Help with Leveling and Filling Compounds specifications:
Substrate / Material Compatibility
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Ceramic / Glass | Ceramics consist of oxides, carbides, nitrides, and other non-metals with high melting points. Ceramics are suitable for applications requiring wear resistance, thermal stability, and electrical resistivity. | ||
Concrete / Masonry | Concrete and cements consist of a mixture of a binder or clinker and a coarser aggregate. They are used to patch or line floors and walls, bond brick, and join components for use in high-temperature applications. Clinker is a fused mineral or mineral mixture, such as alumina, bauxite, or lime, which is crushed into a fine powder. Aggregates are coarser, granular materials that are added to mortar, grout, or cement at mixing time to impart special properties such as thermal stability, wear resistance and oxidation resistance. Synthetic aggregates are fused mineral or mineral mixtures crushed to a coarse, granular size range rather than a fine, powdered clinker. Portland cement is the most common bond used in structural concretes and mortars. Polymer cements have a resin bond and are used in corrosion protection, mortars for corrosion-resistant floor tiles, and other specialized industrial applications. Masonry consists of tile, bricks, stone, or other ceramic components that are bonded together with mortar or adhesive. | ||
Composites | Composite materials consist of a resin (suitable for molding) and a matrix (typically fibers or textile material) which serves to enhance strength, alter electrical or magnetic properties, or enhance wear resistance. | ||
Metal | Metals are opaque, fusible, ductile, and typically lustrous substances that are good conductors of heat and electricity. They form cations by the loss of electrons and yield basic oxides and hydroxides. Metals that are used in structural engineering applications have a high toughness that is a combination of high strength and ductility. | ||
Paper / Paperboard | Paper or paperboard products are produced from a pulp of cellulose, cotton, wood, or other vegetable fibers. The pulp is laid down on a fine screen from a water suspension to form sheets that are dried and further processed. | ||
Plastic | Plastics are organic, synthetic, or processed materials that are mostly thermoplastic or thermosetting polymers of high molecular weight. They can be made into objects, films, or filaments. | ||
Porous Surfaces | Substances are adhesives or sealants with a high viscosity or gel-like consistency. Typically, these materials have the ability to work with porous surfaces. | ||
Rubber / Elastomer | Rubber and elastomers are characterized by a high degree of flexibility and elasticity (high reversible elongation). Natural or synthetic rubber is vulcanized to increase useful properties such as toughness and resistance to wear for use in tires, electrical insulation, and waterproof materials. Vulcanization is a chemical treatment that adds sulfur and heat to crosslink the rubber. Natural rubber is an elastic substance that is obtained by coagulating the milky juice of any of various tropical plants. Essentially, natural rubber is a polymer of isoprene, and is prepared as sheets and then dried. Synthetic rubbers or elastomers can be based on a variety of systems such as silicone, polyurethane or neoprene. | ||
Textiles / Fabrics | Substances are adhesives or sealants suitable for coating, filling, sizing, or sealing non-woven or woven textiles. Sizing adhesives or resins are used to fill paper, textile webs, and other fibrous products. | ||
Wood / Wood Product | Wood is a natural composite extracted from the stems, branches, and roots of trees. It is a hard, fibrous substance that consists of xylem, cellulose fibers in an amorphous, lignin polymer matrix. Lignin is a biogenetic cross linked polymer which bonds together adjacent cell walls into a straw or wood tissue composite. Cellulose is a polysaccharide (C6H10O5)x of glucose units that constitutes the chief part of the cell walls of plants. It occurs naturally in fibrous products such as cotton and kapok, and is the raw material of many manufactured goods as paper, rayon, and cellophane. | ||
Other | Other unlisted, specialty, or proprietary substrates. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
Dissimilar Substrates? | Adhesive or sealant systems can bond dissimilar substrates, such as metal to rubber. | ||
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Industry / Applications
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Industry: | |||
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Aerospace | Products are designed for aerospace applications. For example, they can be used to bond composite structures to other composite or metallic frame components. | ||
Automotive | Products are designed for automotive applications. For example, they can be used to bond panels and seal windows. | ||
Electronics | Products are designed for use in electronics applications. For example, they can be used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants. | ||
Electrical Power / HV | Products are resins, compounds, and plastic composites that are suitable for electrical power or high voltage (HV) applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation. | ||
Marine | Products are designed for marine applications. They can be immersed in water and can withstand exposure to marine atmospheres. | ||
Medical / Food (Sanitary / FDA) | Products are suitable for medical or food-contact applications. Typically, they they comply with requirements from regulatory agencies such as the Food and Drug Administration (FDA), U.S. Department of Agriculture (USDA), National Science Foundation (NSF), 3A-Dairy, Canada AG, or USP Class VI. | ||
Military / Government (MIL-SPEC / GG) | Products adhere to U.S. military specifications (MIL-SPEC). | ||
OEM / Industrial | Products are designed for use by original equipment manufacturers (OEMs) for the assembly, sealing, or fabrication of products. | ||
Building / Construction | Products are designed for use by construction contractors and in maintenance, repair, and operation (MRO) applications. Construction materials include wood, wood products, glass, cement products (mortar, concrete, masonry), plaster board, metal trim, flooring tile, sub-floor or underlayment, plaster board, sheet metal roofing or flash, metal ties, insulation materials (fiberglass, foam), and bitumen-based roofing materials. | ||
Other | Other unlisted industries. | ||
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Material System
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Chemical / Polymer System Type | |||
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Phenolics / Formaldehyde Resins | Phenolic and formaldehyde resins are thermosetting molding compounds and adhesives that provide strong bonds and good resistance to high temperatures. Phenolic or phenol formaldehyde, urea formaldehyde, furan, and melamine resins are all part of this category. Generally, the most durable phenolic resin adhesives are made from chemicals of the phenol group and formaldehyde. Phenolic resins come in liquid, powder, and film form. Special phenolic resins are available that harden at moderate temperatures when mixed with suitable accelerators. Phenol-formaldehyde, resorcinol-formaldehyde, resol, and novalac resins are types of phenolic resins. Urea resin adhesives are made from urea, formaldehyde, and catalysts or hardeners. Urea formaldehyde resins can harden rapidly at moderate temperatures, but generally do not have the properties of phenolic resins. Melamine resins are made through a reaction of dicyandiamide with formaldehyde. Most of the resins in this group have excellent dielectric properties. Furan formaldehyde (FF) resins are made by the polymerization or poly-condensation of furfural, furfural alcohol, or other compounds containing a furan ring, or by the reaction of these furan compounds with other compounds (not over 50%). Fire-retardant furans are used in hand lay-up, spray-up, and filament winding operations. Furans are commonly used in foundry binders, grinding wheels, refractories, and other high-temperature applications. Furan resins and chemicals are also used in fiberglass composites, hybrid resins combined with epoxy or phenolics, and in corrosion-resistant cements. | ||
Polyester / Vinyl Ester | Thermosetting resins or plastics are based on the polyester (alkyd) or vinyl ester system. These materials should not be confused with thermoplastic polyesters or PET resins. | ||
Polypropylene (PP) | Polypropylene (PP) is commonly used in hot-melt adhesive systems. PP is a polymer based on polypropylene chemical bonds. | ||
Polysulfide | Polymer resins or compounds are based on polysulfide or polyphenylene sulfide (PPS) chemical systems. | ||
Polyurethane (PU, PUR) | Polyurethane (PUR) resins provide excellent flexibility, impact resistance, and durability. Polyurethanes are formed through the reaction of an isocyanate component with polyols or other active hydroxyl group compounds. PUR resins require a catalyst, heat, or air evaporation to initiate and complete curing. | ||
Vinyl | Polymers are based on the vinyl chemical system. Examples include polyvinyl chloride (PVC), polyvinylidene chloride (PVDF), polyvinyl vinyl acetate (PVA), and polyvinyl alcohol (PVOH). | ||
Specialty / Other | Other specialty, proprietary, or unlisted resins, chemical systems or compound or polymer types. | ||
Acrylic / Polyacrylate | Acrylics feature excellent environmental resistance and fast-setting times. Acrylic polymers are produced from acrylic acids via a catalytic reaction. | ||
Ceramic / Inorganic Cement | Compounds or material systems are based on ceramic or inorganic cement systems. | ||
Epoxy (EP) | Epoxy resins (EP) exhibit high strength and low shrinkage during curing. Epoxies are known for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins cured at room temperature. Some thermally cured or thermoset one-part epoxies are also available. Depending on the formulation, epoxy resins are used as casting resins, potting agents, resin binders or laminating resins in fiberglass or composite construction. They are also used as encapsulates, electrical conductors in microelectronic packaging, and adhesives in structural bonding applications. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
Filled / Reinforced? | Filled compounds consist of adhesives with additional modifiers such as pigments or chopped fiber reinforcements. Typically, filled compounds are ready-to-use. | ||
Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
Rubber Based / Elastomeric? | Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation). Natural rubber, synthetic rubber, or elastomer sealants and adhesives can be based on a variety of systems such silicone, polyurethane, chloroprene, butyl, polybutadiene, isoprene, or neoprene. | ||
Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
Cure Type / Technology
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Cure Type / Technology | |||
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Thermosetting / Crosslinking | Thermoset plastics and thermoset resins are crosslinked polymeric resins that are cured using heat or heat and pressure. Cured thermoset resins generally have higher resistance to heat than thermoplastics, but cannot be melted down and reprocessed. Thermoset adhesives are crosslinked polymeric resins cured using heat or heat and pressure. Cured thermoset resins do not melt and flow when heated, but they may soften. Phenolic, melamine, and urea formaldehyde resins are thermosetting adhesives that offer strong bonds and good resistance to high temperatures. Vulcanization is a thermosetting reaction involving the use of heat and/or pressure in conjunction with a vulcanizing agent, resulting in greatly increased strength, stability and elasticity in rubber-like materials. RTV silicone rubbers are room temperature vulcanizing materials. The vulcanizing agent is a crosslinking compound or catalyst. Sulfur is the traditional vulcanizing agent used with natural rubber. Silicones use moisture, acetic acid and other compounds as curing agents. | ||
Room Temp. Cure / Vulcanizing | Room temperature curing or vulcanizing products are polymer resins or compounds that either cure or vulcanize at room temperature. Vulcanization is a thermosetting reaction involving the use of heat and/or pressure in conjunction with a vulcanizing agent. It results in greatly increased strength, stability, and elasticity in rubber-like materials. The vulcanizing agent is a crosslinking compound or catalyst. Silicones use moisture, acetic acid, and other compounds as curing or vulcanizing agents. | ||
Single Component System | Single component adhesives or sealant systems consist of one resin that hardens by reaction with surface moisture, a surface applied activator-primer, or through the application of heat. | ||
Two Component System | Two or multi-component adhesive or sealant systems consist of two or more resins or a resin and a hardener, crosslinker, activator, or catalyst that, when combined, react and cure into a polymerized compound or bond. Two component systems are mixed and then applied. | ||
Thermoplastic / Hot Melt | Thermoplastics can be repeatedly softened by heat and then hardened, or set by cooling, which allows parts to be injection-molded or thermoformed and scrap to be reprocessed. Thermoplastic or hot melt adhesives can be repeatedly softened by heat and then hardened, or set by cooling, which allows parts to be removed or repositioned during assembly. Most hot melt adhesives are solvent-free thermoplastics that melt or drop in viscosity above 180°F, and then rapidly set upon cooling. They are used in a variety of manufacturing processes, including bookbinding, woodworking, construction, product assembly, and box and carton heat sealing. Hot melt adhesive technology stemmed from the previous use of molten wax for bonding. Thermoplastic systems were introduced to satisfy performance needs. Typically, a pure hot melt system will not have the heat resistance of two-part, catalyst, or thermoset adhesives. Hybrid hot melt systems are available that exhibit a degree of reactive curing. Polyethylenes, polyamides and ethylene-vinyl acetates are common types of hot melt adhesives. Heat activated adhesives become sticky or tacky when warmed, and are used in contact or PSA-type applications. | ||
Specialty / Other | Other unlisted, specialty, proprietary technologies or cure types. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
Features
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Features | |||
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Solvent Based (Volatile Organic) | Solvent-based adhesive resins use a volatile organic solvent (VOC) to thin or alter viscosity. Typically, solvent-based adhesive resins result in greater environmental or regulatory control problems. Solvents can also present a fire hazard or a risk of explosion, depending on the plant or job site. | ||
Thermal / Heat Insulating | Thermally insulating resins, plastics, compounds and encapsulates provide a thermal barrier between components and a hot or cold source. | ||
UL Approved | The material is approved to or recognized under one or more requirements of Underwriters Laboratories, Inc. (UL). | ||
Water Based / Latex Dispersion | Water-based or water-borne adhesive resins are water soluble or water emulsion-based resin systems that typically do not contain any VOC solvents. Water-based adhesive resins usually present fewer environmental or regulatory control problems. | ||
Electrically Conductive | Resins or compounds with a high degree of electrical conductivity (low resistivity) are used in applications such as anti-static or ESD control, EMI/RFI shielding, thick-film metallization, and device and board-level electrical interconnection. | ||
Electrical Insulating / Dielectric | Dielectric compounds and electrical insulation materials form a barrier or isolator between electrical or electronic components. The voltage potential between the conductor and conductive components influence material selection, based on the dielectric strength to reduce shorting. Dielectric constant and loss tangent are important parameters in minimizing crosstalk between insulated circuit paths. | ||
Flame Retardant (e.g. UL 94 Rated) | The material is flame retardant in accordance with industry standards from Underwriters Laboratories, Inc. (UL), Flame Class 94, or other ISO standards. Flame-retardant materials are designed to reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate the substrate and delay damage to it. | ||
Flexible / Dampening | Products are designed to provide flexibility or dampening of sound, vibration, or shock in suitable applications. Flexible adhesives or sealants form a layer that can bend or flex without cracking or delaminating. | ||
Non-corrosive Cure | Silicone or reactive systems use a non-corrosive cure system such as a metal or oxime catalyst. | ||
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Processing & Physical Properties
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Applied Thickness / Gap Fill | Products are applied at a particular functional surface thickness or between two surfaces (the 'gap fill' thickness) to ensure performance criteria, such as strength, electrical resistance, etc., are met. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
Viscosity | Viscosity is a measurement of a fluid's resistance to flow. Water is lower in viscosity than motor oil or honey. Oil is lower in viscosity than tar or molasses. Depending on the application method, viscosity determines how well a resin fills the cavities or voids in a mold. | ||
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Thermal Properties
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Use Temperature | Use temperature is the range of temperatures a product can be exposed to without the degradation of structural or other required end-use properties. | ||
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Thermal Conductivity | Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient (Δ T)] | ||
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Coeff. of Thermal Expansion (CTE) | Coefficient of linear expansion (CFE) is the amount of linear expansion or shrinkage that occurs in a material with a change in temperature. | ||
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Mechanical Properties
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Tensile Strength (Break) | Tensile strength at break is the maximum amount of stress required to break the material under tension-loading test conditions, or to cause failure. Typically, tensile tests are performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets), as well as other OEM proprietary standards. | ||
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Elongation | Elongation is the amount of deformation as a percentage that occurs during a tensile test or other mechanical test. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||