Porous Surfaces Leveling and Filling Compounds
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Cure / Technology: Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Composition: Filled
- Features: Adhesive; Flexible; Electrically Conductive; Non-corrosive; Sealant
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100 °F to +500 °F with a glass transition temperature... [See More]
- Substrate Compatibility: Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a mixed viscosity of 2,000-5,000 cps, enabling it to be used for potting small components. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component