Specialty / Other Leveling and Filling Compounds
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Type / Form: Liquid
- Composition: Unfilled
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
from Master Bond, Inc.
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Cure / Technology: Single Component; Dual Curing
- Type / Form: Liquid
- Composition: Filled
- Features: Adhesive; High Dielectric; Non-corrosive; Sealant
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Features: Adhesive; Flexible; Electrically Conductive; Non-corrosive; Sealant
- Composition: Filled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity and a refractive index of 1.51. [See More]
- Cure / Technology: Single Component; Cures by LED light
- Type / Form: Liquid
- Composition: Unfilled
- Features: Adhesive; High Dielectric; Non-corrosive; Sealant
from Master Bond, Inc.
Master Bond MasterSil 980 is a two component fluorosilicone for bonding, sealing, coating and encapsulating. Its most outstanding attribute is enhanced chemical resistance particularly to fuels, oils and solvents. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cured
- Type / Form: Liquid
- Composition: Unfilled
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological design, let it penetrate 25µm clearance, minimize induced stress, improve temperature cycling performance, with... [See More]
- Cure / Technology: Heat Curing
- Industry: Electronics
- Chemical System: Epoxy
- Viscosity: 3500 to 7000