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Two Component System Leveling and Filling Compounds

31 Results
Bergquist Gap Filler 1500 Thermally Conductive Adhesive Yellow 50 cc Cartridge -- GAP FILLER 1500 50CC [GF1500-00-60-50CC from Bergquist Company (The)]
from Ellsworth Adhesives

Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics, slump resistance,... [See More]

  • Cure / Technology: Two Component  
  • Viscosity: 25
  • Features: Adhesive
  • Thermal Conductivity: 1.8
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
  • Type / Form: Liquid
  • Composition: Unfilled
  • Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
Bergquist Gap Filler 2000 Thermally Conductive Adhesive Pink 50 cc Cartridge -- GAP FILLER 2000 50CC [GF2000-00-60-50CC from Bergquist Company (The)]
from Ellsworth Adhesives

Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at room or elevated temperatures and offers mechanical and chemical stability. 50 cc Cartridge. [See More]

  • Cure / Technology: Two Component  
  • Viscosity: 300000
  • Features: Adhesive
  • Thermal Conductivity: 2
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
  • Features: Adhesive; Flexible; Electrically Conductive; Non-corrosive; Sealant
  • Composition: Filled
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler 720 g Kit -- TC-5515 LT GAP FILLER 720G KIT [99151387 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating components. It is non-flowable and cures at room temperature or heat accelerated. 720 g Kit. [See More]

  • Cure / Technology: Two Component  
  • Viscosity: 120 to 150
  • Features: Adhesive
  • Thermal Conductivity: 1.7
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type / Form: Liquid
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type / Form: Liquid
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Type / Form: Liquid
  • Composition: Unfilled
  • Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type / Form: Powder
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type / Form: Liquid
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type / Form: Liquid
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Chemical System: Epoxy
  • Type / Form: Liquid
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Epoxy
  • Type / Form: Liquid
Conocrete - Fast Patch -- No. 149
from Sauereisen, Inc.

ConoCrete - Fast Patch No. 149 is a three-component, fast setting epoxy monolithic that is designed for patching cracks and holes. This material is ideal for use on highways, bridge decks,. docks, ramps, traffic aisles, industrial floors and airport runways. Fast Patch No. 149 produces extremely... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type / Form: Powder
Ultra Clear Epoxy Adhesive -- 10-3713
from Epoxies Etc...

10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive when UV aged in a QUV Weatherometer... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type / Form: Liquid
ArmorSeal® Crack Filler
from Sherwin-Williams Protective & Marine Coatings

ArmorSeal ®CRACK FILLER is a two-component, fast set epoxy paste developed specifically for sealing, smoothing, and fairing applications on concrete, metals, plastics (FRP), wood, or masonry. The smooth consistency and excellent non-sagging properties allow the product to be used on vertical and... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Features: Flame Retardant; Sealant
Grout Material -- LOCTITE PC 6231
from Henkel Corporation - Industrial

2-part, rapid curing, polyurethane joint filler. It is a self-leveling, 100% solids, low viscosity, flexible system. LOCTITE ® PC 6231 is a gray, 2-part, rapid curing, polyurethane joint filler. It is a self-leveling, 100% solids, low viscosity, flexible system. Typical applications include... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
Engineered Materials -- Thermotech TE
from Materion Corporation

Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]

  • Cure / Technology: Two Component  
  • Industry: Electronics
  • Features: Electrically Conductive; Sealant
3M™ Scotch-Weld™ Core Splice Adhesive -- EC-3500 Part A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Features: Adhesive; Sealant
  • Chemical System: Epoxy
  • Substrate Compatibility: Honeycomb Core
Epoxy Filler / Sealer -- Kem Cati-Coat® HS N
from Sherwin-Williams Protective & Marine Coatings

KEM CATI-COAT HS N EPOXY FILLER/SEALER is a high performance, interior/exterior, low VOC, epoxy. Designed for tenacious adhesion to masonry and concrete substrates. This product meets specific design requirements for nuclear safety related qualification*. This product is quality manufactured to the... [See More]

  • Cure / Technology: Two Component  
  • Features: Sealant
  • Chemical System: Epoxy
  • Substrate Compatibility: Concrete, Masonry
Grout Material -- LOCTITE PC 9020
from Henkel Corporation - Industrial

known as NORTH AMERICA - NORDBAK HP CRUSHER BACKING, is a 2-part epoxy system for backing wear metal. LOCTITE ® PC 9020 (known as NORTH AMERICA - NORDBAK HP CRUSHER BACKING) is a blue, 2-part epoxy system for backing wear metal in gyratory and cone crushers under typical dry service... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
3M™ Scotch-Weld™ Structural Void Filling Compound -- 3524 B/A Black
from 3M Aerospace and Aircraft Maintenance Division

A two part, room temperature curing, low density void filling compound. It is designed for reinforcement of honeycomb sandwich constructions typically found in aircraft interior structures, honeycomb joining and bonding (interior furnishing, ceiling panels), edge panel sealing, inserts bonding,... [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: Flame Retardant; Sealant
  • Chemical System: Epoxy
  • Substrate Compatibility: Honeycomb Core
Heavy Duty, Interior/Exterior, Voc Compliant, Two Component, Cementitious, Acrylic, Waterborne Block Filler -- Cement-Plex® 875
from Sherwin-Williams Protective & Marine Coatings

Cement-Plexl ® 875 is a heavy duty, interior/exterior, VOC compliant, two component, cementitious, acrylic, waterborne block filler, which accepts both conventional and high performance topcoats. When topcoated, this product provides an excellent coating system for moderate service environments... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Unfilled
  • Chemical System: Ceramic; Acrylic
  • Type / Form: Liquid
Grout Material -- LOCTITE PC 9422
from Henkel Corporation - Industrial

Aggregate-filled liquid epoxy system designed for grouting up to 18 in (46 cm) deep, including self-leveling applications under rails and sole plates. LOCTITE ® PC 9422 is a red, 2-part, thick, aggregate-filled liquid epoxy system designed for grouting up to 18 in (46 cm) deep, including... [See More]

  • Cure / Technology: Two Component  
  • Type / Form: Liquid
  • Chemical System: Epoxy
Grout Material -- LOCTITE PC 9626
from Henkel Corporation - Industrial

2-part, thick aggregate-filled liquid epoxy system designed for grouting up to 6 in (150 mm) deep, including self-leveling applications. LOCTITE ® PC 9626 is a black, 2-part, thick aggregate-filled liquid epoxy system designed for grouting up to 6 in (150 mm) deep, including self-leveling... [See More]

  • Cure / Technology: Two Component  
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Use Temperature: 120 to 190
Metal Rebuilding Material -- LOCTITE EA E-120HP
from Henkel Corporation - Industrial

2-part industrial grade epoxy adhesive. It cures at room temperature to form a tough bondline with excellent resistance to peel and impact forces. LOCTITE ® EA E-120HP is an amber-beige, 2-part, high viscosity, industrial grade epoxy adhesive. The mixture cures at room temperature to form a... [See More]

  • Cure / Technology: Two Component  
  • Features: Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Metal Rebuilding Material -- LOCTITE EA E-40HT
from Henkel Corporation - Industrial

2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive with extended work life. LOCTITE ® EA E-40HT is an off-white, 2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive with extended work life. It forms a tough bondline... [See More]

  • Cure / Technology: Two Component  
  • Features: Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Metal Rebuilding Material -- LOCTITE PC 7254
from Henkel Corporation - Industrial

2-part epoxy metal repair compound heavily reinforced with aluminum powder. Its ideal for repairing non-structural defects in aluminum castings. LOCTITE ® PC 7254 is a gray, 2-part epoxy metal repair compound heavily reinforced with aluminum powder. Its ideal for repairing non-structural... [See More]

  • Cure / Technology: Two Component  
Potting Compounds -- LOCTITE EA E-40EXP A/B
from Henkel Corporation - Industrial

To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE ® E-40EXP Hysol, a two-component, room-temperature-curing epoxy potting compound designed to pass UL testing and maintain more than 85% of its compression... [See More]

  • Cure / Technology: Two Component  
  • Features: Adhesive
  • Chemical System: Epoxy
  • Viscosity: 24000
Potting Compounds -- LOCTITE SI 5620
from Henkel Corporation - Industrial

Alkoxy silicone liquid for potting that will cure at room temperature or at elevated temperatures. LOCTITE ® SI 5620 is a clear, 2-part, alkoxy silicone liquid for potting that will cure at room temperature or at elevated temperatures. After mixing, the material cures quickly to form a clear,... [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Viscosity: 200
  • Type / Form: Liquid
  • Use Temperature: 40 to 450
Potting Compounds -- LOCTITE STYCAST 2850FT
from Henkel Corporation - Industrial

Thermally conductive epoxy encapsulant recommended for encapsulation of components that require heat dissipation and thermal shock properties. LOCTITE ® STYCAST 2850FT is a black, thermally conductive epoxy encapsulant recommended for encapsulation of components that require heat dissipation and... [See More]

  • Cure / Technology: Two Component  
  • Viscosity: 225000
  • Chemical System: Epoxy