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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.
- Viscosity: 15,000 cP
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 3.5 W/m-K
- Dielectric Strength: 300 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 257 F
- Thermal Conductivity: 7 W/m-K
- Dielectric Strength: 203.20000000000041 kV/in
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Silicone Adhesives and Sealants - Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/BSupplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive
- Industry: Electronics
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Features: Rubber Based / Elastomeric, Silicone
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Supplier: Gelest, Inc.
Description: Safety Packaging Under Nitrogen
- Features: Silicone
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆ Free
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 3 W/m-K
- Tensile Strength (Break): 7.977026164645835 psi
- Elongation: 70 %
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Supplier: Master Bond, Inc.
Description: Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature
- Use Temperature: -60 to 400 F
- Thermal Conductivity: 2.1 W/m-K
- Tensile Strength (Break): 210 psi
- Elongation: 70 %
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Supplier: Master Bond, Inc.
Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace,
- Applied Thickness / Gap Fill: 0.002 to 0.003 inch
- Viscosity: 300,000 to 400,000 cP
- Use Temperature: -65 to 400 F
- Thermal Conductivity: 1.15 to 1.3 W/m-K
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar
- Viscosity: 100,000 cP
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 2.5 W/m-K
- Dielectric Strength: 350 kV/in
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 596, Silicone, Gasketing & sealing LOCTITE® 596 cures on exposure to moisture in the air to form a tough, flexible, waterproof, oil-resistant silicone rubber bond. This product resists aging, weathering and thermal cycling without hardening, shrinking or cracking. This product
- Viscosity: 73,500 cP
- Features: Room Temp. Cure / Vulcanizing, Silicone
- Cure / Technology: Single Component System
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive
- Features: Electrically Conductive, Gel, Rubber Based / Elastomeric, Silicone
- Industry: Electronics, OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9
- Viscosity: 35,000 to 50,000 cP
- Use Temperature: -65 to 221 F
- Thermal Conductivity: 1.1538 to 1.2981 W/m-K
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.77999999999999 µin/in-F
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Supplier: CHT USA Inc.
Description: CHT’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It
- Viscosity: 350,000 cP
- Use Temperature: -58 to 428 F
- Thermal Conductivity: 1.55 W/m-K
- Tensile Strength (Break): 406.1031502001516 psi
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Viscosity: 400 cP
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
- Dielectric Strength: 635.0000000000014 kV/in
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆ Free
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 2 W/m-K
- Tensile Strength (Break): 7.977026164645835 psi
- Elongation: 70 %
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆ Free
- Use Temperature: -40 to 248 F
- Thermal Conductivity: 8 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 30 %
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Supplier: Master Bond, Inc.
Description: MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics as well as many types of rubbers
- Viscosity: 30,000 to 40,000 cP
- Use Temperature: -120 to 400 F
- Thermal Conductivity: 1.01 to 1.3 W/m-K
- Tensile Strength (Break): 150 to 400 psi
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆ Free
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 1 W/m-K
- Tensile Strength (Break): 10.877762951789775 psi
- Elongation: 100 %
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 1.7 W/m-K
- Dielectric Strength: 381.0000000000008 kV/in
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity.
- Viscosity: 150,000 cP
- Dielectric Strength: 177.80000000000038 kV/in
- Features: Air Setting / Film Drying, Die Bonding Adhesive / Compound, Gap Filling Sealant / FIP Gasket, Gel, Silicone
- Industry: Electronics
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Supplier: Techsil Limited
Description: Techsil® TIM11123 (GB) Grey is a 200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanizing (RTV) silicone rubber. It is one of a new family of products called acetone cure sealants. These products are cured rapidly in contact with atmospheric moisture to a
- Features: Electrically Conductive, Gap Filling Compound, Thermal Compound / Interface (Thermally Conductive)
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Supplier: Techsil Limited
Description: Techsil RTV 1084G is a non-corrosive, 1-part, grey silicone rubber. RTV 1084 G has amazing thermal conductivity (2.3 W/mK) and is non corrosive, fast skinning with low linear shrinkage. It is one of a new family of products called acetone cure sealants that are solvent
- Features: Electrically Conductive, Thermally Conductive
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Supplier: Techsil Limited
Description: Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof
- Industry: Electronics
- Features: Rubber Based / Elastomeric, Silicone, Thermal / Heat Conductive
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Supplier: Techsil Limited
Description: Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies,
- Industry: Electronics
- Features: Rubber Based / Elastomeric, Silicone, Thermal / Heat Conductive
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity,
- Viscosity: 35,000 to 55,000 cP
- Thermal Conductivity: 1.15 W/m-K
- Tensile Strength (Break): 400 psi
- Elongation: 17 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity,
- Viscosity: 15,000 to 35,000 cP
- Thermal Conductivity: 1.15 W/m-K
- Tensile Strength (Break): 400 psi
- Elongation: 17 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is
- Viscosity: 15,000 to 35,000 cP
- Thermal Conductivity: 1.15 W/m-K
- Tensile Strength (Break): 400 psi
- Elongation: 17 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5952 White, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive, reversion
- Viscosity: 18,000 to 40,000 cP
- Thermal Conductivity: 0.85 W/m-K
- Tensile Strength (Break): 500 psi
- Elongation: 50 %
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant LOCTITE® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive Good elongation
- Viscosity: 60,000 cP
- Thermal Conductivity: 0.8 W/m-K
- Tensile Strength (Break): 580 psi
- Features: Electrical Insulation / Dielectric, Silicone
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP 1800, Exceptional Performance, Silicone based, Fiberglass-reinforced, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD TSP 1800 is a silicone based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface.
- Thermal Conductivity: 1.8 W/m-K
- Compound Type: Leveling / Filling Compound
- Features: Silicone, Thermal / Heat Conductive
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Supplier: Materion Corporation
Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure
- Features: Electrically Conductive, Leveling / Filling Compound
- Industry: Electronics
- Cure / Technology: Two Component System
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Supplier: Hosco Finishing System Components
Description: PSH – non-conductive, PTFE lined, fiberglass reinforced innercore, overbraided with 300 series stainless steel. PSHC – conductive (carbon impregnated), PTFE lined, fiberglass reinforced innercore, overbraided with 300 series stainless steel. PDH – .030 wall,
- Outside Diameter: 0.375 to 1.25 inch
- Media: Adhesives / Sealants / Coatings
- Product Form: Complete Hose Assembly
- Material: Fluoropolymers / Silicone
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The Creep Testing Apparatus (CRETA): A New Testing Device for Measuring the Viscoelasticity of Joint Sealant
Creep tests were conducted on two types of silicone sealant : self-leveling (SL) and non -self-leveling (NS).
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Aluminum Alloys as Potential O.T.E.C. Heat Exchanger Materials
The samples are coated on the outside with a sealant to prevent corrosion from condensation, etc., and are coupled to one another with non - conducting , flexible silicone couplings.
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Effects of Stem‐Injected Plant Growth Regulators, with or without Sucrose, on Grain Production, Biomass and Photosynthetic Activity of Field‐Grown Corn Plants
…latex "Vultex\ General Latex Canada\ Can! diac\ PQ\ Canada#[ the top end of the 10!gauge needle\ with the plastic portion removed\ was inserted into the bottom of the tubing and sealed with white silicon sealant "GE Silicones Canada\ Pickering\ Ontario\ Canada# … of the _rst injection set!up was detected\ the experimental treatments were immediately switched to the second injection site[ Leaf photosynthetic rate\ transpiration\ intercellular CO1 concentration and stomatal conductance "LI!5199 portable photosynthesis … with distilled water and non !injected plants were not…