Specialty / Other Leveling and Filling Compounds
from MacDermid Alpha Electronics Solutions
ALPHA ® HiTech ™ CF12-4485B is a one-component, low temperature cure, cornerfill epoxy system. It is designed to provide protection to the solder joint during mechanical stress. [See More]
- Cure / Technology: Single Component; Low Temperature Capability
- Industry: Electronics
- Chemical System: Epoxy
- CTE: 31 to 106
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Type / Form: Liquid
- Composition: Unfilled
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
from Master Bond, Inc.
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Cure / Technology: Single Component; Dual Curing
- Type / Form: Liquid
- Composition: Filled
- Features: Adhesive; High Dielectric; Non-corrosive; Sealant