Products & Services
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Supplier: CoorsTek
Description: Navigation and communication are critical elements when flying. With up to 35 antennas per aircraft in major airliners, reducing weight while ensuring unquestionable reliability are critical factors for aerospace communication. Our ceramic components can be found in many on-board
- Materials of Construction: Specialty / Other
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Supplier: CoorsTek
Description: CoorsTek is the leader in custom and standard thin-film ceramic substrates. Four thin-film substrate material options combine smooth surface finish, strong flexural strength, and consistent electrical properties. Why Ceramic Thin-Film Substrates? Alumina is an
- Features: Dielectric / Insulating
- Materials of Construction: Specialty / Other
- Thickness: 0.0050 to 0.0600 inches
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Description: Direct Plated Copper (DPC) is a newest development in the field of Ceramic Substrate PCBs, its process is by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of the ceramic substrate which result in copper thickness' ranging
- Applications: Other
- Material Type: Specialty Ceramic
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Printed Circuit Substrate Materials (PCB / PWB) - Mid-Film Ceramic Electronic Substrates -- ADS-995RSupplier: CoorsTek
Description: CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates?
- Features: Dielectric / Insulating
- Materials of Construction: Specialty / Other
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Supplier: CoorsTek
Description: CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates?
- Features: Dielectric / Insulating
- Materials of Construction: Specialty / Other
- Thickness: 0.0100 to 0.1400 inches
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Supplier: FX PCB Co., Ltd.
Description: Description FX PCB manufacture for Display PCB in 2022 FX PCB can produce 1-24 Layer display PCB for our customers, and we help customers from prototype to mass production with competitive price. Our experienced engineer team will give you the suggestion on your design to
- Materials of Construction: Aluminum Foil / Cladding, Copper Foil / Cladding, Specialty / Other
- Thickness: 0.0079 to 0.3150 inches
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Supplier: 3X Ceramic Parts Company Limited
Description: PCB substrate in China's market continues to rise. With its excellent performance, the market share of silicon nitride ceramic substrate is increasing. (1) Compared with alumina substrate or aluminum nitride substrate, it has more than twice the bending
- Compressive / Crushing Strength: 362592 psi
- Density: 3.2 g/cc
- MOR / Flexural Strength: 87022 psi
- Material Type: Silicon Nitride, Specialty Ceramic
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Supplier: FX PCB Co., Ltd.
Description: Description What is the Ceramic PCB Substrate? FX PCB listed two kinds of Ceramic PCBs, which are Aluminum Nitride Ceramic PCB and Alumina Ceramic PCB (ALN and AI203) Properties for your reference: BECAUSE OF ITS HIGH THERMAL
- Electrical Resistivity: 10 ohm-cm
- Materials of Construction: Specialty / Other
- Thickness: 0.0098 to 0.0150 inches
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Supplier: FX PCB Co., Ltd.
Description: Description Ceramic PCB Materials Properties: FX PCB use the ceramic material imported from Germany and Fujian Huaqing, all incoming material will be strictly checked for the material properties. See the capability of FX PCB for the Ceramic. Ceramic
- Electrical Resistivity: 10 ohm-cm
- Materials of Construction: Specialty / Other
- Thickness: 0.0098 to 0.1181 inches
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Supplier: FX PCB Co., Ltd.
Description: Description Ceramic PCB Materials Properties: FX PCB use the ceramic material imported from Germany and Fujian Huaqing, all incoming material will be strictly checked for the material properties. See the capability of FX PCB for the Ceramic. Ceramic
- Electrical Resistivity: 10 ohm-cm
- Materials of Construction: Specialty / Other
- Thickness: 0.0098 to 0.1181 inches
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Supplier: Dymax
Description: for surfaces and substrates including LCP, PCB, PPS, FPC, CAP, PS, FR-4 board, and glass. 9801 requires cold storage/cold shipping and should be kept between 1°C [34°F] and 5°C [41°F] in the original, unopened container. Dymax materials have no solvents added and cure
- Dissimilar Substrates: Yes
- Industry: Other
- Substrate / Material Compatibility: Ceramic / Glass, Other
- Viscosity: 60000 cP
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Supplier: Dymax
Description: Dymax 9803 low shrinkage optical epoxy adhesive offers superior adhesion for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. The adhesive has the unique flexibility to cure in seconds with LED and/or UV/Visible light
- Dissimilar Substrates: Yes
- Industry: Other
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Other
- Viscosity: 80000 cP
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Supplier: Dymax
Description: or hours. Light cure fixtures parts in place so a secondary cure can effectively cure shadow areas without interruption to process flow. Bondable substrates include PCB, FR4, silicon, ceramic, and lead frame as well as many metals. Dymax materials have no solvents added and cure
- Dissimilar Substrates: Yes
- Substrate / Material Compatibility: Ceramic / Glass, Rubber / Elastomer, Other
- Viscosity: 110000 cP
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Supplier: Dymax
Description: the holder to printed circuit boards (PCBs). With improved 85°C/85% RH resistance, this epoxy adhesive exhibits less overall movement through thermal excursions. It also features higher viscosity and thixotropy to maintain bead shape upon dispense. 9906-AA requires cold ship, cold storage and
- Dissimilar Substrates: Yes
- Industry: Other
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Other
- Viscosity: 86000 cP
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Supplier: Advanced Technical Ceramics Company
Description: AdTech Ceramics is the leading manufacturer of custom designed multilayer aluminum nitride substrates. Aluminum nitride offers high thermal conductivity with an excellent coefficient of thermal expansion (CTE) match to silicon. The material system is stable from cryogenic to high
- Materials of Construction: Aluminum Foil / Cladding, Metal Foil / Cladding
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: This material is a filled dielectric which contains a high Dk ceramic powder. The thicknesses available include 25 and 16um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor
- Features: Dielectric / Insulating
- Thickness: 6.30E-4 to 9.84E-4 inches
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: These materials are partially filled dielectrics which contain a high Dk ceramic powder. The thicknesses available include 12 and 8um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated
- Electrical Resistivity: 1.20E13 to 1.90E13 ohm-cm
- Features: Dielectric / Insulating
- Thickness: 3.15E-4 to 4.72E-4 inches
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: This material is a single sided coated copper which contains a high Dk ceramic powder. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and
- Materials of Construction: Copper Foil / Cladding, Metal Foil / Cladding
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Supplier: LPKF Laser & Electronics North America
Description: substrates can be processed included copper-clad FR4, aluminum-coated PET films, ceramics, Rogers TMM®, RT/duroid®, RO4000® and PTFE based materials up to 9" x 12" in size. Precise alignment for double-sided prototypes is achieved with an included fiducial recognition camera. This
- Automation / Control: Windows / PC Control
- Laser Type: Other
- Materials Processed: Semiconductors / Electronics
- Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure
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Supplier: Knowles Precision Devices
Description: Our complete testing facility is available for any additional military testing requirements. Options available include thru-hole and surface mount lead styles, to make them suitable for mounting on ceramic substrates or epoxy PCBs. Consult the Sales Office if your specific
- Electrostatic Capacitors: Ceramic COG (NPO), Ceramic X7R
- Mounting Style: Through Hole Technology (THT)
- Technology: Multilayer
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Supplier: Knowles Precision Devices
Description: Our complete testing facility is available for any additional military testing requirements. Options available include thru-hole and surface mount lead styles, to make them suitable for mounting on ceramic substrates or epoxy PCBs. Consult the Sales Office if your specific
- Electrostatic Capacitors: Ceramic COG (NPO), Ceramic X7R
- Mounting Style: Through Hole Technology (THT)
- Technology: Multilayer
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Supplier: Matexcel
Description: for PE substrates, with good printability, conductivity, oxidation resistance, hardness, and good adhesion . Storage: Store at room Temperature Application: 1. Heating film electrode 2. RFID 3. Flexible circuit board 4. PCB Usage: 1. Substrate: PI, PET
- Density: 1.8 g/cc
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Supplier: Henkel Corporation - Electronics
Description: DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide.
- Coeff. of Thermal Expansion (CTE): 38.89 µin/in-F
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
- Viscosity: 20000 cP
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Supplier: Monocrystal, Inc.
Description: AGH – series Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: Materials Ceramic Circuit Board is a high-performance electronic substrate made from ceramic materials, typically alumina (Al2O3), aluminum nitride (AlN).Features High Thermal Conductivity: Ceramic circuit boards offer superior heat dissipation compared to traditional
- Type: Component / Subsystem
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Supplier: Sauereisen, Inc.
Description: Sauereisen Flotemp Cement No. 4 is used for potting applications where high electrical insulation and thermal conductivity are required. No. 4 is specially formulated to limit the wicking nature of a porous substrate. This will prevent permeation of water into the substrate and the
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 6.18 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol CB064/FP4653 ) LOCTITE ECCOBOND CB064 is high purity, low stress, liquid, self-leveling encapsulant material. This material is for cavity fill or dam and fill applications. The unique properties of CB064 allows for it to be “chocolate breakable" on pre-scored ceramic
- Coeff. of Thermal Expansion (CTE): 4.44 µin/in-F
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
- Viscosity: 80000 cP
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Supplier: Henkel Corporation - Electronics
Description: applied to ceramic or organic substrates, including solder masks and polyimide. Due to the combination of properties FP0114 is ideal for high reliability applications.
- Coeff. of Thermal Expansion (CTE): 18.33 µin/in-F
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
- Viscosity: 5000 cP
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Supplier: Techsil Limited
Description: volume mix ratio High compressive and tensile strength Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics Excellent electrical insulating characteristics Extreme resistance to water and humidity (allows for submersion
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Encapsulants and Potting Compounds - MG Chemicals Black Encapsulating/Potting Epoxy Kit -- MGEP00009Supplier: Techsil Limited
Description: to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics Excellent electrical insulating characteristics Broad service temperature range -40 to 140 °C (-40 to 284 °F) Extreme resistance to water and humidity (allows for submersion where needed)
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: viscosity of 2 600 cP Very high compressive & tensile strength Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics Excellent Comparative Tracking Index (>600 V, PLC=0) Excellent electrical insulating characteristics
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Flame Retardant / UL 94V-0 Rated: Yes
- Form / Function: Encapsulant / Potting Compound
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Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxies Etc...
Description: 40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
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Supplier: Epoxies Etc...
Description: 40-3914 is a one component electrically conductive ink. This Polymer system was developed to provide a good balance of low cost and high conductivity. This thick film ink provides conductivity for many electronic and industrial applications. 40-3914 exhibits outstanding adhesion to a variety of
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. This adhesive cures quickly at low temperatures, minimizing thermal stress on sensitive components and enabling efficient production processes. Fast, Low
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound
- Applied Thickness / Gap Fill: 0.0040 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Master Bond, Inc.
Description: addition of heat. Some other positives include low shrinkage upon curing, a low CTE and a high degree of dimensional stability. It bonds well to a wide variety of substrates including metals, composites, ceramics and most plastics.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Master Bond, Inc.
Description: exceeding 200°C. This dimensionally stable system bonds well to a wide variety of substrates including metals, glass, ceramics, composites, various rubbers and many plastics.
- Applied Thickness / Gap Fill: 0.0040 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Composition: Unfilled
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Supplier: Master Bond, Inc.
Description: Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites,
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Epoxies Etc...
Description: UV Cure 60-7159 is a low viscosity conformal coating for Printed Circuit Boards (PCB's), components and various substrates. When exposed to long wave UV it forms a tough, clear and flexible coating. UV Cure 60- 7159 resists yellowing, vibration and impact.
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Single Component System, UV / Radiation Cured (also EB, Light)
- Industry: OEM / Industrial
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Protavic America, Inc.
Description: generated by encapsulated parts. The material bonds well to most metals, ceramics and plastics as well as to epoxy and paper phenolic circuit boards material. The cured material allows repair by cutting away material in the area of the affected component, replacing the component and
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coating Type: Electrical Insulation / Dielectric
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: provides long term circuit protection from -55ºC. to 125ºC.. The material bonds well to most metals, ceramics and plastics as well as to epoxy and paper phenolic circuit boards and, when necessary, allows repair by cutting away material in the area of the affected component
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coating Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Featured Products Top
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demands on PCB materials grow, leading to the increasing use of advanced ceramic substrates. This article delves into the applications, characteristics, and current trends of ceramic substrates in PCB manufacturing, showcasing their importance and impact on the electronics industry. Ceramic (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
allow the resistor, capacitor, conductor, semiconductor, and switchable conductors to be integrated onto the Ceramic substrate. Meanwhile, with the thick film technology, we can make all of the resistors the same value on the board, or set different values for the different resistors on the same PCB (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
needs. It’s essential to know that they come in a variety of forms, dictated primarily by the material used for their substrate or base. There are metal-based PCBs, known for their robustness and durability. Ceramic-based PCBs, prized for their resistance to (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for FX PCB Co., Ltd. -
), with the requirements on the PCB substrate of flatness, transparent, deformation, heat resistance, and tear-resistance. We found that using a glass substrate to build the PCB can meet the demand. So we are using a transparent glass substrate to build the circuit boards called transparent glass (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for FX PCB Co., Ltd. -
Dymax 9309-SC edgebond adhesive rapidly cures with UV/Visible light to strengthen and protect sensitive circuit board components. Engineered for shock attenuation and ruggedization, the material bonds quickly to leadframe, PCB, silicon, and ceramic surfaces—providing an effective (read more)
Browse UV Curing Adhesives Datasheets for Dymax -
requirements of the ceramic substrate. FX PCB has enough experience and technical expertise in ceramic production, and we can ensure the high quality of laser cutting for ceramic products. Contact us today to get a quote! (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
processing methods such as drilling, punching, and copper. 2 Layer Aluminum PCB is called double-sided Aluminum PCB. its substrates can still only have one LED, a single layer trace, double-sided Aluminum substrates can be used for LEDs on both sides, and double-sided Aluminum substrates (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
. 96% Alumina (A960): High thermal conductivity with low thermal expansion; perfect for ceramic substrates, thin-film and thick-film electronics, and PCB applications (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Applications: Ceramic substrates, electrical insulators, PCB substrates, thin-film, and thick-film electronics. Features: (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
flexibility and adhesion to substrates such as PCBs, ceramics, lead frames, flex circuits, and silicon. Its low modulus and low glass-transition temperature help absorb mechanical stress, reducing strain on delicate wire bonds and fine interconnects. Dual-Cure Processing Flexibility (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax
Conduct Research Top
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PTFE Microwave Substrates For Automotive Applications
With PTFE's low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established. The growth in wireless-technology has by extension, driven the RF Microwave industry to design and develop lower-cost PCB substrates for the requirements of an ever
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How PTFE Can Compete With The Best In Thermosets
With PTFE's low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established. The growth in wireless-technology has by extension, driven the RF Microwave industry to design and develop lower-cost PCB substrates for the requirements of an ever
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Advanced Motion Control Optimizes Laser Micro-Drilling
In micro-drilling process equipment, the most popular ways to create microvias (blind or buried vias with a diameter =150 µm) are mechanical drilling and laser drilling. Mechanical drilling is mainly used in larger apertures such as PCBs or IC substrates. Laser drilling is mainly used in finer
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Development of small‐sized UWB antenna for binaural hearing AIDS
The nonbody- contact antenna has a small size of 4 3 4.5 3 0.635 mm, and uses the Taconic CER 10 PCB ceramic substrate with a relative permittivity of 10.
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Labtech Microwave Undertakes Major Investment In New Machinery
The PCB-1600 will provide increased capability for producing plated-through-hole Teflon and ceramic substrate PCBs ; offer uniform treatments for blind vias, higher aspect ratio holes, and a faster, more reliable removal of residual resin on the PCB surface following laser …
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The properties comparison of solder joints on ceramic and FR-4 substrates
Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board ( PCB ) or ceramic substrates , which are interconnected by solder joints.
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Trends in Power Electronics Packaging Technologies For XEVs
In COB manufacturing, an unpackaged sili- con die is attached directly onto the sur- face of an FR4, flexible PCB or ceramic substrate and wire bonded to form the electrical connections.
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Information Technology Applications in Industry
The chip of GaN HEMT and PCB above ceramic substrate will be mounted on metal copper.
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Package‐induced cross‐coupling effect on amplifier harmonic suppression
Considering the practical environment, either design with a chip or by hybrid technique, the bandpass amplifier is mounted on the pad of PCB or ceramic substrate for integration of systems.
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Advanced Hybrid Powertrains for Commercial Vehicles
The hardware consists of electronic components on a printed circuit board ( PCB ), ceramic substrate , or a thin laminate substrate.
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Thermal and optoelectronic model of VCSEL arrays for short-range communication
PCB or ceramic substrate .
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http://www.microsemi.com/document-portal/doc_download/14706-innovative-mounting-techniques-enhance-thermal-performance-of-the-surface-mount-d3-pak-package
In the case of surface mounted devices, because the total heat sink is often just the PCB or ceramic substrate to which the SMD is soldered, the sink to ambient thermal impedance will depend on the board or substrate material, the pad …
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Stress impact of thermal-mechanical loads measured with the stress chip
Likewise, it allows detecting process defects like voids in solder films mounting the components onto PCB or ceramic substrates .