Flexible / Dampening Leveling and Filling Compounds
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: Adhesive; Flexible; High Dielectric; Flame Retardant; Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Adhesive; Flexible; Electrically Conductive; Non-corrosive; Sealant
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Composition: Filled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]
- Features: Adhesive; Flexible; Electrically Conductive; Non-corrosive; Sealant
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP110F8-3 is a two component high performance epoxy resin system with a long pot life for potting, sealing, encapsulating and casting. [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be used for bonding, sealing, coating and casting. Master Bond UV15X-5 offers... [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure to UV lamps or EB radiation. The cure can be effected in air or under an inert atmosphere such... [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high performance seals and gaskets. The UV21 is a solvent free system and has an excellent six month shelf life at ambient... [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Master Bond, Inc.
Featuring an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300 °F. It has high strength properties, superior electrically insulation and is readily reworkable. With a flowable, moderate viscosity, EP3SP5FL adheres well to a... [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and has a... [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
With a low viscosity, EP38CL is an optically clear two component epoxy that is used for bonding, sealing, coating and encapsulation in optical, aerospace, opto-electronic and specialty OEM applications. It possesses superior impact resistance, thermal cycling capabilities as well as the ability to... [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond MasterSil 980 is a two component fluorosilicone for bonding, sealing, coating and encapsulating. Its most outstanding attribute is enhanced chemical resistance particularly to fuels, oils and solvents. [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cured
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System UV15-7TK1ANV is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80 °F to +300 °F. It is fully reactive, does not contain any solvents or other volatiles and does not embrittle even upon exposure to... [See More]
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates