Solvent Based (Volatile Organic) Leveling and Filling Compounds

Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Solvent Based; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Sealer -- McLube Mold
from McGee Industries, Inc. / McLube Division

McLube mold sealer is effective on new and seasoned molds of all types. Our sealer will reduce or effectively eliminate porosity on the surface of your mold and leave a high-gloss finish. [See More]

  • Features: Sealant; Solvent Based
  • Type / Form: Liquid
  • Cure / Technology: Single Component
Universal Block Filler -- No. 509
from Sauereisen, Inc.

Sauereisen Universal Block Filler No. 509 is a moist-cured urethane formulation specifically designed to fill small voids, irregularities, and air pockets in concrete. No. 509 provides a smooth surface prior to application of vinyl ester and urethane protective barriers. [See More]

  • Features: Solvent Based
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: Two Component