Products & Services
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Supplier: Allied Electronics, Inc.
Description: Aavid's Ultrastick is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free, paraffin-based thermal compound changes phase at 60°C, with a concurrent
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Supplier: Newark, An Avnet Company
Description: PHASE CHANGE THERMAL MATERIAL, RECT; Thermal Conductivity:-; Conductive Material:-; Thickness:0.0762mm; Thermal Impedance:0.107°C/W; Dielectric Strength:-; External Length:254mm; External Width:196.85mm RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: PHASE CHANGE THERMAL MATERIAL, TO247; Thermal Conductivity:-; Conductive Material:-; Thickness:0.0762mm; Thermal Impedance:0.107°C/W; Dielectric Strength:-; External Length:24.13mm; External Width:19.05mm RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: PHASE CHANGE THERMAL MATERIAL, TO220; Thermal Conductivity:-; Conductive Material:-; Thickness:0.0762mm; Thermal Impedance:0.107°C/W; Dielectric Strength:-; External Length:17.78mm; External Width:12.7mm RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: PHASE CHANGE THERMAL MATERIAL, 127MM; Thermal Conductivity:-; Conductive Material:-; Thickness:0.0762mm; Thermal Impedance:0.107°C/W; Dielectric Strength:-; External Length:127mm; External Width:127mm; Product Range:ulTIMiFlux SeriesRoHS Compliant: Yes
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Description: The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in²/W at 50psi, ensuring
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 3 W/m-K
- Dielectric Constant (Relative Permittivity): 3
- Industry: Electronics
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Thermal Compounds and Thermal Interface Materials - Arctic Alumina Thermal Compound (14 gram) -- 408Supplier: Xoxide
Description: Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride: Arctic
- Features: Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE TCF 2000 AF, Phase Change, Thermal Management LOCTITE® TCF 2000 AF phase-change thermal interface material is suitable for use between a heat sink and a variety of heat generating components. This product is supplied as a dry compound coated
- Use Temperature: 302 F
- Features: Phase Change, Thermally Conductive
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Supplier: Xoxide
Description: Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride: Arctic
- Features: Thermally Conductive
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Supplier: Xoxide
Description: conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Arctic Silver 5 goes through are much more subtle and ultimately much more effective.) Not Electrically
- Features: Thermally Conductive
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Supplier: Xoxide
Description: conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Arctic Silver 5 goes through are much more subtle and ultimately much more effective.) Not Electrically
- Features: Thermally Conductive
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Description: The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in²/W at 50psi, ensuring
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 3.5 W/m-K
- Dielectric Constant (Relative Permittivity): 3
- Industry: Electronics
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Description: The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in²/W at 50psi, ensuring
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 4 W/m-K
- Dielectric Constant (Relative Permittivity): 4
- Industry: Electronics
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Description: The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in²/W at 50psi, ensuring
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 5 W/m-K
- Dielectric Constant (Relative Permittivity): 4
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: (Known as LOCTITE Thermstrate 2000 Phase Change ) LOCTITE TCF 1000 AL is a phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. It is supplied as a dry compound coated onto an aluminum
- Industry: Electronics
- Features: Thermally Conductive
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Supplier: RS Components, Ltd.
Description: Thermally conductive phase-change film
- Thermal Conductivity: 3 W/m-K
- Features: Thermally Conductive
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Supplier: Win Source Electronics
Description: Phase Change Compound Shape: Rectangular Adhesive: Adhesive - One Side Backing, Carrier: Fiberglass Thermal Resistivity: 0.35°C/W Thermal Conductivity: 0.8W/m-K ECCN: EAR99 Fake Threat In the Open Market: 54 pct. MSL Level: 1 (Unlimited) Shelf Life Start: Date of
- Thermal Conductivity: 0.8 W/m-K
- Features: Thermally Conductive
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE PSX-D-LV (Powerstrate Xtreme) is a reworkable and repeatable phase change thermal interface material. It offers the enhanced performance and reliability of a phase change thermal interface material with the application ease of thermal grease.
- Industry: Electronics
- Features: Thermally Conductive
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Supplier: Henkel Corporation - Electronics
Description: Loctite Silverstrate is an electrically conductive phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a dry compound coated onto an aluminum substrate. The compound
- Industry: Electronics
- Features: Thermally Conductive
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Supplier: Master Bond, Inc.
Description: MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its
- Applied Thickness / Gap Fill: 1 inch
- Use Temperature: -120 to 400 F
- Tensile Strength (Break): 400 to 700 psi
- Elongation: 50 to 100 %
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Supplier: Master Bond, Inc.
Description: Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.
- Applied Thickness / Gap Fill: 0.004 to 0.006 inch
- Viscosity: 70,000 to 100,000 cP
- Use Temperature: -100 to 250 F
- Coeff. of Thermal Expansion (CTE): 5,555,555.555555555 to 7,222,222.222222222 µin/in-F
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE PSX-D (Powerstrate Xtreme) is a repeatable phase change thermal interface material. Supplied as a paste that can be stenciled, needle dispensed, screen printed or applied manually onto a heat sink, baseplate or other surfaces. Also available in other versions (PSX-D-LV,
- Thermal Conductivity: 3.4 W/m-K
- Industry: Electronics
- Features: Thermally Conductive
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Supplier: Master Bond, Inc.
Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
- Applied Thickness / Gap Fill: 1 inch
- Viscosity: 1,000 cP
- Use Temperature: -67 to 392 F
- Dielectric Strength: 500.00000000000006 kV/in
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Supplier: Woodex MECO Industries
Description: motion, changing pressures and shaft runout. They are frequently used on agitator shafts in reactors where the process medium goes through several phase changes, containing liquids, vapors and/or solids. They are well-suited for extensive thermal growth or shrinkage of the shaft
- Shaft Speed: 600 rpm
- Operating Pressure: 0 to 50 psi
- Operating Temperature: -60 to 500 F
- Seal Application: Agitator / Mixer
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Supplier: ASTM International
Description: across the material surface, hm, from the known dimethyl phthalate mass transfer coefficient in the chamber (1).2 1.6 Using the steady-state gas phase concentration and mass transfer coefficient, the method estimates the gas-phase concentration of SVOC in equilibrium with the material
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Supplier: ToneCooling Technology Co., Ltd
Description: Quick Installation Elastic Mounting System: Press-fit clamps require no tools, ensuring ±0.05mm flatness, preventing poor contact due to improper installation. Pre-Applied Phase-Change Thermal Compound: Uses Indium alloy sheet with graphene filler, melts at 45°C to ensure
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Supplier: SAE International
Description: system testing, was implemented on past flight hardware for launch vehicles. Reliability estimates prior to the first flight of a new engine historically have been based largely upon results from qualification or certification tests which formally declared the engine ready to fly. Many
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Introducing our curable phase-change thermal adhesive — a dual-function solution engineered for high-power server CPUs and GPUs. Applied as a manageable pre-form, it melts during assembly to flow into microscopic surface irregularities, displacing trapped air and achieving low thermal (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
door controller manufacturer was dealing with a phase-change material that performed well in theory but created problems on the line. It had to be peeled from the release film extremely quickly, often (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
thermal silicone pads, phase change thermal material, thermal conductive insulating film, thermal grease, thermal gels, carbon fiber thermal pads, and non-silicone thermal pad. Each type has unique features tailored to specific product requirements. 5G smartphones, base stations, and servers are (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
EP35AOLV is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against corrosion in various harsh environments and helps prolong longevity of critical (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
New 4.5-Watt Thermal Putty Fujipoly® introduces Sarcon® PG45A its (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
. SG560-50 thermal grease is designed for this kind of thermal interface. It fills the tiny air gaps between the heat source and heatsink, helping heat move out more efficiently. With thermal conductivity up to (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
SARCON® PG65A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
heatsink, this 0.5mm thick, highly conformable gap filler pad can transfer heat with a thermal conductivity of 1.4 W/m•K while exhibiting a thermal resistance of .60° C•in2/W at 14.5 PSI. To improve material handling and ease of installation, (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
flame retardant non-halogenated system is thermally conductive, 9 (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc.
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Products & Services
Use Ultrasonics to Characterize Emulsions and Suspensions High-resolution ultrasonic spectroscopy can be used to analyze industrial emulsions and suspensions, allowing users to identify key changes in compound behavior, such as changes in some emulsions after thermal activity, which can lead
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Tin Vs. Bare
to oxidize the materials properties (conductive, tensile, thermal, etc.) will begin to change. As we said above, if the metal is thick enough and it just has a little surface rust, it will maintain its structural integrity. But we aren't talking about structural integrity when it comes to passing
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Aavid Thermalloy - 100300F00000G - Chemicals - Potting Compounds - Allied Electronics
This solid, silicone-free, paraffin-based thermal compound changes phase at 60°C, with a concurrent volumetric expansion that fills gaps between the mating surfaces.
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http://www.alliedelec.com/catalog/catalogpages/201112/780.pdf
This solid, silicone-free, paraffin-based thermal compound changes phase at 60°C, with a concurrent volumetric expansion that fills gaps between the mating surfaces.
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Thermal Management for LED Applications
This is a critical property of properly designed thermal compounds and phase - change thermal compounds .
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Understanding the performance characteristics of phase-change thermal interface materials
Fig. 6 also shows the results of tests on the composite material which reveals that the addition of the phase - change thermal compound to the surfaces of the KaptonB again eliminates the thermal interfacial impedance as the data line with the compound …
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Aavid Thermalloy - 100200F00000G - Chemicals - Potting Compounds - Allied Electronics
Ultrastick Phase Change Thermal Interface Compound 47.5 gram bar .
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Chemicals & Adhesives - from Allied Electronics
Ultrastick Phase Change Thermal Interface Compound 47.5 gram bar .
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Chemicals - Chemicals & Adhesives from Allied Electronics
Ultrastick Phase Change Thermal Interface Compound 47.5 gram bar .
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Fabrication and processing of polypropylene ‐ paraffin compounds with enhanced thermal and processing properties: Impact penetration and thermal characterizati...
The research work presented in this manuscript explains the production of commercially processable, shape stable polymeric phase change compounds for thermal energy conservation applications.
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Environmental Catalysis
Deactivation mechanism Road Mechanical Disintegration Fouling Thermal Sintering Phase change Compound formation Hot spots Component migration Chemical Poison adsorption Product adsorption Oxidation state changes Vehicle tests Dynamometer no yes yes/no yes/no yeslno yes yes/no yes/no yes/no yeslno yes/no yes/no Yes no yeslno …
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Thermal energy storage by encapsulated Glauber's salt in a liquid fluidized bed
Glauber's salt is a promising phase change thermal energy storage compound because of its low price, suitable phase change temperature (32.4/sup 0/C), high latent heat (3.665 x 10/sup 5/kJ/m/sup 3/) and the availability of a suitable nucleating agent (Borax).