Specialty / Other Leveling and Filling Compounds

Cornerfill Epoxy System -- ALPHA® HiTech™ CF12-4485B
from MacDermid Alpha Electronics Solutions

ALPHA ® HiTech ™ CF12-4485B is a one-component, low temperature cure, cornerfill epoxy system. It is designed to provide protection to the solder joint during mechanical stress. [See More]

  • Cure / Technology: Single Component; Low Temperature Capability
  • Industry: Electronics
  • Chemical System: Epoxy
  • CTE: 31 to 106
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
  • Type / Form: Liquid
  • Composition: Unfilled
  • Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Cure / Technology: Single Component; Dual Curing
  • Type / Form: Liquid
  • Composition: Filled
  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant