Sucrose, on Grain Production, Biomass and Photosynthetic Activity of Field‐Grown Corn Plants
…latex "Vultex\ General Latex Canada\ Can! diac\ PQ\ Canada#[ the top end of the 10!gauge needle\ with the plastic portion removed\ was inserted into the bottom of the tubing and sealed with white silicon sealant "GE Silicones Canada\ Pickering\ Ontario\ Canada# … of the _rst injection set!up was detected\ the experimental treatments were immediately switched to the second injection site[ Leaf photosynthetic rate\ transpiration\ intercellular CO1 concentration and stomatal conductance "LI!5199 portable photosynthesis … with distilled water and non !injected plants were not…